TWI658162B - Vacuum evaporation device - Google Patents

Abstract

Provided is a vacuum vapor deposition apparatus capable of reducing the influence of particles as much as possible on an attached matter. The vacuum vapor deposition device (DM) of the present invention includes a vapor deposition source (3) disposed in a vacuum chamber (1). The vapor deposition source includes a storage box (31) for storing a vapor deposition substance (Vm), And a heating means (33) for sublimating or vaporizing the vapor deposition material, the storage box is provided with a spraying part (32) for the vaporization material that is sublimated or vaporized, and the spraying part is located in the vacuum chamber The object to be plated (S) is more vertically upward, and the ejection part has an ejection port (32b) inclined obliquely downward to the vertical direction, so that the vapor deposition material is ejected from the ejection port toward the object to be plated, and the storage box is directed toward the object. The end portions of the plated object are separated from each other.

Description

Vacuum evaporation device

[0001] The present invention relates to a vacuum evaporation device. More specifically, it relates to a sublimation or vaporization of a vapor deposition material ejection portion provided in a storage box in a direction that is more vertical than a coating object in a vacuum chamber. Those who reduce the attachments above.

[0002] As such a vacuum evaporation apparatus, for example, a vacuum evaporation apparatus of Patent Document 1 is known. In this case, a substrate conveying means for conveying a substrate is provided below the vertical direction of the vacuum chamber in one direction of the vacuum chamber, and a vapor deposition source is disposed to face the upper portion. The vapor deposition source is a tube-shaped storage box for arranging substrates across the substrate. In the lower part of the storage box, the outlets of the vapor deposition materials are arranged at predetermined intervals along the longitudinal direction. . In addition, the vapor deposition substance is heated by the heater and sublimated or vaporized in the storage box, and the sublimated or vaporized person is ejected from the ejection port toward the substrate, and the substrate is coated. [0003] Here, the vapor deposition material that is sublimated or vaporized in the storage box is not only ejected from the ejection port toward the substrate, but also adheres to and accumulates on the outer surface portion of the storage box located around the ejection port. . In this case, the deposited and deposited material becomes a source of generation of particles. Therefore, as in the conventional example, if a storage box is provided across the substrate, the vapor deposition substance attached to the storage box will fall down as particles, and the problem of adhesion to the substrate will occur, which will cause the product yield to decrease. And other issues. [Prior Art Document] [Patent Document] [0004] [Patent Document 1] Japanese Patent No. 4216522

[Problems to be Solved by the Present Invention] [0005] In view of the foregoing, the present invention has as its object to provide a vacuum vapor deposition apparatus that can reduce the effect of particles as much as possible by an attachment reduction method. [Means for Solving the Problems] 0006 [0006] In order to solve the above-mentioned problems, the vacuum vapor deposition device of the present invention includes a vapor deposition source disposed in a vacuum chamber. The vapor deposition source includes a storage box for storing a vapor deposition substance, And the heating means for sublimating or vaporizing the vapor deposition material is provided in the storage box with a spraying part that sprays the vapor of the vaporized vaporization material that is sublimated or vaporized, and the spraying part is a coating film located in a vacuum chamber. The object is more vertically upward, and the ejection part has an ejection port inclined downward with respect to the vertical direction. The vapor of the vapor deposition substance is ejected from the ejection port toward the object to be coated, and the storage box is separated from the end of the object to be coated. The position is offset. [0007] According to the present invention, when the sublimated or vaporized vapor deposition material is ejected from the ejection port toward the substrate in the storage box, the vapor deposition material also adheres to and accumulates on the outer surface of the storage box, even if particles are generated. The source falls downward, but because the storage box is disposed offset, it becomes difficult to attach to the object to be coated. As a result, the influence of fine particles can be reduced as much as possible. [0008] In the present invention, it is preferable that the heating means heats the storage box, and heats the vapor deposition material by radiant heat from the storage box. Thereby, even if the vapor deposition material adheres to the outer surface of the storage box, the storage box itself is heated, so that the vapor deposition material is sublimated or vaporized again. Therefore, it is difficult and advantageous to form a microparticle generation source. [0009] The valve plate is disposed close to the ejection port to prevent the vapor of the vapor deposition material from the ejection port from being ejected toward the object to be plated, and the valve plate can move back and forth in a vertical direction. The valve plate is toward the end from the object to be plated. It is preferable that the part separation direction is shifted. This makes it difficult for the vapor deposition substance adhering to the shutter plate to adhere to the object to be plated even if the particles fall downward. [0010] Furthermore, it is preferable to have a holding portion that horizontally arranges the object to be plated. Here, level does not mean strictly horizontal, but means substantially horizontal. Further, it is preferable to further include a driving means for rotationally driving the holding portion around an axis in the vertical direction. This can improve the film thickness distribution. [0011] In the case where the object to be coated is a substrate that is long in one direction, and the substrate is coated with respect to the vapor deposition source while being relatively moved in one direction in the vacuum chamber by the moving means, the substrate of the vapor deposition source will be coated. The relative movement direction of X is set to the X-axis direction, and the width direction of the substrate perpendicularly crossing the X-axis direction is set to the Y-axis direction. In the aforementioned storage box, the ejection sections are preferably arranged at predetermined intervals in the Y-axis direction. In this case, depending on the width of the substrate, in order to improve the uniformity of the film thickness distribution, the vapor deposition sources may be arranged on both sides in the Y-axis direction.

