TWI657920B - Insulation film and electronic component comprising insulation film - Google Patents

Abstract

The invention provides an insulating film and a method for manufacturing an insulating film, including an upper film layer and a lower film layer, wherein the upper film layer and the lower film layer are both made of thermally conductive plastic, and the thermally conductive plastic contains a thermally conductive additive; between. The middle layer of the film is made of thermally conductive plastic, which contains conductive additives. The upper surface of the film intermediate layer is combined with the lower surface of the film upper layer, and the lower surface of the film intermediate layer is combined with the upper surface of the lower film layer.

Description

Insulating film and electronic component including the insulating film

The present invention relates to an insulating film.

The insulating film is used to isolate various electronic devices or components, so as to avoid short circuits, failures and failures of electronic devices or components or electronic components of electronic devices or components, and reduce the risk of fire of electronic devices or components to ensure the normal operation of various electronic components. For example, an insulating film may be placed between a printed circuit board (PCB) containing various circuits and a metal case (such as aluminum or copper case) for preventing EMI (electromagnetic interference) to prevent various components such as the PCB from contacting the metal case Problems such as short circuits. In order to use an insulating film, the insulating film needs to have different operating properties. In addition, the requirements for specific insulation film properties vary with different insulation needs.

Therefore, it is expected to provide an insulating film manufactured at a low cost and having superior properties.

The invention provides an insulating film comprising an upper film layer, a middle film layer and a lower film layer, wherein the upper film layer and the lower film layer are made of thermally conductive plastic, and the thermally conductive plastic contains plastic (such as PC, PET, PI, PP, PA, etc.) and a thermally conductive additive ( (Such as corundum, boron nitride, and metal oxides, etc.) to meet insulation and thermal conductivity; the film intermediate layer is located between the upper and lower layers of the film. The middle layer of the film is made of plastic (such as PC, PET, PI, PP, PA, etc.) and conductive additives (such as carbon black, carbon fiber, metal powder and conductive polymer, etc.) to comply with electrical conductivity, thermal conductivity, and mechanical toughness . The upper surface of the film intermediate layer is combined with the lower surface of the film upper layer, and the lower surface of the film intermediate layer is combined with the upper surface of the lower film layer.

The invention further provides an insulating film, comprising an upper film layer and a lower film layer, wherein the upper film layer consists of Made of thermally conductive plastic, which contains plastic (such as PC, PET, PI, PP, PA, etc.) and thermal conductive additives (such as silicon carbide, boron nitride, and metal oxides) to meet insulation and thermal conductivity; Made of plastic (such as PC, PET, PI, PP, PA, etc.) and conductive additives (such as carbon black, carbon fiber, metal powder, and conductive polymers) to meet electrical conductivity, thermal conductivity, and mechanical toughness. The lower surface of the upper layer of the film is combined with the upper surface of the lower layer of the film.

