TWI663487B - 微影設備及物品製造方法 - Google Patents
微影設備及物品製造方法 Download PDFInfo
- Publication number
- TWI663487B TWI663487B TW106104126A TW106104126A TWI663487B TW I663487 B TWI663487 B TW I663487B TW 106104126 A TW106104126 A TW 106104126A TW 106104126 A TW106104126 A TW 106104126A TW I663487 B TWI663487 B TW I663487B
- Authority
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- Taiwan
- Prior art keywords
- substrate
- original plate
- lithographic apparatus
- electrode
- patent application
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000001459 lithography Methods 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims abstract description 121
- 238000012546 transfer Methods 0.000 claims abstract description 9
- 230000002093 peripheral effect Effects 0.000 claims description 62
- 230000005684 electric field Effects 0.000 claims description 30
- 239000012212 insulator Substances 0.000 claims description 18
- 238000007664 blowing Methods 0.000 claims description 12
- 238000004049 embossing Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 description 77
- 239000000463 material Substances 0.000 description 39
- 230000007246 mechanism Effects 0.000 description 30
- 239000007789 gas Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 8
- 230000005484 gravity Effects 0.000 description 8
- 230000004907 flux Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000852 hydrogen donor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Computer Networks & Wireless Communication (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016028297A JP6643135B2 (ja) | 2016-02-17 | 2016-02-17 | リソグラフィ装置および物品製造方法 |
| JP2016-028297 | 2016-02-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201740222A TW201740222A (zh) | 2017-11-16 |
| TWI663487B true TWI663487B (zh) | 2019-06-21 |
Family
ID=59561429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106104126A TWI663487B (zh) | 2016-02-17 | 2017-02-08 | 微影設備及物品製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10228624B2 (enExample) |
| JP (1) | JP6643135B2 (enExample) |
| KR (1) | KR102091908B1 (enExample) |
| CN (1) | CN107092163B (enExample) |
| SG (1) | SG10201700942WA (enExample) |
| TW (1) | TWI663487B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6732475B2 (ja) * | 2016-02-29 | 2020-07-29 | キヤノン株式会社 | インプリント装置、物品の製造方法、保持装置および露光装置 |
| US10722925B2 (en) * | 2017-12-04 | 2020-07-28 | Suss Micro Tec Photomask Equipment Gmbh & Co Kg | Treatment head, treatment system and method for treating a local surface area of a substrate |
| JP7348454B2 (ja) * | 2018-10-01 | 2023-09-21 | 東京エレクトロン株式会社 | 基板表面から異物を静電的に除去するための装置及び方法 |
| US11506985B2 (en) * | 2019-04-29 | 2022-11-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor apparatus and method of operating the same for preventing photomask particulate contamination |
| JP7495814B2 (ja) * | 2020-05-13 | 2024-06-05 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
| CN116917805A (zh) * | 2021-01-20 | 2023-10-20 | 应用材料公司 | 防滑印模降落环 |
| KR102542639B1 (ko) * | 2021-02-10 | 2023-06-12 | 성균관대학교산학협력단 | 미세 패턴 형성 장치 및 방법 |
| KR102528880B1 (ko) * | 2021-02-16 | 2023-05-03 | 성균관대학교산학협력단 | 전기수력학 불안정성을 이용한 패턴제작기술의 미세 구조체 사이의 2차 간섭효과에 의한 초미세구조체 제작 및 초소수성표면 형성방법 |
