TWI657920B - 絕緣膜與包含絕緣膜之電子部件 - Google Patents
絕緣膜與包含絕緣膜之電子部件 Download PDFInfo
- Publication number
- TWI657920B TWI657920B TW104119835A TW104119835A TWI657920B TW I657920 B TWI657920 B TW I657920B TW 104119835 A TW104119835 A TW 104119835A TW 104119835 A TW104119835 A TW 104119835A TW I657920 B TWI657920 B TW I657920B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- layer
- insulating film
- electronic component
- plastic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/08—Interconnection of layers by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/02—Synthetic macromolecular particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/105—Metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
- B32B2264/108—Carbon, e.g. graphite particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/04—Insulators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
- Y10T428/31728—Next to second layer of polyamide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
- Y10T428/31736—Next to polyester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
- Y10T428/3175—Next to addition polymer from unsaturated monomer[s]
- Y10T428/31757—Polymer of monoethylenically unsaturated hydrocarbon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
- Y10T428/31797—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31913—Monoolefin polymer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Insulating Bodies (AREA)
Abstract
本發明提供絕緣膜和製作絕緣膜的方法,包含膜上層和膜下層,其中膜上層和膜下層均由導熱塑料製成,導熱塑料含有導熱添加劑;及膜中間層,位於膜上層與膜下層之間。膜中間層由導熱塑料製成,導熱塑料含有導電添加劑。膜中間層的上表面與膜上層的下表面結合在一起,膜中間層的下表面與膜下層的上表面結合在一起。
Description
本發明係關於絕緣膜。
絕緣膜用於隔離各種電子裝置或部件,以免電子裝置或部件間或電子裝置或部件的電子元件短路、故障而失靈,及降低電子裝置或部件著火的風險,以確保各種電子元件正常操作。例如,絕緣膜可置於含有各種電路的印刷電路板(PCB)與用於防止EMI(電磁干擾)的金屬外殼(例如鋁或銅殼)之間,以避免諸如PCB的各種元件與金屬外殼接觸短路等問題。為使用絕緣膜,絕緣膜需具有不同操作性質。另外,特定絕緣膜性質要求指標因不同絕緣需求而異。
因此,期提供以低成本製造且具優越性質的絕緣膜。
本發明提供絕緣膜,包含膜上層、膜中間層和膜下層,其中膜上層和膜下層由導熱塑膠製成,導熱塑膠含有塑膠(例如PC、PET、PI、PP、PA等)與導熱添加劑(例如金剛砂、氮化硼和金屬氧化物等),以符合絕緣性和熱導性;膜中間層位於膜上層與膜下層之間。膜中間層由塑膠(例如PC、PET、PI、PP、PA等)與導電添加劑(例如碳黑、碳纖、金屬粉末和導電聚合物等)製成,以符合電導性、熱導性和機械韌性。膜中間層的上表面與膜上層的下表面結合在一起,膜中間層的下表面與膜下層的上表面結合在一起。