100‧‧‧ insulating film

100’‧‧‧ film

101‧‧‧ Upper Level

102‧‧‧ middle layer

103‧‧‧ lower level

200‧‧‧ film

201, 202‧‧‧ floors

500‧‧‧co-extrusion production line

501, 502‧‧‧ extruder

503‧‧‧Distributor

504‧‧‧die

505‧‧‧forming roll equipment

505.1, 505.2, 505.3‧‧‧forming roller

506, 507‧‧‧ tube

509、515‧‧‧Feed hopper

510, 516‧‧‧accommodating cavity

511, 517‧‧‧ lead screw

512, 514, 518, 520‧‧‧ entrance

513, 519, 524‧‧‧ export

521-523‧‧‧ Branch

525‧‧‧catheter

526‧‧‧mould cavity

600‧‧‧Co-extrusion production line

601-603‧‧‧ Extruder

604‧‧‧Distributor

605‧‧‧die

607-609‧‧‧tube

610‧‧‧forming roll equipment

610.1, 610.2, 610.3‧‧‧‧forming roller

611-613‧‧‧Feeding hopper

614-616‧‧‧accommodating cavity

617-619‧‧‧lead screw

620, 622, 623, 627-629‧‧‧ Entrance

624-626, 633‧‧‧ export

630-632‧‧‧ Branch

634‧‧‧catheter

635‧‧‧mould cavity

700‧‧‧ composite production line

701‧‧‧ Upper floor

702‧‧‧ middle layer

703‧‧‧lower floor

704.1, 704.2‧‧‧‧Roller

800‧‧‧ composite production line

801‧‧‧ Upper floor

802‧‧‧ middle layer

803‧‧‧lower

804.01, 804.02 ‧‧‧Press roller

805-807‧‧‧Oven

900‧‧‧ electronic device

902‧‧‧ insulating film

910‧‧‧shielded interlayer

Fig. 1 is a schematic view of an insulating film according to an embodiment of the present invention; Fig. 2 is a cross-sectional view of the insulating film of Fig. 1 taken along line AA of Fig. 1; and Fig. 3 is an insulating film according to another embodiment of the present invention Fig. 4 is a cross-sectional view of the insulating film of Fig. 3 taken along the line BB of Fig. 3; Fig. 5 is an example of a co-extrusion process for manufacturing an insulating film according to an embodiment of the present invention; According to an embodiment of the present invention, another example of a co-extrusion process for manufacturing an insulating film; FIG. 7 is an example of a composite process for manufacturing an insulating film according to an embodiment of the present invention; In the embodiment, a diagram of an example of a composite process for manufacturing an insulating film; FIG. 9 illustrates a conventional structure of an electronic device (such as an adapter); FIG. 10 illustrates a structural detail of an electronic device (such as an adapter).

FIG. 1 illustrates a schematic diagram of an insulating film 100 according to an embodiment of the present invention. According to an embodiment of the present invention, the thickness of the insulating film 100 is 0.05 millimeter (mm) to 3.0 mm. Figure 2 is along line 1 A-A cross-sectional view of the insulating film 100 in FIG. 1. As shown in FIG. 2, the insulating film 100 includes an upper layer 101, an intermediate layer 102, and a lower layer 103.

The upper layer 101 and the lower layer 103 of the insulating film 100 are made of an insulating material, and the insulating material may be Plastics (such as PC, PET, PI, PP, PA, etc.) containing thermally conductive additives (such as silicon carbide, boron nitride, and metal oxides) to provide insulation and thermal conductivity. The intermediate layer 102 of the insulating film 100 is located between the upper layer 101 and the lower layer 103 of the insulating film 100, and is made of plastic (such as PC, PET, PI, PP, PA, etc.) and conductive additives (such as carbon black, carbon fiber, metal powder, and conductive) Polymers, etc.) to meet electrical, thermal, and mechanical toughness. The upper surface of the film intermediate layer 102 is combined with the lower surface of the film upper layer 101, and the lower surface of the film intermediate layer 102 is combined with the upper surface of the film lower layer 103.

Ordinary insulating materials do not conduct heat. Although thermally conductive adhesives are currently available on the market Thermally conductive insulating film to increase thermal conductivity, but this can only be used as an interface thermally conductive insulating material (contact surfaces of different materials are called interfaces; interface thermally conductive insulating materials are thermally conductive insulating materials that require surface contact, such as the surface of electronic components and cooling fins The interface between the surfaces is a thermally conductive insulating material), because the mechanical properties of the adhesive are poor and the adhesive is sticky, it is not convenient to use. In addition, the withstand voltage (or breakdown voltage) is very low. Adhesive-free thermally conductive insulation films are usually thermoplastic after modification, but thermally conductive thermoplastic materials are often fragile, not resistant to impact, and not resistant to folding, so it cannot be made into a thin film (such as 0.2-0.8mm) in order to For use. At present, when the product needs to have non-surface thermal insulation, it can only increase the number of metal cooling fins and improve the heat resistance gradient of the component to meet the requirements for use. However, this will increase manufacturing costs.