| US12463042B2 (en) | 2022-05-31 | 2025-11-04 | Canon Kabushiki Kaisha | Planarization system and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100068659A1 (en) * | 2008-03-28 | 2010-03-18 | Canon Kabushiki Kaisha | Exposure apparatus and device manufacturing method |
| US20120080820A1 (en) * | 2010-10-04 | 2012-04-05 | Canon Kabushiki Kaisha | Imprinting method |
| TW201637742A (zh) * | 2015-02-12 | 2016-11-01 | 應用材料股份有限公司 | 自身清潔的基板接觸表面 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000228439A (ja) * | 1999-02-05 | 2000-08-15 | Advantest Corp | ステージ上のパーティクル除去方法及び清掃板 |
| CN1222918C (zh) * | 2001-08-27 | 2005-10-12 | 佳能株式会社 | 布线基板及使用该布线基板的图象显示装置 |
| JP2008258490A (ja) * | 2007-04-06 | 2008-10-23 | Canon Inc | 露光装置及び原版 |
| US8125603B2 (en) * | 2007-05-17 | 2012-02-28 | Lg Display Co., Ltd. | In-plane switching mode liquid crystal display device and method for fabricating the same |
| US7558045B1 (en) * | 2008-03-20 | 2009-07-07 | Novellus Systems, Inc. | Electrostatic chuck assembly with capacitive sense feature, and related operating method |
| JP2009302234A (ja) * | 2008-06-12 | 2009-12-24 | Canon Inc | 露光装置及びデバイス製造方法 |
| JP2011040464A (ja) * | 2009-08-07 | 2011-02-24 | Canon Inc | 異物除去装置、露光装置及びデバイス製造方法 |
| JP5846572B2 (ja) * | 2011-07-27 | 2016-01-20 | ギガフォトン株式会社 | チャンバ装置、極端紫外光生成装置および極端紫外光生成装置の制御方法 |
| JP2013197465A (ja) * | 2012-03-22 | 2013-09-30 | Toshiba Corp | 静電チャック装置および露光装置 |
| DE102012017669A1 (de) * | 2012-09-07 | 2014-03-13 | Valeo Schalter Und Sensoren Gmbh | Anordnung mit einem Verkleidungsteil und einem Radarsensor, Kraftfahrzeug und Verfahren zum Herstellen einer Anordnung |
| TWI628081B (zh) * | 2012-10-04 | 2018-07-01 | 大日本印刷股份有限公司 | 壓印方法及壓印裝置 |
| JP6171412B2 (ja) | 2013-03-06 | 2017-08-02 | 大日本印刷株式会社 | インプリント方法、インプリント用のモールドおよびインプリント装置 |
| JP2015149390A (ja) * | 2014-02-06 | 2015-08-20 | キヤノン株式会社 | インプリント装置、型、および物品の製造方法 |
-
2016
- 2016-02-17 JP JP2016028297A patent/JP6643135B2/ja active Active
-
2017
- 2017-02-07 SG SG10201700942WA patent/SG10201700942WA/en unknown
- 2017-02-08 TW TW106104126A patent/TWI663487B/zh active
- 2017-02-13 US US15/430,988 patent/US10228624B2/en active Active
- 2017-02-14 CN CN201710078450.6A patent/CN107092163B/zh active Active
- 2017-02-15 KR KR1020170020309A patent/KR102091908B1/ko active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100068659A1 (en) * | 2008-03-28 | 2010-03-18 | Canon Kabushiki Kaisha | Exposure apparatus and device manufacturing method |
| US20120080820A1 (en) * | 2010-10-04 | 2012-04-05 | Canon Kabushiki Kaisha | Imprinting method |
| TW201637742A (zh) * | 2015-02-12 | 2016-11-01 | 應用材料股份有限公司 | 自身清潔的基板接觸表面 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6643135B2 (ja) | 2020-02-12 |
| JP2017147343A (ja) | 2017-08-24 |
| CN107092163B (zh) | 2020-12-29 |
| US10228624B2 (en) | 2019-03-12 |
| KR102091908B1 (ko) | 2020-03-20 |
| US20170235234A1 (en) | 2017-08-17 |
| TW201740222A (zh) | 2017-11-16 |
| KR20170096961A (ko) | 2017-08-25 |
| CN107092163A (zh) | 2017-08-25 |
| SG10201700942WA (en) | 2017-09-28 |
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