本發明進一步提供絕緣膜,包含膜上層和膜下層,其中膜上層由
導熱塑膠製成,導熱塑膠含有塑膠(例如PC、PET、PI、PP、PA等)與導熱添加劑(例如金剛砂、氮化硼和金屬氧化物等),以符合絕緣性和熱導性;膜下層由塑膠(例如PC、PET、PI、PP、PA等)與導電添加劑(例如碳黑、碳纖、金屬粉末和導電聚合物等)製成,以符合電導性、熱導性和機械韌性。膜上層的下表面與膜下層的上表面結合在一起。
100‧‧‧絕緣膜
100’‧‧‧膜
101‧‧‧上層
102‧‧‧中間層
103‧‧‧下層
200‧‧‧膜
201、202‧‧‧層
500‧‧‧共擠生產線
501、502‧‧‧擠出機
503‧‧‧分配器
504‧‧‧模頭
505‧‧‧成形輥設備
505.1、505.2、505.3‧‧‧成形輥
506、507‧‧‧管
509、515‧‧‧進料斗
510、516‧‧‧容納腔
511、517‧‧‧導螺桿
512、514、518、520‧‧‧入口
513、519、524‧‧‧出口
521-523‧‧‧支線
525‧‧‧導管
526‧‧‧模穴
600‧‧‧共擠生產線
601-603‧‧‧擠出機
604‧‧‧分配器
605‧‧‧模頭
607-609‧‧‧管
610‧‧‧成形輥設備
610.1、610.2、610.3‧‧‧成形輥
611-613‧‧‧進料斗
614-616‧‧‧容納腔
617-619‧‧‧導螺桿
620、622、623、627-629‧‧‧入口
624-626、633‧‧‧出口
630-632‧‧‧支線
634‧‧‧導管
635‧‧‧模穴
700‧‧‧複合生產線
701‧‧‧上層
702‧‧‧中間層
703‧‧‧下層
704.1、704.2‧‧‧壓輥
800‧‧‧複合生產線
801‧‧‧上層
802‧‧‧中間層
803‧‧‧下層
804.01、804.02‧‧‧壓輥
805-807‧‧‧烘爐
900‧‧‧電子裝置
902‧‧‧絕緣膜
910‧‧‧屏蔽介層
第1圖係根據本發明一實施例的絕緣膜示意圖;第2圖係沿第1圖線A-A截切的第1圖絕緣膜截面圖;第3圖係根據本發明另一實施例的絕緣膜示意圖;第4圖係沿第3圖線B-B截切的第3圖絕緣膜截面圖;第5圖係根據本發明一實施例,用於製造絕緣膜的共擠製程示例圖;第6圖係根據本發明一實施例,用於製造絕緣膜的另一共擠製程示例圖;第7圖係根據本發明一實施例,用於製造絕緣膜的複合製程示例圖;第8圖係根據本發明一實施例,用於製造絕緣膜的複合製程示例圖;第9圖圖示電子裝置(例如轉接器)900的傳統結構;第10圖圖示電子裝置(例如轉接器)的結構細部。
第1圖圖示根據本發明一實施例,絕緣膜100的示意圖。根據本發明一實施例,絕緣膜100的厚度為0.05毫米(mm)-3.0mm。第2圖係沿第1圖線
A-A截切的第1圖絕緣膜100的截面圖。如第2圖所示,絕緣膜100包含上層101、中間層102和下層103。
絕緣膜100的上層101和下層103由絕緣材料製成,絕緣材料可為
含導熱添加劑(例如金剛砂、氮化硼和金屬氧化物等)的塑膠(例如PC、PET、PI、PP、PA等),以提供絕緣與熱導性。絕緣膜100的中間層102位於絕緣膜100的上層101與下層103之間,且由塑膠(例如PC、PET、PI、PP、PA等)與導電添加劑(例如碳黑、碳纖、金屬粉末和導電聚合物等)製成,以符合電導性、熱導性和機械韌性。膜中間層102的上表面與膜上層101的下表面結合在一起,膜中間層102的下表面與膜下層103的上表面結合在一起。
普通絕緣材料並不導熱。雖然目前市場上已有塗覆熱導黏著劑的
導熱絕緣膜來增加熱導性,但此通常只能用作界面導熱絕緣材料(不同材料的接觸表面稱為界面;界面導熱絕緣材料係需表面接觸的導熱絕緣材料,例如電子部件表面與冷卻片表面間的界面導熱絕緣材料),因黏著劑的機械性質不佳且黏著劑很黏,使用起來並不方便。此外,耐受電壓(或崩潰電壓)很低。無黏著劑的導熱絕緣膜改質後通常具熱塑性,但導熱熱塑材料通常易碎、不耐衝擊又不耐摺疊,故無法製作成一定薄度的片膜(例如0.2-0.8mm),以便於使用。
目前產品需具非表面導熱絕緣性時,只能增加金屬冷卻片數量及改善部件耐熱梯度來符合使用要求。然此會增加製造成本。
本發明的絕緣膜100具有下列優點:(1)本發明絕緣膜的中間層的導電材料使用具良好機械韌性或經改質提高韌性的材料,故易碎導熱絕緣材料可附接至具良好機械韌性的中間層材料,及降低表面層變脆的可能性。故整體觀之,材料符合沖壓及摺疊或類似處理要求;
(2)本發明中間層的導電材料(厚度可薄至0.03mm)用於屏蔽電磁輻射且整體可形成一定的機械強度,故可取代客戶目前用於電子產品的厚金屬片,是以方便客戶設計及降低成本;(3)如同上層和下層,中間層亦具良好熱導性,故材料具有良好熱導性(熱係數高達2.0W/(m.K))。此外,本發明絕緣膜具有絕緣、熱導及屏蔽電磁輻射的所有功能。
