CN112468636B - 壳体、及壳体的加工方法 - Google Patents
壳体、及壳体的加工方法 Download PDFInfo
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Abstract
本公开是关于壳体、及壳体的加工方法,尤其针对消费电子产品陶瓷减重需要。方法包括:将预先制备的溶胶涂覆在预先制备的陶瓷壳体的内表面;采用烧结工艺对涂覆有溶胶的陶瓷壳体进行烧结处理,在陶瓷壳体的内表面形成含有纳米级微孔的过渡层,从而为陶瓷壳体与塑胶件的结合提供良好的结合锚点,形成机械锁和效应,提高陶瓷壳体与塑胶件之间的结合力,实现通过注塑或胶粘复合纤维板方式补强陶瓷强度并减重的目的,获得预期效果成品壳体;并且,陶瓷壳体与塑胶件的连接过程不需要对陶瓷表面做特殊表面处理,减少陶瓷壳体加工工序,降低生产能耗,操作简单。
Description
技术领域
本公开涉及终端技术领域,尤其涉及壳体、及壳体的加工方法。
背景技术
智能手机在最近十年得到极大普及,而手机外壳材质的变化也十分显著,从塑料发展到以金属玻璃为代表的新一代材质。但是,在手机硬件差异化不明显的情况下,材质方面的创新日益成为终端厂商解决智能手机同质化严重的主要途径之一。常见的手机外壳材质包括:塑料,金属,玻璃,陶瓷,木质,皮革等,它们的物理特性不尽相同,做出来的手机观感以及手感都大不一样。
相关技术中,考虑到陶瓷相比玻璃有着更高的硬度,更加耐刮防磨,具有晶莹通透的独特观感,再加上对于高频信号干扰较低,因而,基于陶瓷材质的陶瓷壳体备受终端厂商和用户的关注;但由于陶瓷重量较大,成本较高,并且陶瓷内部不易加工卡扣与中框连接,因此希望将陶瓷减薄并与塑胶或纤维板复合起来,减少壳体重量。
发明内容
为克服相关技术中存在的问题,本公开实施例提供一种壳体、及壳体的加工方法。所述技术方案如下:
根据本公开实施例的第一方面,提供一种壳体的加工方法,包括:
将预先制备的溶胶涂覆在预先制备的陶瓷壳体的内表面。
采用烧结工艺对涂覆有所述溶胶的所述陶瓷壳体进行烧结处理,在所述陶瓷壳体的内表面形成含有纳米级微孔的过渡层;
将所述陶瓷壳体通过所述过渡层与塑胶件连接,制成目标壳体。
本公开的实施例提供的技术方案可以包括以下有益效果:该技术方案通过在陶瓷壳体表面涂覆溶胶,采用低温烧结工艺在在陶瓷壳体的内表面形成含有纳米级微孔的过渡层,为陶瓷与塑胶件的结合提供力学锚点,形成机械锁和效应,提高陶瓷与塑胶件之间的结合力,并且,陶瓷与塑胶件的连接过程不需要对陶瓷表面做特殊表面处理,减少陶瓷壳体加工工序,降低生产能耗,操作简单,对常规工程塑料或橡胶都可适用,大大拓展了陶瓷与塑胶结合选材的设计空间,过渡层也不会对陶瓷壳体的外观面打磨抛光或釉料装饰造成影响。
在一个实施例中,所述溶胶的成分,包括以下任一种元素或组合:Al、Zr或Zn元素。
在一个实施例中,所述陶瓷壳体的成分,包括以下任一种材料或组合:氧化铝、氧化锆或氧化锌。
在一个实施例中,在所述将预先制备的溶胶涂覆在陶瓷壳体的内表面之前,所述方法还包括:
将溶胶前驱体分次加入水中,采用加热回流的方式得到底部含有水解沉淀的类悬浊液液体;
在所述类悬浊液液体中分次加入强酸,采用加热回流的方式得到澄清的所述溶胶。
在一个实施例中,所述将预先制备的溶胶涂覆在陶瓷壳体的内表面,包括:
采用以下任一种涂装方式或组合,将预先制备的所述溶胶涂覆在所述陶瓷壳体的内表面:提拉浸渍、流延、旋涂、喷涂。
在一个实施例中,所述采用烧结工艺对涂覆有所述溶胶的所述陶瓷壳体进行烧结处理,包括:
将所述涂覆有所述溶胶的所述陶瓷壳体在无尘环境中静置预设时间,然后放入烧结炉中进行烧结处理;其中,烧结温度的范围为660℃至850℃,保温时间为至少1小时。
