TWI663478B - 矽氧烷樹脂組成物、使用該矽氧烷樹脂組成物之透明硬化物、透明像素、微透鏡、固體攝像元件 - Google Patents

矽氧烷樹脂組成物、使用該矽氧烷樹脂組成物之透明硬化物、透明像素、微透鏡、固體攝像元件 Download PDF

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TWI663478B
TWI663478B TW104132366A TW104132366A TWI663478B TW I663478 B TWI663478 B TW I663478B TW 104132366 A TW104132366 A TW 104132366A TW 104132366 A TW104132366 A TW 104132366A TW I663478 B TWI663478 B TW I663478B
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Taiwan
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mass
resin composition
siloxane resin
group
preferred
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TW104132366A
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Chinese (zh)
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TW201614377A (en
Inventor
田口貴規
室祐継
久保田誠
高桑英希
上村哲也
中村翔一
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日商富士軟片股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition
    • C08L2666/68—Plasticizers; Solvents

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Solid State Image Pick-Up Elements (AREA)
TW104132366A 2014-10-03 2015-10-01 矽氧烷樹脂組成物、使用該矽氧烷樹脂組成物之透明硬化物、透明像素、微透鏡、固體攝像元件 TWI663478B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-205274 2014-10-03
JP2014205274 2014-10-03
JP2015-007504 2015-01-19
JP2015007504A JP5799182B1 (ja) 2014-10-03 2015-01-19 シロキサン樹脂組成物、これを用いた透明硬化物、透明画素、マイクロレンズ、固体撮像素子

Publications (2)

Publication Number Publication Date
TW201614377A TW201614377A (en) 2016-04-16
TWI663478B true TWI663478B (zh) 2019-06-21

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TW104132366A TWI663478B (zh) 2014-10-03 2015-10-01 矽氧烷樹脂組成物、使用該矽氧烷樹脂組成物之透明硬化物、透明像素、微透鏡、固體攝像元件

Country Status (4)

Country Link
JP (1) JP5799182B1 (ko)
KR (1) KR101787492B1 (ko)
TW (1) TWI663478B (ko)
WO (1) WO2016052658A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6013422B2 (ja) * 2014-10-03 2016-10-25 富士フイルム株式会社 シロキサン樹脂組成物、これを用いた透明硬化物、透明画素、マイクロレンズ、固体撮像素子
JP6001041B2 (ja) * 2014-10-03 2016-10-05 富士フイルム株式会社 シロキサン樹脂組成物、これを用いた透明硬化物、透明画素、マイクロレンズ、固体撮像素子
JPWO2016121263A1 (ja) * 2015-01-29 2017-08-03 富士フイルム株式会社 シロキサン樹脂組成物、これを用いた透明硬化物、透明画素、マイクロレンズ、固体撮像素子
JP7016403B2 (ja) 2018-03-13 2022-02-04 富士フイルム株式会社 硬化膜の製造方法、固体撮像素子の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009024116A (ja) * 2007-07-23 2009-02-05 Sony Corp 硬化性樹脂材料−微粒子複合材料及びその製造方法、光学材料、並びに発光装置
JP2010007057A (ja) * 2008-05-30 2010-01-14 Toray Ind Inc シロキサン系樹脂組成物およびこれを用いた光学デバイス
JP2010106076A (ja) * 2008-10-28 2010-05-13 Panasonic Electric Works Co Ltd コーティング材組成物及び塗装品
TW201431682A (zh) * 2012-12-28 2014-08-16 Fujifilm Corp 紅外線反射膜形成用的硬化性樹脂組成物、紅外線反射膜及其製造方法、以及紅外線截止濾光器及使用其的固體攝影元件

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1930522B (zh) * 2004-03-12 2013-06-12 东丽株式会社 正型感光性树脂组合物、使用该组合物的浮雕图形以及固体成象元件
JP2008280534A (ja) 2007-04-10 2008-11-20 Shin Etsu Chem Co Ltd 光関連デバイス封止用樹脂組成物およびその硬化物ならびに半導体素子の封止方法
WO2014091762A1 (ja) * 2012-12-14 2014-06-19 コニカミノルタ株式会社 Ｌｅｄ装置用封止剤、及びこれを用いたｌｅｄ装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009024116A (ja) * 2007-07-23 2009-02-05 Sony Corp 硬化性樹脂材料−微粒子複合材料及びその製造方法、光学材料、並びに発光装置
JP2010007057A (ja) * 2008-05-30 2010-01-14 Toray Ind Inc シロキサン系樹脂組成物およびこれを用いた光学デバイス
JP2010106076A (ja) * 2008-10-28 2010-05-13 Panasonic Electric Works Co Ltd コーティング材組成物及び塗装品
TW201431682A (zh) * 2012-12-28 2014-08-16 Fujifilm Corp 紅外線反射膜形成用的硬化性樹脂組成物、紅外線反射膜及其製造方法、以及紅外線截止濾光器及使用其的固體攝影元件

Also Published As

Publication number Publication date
JP5799182B1 (ja) 2015-10-21
WO2016052658A1 (ja) 2016-04-07
JP2016074870A (ja) 2016-05-12
KR101787492B1 (ko) 2017-11-15
TW201614377A (en) 2016-04-16
KR20170042341A (ko) 2017-04-18

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