對熟諳此技術者來說,想到把導電添加劑(或材料)加入絕緣膜並不簡單(或顯而易見),因為絕緣膜傳統上係用於執行電子部件間的絕緣功能。
透過長期觀察發現,使用絕緣材料的產品(例如膝上型電腦的電源轉接器)需用於一些電子產品內,電路板則需被金屬片圍繞,以屏蔽電磁輻射。金屬片通常較厚(約0.3mm至0.6mm),以符合產品要求(例如散熱與強度要求)。本發明使用絕緣膜處理絕緣零件可省略電子產品內的金屬片,並仍維持散熱與屏蔽電磁輻射的功能。相較於本發明,傳統電子產品不僅需有更多金屬片來達成散熱與屏蔽電磁輻射的功能,處理上也更為複雜(例如,金屬片和絕緣零件需各自沖壓、摺疊、組裝來圍繞電路板),且處理成本更高、獲得缺陷產品的機會更大。
另發現,目前絕緣膜監管標準(例如國際標準UL-60950或IEC-60950)要求若單層絕緣膜需補充絕緣或加強絕緣,則由同質材料製成的單層絕緣膜厚度為至少0.4mm。然UL標準未對包含不可分層的多層絕緣膜加諸厚度要求。UL標準要求包含不可分層的多層絕緣膜的壓電阻提高50%至100%,並要求包含不可分層的多層絕緣膜通過附加心軸試驗。即,即使包含不可分層的多層絕緣膜厚度小於0.4mm,只要通過嚴格耐壓試驗和附加心軸試驗,仍視為符合監管標準。本發明絕緣膜係具不可分多層且由不同材料製成的多層絕緣
膜,實驗後發現,本發明絕緣膜的材料的確可通過嚴格耐壓試驗和附加心軸試驗。因此,為符合監管標準要求,絕緣膜厚度可小於0.4mm。換言之,相較於習知單層絕緣膜,根據本發明的絕緣膜可具較小厚度,例如絕緣膜厚度可從0.43mm減至0.25mm或更薄,同時根據本發明的絕緣膜可通過嚴格耐壓試驗和附加心軸試驗,從而節省材料及削減製造成本。
第3圖係根據本發明另一實施例,膜200的示意圖。絕緣膜200與
第1圖絕緣膜100的差異只在於絕緣膜200具有二層結構。第2圖絕緣膜200的第一層201由和第1圖絕緣膜100的第一層101一樣的材料製成;第2圖絕緣膜200的第二層202由和第1圖絕緣膜100的第二層102一樣的材料製成。
第5圖圖示根據本發明一實施例,共擠製程的共擠生產線500,用
以製造絕緣膜100。如第5圖所示,共擠生產線500包含第一擠出機501和第二擠出機502。第一擠出機501包含進料斗509和容納腔510。進料斗509配置以接收含導熱添加劑(例如金剛砂、氮化硼和金屬氧化物等)的塑膠(例如PC、PET、PI、PP、PA等)粒子。容納腔510配有導螺桿511。進料斗509的出口連接容納腔510的前端入口512,容納腔510的後端出口513連接管506的入口,管506的出口連接分配器503的第一入口514。第二擠出機502包含進料斗515和容納腔516。進料斗515配置以接收含導電添加劑(例如碳黑、碳纖、金屬粉末和導電聚合物等)的塑膠(例如PC、PET、PI、PP、PA等)。容納腔516配有導螺桿517。進料斗515的出口連接容納腔516的前端入口518,容納腔516的後端出口519連接管507的入口,管507的出口連接分配器503的第二入口520。
分配器503的第一入口514連接第一支線521的入口與分配器的第
二支線522的入口,分配器503的第二入口520連接第三支線523的入口。如第5圖所示,第三支線523位於第一支線521與第二支線522之間。第一支線521的出口、第二支線522的出口和第三支線523的出口於分配器的出口524會合。分配器的出
口524連接至導管525的入口,導管525的出口連接模頭504的模穴526的入口。模頭504的模穴526具有適當寬度與深度,使模穴足以容納自分配器管輸送的材料,模穴526係平的,如此自分配器管輸送的材料得在其內模壓成扁平狀。模壓材料經由模穴526的出口輸送到成形輥設備505。成形輥設備505包含複數個彼此相鄰放置的成形輥。自模頭的模穴輸送到成形輥設備的材料在複數個成形輥間拉伸、滾壓及冷卻而達預定厚度及形成片材。第5圖圖示三個成形輥505.1、505.2、505.3。其他實施例可採用二或更多成形輥。
根據第5圖所示共擠生產線500,根據本發明的絕緣膜100依下列
程序製造。
製造期間,加熱第一擠出機501和第二擠出機502的容納腔510、
516,及轉動第一擠出機501和第二擠出機502的導螺桿511、517。含導熱添加劑(例如金剛砂、氮化硼和金屬氧化物等)的塑膠(例如PC、PET、PI、PP、PA等)粒子供給到第一擠出機501的進料斗509。第一擠出機501的導螺桿511旋轉可將進料斗509中含導熱添加劑的塑膠粒子推進容納腔510。由於容納腔510經加熱,含導熱添加劑的塑膠粒子在進入容納腔510後會因摩擦產生的熱而熔化及呈熔融態。受導螺桿511旋轉產生的推進力影響,含導熱添加劑的熔融態塑膠將輸送到容納腔510的後端出口513。導螺桿511旋轉產生的推進力能使含導熱添加劑的熔融態塑膠從容納腔510的後端出口513流出容納腔510,接著經由管506的入口進入管506,管506的入口連接容納腔510的後端出口513。含導熱添加劑的熔融態塑膠經由管506的出口流出而至分配器503的第一入口514。在分配器的第一入口514,含導熱添加劑的熔融態塑膠分成兩流:其一流入分配器的第一支線521而變成含導熱添加劑的第一熔融塑膠,另一流入分配器的第二支線522而變成含導熱添加劑的第二熔融塑膠。
