TWI665174B - 陶瓷塑料複合體及其製造方法 - Google Patents
陶瓷塑料複合體及其製造方法 Download PDFInfo
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- TWI665174B TWI665174B TW106130046A TW106130046A TWI665174B TW I665174 B TWI665174 B TW I665174B TW 106130046 A TW106130046 A TW 106130046A TW 106130046 A TW106130046 A TW 106130046A TW I665174 B TWI665174 B TW I665174B
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- ceramic
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- plastic composite
- plastic
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- 239000000919 ceramic Substances 0.000 title claims abstract description 84
- 239000004033 plastic Substances 0.000 title claims abstract description 83
- 229920003023 plastic Polymers 0.000 title claims abstract description 83
- 239000002131 composite material Substances 0.000 title claims abstract description 39
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000004094 surface-active agent Substances 0.000 claims description 11
- 239000004952 Polyamide Substances 0.000 claims description 10
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 10
- 229920002647 polyamide Polymers 0.000 claims description 10
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 10
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 8
- 230000004913 activation Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- LQLQDKBJAIILIQ-UHFFFAOYSA-N Dibutyl terephthalate Chemical compound CCCCOC(=O)C1=CC=C(C(=O)OCCCC)C=C1 LQLQDKBJAIILIQ-UHFFFAOYSA-N 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 6
- 239000003112 inhibitor Substances 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 6
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 239000012190 activator Substances 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 229920006260 polyaryletherketone Polymers 0.000 claims description 5