在一个实施例中,所述将所述陶瓷壳体通过所述过渡层与塑胶件连接,制成目标壳体,包括:
将所述陶瓷壳体通过所述过渡层与塑胶件粘接、或注塑连接,制成目标壳体。
根据本公开实施例的第二方面,提供一种壳体,所述壳体采用上述第一方面所述方法的步骤加工而成,所述壳体包括:
陶瓷壳体和塑胶件;其中:所述陶瓷壳体的内表面含有纳米级微孔的过渡层;所述陶瓷壳体通过所述过渡层与所述塑胶件连接。
在一个实施例中,所述陶瓷壳体通过所述过渡层与所述塑胶件粘接、或注塑连接。
应当理解的是,以上的一般描述和后文的细节描述仅是示例性和解释性的,并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分,示出了符合本公开的实施例,并与说明书一起用于解释本公开的原理。
图1是根据一示例性实施例示出的壳体的加工方法的流程图。
图2是根据一示例性实施例示出的壳体的加工方法的流程图。
图3是根据一示例性实施例示出的一种壳体的剖面示意图。
具体实施方式
这里将详细地对示例性实施例进行说明,其示例表示在附图中。下面的描述涉及附图时,除非另有表示,不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本公开相一致的所有实施方式。相反,它们仅是与如所附权利要求书中所详述的、本公开的一些方面相一致的装置和方法的例子。
相关技术中,很多厂商使用陶瓷材料制作手机。但是,由于模压烧结后陶瓷表面较为光滑,表面张力相比常用塑胶较小,在粘接或注塑时依赖于电化学表面处理以提高表面粘接结合力,陶瓷和塑胶件之间的结合力较弱,并且由于增加工序和生产能耗,一定程度上也限制了陶瓷在手机产品上的结构造型设计。
为了解决上述问题,本公开实施例提供了一种壳体的加工方法,方法包括:将预先制备的溶胶涂覆在预先制备的陶瓷壳体的内表面;采用烧结工艺对涂覆有溶胶的陶瓷壳体进行烧结处理,在陶瓷壳体的内表面形成含有纳米级微孔的过渡层;将陶瓷壳体通过过渡层与塑胶件连接,制成目标壳体。采用本公开实施例提供的技术方案,通过在陶瓷壳体表面涂覆溶胶,采用低温烧结工艺在在陶瓷壳体的内表面形成含有纳米级微孔的过渡层,为陶瓷与塑胶件的结合提供力学锚点,形成机械锁和效应,提高陶瓷与塑胶件之间的结合力,并且,陶瓷与塑胶件的连接过程不需要对陶瓷表面做特殊表面处理,减少陶瓷壳体加工工序,降低生产能耗,操作简单,对常规工程塑料或橡胶都可适用,大大拓展了陶瓷与塑胶结合选材的设计空间,过渡层也不会对陶瓷壳体的外观面打磨抛光或釉料装饰造成影响。本公开中目标壳体可以应用于手机、平板电脑或可穿戴设备等用户设备上。
在上述分析的基础上,下面介绍本公开的方法实施例。
图1是根据一示例性实施例示出的一种壳体的加工方法的流程图;如图1所示,该方法包括以下步骤101-103:
在步骤101中,将预先制备的溶胶涂覆在预先制备的陶瓷壳体的内表面。
示例的,溶胶的成分中包括Al、Zr或Zn等金属元素,溶胶中含有溶胶前驱体水解后产生的溶胶复盐。陶瓷壳体的成分,包含但不限于氧化铝、氧化锆或氧化锌等金属氧化物陶瓷。可选的,为保证溶胶与陶瓷壳体之间具有较好的化学相容性和截面复合性能,通常,溶胶与陶瓷壳体的成分中含有相同的金属元素。
示例的,在将预先制备的溶胶涂覆在预先制备的陶瓷壳体的内表面之前,需要制备溶胶,制备溶胶的方法可以包括:将溶胶前驱体分次加入水中,采用加热回流的方式得到底部含有水解沉淀的类悬浊液液体;溶胶前驱体包括含有Al、Zr或Zn等金属元素的水解后碱式盐沉淀;在类悬浊液液体中分次加入一定量强酸,采用加热回流的方式得到均匀澄清的溶胶。可选的,加入到类悬浊液液体中的强酸作为溶胶剂,强酸的具体种类根据溶胶前驱体的成分而定。