同樣地,含導電添加劑(例如碳黑、碳纖、金屬粉末、導電聚合
物等)的塑膠(例如PC、PET、PI、PP、PA等)粒子供給到第二擠出機502的進料斗515。第二擠出機502的導螺桿517旋轉可將進料斗515中含導電添加劑的塑膠粒子推進容納腔516。由於容納腔516經加熱,含導電添加劑的塑膠粒子在進入容納腔516後會因摩擦產生的熱而熔化及呈熔融態。受導螺桿517旋轉產生的推進力影響,含導電添加劑的熔融態塑膠將輸送到容納腔516的後端出口519。
導螺桿517旋轉產生的推進力能使含導電添加劑的熔融態塑膠從容納腔516的後端出口519流出容納腔516,接著經由管507的入口進入管507,管507的入口連接容納腔516的後端出口519。含導電添加劑的熔融態塑膠經由管507的出口流出而至分配器503的第二入口520,及經由第二入口520進入分配器的第三支線523。
應注意到,含導電添加劑之塑膠粒子的操作係與前述含導熱添加劑之塑膠粒子的操作同時進行。
進入分配器503的第一支線521的含導熱添加劑的第一熔融塑
膠、進入分配器503的第三支線523的含導電添加劑的熔融態塑膠和進入分配器503的第二支線522的含導熱添加劑的第二熔融塑膠將於分配器的出口524會合而疊加在一起,接著經由連接分配器出口524的導管525進入模頭504的模穴526,使熔融PP得在模穴526內模壓成扁平熔融體。模壓扁平熔融體輸送到成形輥505.1與505.2之間,以接收成形輥505.1與505.2施予的拉伸及壓緊力,同時由成形輥505.1與505.2冷卻而形成預定厚度的片或膜100’。膜100’繼續供給到成形輥505.2與505.3之間,以進一步冷卻或退火而形成根據本發明一實施例的絕緣膜或片100。若有需要,輸出自模頭的模壓扁平熔融體可只行經兩個成形輥或超過兩個成形輥而成膜。
第6圖圖示根據本發明一實施例,另一共擠製程的共擠生產線
600,用以製造絕緣膜100。如第6圖所示,共擠生產線600包含第一擠出機601、
第二擠出機602和第三擠出機603。第一擠出機601、第二擠出機602和第三擠出機603各自包含進料斗611、612、613、容納腔614、615、616和導螺桿617、618、619。第一和第三擠出機的進料斗611、613配置以接收含導熱添加劑(例如金剛砂、氮化硼和金屬氧化物等)的塑膠(例如PC、PET、PI、PP、PA等)粒子。
第二擠出機的進料斗612配置以接收含導電添加劑(例如碳黑、碳纖、金屬粉末和導電聚合物等)的塑膠(例如PC、PET、PI、PP、PA等)粒子。第一擠出機601的進料斗611的出口連接容納腔614的前端入口620,容納腔614的後端出口624連接管607的入口,管607的出口連接分配器604的第一入口627。同樣地,第二擠出機602的進料斗612的出口連接容納腔615的前端入口622,容納腔615的後端出口625連接管608的入口,管608的出口連接分配器604的第二入口628。第三擠出機603的進料斗613的出口連接容納腔616的前端入口623,容納腔616的後端出口626連接管609的入口,管609的出口連接分配器604的第三入口629。
分配器604的第一入口627連接分配器的第一支線630的入口,分
配器604的第二入口628連接分配器的第二支線631的入口,分配器604的第三入口629連接分配器的第三支線632的入口。如第6圖所示,第二支線631位於第一支線630與第三支線632之間。第一支線630的出口、第二支線631的出口和第三支線632的出口於分配器的出口633會合。分配器的出口633連接至導管634的入口,導管634的出口連接模頭605的模穴635的入口。模頭605的模穴635具有適當寬度與深度,使模穴足以容納自分配器管輸送的材料,模穴635係平的,如此自分配器管輸送的材料得在其內模壓成扁平狀。模壓材料經由模穴635的出口輸送到成形輥設備610。成形輥設備610包含複數個彼此相鄰放置的成形輥。自模頭的模穴輸送到成形輥設備的材料在複數個成形輥間拉伸、滾壓及冷卻而達預定厚度及形成片材。第6圖圖示三個成形輥610.1、610.2、610.3。其他實施例可採用二或更多成形輥。
根據第6圖所示共擠生產線600,根據本發明的絕緣膜100依下列
程序製造。
製造期間,加熱第一擠出機601、第二擠出機602和第三擠出機603