- 229920006395 saturated elastomer Polymers 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000008139 complexing agent Substances 0.000 claims description 3
- 238000005238 degreasing Methods 0.000 claims description 3
- 238000010981 drying operation Methods 0.000 claims description 3
- -1 organic acid salt Chemical class 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 3
- 150000007530 organic bases Chemical class 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 238000012360 testing method Methods 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
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- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
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- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- 239000013543 active substance Substances 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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- 238000004537 pulping Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
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- Chemical & Material Sciences (AREA)
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- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Nanotechnology (AREA)
- Laminated Bodies (AREA)
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Abstract
一種陶瓷塑料複合體及其製造方法,是對於陶瓷基體表面先依序進行化學清洗、微蝕、擴孔、表面調整等步驟,來形成平均孔徑為150-450奈米的奈米孔洞,然後,再將烘乾後的陶瓷基體表面注射塑料,成型後的塑料層可以更深地填充於奈米孔洞中,而產生更高的附著力,因此,使得陶瓷基體與塑料層之間具有較高的結合強度和氣密性,從而可提昇陶瓷塑料複合體的可靠度和使用性能。
Description
本發明係有關於一種陶瓷與塑膠的複合材料及其製造方法,特別是一種通過奈米孔洞結構來提高結合強度的陶瓷塑料複合體及其製造方法。
隨著3C電子產品日漸普及,而消費者的審美水準也不斷提高,不但要求產品的性能,還要求其尺寸輕薄,同時具備質感及美觀。由於陶瓷製成的外觀結構件擁有自然的美感以及溫和的觸感,而且,比起傳統的金屬和塑膠的外觀結構件更為耐用、氣密性更佳,並可達到防止天線屏蔽,所以越來越受到人們的歡迎,也更為普遍製作在3C電子產品上。
然而,由於陶瓷本身具有硬而脆的特殊性質,不適合一些結構的應用,如何將陶瓷和塑膠結構很好的結合在一起,是現有技術面臨的一個難題。一般而言,陶瓷外觀結構件的內表面會通過黏膠的方式固定有塑膠件,但是塑膠件和陶瓷之間容易脫落,存在後續加工難度大等缺陷。另外,也可以製作各種咬合結構,例如倒扣和凹口,將陶瓷和塑膠間彼此穩固地結合為一體;但是,這種方式會使製作成本大幅增加。
有鑑於此,本案發明人構思研製出一種陶瓷塑料複合體及其製造方法,除了製作方式非常簡易,並可將複合結構的結合強度和氣密度大幅提昇,不但有別於先前技術的結構及製程,更能有效克服其各種缺失;其具體架構及實施方式將詳述於下。