The insulating film 100 of the present invention has the following advantages: (1) The conductive material of the intermediate layer of the insulating film of the present invention uses a material with good mechanical toughness or improved toughness through modification, so the fragile thermal conductive insulating material can be attached to a good mechanical Tough intermediate layer material and reduce the possibility of the surface layer becoming brittle. Therefore, as a whole, the material meets the requirements of stamping and folding or similar processing; (2) The conductive material (thickness as thin as 0.03mm) of the intermediate layer of the present invention is used to shield electromagnetic radiation and can form a certain mechanical strength as a whole, so it can replace the thick metal sheets currently used by customers for electronic products, for the convenience of customers Design and reduce costs; (3) Like the upper and lower layers, the middle layer also has good thermal conductivity, so the material has good thermal conductivity (heat coefficient up to 2.0W / (m · K)). In addition, the insulating film of the present invention has all functions of insulation, thermal conductivity, and shielding of electromagnetic radiation.

For those skilled in the art, it is not easy (or obvious) to think of adding conductive additives (or materials) to the insulating film, because the insulating film has traditionally been used to perform the insulation function between electronic components.

It has been found through long-term observation that products using insulating materials (such as power adapters for laptops) need to be used in some electronic products, and circuit boards need to be surrounded by metal sheets to shield electromagnetic radiation. The metal sheet is usually thick (about 0.3mm to 0.6mm) to meet product requirements (such as heat dissipation and strength requirements). In the present invention, the use of an insulating film to treat insulating parts can omit metal pieces in electronic products, and still maintain the functions of heat radiation and shielding of electromagnetic radiation. Compared with the present invention, traditional electronic products not only need more metal sheets to achieve the functions of heat dissipation and shielding of electromagnetic radiation, but also have more complicated processing (for example, metal sheets and insulating parts need to be stamped, folded, and assembled to surround the circuit respectively). Board), and the processing cost is higher, and the chance of obtaining defective products is greater.

It was also found that the current regulatory standards for insulating films (such as the international standards UL-60950 or IEC-60950) require that if a single-layer insulating film needs to be supplemented or reinforced, the thickness of a single-layer insulating film made of homogeneous material is at least 0.4mm. However, the UL standard does not impose thickness requirements on non-layered multilayer insulation films. The UL standard requires that the piezoresistance of non-layered multilayer insulation films be increased by 50% to 100%, and requires non-layered multilayer insulation films to pass additional mandrel tests. That is, even if the thickness of the non-layered multi-layer insulation film is less than 0.4 mm, as long as it passes the rigorous withstand voltage test and the additional mandrel test, it is still considered to meet regulatory standards. The insulating film of the present invention has a multilayer insulation that is indivisible and made of different materials. After the experiment, it was found that the material of the insulating film of the present invention can indeed pass the strict withstand voltage test and the additional mandrel test. Therefore, in order to comply with regulatory standards, the thickness of the insulating film can be less than 0.4mm. In other words, compared with the conventional single-layer insulating film, the insulating film according to the present invention can have a smaller thickness, for example, the thickness of the insulating film can be reduced from 0.43 mm to 0.25 mm or thinner, while the insulating film according to the present invention can pass strict Withstand pressure test and additional mandrel test to save material and reduce manufacturing costs.

FIG. 3 is a schematic diagram of a film 200 according to another embodiment of the present invention. Insulation film 200 and The difference between the insulating film 100 in FIG. 1 is that the insulating film 200 has a two-layer structure. The first layer 201 of the insulating film 200 in FIG. 2 is made of the same material as the first layer 101 of the insulating film 100 in FIG. 1; the second layer 202 of the insulating film 200 in FIG. 2 is made of the same material as that of the insulating film 100 in FIG. 1. The second layer 102 is made of the same material.