[0013] Hereinafter, referring to the drawings, the object to be coated is a glass substrate (hereinafter referred to as "substrate S") having a predetermined thickness having a rectangular outline, and a case where a predetermined thin film is coated on one side of the substrate S is taken as an example. An example of the vacuum evaporation apparatus of this invention is demonstrated. [0014] Referring to FIGS. 1 and 2, the vacuum evaporation apparatus DM includes a vacuum chamber 1. Although not specifically illustrated in the vacuum chamber 1, a vacuum pump is connected through the exhaust pipe, and the vacuum chamber 1 can be evacuated and maintained at a predetermined pressure (degree of vacuum). A substrate transfer device 2 is provided at a lower portion of the vacuum chamber 1 in the vertical direction. The substrate transfer device 2 includes a carrier 21 that holds the substrate S in a state where the upper surface serving as a coating surface is opened, and the carrier 21 and the substrate S are directed in one direction of the vacuum chamber 1 by a driving device (not shown). Move at the specified speed. Since the substrate transfer device 2 can be used by a publicly known person, the above description is omitted. However, in this embodiment, the substrate transfer device 2 relatively moves the substrate S in a direction in the vacuum chamber 1 with respect to a vapor deposition source described later. Means of movement. In the following, the relative movement direction of the substrate S to the vapor deposition source is set to the X-axis direction, and the width direction of the substrate S perpendicularly crossing the X-axis direction is set to the Y-axis direction. [0015] In the vacuum chamber 1, a vapor deposition source 3 is provided which is located in a more vertical direction than the substrate S. The vapor deposition source 3 is a storage box 31 having a vapor deposition substance Vm appropriately selected corresponding to a thin film to be deposited on the substrate S. In this case, the storage box 31 has a rectangular parallelepiped shape that is long in the Y-axis direction. Among the corners in the Y-axis direction below the storage box 31, a plurality of ejection nozzles 32 as ejection sections formed of a cylinder are in the Y-axis direction. Provision is protruded at intervals. In this case, the ejection nozzle 32 is such that the hole axis 32a of the nozzle hole is inclined at a predetermined angle with respect to the vertical direction, and the ejection port 32b at the tip thereof is inclined downward in the vertical direction. In this case, the inclination angle of the hole axis 32a is based on the uniformity of the width of the substrate S, the ejection distribution of the vapor deposition material Vm from the ejection nozzle 32 caused by the vapor deposition material Vm, and the uniformity of the film thickness of the thin film formed on the substrate S. Etc. are set appropriately. [0016] The heating wire 33 as a heating means is wound around the storage box 31 including the ejection nozzle 32, and the power can be supplied to the storage box 31 across the entire body by applying power from a power source not shown in the figure. In addition, by heating the storage box 31 and heating the vapor deposition substance Vm in the container 31a by radiant heat from the storage box 31, the vapor deposition substance Vm can be sublimated or vaporized. Although not specifically illustrated, a dispersion plate is provided in the storage box 31. The storage box 31 can be heated to sublimate or vaporize the vapor deposition substance Vm inside, and this can be sublimated or vaporized. The vapor deposition material Vm is ejected from each ejection nozzle 32 approximately uniformly. The method of heating the storage box 31 substantially uniformly is not limited to the above. Further, the heating means for directly heating the vapor deposition substance Vm in the container 31a may not be separately provided. For example, a heating wire as another heating means is wound around the container 31a and is energized, and the vapor deposition substance Vm is borrowed. Heating by heat transfer is also possible. [0017] The storage box 31 configured as described above is disposed so that the ejection port 32b of the ejection nozzle 32 is shifted from a position separated from one end in the Y-axis direction of the substrate S. In this case, the interval DS between the discharge port 32b and one end in the Y-axis direction of the substrate S can be appropriately set in consideration of the uniformity of the film thickness of the thin film formed on the substrate S, and the like. In the vacuum chamber 1, a shutter plate 4 is provided, which is arranged close to the ejection port 32 b of the ejection nozzle 32 to prevent the vapor of the vapor deposition material from the ejection port 32 b from being ejected toward the substrate S in a vertical direction. The shutter plate 4 moves to the shielding position shown by the broken line in the figure until the discharge of the vapor