的容納腔614、615、616,及轉動第一擠出機601、第二擠出機602和第三擠出機603的導螺桿617、618、619。
含導熱添加劑(例如金剛砂、氮化硼和金屬氧化物等)的塑膠(例
如PC、PET、PI、PP、PA等)粒子供給到第一擠出機601的進料斗611。第一擠出機601的導螺桿617旋轉可將進料斗611中含導熱添加劑的塑膠粒子推進容納腔614。由於容納腔614經加熱,含導熱添加劑的塑膠粒子在進入容納腔614後會因摩擦產生的熱而熔化及呈熔融態。受導螺桿617旋轉產生的推進力影響,含導熱添加劑的熔融態塑膠將輸送到容納腔614的後端出口624。導螺桿617旋轉產生的推進力能使含導熱添加劑的熔融態塑膠從容納腔614的後端出口624流出容納腔614,接著經由管607的入口進入管607,管607的入口連接容納腔614的後端出口624。含導熱添加劑的熔融態塑膠經由管607的出口流出而至分配器604的第一入口627,及進入分配器604的第一支線630。進入分配器604的第一支線630的含導熱添加劑的塑膠粒子為含導熱添加劑的第一熔融塑膠。
同樣地,含導熱添加劑的塑膠粒子供給到第三擠出機603的進料
斗613。含導熱添加劑的塑膠粒子以和第一擠出機601的進料斗611中含導熱添加劑的塑膠粒子一樣的方式輸送到分配器604的第三支線632,進入分配器604的第三支線632的含導熱添加劑的塑膠粒子為含導熱添加劑的第二熔融塑膠。
含導電添加劑(例如碳黑、碳纖、金屬粉末、導電聚合物等)的塑膠(例如PC、PET、PI、PP、PA等)粒子供給到第二擠出機602的進料斗612。含導電添加劑的塑膠粒子以和第一擠出機601的進料斗611中含導熱添加劑的塑膠粒子一樣的方式輸送到分配器604的第二支線631。
注意分別將含導熱添加劑的塑膠粒子和含導電添加劑的塑膠粒
子輸送到第一支線630、第二支線631和第三支線632的操作係同時進行。
類似第5圖所示生產線的擠出製程,在第6圖中,進入分配器604
的第一支線630的含導熱添加劑的第一熔融塑膠、進入分配器604的第二支線631的含導電添加劑的熔融態塑膠、和進入分配器604的第三支線632的含導熱添加劑的第二熔融塑膠將於分配器的出口633會合而疊加在一起,接著經由連接分配器出口633的導管634進入模頭605的模穴635,使熔融塑膠得在模穴635內模壓成扁平熔融體。模壓扁平熔融體輸送到成形輥610.1與610.2之間,以接收成形輥610.1與610.2施予的拉伸及壓緊力,藉以形成預定厚度的片或膜100’。膜100’繼續供給到成形輥610.2與610.3之間,以進一步冷卻或退火而形成根據本發明一實施例的絕緣膜或片100。若有需要,輸出自模頭的模壓扁平熔融體可只行經兩個成形輥或超過兩個成形輥而成膜。
以共擠出製程製造的絕緣膜具高品質,但共擠出製程亦需要高設
備要求。因此,本發明進一步提供以複合製程製造絕緣膜的方法,此需要較低設備要求。
第7圖係根據本發明一實施例,複合製程的複合生產線700,用以
製造絕緣膜100,包含一對壓輥704.1、704.2。絕緣膜100的上層701、中間層702和下層703分別捲繞在三個輸送輥(未圖示)上,同時在壓輥704.1與704.2間輸出。當壓輥704.1、704.2相對彼此轉動時,將對上層701、中間層702和下層703產生拉力,致使輸送輥移動而分別就壓輥704.1、704.2放開上層701、中間層702和下層703。如此,上層701、中間層702和下層703在其間捲繞及行進通過壓輥704.1、704.2間,以壓合上層701、中間層702和下層703而形成絕緣膜100。
在第7圖中,絕緣膜100的上層701和下層703由含導熱添加劑的塑
料製成,絕緣膜100的中間層702係含導電添加劑(例如碳黑、碳纖、金屬粉末、
導電聚合物等)的塑料。各輸送輥放開絕緣膜100的上層701、中間層702和下層703後且在其間捲繞及行經壓輥704.1、704.2前,施用黏膠至上層701的下表面及/或中間層702的上表面,及施用黏膠至中間層702的下表面及/或下層703的上表面,如此經壓輥704.01、704.02壓合後,絕緣膜100的上層701、中間層702和下層703便黏在一起而形成絕緣膜100。
第8圖係根據本發明一實施例,複合製程的另一複合生產線800,
用以製造絕緣膜100。第8圖的複合生產線800類似第7圖的複合生產線700。差別僅在於在第8圖中,烘爐805、806、807分別設在從用於絕緣膜100的上層801、中間層802和下層803的各輸送輥到壓輥804.01與804.02間的路徑一側。
在第8圖中,各輸送輥放開絕緣膜100的上層801、中間層802和下
