TWI663011B - Welding method - Google Patents

Welding method Download PDF

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TWI663011B
TWI663011B TW106139300A TW106139300A TWI663011B TW I663011 B TWI663011 B TW I663011B TW 106139300 A TW106139300 A TW 106139300A TW 106139300 A TW106139300 A TW 106139300A TW I663011 B TWI663011 B TW I663011B
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solder
flux
temperature
heating
solder paste
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TW201834775A (zh
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角石衛
鵜飼竜史
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日商千住金屬工業股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering

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  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本發明係提供一種防止回焊時焊料的飛散，同時確實去除形成於焊料或電極的表面的氧化膜。
本發明相關的焊接方法，係具有：於印刷基板上的電極塗佈焊膏，於該焊膏上組裝電子組件的步驟；藉由預熱時(區間A)艙體內為真空狀態且作為約180℃加熱印刷基板，使焊膏中含有的無殘渣用助焊劑揮發的步驟；藉由在還原時(區間B)艙體內為甲酸環境且作為約200℃加熱印刷基板，去除形成於電極等的氧化膜的步驟；以及藉由本加熱時(區間C)艙體內為真空狀態且作為250℃加熱印刷基板，使焊膏中含有的焊料粉末熔融的步驟。

Description

焊接方法
本發明關於一種將電子組件焊接於印刷基板上的焊接方法。
一般而言，將電子組件於印刷基板上的電極(焊接部)進行焊接時，焊膏藉由印刷法或吐出法而塗佈於印刷基板的電極，之後，於回焊裝置的艙體內，對此印刷基板預加熱以及藉由本加熱將電子組件焊接於印刷基板上。
焊膏係藉由將焊料粉末與助焊劑混合的接合材料所構成。近年來，回焊後的焊接部中，無須助焊劑殘渣的清洗步驟的無殘渣焊膏在半導體業界或汽車業界等受到廣泛應用。例如，專利文獻1中，記載一種由在常溫為固體，於回焊溫度蒸發的固體溶劑及在常溫為高黏性流體，於回焊溫度蒸發的高黏性溶劑，以及剩餘部分為在常溫為液體，於回焊溫度蒸發的液體溶劑而成的無殘渣焊膏。
此外，作為助焊劑的殘渣對策，已知除了使用上述無殘渣焊膏以外，亦使用無助焊劑(fluxless)的預成形材將電子組件焊接於印刷基板上的技術。例如，專利文獻2中，記載在半導體元件與絕緣金屬基板的接合，使用無助焊劑的焊料預成形材的電源模組。此時，由於回焊使用無助焊劑的預成形 材，故在還原環境中進行。
[先前技術文獻]
[專利文獻]
專利文獻1：日本特開第2004-025305號公報
專利文獻2：日本特開第2008-172120號公報
然而，上述專利文獻1所記載的焊接方法有以下所述的問題。亦即，專利文獻1中記載的焊接方法，由於在本加熱時在助焊劑殘留的狀態在大氣壓下或氮氣環境下使焊料熔融，焊料熔融時助焊劑飛散，由於此助焊劑的飛散促使焊料亦飛散。作為助焊劑飛散的理由，推測係助焊劑中所含有的溶劑成分的殘留之故。
在此，本發明係鑑於上述課題而完成者，其目的係提供一種可防止回焊時焊料的飛散，同時可確實去除形成於焊料或電極的表面的氧化膜的焊接方法。