FIG. 5 illustrates a coextrusion production line 500 for a coextrusion process according to an embodiment of the present invention. To produce an insulating film 100. As shown in FIG. 5, the coextrusion line 500 includes a first extruder 501 and a second extruder 502. The first extruder 501 includes a hopper 509 and a receiving cavity 510. The feed hopper 509 is configured to receive plastic (e.g., PC, PET, PI, PP, PA, etc.) particles containing thermally conductive additives (e.g., emery, boron nitride, metal oxides, etc.). The receiving cavity 510 is provided with a lead screw 511. The outlet of the feed hopper 509 is connected to the front inlet 512 of the receiving cavity 510, the rear outlet 513 of the receiving cavity 510 is connected to the inlet of the tube 506, and the outlet of the tube 506 is connected to the first inlet 514 of the distributor 503. The second extruder 502 includes a feed hopper 515 and a receiving cavity 516. The feed hopper 515 is configured to receive plastic (for example, PC, PET, PI, PP, PA, etc.) containing conductive additives (for example, carbon black, carbon fiber, metal powder, and conductive polymer, etc.). The receiving cavity 516 is provided with a lead screw 517. The outlet of the feed hopper 515 is connected to the front inlet 518 of the receiving cavity 516, the rear outlet 519 of the receiving cavity 516 is connected to the inlet of the tube 507, and the outlet of the tube 507 is connected to the second inlet 520 of the distributor 503.

The first entrance 514 of the distributor 503 connects the entrance of the first branch line 521 with the first entrance of the distributor The entrance of the second branch line 522 and the second entrance 520 of the distributor 503 are connected to the entrance of the third branch line 523. As shown in FIG. 5, the third branch line 523 is located between the first branch line 521 and the second branch line 522. The exit of the first branch line 521, the exit of the second branch line 522, and the exit of the third branch line 523 meet at the exit 524 of the distributor. Distributor Out The port 524 is connected to the entrance of the catheter 525, and the exit of the catheter 525 is connected to the entrance of the cavity 526 of the die 504. The cavity 526 of the die head 504 has an appropriate width and depth, so that the cavity is sufficient to accommodate the material conveyed from the distributor tube. The cavity 526 is flat, so the material conveyed from the distributor tube must be molded into a flat shape in it. The molding material is conveyed to the forming roll apparatus 505 via the exit of the cavity 526. The forming roll apparatus 505 includes a plurality of forming rolls placed adjacent to each other. The material conveyed from the cavity of the die to the forming roll equipment is stretched, rolled, and cooled between a plurality of forming rolls to a predetermined thickness and form a sheet. Figure 5 illustrates three forming rolls 505.1, 505.2, 505.3. Other embodiments may use two or more forming rolls.

According to the co-extrusion line 500 shown in FIG. 5, the insulating film 100 according to the present invention is as follows Program manufacturing.

During manufacturing, the receiving cavity 510 of the first extruder 501 and the second extruder 502 is heated, 516, and the lead screws 511, 517 of the first extruder 501 and the second extruder 502 are rotated. Particles of plastic (for example, PC, PET, PI, PP, PA, etc.) containing a thermally conductive additive (for example, emery, boron nitride, metal oxide, etc.) are supplied to the feed hopper 509 of the first extruder 501. The rotation of the lead screw 511 of the first extruder 501 can advance the plastic particles containing the thermally conductive additive in the hopper 509 into the receiving cavity 510. Since the receiving cavity 510 is heated, the plastic particles containing a thermally conductive additive will melt and become molten due to the heat generated by friction after entering the receiving cavity 510. Affected by the propulsive force generated by the rotation of the lead screw 511, the molten plastic containing the thermally conductive additive will be delivered to the rear end outlet 513 of the receiving cavity 510. The propulsive force generated by the rotation of the lead screw 511 can cause the molten plastic containing the thermal conductive additive to flow out of the receiving cavity 510 from the rear end outlet 513 of the receiving cavity 510 and then enter the tube 506 through the inlet of the tube 506. The inlet of the tube 506 is connected to the receiving cavity 510. Rear exit 513. The molten plastic containing the thermally conductive additive flows out through the outlet of the tube 506 to the first inlet 514 of the dispenser 503. At the first inlet 514 of the distributor, the molten plastic containing the thermally conductive additive is divided into two streams: one flows into the first branch line 521 of the distributor and becomes the first molten plastic containing the thermal conductive additive, and the other flows into the second branch line of the distributor 522 into a second molten plastic containing a thermally conductive additive.