本發明之主要目的在於提供一種陶瓷塑料複合體及其製造方法,乃將陶瓷基體表面蝕刻形成150-450奈米的奈米孔洞,使得注塑成型的塑料層可以更深入每個奈米孔洞,而產生更高的附著力,以提昇陶瓷基體和塑料層兩者之間的結合強度和氣密度,使產品的品質和性能更加穩定。
本發明之另一目的在於提供一種陶瓷塑料複合體及其製造方法,其製作流程簡易,成本低廉,可容易達到產品的輕量化,並降低厚度。
為達到上述之目的,本發明揭露一種陶瓷塑料複合體的製造方法,其步驟包括:首先,在步驟(a)中,對陶瓷基體表面進行化學清洗;在步驟(b)中,再對經化學清洗的陶瓷基體表面進行活化處理;然後,在步驟(c)中,對經活化處理的陶瓷基體表面進行微蝕處理,以形成微孔洞;接著,在步驟(d)中,對經微蝕處理的陶瓷基體表面進行擴孔處理,使微孔洞的平均孔徑擴大而形成複數奈米孔洞,奈米孔洞的平均孔徑為150-450奈米;之後,在步驟(e)中,對經擴孔處理的陶瓷基體表面進行表面調整;在步驟(f)中,再對經表面調整的陶瓷基體表面進行烘乾作業;最後,在步驟(g)中,對烘乾作業後的陶瓷基體表面注射塑料,成型後則形成塑料層,以使塑料層通過前述奈米孔洞與陶瓷基體表面結合,而製得本發明的陶瓷塑料複合體。
較佳地,奈米孔洞的平均孔徑可達到200-400奈米。
較佳地,在步驟(a)中化學清洗的步驟包括脫蠟處理和脫脂處理。
較佳地,陶瓷基體的材質為氮化矽(Si3
N4
)、碳化鎢(WC)、氧化鋯(ZrO2
)或氧化鋁(Al2
O3
)等等各種陶瓷。
較佳地,塑料層的材質為聚酰胺(PA)、聚亞苯基硫醚(PPS)、飽和聚酯對苯二甲酸丁酯(PBT)或聚芳醚酮(PEAK)。
較佳地,在步驟(b)中是使用活化劑進行活化處理,且活化劑包含8-10重量%的表面活性劑、5-8重量%的有機鹼、2-5重量%的絡合劑及2-5重量%的添加劑,其餘為水。
較佳地,在步驟(c)中是使用微蝕處理劑進行微蝕處理,且微蝕處理劑包含50重量%的酸性鹽、1-5重量%的緩蝕劑、1-3重量%的表面活性劑及1-3重量%的添加劑,其餘為水。
較佳地,在步驟(d)中是使用擴孔處理劑進行擴孔處理,且擴孔處理劑包含5-10重量%的滲透劑、35重量%的有機酸鹽、1-3重量%的表面活性劑及1-3重量%的添加劑,其餘為水。
較佳地,在步驟(d)中是使用表面調整劑進行表面調整,且表面調整劑包含1-10重量%的有機酸、1-5重量%的緩蝕劑、1-3重量%的表面活性劑及1-3重量%的添加劑,其餘為水。
另外,本發明也揭露一種陶瓷塑料複合體,其包括陶瓷基體及注塑結合於陶瓷基體表面的塑料層,而陶瓷基體表面分佈有複數奈米孔洞,這些奈米孔洞的平均孔徑為150-450奈米,塑料層嵌入每個奈米孔洞中,且塑料層與陶瓷基體的結合力達300公斤/平方公分(kg/cm2
)。
較佳地,陶瓷基體的材質為氮化矽(Si3
N4
)、碳化鎢(WC)、氧化鋯(ZrO2
)或氧化鋁(Al2
O3
)等等各種陶瓷。
較佳地,奈米孔洞的平均孔徑可達到200-400奈米。
較佳地,塑料層的材質為聚酰胺(PA)、聚亞苯基硫醚(PPS)、飽和聚酯對苯二甲酸丁酯(PBT)或聚芳醚酮(PEAK)。
與習知技術相比,本發明的方法使用化學清洗、微蝕、擴孔、表面調整等步驟,將奈米孔洞的平均孔徑為150-450奈米的程度,而可讓注塑成型後的塑料層得以更完整地填充於每個奈米孔洞中,來產生更高的附著力,能夠大幅提昇陶瓷基體與塑料層的結合強度,同時也確保陶瓷基體與塑料層的界面間的氣密性。
底下藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。
請參照第1圖,繪示本發明之實施例所提供的陶瓷塑料複合體之剖面圖。此陶瓷塑料複合體100包含有陶瓷基體10與結合於陶瓷基體10表面的塑料層20。本實施例所使用的陶瓷基體10的材質可以例如為氮化矽(Si3
N4
)、碳化鎢(WC)、氧化鋯(ZrO2
)或氧化鋁(Al2
O3
)等等各種陶瓷,而塑料層20的材質可以例如為聚酰胺(PA)、聚亞苯基硫醚(PPS)、飽和聚酯對苯二甲酸丁酯(PBT)或聚芳醚酮(PEAK)等塑料。
再請參照第2A圖和第2B圖,為本發明之實施例所提供的陶瓷基體表面10的奈米孔洞30的掃描電子顯微鏡之示意圖;可以看到,本實施例的陶瓷基體10表面分佈有多個奈米孔洞30,這些奈米孔洞30的孔徑約為200-400奈米(nm),其存在可讓後續注塑成型的塑料層得以充分填充於這些奈米孔洞30的孔隙中;本發明中,這些奈米孔洞30的平均孔徑可為150-450奈米,較佳者為200-400奈米,藉此,可以提高塑料層20於奈米孔洞30中的吸附力,並從而增加塑料層20與陶瓷基體10之間的結合強度及氣密性,經過實際的結合強度測試,可提升陶瓷塑料複合體100的結合力至300公斤/平方公分(kg/cm2