本發明相關的焊接方法，係具有：將焊接合金與無殘渣用助焊劑經混合而成的焊膏塗佈於基板上的焊接部，於該焊膏上載置電子組件的第1步驟；藉由爐內為真空狀態且作為第1溫度加熱上述基板，使上述焊膏中所含的上述無殘渣用助焊劑揮發的第2步驟；藉由上述爐內為還原環境，作為第2溫度加熱上述基板，去除至少上述焊接部的氧化膜的第3步 驟；以及藉由上述爐內在真空狀態且作為較上述第2溫度更高的第3溫度加熱上述基板，使上述焊膏中所含的焊料熔融的第4步驟。
根據本發明，可防止回焊時焊料的飛散，同時可確實去除形成於焊料或電極的表面的氧化膜。
10‧‧‧印刷基板(基板)
20‧‧‧焊膏
22‧‧‧焊料粉末
24‧‧‧助焊劑
30‧‧‧電子組件
第1A圖係表示本發明一實施形態相關的焊接方法的步驟的一例的示意圖。
第1B圖係表示本發明一實施形態相關的焊接方法的步驟的一例的示意圖。
第1C圖係表示本發明一實施形態相關的焊接方法的步驟的一例的示意圖。
第1D圖係表示本發明一實施形態相關的焊接方法的步驟的一例的示意圖。
第2圖係表示回焊時艙體內的溫度與氣壓的關係之一例的示意圖。
以下參照附加圖示，詳細說明有關於本發明較佳的實施形態。
[焊接方法的步驟例]
第1A圖~第1D圖係表示本發明相關的焊接方法中半導體裝置的製造步驟的一例。第2圖係表示回焊時艙體內的溫度與 氣壓的關係(溫度曲線)之一例。第2圖中，左側的縱軸表示艙體內的溫度，右側的縱軸表示艙體內的氣壓，橫軸表示時間。
作為本實施形態中回焊裝置100，使用利用甲酸還原進行焊接的回焊裝置。且，利用甲酸還原的回焊裝置，由於為已知，故省略詳細說明。
首先，準備與印刷基板10的電極(焊接部)同一處形成有開口部的金屬遮罩，將此金屬遮罩的開口部對準印刷基板10的電極位置後載置於印刷基板10。然後，置於金屬遮罩上的焊膏20藉由刮刀移動而填充於金屬遮罩的開口部內。焊膏20可使用例如將由Sn-3.0Ag-0.5Cu而成的焊接合金與無殘渣用助焊劑混合而成者。調整金屬遮罩的開口部的開口尺寸或厚度，可形成對應任意大小的電極等的焊膏20。接著，如第1A圖所示，將金屬遮罩從印刷基板10上取走後，於焊膏20上載置電子組件30(第1步驟)。
接著，如第1B圖所示，將組裝有電子組件30的印刷基板10運送至回焊裝置100的艙體內。艙體內如第2圖所示，於區間A的預熱時，艙體內呈真空狀態，同時設定於150~180℃(第1溫度)。作為真空度，例如以10~100Pa為佳。藉此，如第1C圖所示，呈焊膏20中含有的助焊劑完全揮發的無殘渣的狀態，印刷基板10上呈僅殘留焊料粉末22的狀態(第2步驟)。且，本實施形態中，如第1C圖所示的助焊劑揮發狀態的「無殘渣」係如上述助焊劑完全地揮發，呈全無助焊劑殘渣的情況外，亦包含幾乎未見助焊劑殘渣，具體而言助焊劑殘渣的量為助焊劑中1質量%以下的情況。
接著，如第2圖所示，區間B的還原中，於回焊裝置100的艙體內供給甲酸，同時艙體內由真空狀態成為大氣壓狀態。此外，於本加熱時艙體內的溫度設定為第1溫度以上但較焊料的熔融溫度更低的溫度(第2溫度)。以設定成較焊料的熔融溫度低10℃~20℃的溫度為佳。如此一來，艙體內供給的甲酸成分使形成於印刷基板10的電極或焊料的表面的氧化膜還原，去除電極或焊料表面的氧化膜。換言之，即使無助焊劑，亦可去除電極或焊料表面的氧化膜(第3步驟)。
接著，如第2圖所示，區間C的本加熱係將艙體內的甲酸予以排氣，同時使艙體內由大氣壓狀態成為真空狀態。作為真空度，例如以10~100Pa為佳。此外，本加熱時艙體內的溫度，以設定成較焊料的熔融溫度高20℃~50℃為佳，較佳為高20℃~30℃的溫度(第3溫度)。如此一來，如第1D圖所示，由於焊料熔融，電子組件30接合於印刷基板10上的電極(第4步驟)。焊料的熔融時，由於助焊劑揮發無殘留，故亦防止焊料的飛散。本實施形態藉由此一連串的步驟，電子組件30隔著焊膏20焊接於印刷基板10上。
(實施例)
接著，變更艙體內的溫度或氣壓等回焊條件，各別檢驗進行回焊時，回焊後的孔洞的發生，助焊劑殘渣，焊料的飛散。回焊裝置使用ATV Technologie Gmbh公司製的SRO 700。
首先，製作由Sn-3.0Ag-0.5Cu而成的焊料粉末，將無殘渣用助焊劑的NRB60與焊料粉末混合而製作焊膏。接 著，於銅板上塗佈焊膏，於此焊膏上載置8mm正方的Si晶片後，變更艙體內的溫度或氣壓等回焊條件進行焊接。最後，進行焊接的銅板使用X射線檢測裝置，進行回焊後孔洞的發生以及焊料的飛散的確認，使用電子顯微鏡進行助焊劑殘渣的確認。