deposition material Vm from the discharge nozzle 32 becomes stable, and if the discharge is stable, moves to the discharge position shown by the solid line in the figure. The driving means for reciprocating the shutter plate 4 between these two positions can use a well-known constructor, so the description is omitted here. The shutter plate 4 is also shifted in a direction separated from one end in the Y-axis direction of the substrate S. The lower end of the shutter plate 4 is bent in an L shape toward the storage box 31. [0018] According to the above embodiment, when the sublimated or vaporized vapor deposition material Vm is ejected from the ejection port 32b toward the substrate S in the storage box 31, the vapor deposition material Vm also adheres to and accumulates in the storage box 31. Even if the outer surface falls downward as a source of generation of particles, the storage box 31 is disposed offset, so that it is difficult to adhere to the substrate S. As a result, the influence of fine particles can be reduced as much as possible. The heating means 33 is configured to heat the storage box 31 and heat the vapor deposition material Vm by radiant heat from the storage box 31. Even if the vapor deposition material Vm is attached to the storage box 31 including the ejection port 32b, The surface and the outside are heated by the storage box 31 itself, so that the vapor deposition material Vm is sublimated or vaporized again. Therefore, it is difficult and advantageous to form a microparticle generation source. The shutter plate 4 is shifted in a direction away from the end portion of the substrate S, and the lower end of the shutter plate 4 is preferably bent in an L shape toward the storage box 31. Therefore, similar to the above, even if the vapor deposition substance adhering to the shutter plate 4 falls down as particles, it is difficult to adhere to the substrate. [0019] Although the embodiments of the present invention have been described above, the present invention is not limited to the above. Although the above embodiment has described an example in which a plurality of ejection nozzles 32 are provided in the storage box 31, only one ejection nozzle 32 may be provided, and a circular or slit-shaped opening may be provided at a corner of the storage box. A hole may be used as this ejection portion. [0020] However, when the storage box 31 is shifted, depending on the width of the substrate S, the film thickness distribution may not be substantially uniform. In this case, as shown in FIG. 3, in the vacuum chamber 1, the storage boxes 31 may be disposed on both sides in the width direction of the substrate S, respectively. In this case, the hole shaft 32a of each of the discharge nozzles 32 may be appropriately changed in arrangement. In addition, as shown in FIG. 4, the substrate S can be set on the rotary table 5 and can be coated while being rotated by a predetermined number of rotations. The rotating platform 5 can be used. A rotating shaft 53 having a plate-shaped holding portion 51 for horizontally holding the substrate S, and a driving means 52 such as a motor is connected to the holding portion 51. The holding portion 51 is driven by the driving means 52. A known person is driven to rotate around the rotation shaft 53. With this configuration, the film thickness distribution can be improved. [0021] In order to improve the film thickness distribution, the evaporation source 3 or the substrate S may be moved. For example, at least one of the vapor deposition source 3 and the substrate S is changed so that the storage box 3 is maintained in a state of being offset from the substrate S, and the distance DS between the vapor deposition source 3 and the substrate S is changed. Mobile is also possible. Alternatively, the vapor deposition source 3 may be moved up and down, and the vapor deposition source 3 may be swung at a predetermined angle around an axis extending in the juxtaposed direction (X-axis direction) of the discharge nozzles 32. [0022] Further, in the above-mentioned embodiment, although the object to be coated is a glass substrate, and the glass substrate is transported at a constant speed while being coated by the substrate transfer device 2, the configuration of the vacuum evaporation device is not described. Limited to the above. For example, the present invention can also be applied to an apparatus for coating a single-sided surface of a substrate by using an object to be coated as a sheet-like substrate and moving the substrate at a constant speed between a driving roller and a take-up roller. In addition, the object to be coated is assembled in the vacuum chamber 1 and a driving means having a known structure is attached to the evaporation source. The present invention is also applicable to a case where the object to be coated is coated while the evaporation source 3 is relatively moved. Furthermore, although the example in which the ejection nozzles 32 are arranged in a row in the storage box 31 has been described, a plurality of rows may be provided.