層803後且在其間捲繞及行經壓輥804.1、804.2前,利用各烘爐加熱絕緣膜100的上層801、中間層802和下層803,使之軟化,如此經壓輥804.01、804.02壓合後,軟化絕緣膜100的上層801、中間層802和下層803便黏在一起而形成絕緣膜100。
雖然第8圖只圖示利用烘爐加熱絕緣膜的上層801、中間層802和
下層803的方法,但熟諳此技術者當明白,上層801、中間層802和下層803可以其他軟化方式軟化。
應注意本說明書所述數值範圍內的任一數值當可應用於本發明。
本發明絕緣膜可用於複合電子裝置結構。大體而言,電子裝置從外到內包含外殼、屏蔽與散熱金屬片層、絕緣膜、絕緣膜內圍繞(或部分圍繞)屏蔽與散熱金屬片層的電子部件。電子部件包括印刷電路板,電子元件與電路零件安裝於上。本發明絕緣膜可置於外殼內側與電子部件之間。採用此結構則不需在外殼內側與電子部件(或印刷電路板)間放置其他屏蔽介層(通常為金屬片層)。
第9圖圖示電子裝置(例如電源轉接器或電源供應器)900的組裝
結構。如第9圖所示,印刷電路板(未圖示)被傳統絕緣膜層902圍繞(或部分圍繞),而傳統絕緣膜層902被屏蔽介層(通常為金屬片介層)910圍繞,屏蔽介層具有防止EMI(電磁干擾)的功能。電子元件與電路零件(例如電阻器、電容器、電感器、電晶體、二極體、電線、管腳等)安裝在印刷電路板上。被傳統絕緣膜層902和屏蔽介層910圍繞的印刷電路板組裝於外殼內。
第10圖圖示傳統電子裝置的結構細部。如第10圖所示,印刷電路
板被傳統絕緣膜層902和屏蔽介層910圍繞(或部分圍繞)。應注意結構類似或同於第9圖所示電子裝置(例如電源轉接器或電源供應器)900的組裝結構的任何電子裝置都可應用本發明的絕緣膜100、200。
當用本發明絕緣膜取代傳統絕緣膜層902時,可省略電子裝置900
中的屏蔽介層910,因為本發明絕緣膜具有防止EMI(電磁干擾)的功能。故電子裝置的部件完全或部分被本發明絕緣膜包覆後,接著將部件和部件安裝於上的印刷電路板安裝於由絕緣材料(例如塑料)製成的外殼(未圖示)內,而不需第9圖及第10圖所示屏蔽介層910。
雖然敘述內容說明、描述及指出本發明的新穎特徵結構可應用到
本發明的較佳實施例,但應理解在不悖離本發明精神的情況下,熟諳此技術者可省略、取代或改變所示設備和操作的形式和細節。例如,特別注意的是,以實質相同的方式執行實質相同功能而達成相同結果的該等元件及/或方法步驟組合亦落在本發明範圍內。此外,應理解本發明所述形式及/或實施例所示及/或所述結構或構件及/或方法步驟可依設計選擇結合成其他形式或實施例。因此,本
發明的範圍視後附申請專利範圍所界定者為準。
Claims (10)
- 一種絕緣膜,包含:一膜上層和一膜下層,其中該膜上層和該膜下層均由選自由PC、PET、PI、PP和PA所組成群組的一第一塑料製成,該第一塑料含有一導熱添加劑;及一膜中間層,位於該膜上層與該膜下層之間,其中該膜中間層由選自由PC、PET、PI、PP和PA所組成群組的一第二塑料製成,該第二塑料含有一導電添加劑,其中該膜中間層的一上表面與該膜上層的一下表面結合在一起,且該膜中間層的一下表面與該膜下層的一上表面結合在一起。
- 一種絕緣膜,包含:一膜上層,其中該膜上層由選自由PC、PET、PI、PP和PA所組成群組的一第一塑料製成,該第一塑料含有選自由金剛砂、氮化硼和金屬氧化物所組成群組的一導熱添加劑;及一膜下層,其中該膜下層由選自由PC、PET、PI、PP和PA所組成群組的一第二塑料製成,該塑料含有選自由碳黑、碳纖、金屬粉末和導電聚合物所組成群組的一導電添加劑,其中該膜上層的一下表面與該膜下層的一上表面結合在一起。
- 一種電子部件,包含一印刷電路板,多個電子元件與電路零件安裝在該印刷電路板上,一絕緣膜圍繞或部分圍繞該印刷電路板,其特徵在於,該絕緣膜包含:一膜上層和一膜下層,其中該膜上層和該膜下層由選自由PC、PET、PI、PP和PA所組成群組的一第一塑料製成,該第一塑料含有一導熱添加劑;及一膜中間層,位於該膜上層與該膜下層之間,其中該膜中間層由選自由PC、PET、PI、PP和PA所組成群組的一第二塑料製成,該第二塑料含有一導電添加劑,其中該膜中間層的一上表面與該膜上層的一下表面結合在一起,且該膜中間層的一下表面與該膜下層的一上表面結合在一起。
- 如請求項3所述之電子部件,其中該電子部件用於一電子裝置,其中該電子裝置包含一外殼供該電子部件安裝,該絕緣膜位於該外殼與該印刷電路板之間,且在該外殼內無其他屏蔽介層位於該外殼與該印刷電路板之間。
- 如請求項4所述之電子部件,其中該電子部件係一轉接器。
- 如請求項4所述之電子部件,其中該電子部件係一電源供應器。
- 一種電子部件,包含一印刷電路板,多個電子元件與電路零件安裝在該印刷電路板上,一絕緣膜圍繞或部分圍繞該印刷電路板,其特徵在於,該絕緣膜包含:一膜上層,其中該膜上層由選自由PC、PET、PI、PP和PA所組成群組的一第一塑料製成,該第一塑料含有一導熱添加劑;及一膜下層,其中該膜下層由選自由PC、PET、PI、PP和PA所組成群組的一第二塑料製成,該第二塑料含有一導電添加劑,其中該膜上層的一下表面與該膜下層的一上表面結合在一起。