(1)孔洞之評估方法
使X射線的倍率為7倍，藉由影像處理軟體，進行孔洞率的測定。
○：孔洞率為1%以下。
×：孔洞率超過1%。
(2)焊接之評估方法
若焊接可正常進行為○，若無法焊接為×。
表1表示在各回焊條件的回焊後，孔洞的發生，助焊劑殘渣及焊料飛散的結果。
實施例1係如表1所示，確認由於在區間A的預熱時為真空狀態，加熱焊膏使助焊劑完全揮發，即使在回焊後亦無助焊劑殘渣。此外，在區間C的本加熱時，由於助焊劑已經揮發，確認亦無因助焊劑而起的焊料飛散。再者，由於藉由甲酸去除氧化膜，焊接亦可正常進行。焊料的熔融時由於在真空狀態，因此確認亦無孔洞的發生。
相對於此，比較例1係如表1所示，由於在區間A未呈真空狀態，無法使助焊劑完全揮發。因此，於區間C使焊料熔融時，造成助焊劑殘留而成為孔洞。之後，進行本加熱期間殘留的助焊劑揮發，導致焊料的飛散發生。比較例2由於僅進行1分鐘區間B的藉由甲酸之還原，未充分去除氧化膜而殘留，無法進行焊接。比較例3在區間C未呈真空狀態。此外，在區間B藉由甲酸進行去除氧化膜，即使停止供給甲酸，由於在焊料的周圍有甲酸殘留，因此使焊料熔融時，甲酸殘留而成為孔洞。
如以上說明，根據本實施形態，由於預熱時間設定成較以往更長，同時艙體內呈真空狀態，因此在預熱時助焊劑可完全揮發，可確實地防止在焊料熔融時焊料的飛散。此外，即使此情況，由於採用甲酸環境回焊，可進行無助焊劑的焊接。雖然使用甲酸進行回焊，在氫等還原環境進行回焊亦可。如此一來，可無孔洞地防止焊料飛散並進行焊接，且可省略助焊劑清洗步驟。此外，助焊劑即使不包含去除氧化膜必要的活性劑亦可。
此外，根據本實施形態，由於使用金屬遮罩將焊膏20塗佈於電極上，焊料粉末22即使焊料粉末中盡可能地以各種組成皆可使用。例如作為預成形，難以加工的不易加工性的Sn-Sb系或Bi-Sn系焊料等亦可使用。作為不易加工性的條件，係焊接合金的抗張強度(抗張性)為55MPa以上，拉伸(斷裂拉伸)為40%以下，0.2%耐力(偏向法，offset)為40MPa以上。拉伸係與金屬加工相關的特性，拉伸率越小形成加工越困難。抗張性、斷裂拉 伸、0.2%耐力的各測定方法係以JIS Z 2241為準則。0.2%耐力係開始可塑性變形時的荷重，此值越高加工時必要的力越大。抗張強度亦有作為求得沖壓加工時必要的力的指標使用的情況，此值越高沖壓加工越困難。滿足此等條件時，焊料無法薄地拉伸，進行沖壓時，發生龜裂或斷片。作為顯示此等特性的焊接合金，可列舉例如含有Sb為10質量%以上的Sn-Sb系焊接合金或含有Bi為80質量%以上的Bi-Sn系焊接合金。此外，藉由調整金屬遮罩的開口徑或厚度，可對應半導體元件或電極的形狀或大小，形成任意大小的焊膏20。換言之，即使使用不易加工性的焊料材料的情況，亦可自由設計焊料形狀。
且，雖然本發明利用實施形態進行說明，然而，本發明的技術性範圍不限定於上述實施形態所記載的範圍。在不脫離本發明主旨的範圍，對於上述實施形態可多樣化地變更或加以改良。

Claims (3)

  1. 一種焊接方法，係具有：將由焊接合金與無殘渣用助焊劑混合而成的焊膏塗佈於基板上的焊接部，於該焊膏上載置電子組件的第1步驟；藉由爐內為真空狀態且作為第1溫度加熱上述基板，使上述焊膏中所含的上述無殘渣用助焊劑揮發而成為無殘渣的狀態(助焊劑殘渣的量為助焊劑中的1質量%以下)的第2步驟；藉由上述爐內為還原環境，作為第2溫度加熱上述基板，去除至少上述焊接部的氧化膜的第3步驟；以及藉由上述爐內為真空狀態且作為較上述第2溫度更高的第3溫度加熱上述基板，使上述焊膏中所含的焊料熔融的第4步驟。
  2. 根據申請專利範圍第1項之焊接方法，其中，上述第1步驟中，使用對應上述基板上的上述焊接部的部分具有經開口的開口部的金屬遮罩，於上述基板上的上述焊接部塗佈上述焊膏。
  3. 根據申請專利範圍第1或2項之焊接方法，其中，上述焊接合金係抗張強度為55MPa以上，拉伸為40%以下，0.2%耐力為40MPa以上。
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