Similarly, it contains conductive additives (e.g. carbon black, carbon fiber, metal powder, conductive polymer (Such as PC, PET, PI, PP, PA, etc.) particles are supplied to the feed hopper 515 of the second extruder 502. The rotation of the lead screw 517 of the second extruder 502 can advance the plastic particles containing the conductive additive in the hopper 515 into the receiving cavity 516. Because the receiving cavity 516 is heated, the plastic particles containing conductive additives will melt and become molten due to the heat generated by friction after entering the receiving cavity 516. Affected by the propulsive force generated by the rotation of the lead screw 517, the molten plastic containing conductive additives will be delivered to the rear end outlet 519 of the receiving cavity 516. The propulsive force generated by the rotation of the lead screw 517 can cause the molten plastic containing conductive additives to flow out of the receiving cavity 516 from the rear end outlet 519 of the receiving cavity 516, and then enter the tube 507 through the inlet of the tube 507. Rear exit 519. The molten plastic containing conductive additives flows out through the outlet of the tube 507 to the second inlet 520 of the distributor 503, and enters the third branch line 523 of the distributor through the second inlet 520. It should be noted that the operation of the plastic particles containing a conductive additive is performed simultaneously with the operation of the plastic particles containing a thermally conductive additive.

The first molten plastic containing the thermally conductive additive entering the first branch line 521 of the distributor 503 The plastic, the molten plastic containing conductive additives entering the third branch line 523 of the distributor 503 and the second molten plastic containing thermal conductive additives entering the second branch line 522 of the distributor 503 will be merged and superimposed together at the outlet 524 of the distributor Then, it enters the cavity 526 of the die 504 through the conduit 525 connected to the outlet 524 of the distributor, so that the molten PP is molded into the flat melt in the cavity 526. The molded flat melt is conveyed between the forming rolls 505.1 and 505.2 to receive the stretching and pressing forces applied by the forming rolls 505.1 and 505.2, and at the same time cooled by the forming rolls 505.1 and 505.2 to form a sheet or film 100 'of a predetermined thickness. The film 100 'is continuously supplied between the forming rolls 505.2 and 505.3 to be further cooled or annealed to form an insulating film or sheet 100 according to an embodiment of the present invention. If necessary, the molded flat melt output from the die head can pass through only two forming rolls or more than two forming rolls to form a film.

FIG. 6 illustrates a coextrusion production line of another coextrusion process according to an embodiment of the present invention 600 for manufacturing an insulating film 100. As shown in FIG. 6, the coextrusion production line 600 includes a first extruder 601, Second extruder 602 and third extruder 603. The first extruder 601, the second extruder 602, and the third extruder 603 each include a feed hopper 611, 612, 613, a receiving cavity 614, 615, 616, and a lead screw 617, 618, 619. The feed hoppers 611, 613 of the first and third extruders are configured to receive plastic (e.g., PC, PET, PI, PP, PA, etc.) particles containing thermally conductive additives (e.g., emery, boron nitride, metal oxides, etc.). The feed hopper 612 of the second extruder is configured to receive particles of plastic (such as PC, PET, PI, PP, PA, etc.) containing conductive additives (such as carbon black, carbon fiber, metal powder, and conductive polymer, etc.). The outlet of the hopper 611 of the first extruder 601 is connected to the front inlet 620 of the receiving cavity 614, the rear outlet 624 of the receiving cavity 614 is connected to the inlet of the tube 607, and the outlet of the tube 607 is connected to the first inlet 627 of the distributor 604. Similarly, the outlet of the feed hopper 612 of the second extruder 602 is connected to the front inlet 622 of the receiving cavity 615, the rear outlet 625 of the receiving cavity 615 is connected to the inlet of the tube 608, and the outlet of the tube 608 is connected to the second inlet of the distributor 604 628. The outlet of the hopper 613 of the third extruder 603 is connected to the front inlet 623 of the receiving cavity 616, the rear outlet 626 of the receiving cavity 616 is connected to the inlet of the tube 609, and the outlet of the tube 609 is connected to the third inlet 629 of the distributor 604.