)。
接著,請參照第3圖,其顯示本發明之實施例所提供的陶瓷塑料複合體的製造方法之流程圖。該製造流程包括如下步驟:
首先,見步驟S10,將陶瓷粉末經由製漿,流延成片後,等待靜壓成型,然後燒結成陶瓷,並通過機械加工形狀化,再研磨為陶瓷基體。
見步驟S20,對陶瓷基體進行化學清洗,先利用溶劑脫臘,再進行脫脂,來去除表面雜質和油脂。
見步驟S21,為了進一步去除陶瓷基體的表面污垢,較佳是再對陶瓷基體表面進行一次或多次的清洗作業。
見步驟S30,對陶瓷基體表面進行活化處理,以形成具催化性的陶瓷基體表面,有利於進行後續的化學反應;活化劑的成份包括8-10重量%的表面活性劑、5-8重量%的有機鹼、2-5重量%的絡合劑及2-5重量%的添加劑,其餘為水;活化處理的溫度為45-55℃,活化處理的時間為5-8分鐘。
見步驟S31,同樣可進一步對活化後的陶瓷基體表面進行一次或多次的清洗作業。
見步驟S40,採用微蝕處理劑,對陶瓷基體表面進行微蝕處理,使經活化處理的陶瓷基體表面產生複數微孔洞,這些微孔洞的平均孔徑約為20-40奈米;微蝕處理劑包含50重量%的酸性鹽、1-5重量%的緩蝕劑、1-3重量%的表面活性劑及1-3重量%的添加劑,其餘為水;微蝕處理的溫度為65-85℃,微蝕處理的時間為30分鐘。
見步驟S41,可進一步對具有微孔洞的陶瓷基體表面進行一次或多次的清洗作業。
見步驟S50,再採用擴孔處理劑,對陶瓷基體表面進行擴孔處理,使陶瓷基體表面的微孔洞進一步擴大為奈米孔洞,這些孔洞的平均孔徑約為150-450奈米,較佳為200-400奈米;本實施例中,擴孔處理劑包含5-10重量%的滲透劑、35重量%的有機酸鹽、1-3重量%的表面活性劑及1-3重量%的添加劑,其餘為水;擴孔處理的溫度為65-85℃,擴孔處理的時間為35分鐘。
見步驟S51,同樣可進一步對形成奈米孔洞的陶瓷基體表面進行一次或多次的清洗作業。
見步驟S60,再採用表面調整劑,對於陶瓷基體表面進行表面調整,使具有奈米孔洞的陶瓷基體表面改變微觀狀態;表面調整劑的成份包括1-10重量%的有機酸、1-5重量%的緩蝕劑、1-3重量%的表面活性劑及1-3重量%的添加劑,其餘為水;表面調整的溫度為55-65℃,表面調整的時間為3-5分鐘。
見步驟S61,可進一步對經表面調整的陶瓷基體表面進行一次或多次的清洗作業。
之後,見步驟S70,對經表面調整的陶瓷基體進行烘乾作業。
最後,見步驟S80,且如第4圖所示,將烘乾完成的陶瓷基體10放入注塑成型模具50內,然後對陶瓷基體10具有奈米孔洞的表面注射塑料,使塑料填充於每個奈米孔洞中,待塑料成型後即形成一塑料層20,此塑料層20會通過奈米孔洞與陶瓷基體10表面緊密結合在一起,以製得本發明的陶瓷塑料複合體。
本實施例在步驟S80的注塑成型中,其成型模溫約為140℃,料管溫度第一階段約為290℃,第二階段約為295℃,第三階段約為300℃,第四階段約為305℃,而射出壓力約為1750公斤力/平方公分(kg-f/cm2
)。
而本發明所製得的陶瓷塑料複合體經由抗拉強度測試,可得知其結合強度可達到300公斤/平方公分(kg/cm2
)。此抗拉強度測試是經由電子萬能材料試驗機來進行,其測試速度為10.00毫米/分鐘(mm/min),測試標準為120公斤力(kgf)/0.5平方公分(cm2
),而測試試片所採用的陶瓷塑料複合體,其陶瓷基體的材質為氧化鋯(ZrO2
),塑料種類為聚酯對苯二甲酸丁酯(PBT),兩者的結合面積為0.5平方公分(cm2
),試片尺寸為45*18*1.5毫米(mm)。
總之,根據本發明所製得的陶瓷塑料複合體的陶瓷基體與塑料的結合效果相當穩定,且結合強度高。因此,相較於現有技術,本發明所提供的陶瓷塑料複合體及其製造方法,通過化學清洗、微蝕、擴孔、表面調整等步驟,而將奈米孔洞的平均孔徑可為150-450奈米的程度,藉此,可讓注塑成型後的塑料層得以更為完整地覆蓋於每個奈米孔洞中,得以產生更高的附著力,能夠有效提昇陶瓷基體與塑料層的結合強度,亦可以確保陶瓷基體與塑料層的界面間的氣密性,從而使產品的品質和性能更加穩定。此外,本發明的製作流程簡易,成本低廉,可容易達到產品的輕量化,及降低厚度,能夠滿足精細化電子產品的市場需求,提高產品的產業競爭力。