- 如請求項7所述之電子部件,其中該電子部件用於一電子裝置,其中該電子裝置包含一外殼供該電子部件安裝,該絕緣膜位於該外殼與該印刷電路板之間,且在該外殼內無其他屏蔽介層位於該外殼與該印刷電路板之間。
- 如請求項8所述之電子部件,其中該電子部件係一轉接器。
- 如請求項8所述之電子部件,其中該電子部件係一電源供應器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/312,222 US9942989B2 (en) | 2013-11-21 | 2014-06-23 | Insulation film and method for making insulation film |
US14/312,222 | 2014-06-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201601908A TW201601908A (zh) | 2016-01-16 |
TWI657920B true TWI657920B (zh) | 2019-05-01 |
Family
ID=53525256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104119835A TWI657920B (zh) | 2014-06-23 | 2015-06-18 | 絕緣膜與包含絕緣膜之電子部件 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3157751B1 (zh) |
CN (2) | CN113844117A (zh) |
HU (1) | HUE059378T2 (zh) |
MX (1) | MX2016016634A (zh) |
TW (1) | TWI657920B (zh) |
WO (1) | WO2015200059A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018236970A1 (en) * | 2017-06-20 | 2018-12-27 | Illinois Tool Works Inc. | INSULATING THIN FILM |
TWI783061B (zh) * | 2017-10-30 | 2022-11-11 | 美商伊利諾工具工程公司 | 一種絕緣複合薄膜及電器部件 |
CN109727732B (zh) * | 2017-10-30 | 2023-10-31 | 伊利诺斯工具制品有限公司 | 一种绝缘复合薄膜及电器部件 |
CN112820485B (zh) * | 2021-02-05 | 2023-04-07 | 南京大学 | 一种绝缘降温复合薄膜 |
CN113415058B (zh) * | 2021-08-17 | 2021-11-16 | 苏州奥美材料科技有限公司 | 一种导热耐电压击穿绝缘聚碳酸酯薄膜及其制备方法和应用 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011052094A (ja) * | 2009-09-01 | 2011-03-17 | Dainippon Printing Co Ltd | 熱伝導性シート及びその製造方法 |
CN103550864A (zh) * | 2013-10-29 | 2014-02-05 | 国家纳米科学中心 | 一种混合驱动的起搏器和混合驱动起搏器电极的方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI277386B (en) * | 2006-03-31 | 2007-03-21 | Asustek Comp Inc | Electromagnetic shielding device |
US20100096181A1 (en) * | 2007-03-29 | 2010-04-22 | Munetomo Nakamura | Electromagnetic shield sheet and rfid plate |
JP5381343B2 (ja) * | 2009-05-29 | 2014-01-08 | 大日本印刷株式会社 | 熱伝導性フィルム |
CN102651961B (zh) * | 2012-05-29 | 2016-02-03 | 安顿雷纳(上海)纤维材料科技有限公司 | 一种导热散热界面材料及其制造方法 |