示例的,将预先制备的溶胶涂覆在陶瓷壳体的内表面,包括:采用以下任一种涂装方式或组合,将预先制备的溶胶涂覆在陶瓷壳体的内表面:提拉浸渍、流延、旋涂、喷涂。
在步骤102中,采用烧结工艺对涂覆有溶胶的陶瓷壳体进行烧结处理,在陶瓷壳体的内表面形成含有纳米级微孔的过渡层。
示例的,将所述涂覆有所述溶胶的所述陶瓷壳体在无尘环境中静置预设时间,然后放入烧结炉中进行烧结处理;其中,烧结温度的范围为660℃至850℃,保温时间至少1小时。可选的,烧结温度为780℃,保温时间为1小时,预设时间为4小时,升温速度为2℃/min。烧结温度低于制作陶瓷壳体时的烧结温度。
示例的,过渡层包括介孔或微孔结构。由于溶胶与陶瓷壳体的成分中含有相同的金属元素,使得陶瓷壳体与过渡层在烧结过程中不易出现热膨胀系数差异造成的皲裂或过渡层剥落的情况。
在步骤103中,将陶瓷壳体通过过渡层与塑胶件连接,制成目标壳体。
示例的,将陶瓷壳体通过过渡层与塑胶件连接,制成目标壳体,包括:将陶瓷壳体通过过渡层与塑胶件粘接、或注塑连接,制成目标壳体。
示例的,塑胶件的材料可以包括:聚碳酸酯(PC,Polycarbonate)、聚甲基丙烯酸甲酯(PMMA,Polymethyl methacrylate)、丙烯腈-丁二烯-苯乙烯共聚物(ABS)、聚酰胺(PA,Polyamide)、聚对苯二甲酸丁二醇酯(PBT,Polybutylene terephthalate)、聚对苯二甲酸乙二醇酯(PET,Polyethylene terephthalate)、丁腈橡胶等塑料或橡胶,或者玻纤/玄武岩纤维/碳纤维复合板。
本公开的实施例提供的技术方案,通过在陶瓷壳体表面涂覆溶胶,采用低温烧结工艺在在陶瓷壳体的内表面形成含有纳米级微孔的过渡层,为陶瓷与塑胶件的结合提供力学锚点,形成机械锁和效应,提高陶瓷与塑胶件之间的结合力,并且,陶瓷与塑胶件的连接过程不需要对陶瓷表面做特殊表面处理,减少陶瓷壳体加工工序,降低生产能耗,操作简单,对常规工程塑料或橡胶都可适用,大大拓展了陶瓷与塑胶结合选材的设计空间,过渡层也不会对陶瓷壳体的外观面打磨抛光或釉料装饰造成影响。
图2是根据一示例性实施例示出的一种壳体的加工方法的流程图;如图2所示,在图1所示实施例的基础上,本公开涉及的壳体的加工方法包括以下步骤201-205,其中:
在步骤201中,将溶胶前驱体分次加入水中,采用加热回流的方式得到底部含有水解沉淀的类悬浊液液体。
示例的,溶胶前驱体包括含有Al、Zr或Zn等金属元素的水解后碱式盐沉淀。陶瓷壳体的成分,包含但不限于氧化铝、氧化锆或氧化锌等金属氧化物陶瓷;溶胶与陶瓷壳体的成分中含有相同的金属元素。将溶胶前驱体分多次加入水中,以一定温度加热伴随水蒸气回流得到底部含有水解沉淀的类悬浊液液体。可选的,陶瓷壳体的陶瓷材料为氧化铝陶瓷,异丙醇铝为水解前驱体。
在步骤202中,在类悬浊液液体中分次加入强酸,采用加热回流的方式得到澄清的溶胶。
示例的,在上述液体中分多次加入强酸,继续加热回流至溶液变成均匀澄清的溶胶。
在步骤203中,采用以下任一种涂装方式或组合,将预先制备的溶胶涂覆在陶瓷壳体的内表面:提拉浸渍、流延、旋涂、喷涂。
在步骤204中,采用烧结工艺对涂覆有溶胶的陶瓷壳体进行烧结处理,在陶瓷壳体的内表面形成含有纳米级微孔的过渡层。
示例的,将涂有溶胶的陶瓷壳体在无尘环境中静置一段时间后烧结,得到表面含有纳米级微孔的过渡层的陶瓷壳体。
在步骤205中,将陶瓷壳体通过过渡层与塑胶件粘接或注塑连接,制成目标壳体。
本公开的实施例提供的技术方案,通过在陶瓷壳体表面涂覆溶胶,采用低温烧结工艺在在陶瓷壳体的内表面形成含有纳米级微孔的过渡层,为陶瓷与塑胶件的结合提供力学锚点,形成机械锁和效应,提高陶瓷与塑胶件之间的结合力,并且,陶瓷与塑胶件的连接过程不需要对陶瓷表面做特殊表面处理,减少陶瓷壳体加工工序,降低生产能耗,操作简单,对常规工程塑料或橡胶都可适用,大大拓展了陶瓷与塑胶结合选材的设计空间,过渡层也不会对陶瓷壳体的外观面打磨抛光或釉料装饰造成影响。