以上所述之實施例僅係為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍內。
100‧‧‧陶瓷塑料複合體
10‧‧‧陶瓷基體
20‧‧‧塑料層
30‧‧‧奈米孔洞
50‧‧‧注塑成型模具
第1圖為本發明之實施例所提供的陶瓷塑料複合體之剖面圖。 第2A與2B圖為本發明之實施例所提供的陶瓷基體表面的奈米孔洞的掃描電子顯微鏡之示意圖。 第3圖為本發明之實施例所提供的陶瓷塑料複合體的製造方法之流程圖 第4圖為本發明之實施例所提供的注射塑料於陶瓷基體表面之示意圖。
Claims (13)
- 一種陶瓷塑料複合體的製造方法,包括以下步驟:(a)對一陶瓷基體表面進行化學清洗;(b)對經化學清洗的該陶瓷基體表面進行活化處理;(c)對經活化處理的該陶瓷基體表面進行微蝕處理,以形成複數微孔洞;(d)對經微蝕處理的該陶瓷基體表面進行擴孔處理,使該些微孔洞平均孔徑擴大形成複數奈米孔洞,該些奈米孔洞的平均孔徑為150-450奈米;(e)對經擴孔處理的該陶瓷基體表面進行表面調整;(f)對經表面調整的該陶瓷基體表面進行烘乾作業;以及(g)對烘乾作業後的該陶瓷基體表面注射一塑料,形成一塑料層,以使該塑料層通過該些奈米孔洞與該陶瓷基體表面結合,而製得該陶瓷塑料複合體。
- 如請求項第1項所述之陶瓷塑料複合體的製造方法,其中該些奈米孔洞的平均孔徑為200-400奈米。
- 如請求項第1項所述之陶瓷塑料複合體的製造方法,其中在步驟(a)中該化學清洗的步驟包括一脫蠟處理和一脫脂處理。
- 如請求項第1項所述之陶瓷塑料複合體的製造方法,其中該陶瓷基體的材質為氮化矽(Si3N4)、碳化鎢(WC)、氧化鋯(ZrO2)或氧化鋁(Al2O3)。
- 如請求項第1項所述之陶瓷塑料複合體的製造方法,其中該塑料層的材質為聚酰胺(PA)、聚亞苯基硫醚(PPS)、飽和聚酯對苯二甲酸丁酯(PBT)或聚芳醚酮(PEAK)。
- 如請求項第1項所述之陶瓷塑料複合體的製造方法,其中在步驟(b)中是使用一活化劑進行該活化處理,且該活化劑包含8-10重量%的表面活性劑、5-8重量%的有機鹼、2-5重量%的絡合劑及2-5重量%的添加劑,其餘為水。
- 如請求項第1項所述之陶瓷塑料複合體的製造方法,其中在步驟(c)中是使用一微蝕處理劑進行該微蝕處理,且該微蝕處理劑包含50重量%的酸性鹽、1-5重量%的緩蝕劑、1-3重量%的表面活性劑及1-3重量%的添加劑,其餘為水。
- 如請求項第1項所述之陶瓷塑料複合體的製造方法,其中在步驟(d)中是使用一擴孔處理劑進行該擴孔處理,且該擴孔處理劑包含5-10重量%的滲透劑、35重量%的有機酸鹽、1-3重量%的表面活性劑及1-3重量%的添加劑,其餘為水。
- 如請求項第1項所述之陶瓷塑料複合體的製造方法,其中在步驟(e)中是使用一表面調整劑進行該表面調整,且該表面調整劑包含1-10重量%的有機酸、1-5重量%的緩蝕劑、1-3重量%的表面活性劑及1-3重量%的添加劑,其餘為水。
- 一種陶瓷塑料複合體,係由如請求項第1項所述之陶瓷塑料複合體的製造方法所製得者,包括一陶瓷基體及注塑結合於該陶瓷基體表面的一塑料層,其特徵在於:該陶瓷基體表面分佈有複數奈米孔洞,該些奈米孔洞的平均孔徑為150-450奈米,該塑料層嵌入該些奈米孔洞中,且該塑料層與該陶瓷基體的結合力達300公斤/平方公分(kg/cm2)。
- 如請求項第10項所述之陶瓷塑料複合體,其中該些奈米孔洞的平均孔徑為200-400奈米。
- 如請求項第10項所述之陶瓷塑料複合體,其中該陶瓷基體的材質為氮化矽(Si3N4)、碳化鎢(WC)、氧化鋯(ZrO2)或氧化鋁(Al2O3)。
- 如請求項第10項所述之陶瓷塑料複合體,其中該塑料層的材質為聚酰胺(PA)、聚亞苯基硫醚(PPS)、飽和聚酯對苯二甲酸丁酯(PBT)或聚芳醚酮(PEAK)。
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JP2018080085A JP6547033B2 (ja) | 2017-09-01 | 2018-04-18 | セラミックプラスチック複合体及びその製造方法 |
US15/978,749 US10800711B2 (en) | 2017-09-01 | 2018-05-14 | Ceramic and plastic composite and method for fabricating the same |
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