CN103854813B (zh) * | 2012-12-03 | 2018-10-12 | 伊利诺斯工具制品有限公司 | 绝缘薄膜及其生产方法 |
WO2014088833A1 (en) * | 2012-12-03 | 2014-06-12 | Illinois Tool Works Inc. | Insulation film and method for making insulation film |
-
2015
- 2015-06-17 CN CN202111186747.7A patent/CN113844117A/zh active Pending
- 2015-06-17 MX MX2016016634A patent/MX2016016634A/es unknown
- 2015-06-17 HU HUE15735776A patent/HUE059378T2/hu unknown
- 2015-06-17 CN CN201580033140.1A patent/CN106457794A/zh active Pending
- 2015-06-17 EP EP15735776.5A patent/EP3157751B1/en active Active
- 2015-06-17 WO PCT/US2015/036133 patent/WO2015200059A1/en active Application Filing
- 2015-06-18 TW TW104119835A patent/TWI657920B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011052094A (ja) * | 2009-09-01 | 2011-03-17 | Dainippon Printing Co Ltd | 熱伝導性シート及びその製造方法 |
CN103550864A (zh) * | 2013-10-29 | 2014-02-05 | 国家纳米科学中心 | 一种混合驱动的起搏器和混合驱动起搏器电极的方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2015200059A1 (en) | 2015-12-30 |
EP3157751B1 (en) | 2022-05-11 |
CN106457794A (zh) | 2017-02-22 |
EP3157751A1 (en) | 2017-04-26 |
TW201601908A (zh) | 2016-01-16 |
MX2016016634A (es) | 2017-04-25 |
HUE059378T2 (hu) | 2022-11-28 |
CN113844117A (zh) | 2021-12-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI657920B (zh) | 絕緣膜與包含絕緣膜之電子部件 | |
US11292235B2 (en) | Insulation film and method for making insulation film | |
CN103854813B (zh) | 绝缘薄膜及其生产方法 | |
WO2018181223A1 (ja) | 積層体の製造方法、積層体の製造装置および積層体 | |
CN105190788B (zh) | 高速传输柔性扁平电缆用多层树脂片材及高速传输柔性扁平电缆 | |
TWI580578B (zh) | 覆蓋帶與其製程方法 | |
EP3704721B1 (en) | Insulating composite film and electrical component | |
US9942989B2 (en) | Insulation film and method for making insulation film | |
CN208271672U (zh) | 一种绝缘薄膜 | |
CN111993708B (zh) | 一种离型膜及其制备方法 | |
TWI783061B (zh) | 一種絕緣複合薄膜及電器部件 | |
CN103854814A (zh) | 绝缘薄膜及其生产方法 | |
WO2020081221A1 (en) | Thermally conductive insulating sheet and method for preparing same | |
JP2021191683A (ja) | キャリアテープの製造方法及びキャリアテープ | |
JPH08307026A (ja) | 配線基板用板状体及びその製造方法 | |
JP2017045862A (ja) | 印刷配線板および印刷配線板の中間体、印刷配線板の製造方法 |