图3是根据一示例性实施例示出的一种壳体的剖面示意图;图3中的壳体采用本公开任意一个方法实施例所提供的壳体的加工方法的步骤加工而成;如图3所示,壳体包括:
陶瓷壳体31和塑胶件32;其中:陶瓷壳体31的内表面含有纳米级微孔331的过渡层33;陶瓷壳体31通过过渡层33与塑胶件32连接。
示例的,过渡层33包括介孔或微孔结构。
示例的,陶瓷壳体31通过过渡层33与塑胶件32粘接或注塑连接。
本公开的实施例提供的技术方案,通过在陶瓷壳体表面涂覆溶胶,采用低温烧结工艺在在陶瓷壳体的内表面形成含有纳米级微孔的过渡层,为陶瓷与塑胶件的结合提供力学锚点,形成机械锁和效应,提高陶瓷与塑胶件之间的结合力,并且,陶瓷与塑胶件的连接过程不需要对陶瓷表面做特殊表面处理,减少陶瓷壳体加工工序,降低生产能耗,操作简单。
本领域技术人员在考虑说明书及实践这里公开的公开后,将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化,这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的,本公开的真正范围和精神由下面的权利要求指出。
应当理解的是,本公开并不局限于上面已经描述并在附图中示出的精确结构,并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。
Claims (8)
1.一种终端壳体的加工方法,其特征在于,所述方法包括:
将预先制备的溶胶涂覆在预先制备的陶瓷壳体的内表面;
采用烧结工艺对涂覆有所述溶胶的所述陶瓷壳体进行烧结处理,在所述陶瓷壳体的内表面形成含有纳米级微孔的过渡层;
将所述陶瓷壳体通过所述过渡层与塑胶件连接,制成目标壳体;
所述溶胶的成分,包括以下任一种元素或组合:Al、Zr或Zn元素。
2.根据权利要求1所述的方法,其特征在于,所述陶瓷壳体的成分,包括以下任一种材料或组合:氧化铝、氧化锆或氧化锌。
3.根据权利要求1所述的方法,其特征在于,在所述将预先制备的溶胶涂覆在陶瓷壳体的内表面之前,所述方法还包括:
将溶胶前驱体分次加入水中,采用加热回流的方式得到底部含有水解沉淀的类悬浊液液体;
在所述类悬浊液液体中分次加入强酸,采用加热回流的方式得到澄清的所述溶胶。
4.根据权利要求1所述的方法,其特征在于,所述将预先制备的溶胶涂覆在陶瓷壳体的内表面,包括:
采用以下任一种涂装方式或组合,将预先制备的所述溶胶涂覆在所述陶瓷壳体的内表面:提拉浸渍、流延、旋涂、喷涂。
5.根据权利要求1所述的方法,其特征在于,所述采用烧结工艺对涂覆有所述溶胶的所述陶瓷壳体进行烧结处理,包括:
将所述涂覆有所述溶胶的所述陶瓷壳体在无尘环境中静置预设时间,然后放入烧结炉中进行烧结处理;其中,烧结温度的范围为660℃至850℃,保温时间为至少1小时。
6.根据权利要求1所述的方法,其特征在于,所述将所述陶瓷壳体通过所述过渡层与塑胶件连接,制成目标壳体,包括:
将所述陶瓷壳体通过所述过渡层与塑胶件粘接、或注塑连接,制成目标壳体。
7.一种壳体,其特征在于,所述壳体采用权利要求1至6中任一项所述方法的步骤加工而成,所述壳体包括:
陶瓷壳体和塑胶件;其中:所述陶瓷壳体的内表面含有纳米级微孔的过渡层;所述陶瓷壳体通过所述过渡层与所述塑胶件连接。
8.根据权利要求7所述的壳体,其特征在于,所述陶瓷壳体通过所述过渡层与所述塑胶件粘接、或注塑连接。
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