[0023]

DM‧‧‧Vacuum evaporation device

S‧‧‧ substrate (coated object)

Vm‧‧‧Evaporation substance

1‧‧‧vacuum chamber

2‧‧‧ substrate transfer device (holding unit, moving means)

3‧‧‧ evaporation source

4‧‧‧ valve plate

5‧‧‧ rotating platform

21‧‧‧ carrier

31‧‧‧Storage Box

31a‧‧‧container

32‧‧‧Ejection nozzle (ejection section)

32a‧‧‧hole shaft

32b‧‧‧jet outlet

33‧‧‧ Electric hotline (heating means)

51‧‧‧holding department

52‧‧‧Driving means

53‧‧‧Rotating shaft (axis)

[0012] 第 [FIG. 1] An embodiment of the vacuum evaporation apparatus of the present invention will be described, and a part is a partial perspective view in cross section.第 [Fig. 2] A diagram illustrating the arrangement relationship between a substrate and a vapor deposition source. [Fig. 3] A diagram illustrating a modified example of the vapor deposition source. [Fig. 4] A diagram illustrating a modification of the vacuum vapor deposition apparatus.

Claims (6)

A vacuum evaporation device is provided with an evaporation source disposed in a vacuum chamber. The evaporation source includes a storage box for storing a vapor deposition substance and a heating means for heating the sublimation material or vaporizing the vapor deposition substance. For: The storage box is provided with a spouting portion that spouts the vapor of the vaporized substance that is sublimated or vaporized. The spouting portion is located more vertically than the coating object in the vacuum chamber. The spouting portion has a vertical The ejection port inclined in the downward direction causes the vapor of the vapor deposition material to be ejected from the ejection port toward the object to be plated, and the storage box is arranged to be offset from a position separated from the end of the object to be plated. For example, the vacuum evaporation device according to the first scope of the patent application, wherein the heating means is to heat the storage box and heat the vapor deposition material by radiant heat from the storage box. For example, the vacuum vapor deposition device according to item 1 or 2 of the patent application scope includes a vacuum vapor deposition device disposed close to the ejection outlet to prevent the vapor of the vapor deposition material from the ejection outlet from being ejected toward the object to be plated in a vertical direction. The shutter plate is disposed so as to be offset from a direction away from an end portion of the object to be coated. For example, the vacuum evaporation device according to item 1 or 2 of the patent application scope includes a holding portion for horizontally holding an object to be plated. The vacuum vapor deposition apparatus according to item 4 of the patent application, further comprising driving means for rotating the holding portion around a vertical axis as a center. For example, the vacuum evaporation device of the scope of application for patents No. 1 or 2, wherein the object to be coated is a substrate that is long in one direction, and the substrate is relatively moved while moving the substrate with respect to the evaporation source in a direction in the vacuum chamber by moving means. For coating, set the relative movement direction of the substrate to the evaporation source to the X-axis direction, and set the width direction of the substrate that intersects the X-axis direction to the Y-axis direction. In the storage box, the ejection part is in the Y-axis direction. The predetermined interval is set.