The first inlet 627 of the distributor 604 is connected to the inlet of the first branch line 630 of the distributor. The second inlet 628 of the distributor 604 is connected to the inlet of the second branch line 631 of the distributor, and the third inlet 629 of the distributor 604 is connected to the inlet of the third branch line 632 of the distributor. As shown in FIG. 6, the second branch line 631 is located between the first branch line 630 and the third branch line 632. The exit of the first branch line 630, the exit of the second branch line 631, and the exit of the third branch line 632 meet at the exit 633 of the distributor. The outlet 633 of the dispenser is connected to the inlet of the conduit 634, and the outlet of the conduit 634 is connected to the inlet of the cavity 635 of the die 605. The cavity 635 of the die head 605 has an appropriate width and depth, so that the cavity is sufficient to accommodate the material conveyed from the distributor tube. The cavity 635 is flat, so the material conveyed from the distributor tube must be flattened in it. The molding material is conveyed to the forming roll apparatus 610 via the exit of the cavity 635. The forming roll apparatus 610 includes a plurality of forming rolls placed adjacent to each other. The material conveyed from the cavity of the die to the forming roll equipment is stretched, rolled, and cooled between a plurality of forming rolls to a predetermined thickness and form a sheet. FIG. 6 illustrates three forming rollers 610.1, 610.2, and 610.3. Other embodiments may use two or more forming rolls.

According to the co-extrusion line 600 shown in FIG. 6, the insulating film 100 according to the present invention is as follows Program manufacturing.

During manufacturing, the first extruder 601, the second extruder 602, and the third extruder 603 are heated The receiving chambers 614, 615, and 616, and the lead screws 617, 618, and 619 of the first extruder 601, the second extruder 602, and the third extruder 603 are rotated.

Plastics containing thermally conductive additives such as silicon carbide, boron nitride, and metal oxides (e.g. (Such as PC, PET, PI, PP, PA, etc.) particles are supplied to the feed hopper 611 of the first extruder 601. The rotation of the lead screw 617 of the first extruder 601 can push the plastic particles containing the thermally conductive additive in the hopper 611 into the receiving cavity 614. Since the receiving cavity 614 is heated, the plastic particles containing the thermal conductive additive will melt and become molten due to the heat generated by friction after entering the receiving cavity 614. Affected by the propulsive force generated by the rotation of the lead screw 617, the molten plastic containing the thermally conductive additive will be delivered to the rear end outlet 624 of the receiving cavity 614. The propulsive force generated by the rotation of the lead screw 617 can cause the molten plastic containing the thermally conductive additive to flow out of the receiving cavity 614 from the rear end outlet 624 of the receiving cavity 614, and then enter the tube 607 through the inlet of the tube 607. Rear end exit 624. The molten plastic containing the thermally conductive additive flows out through the outlet of the tube 607 to the first inlet 627 of the distributor 604 and the first branch line 630 entering the distributor 604. The thermally conductive additive-containing plastic particles entering the first branch line 630 of the dispenser 604 are the first molten plastic containing the thermally conductive additive.

Similarly, plastic particles containing a thermally conductive additive are fed to the feed of the third extruder 603 Bucket 613. The plastic particles containing the thermal conductive additive are conveyed to the third branch line 632 of the distributor 604 in the same manner as the plastic particles containing the thermal conductive additive in the feeding hopper 611 of the first extruder 601, and enter the The plastic particles of the thermal conductive additive are the second molten plastic containing the thermal conductive additive.

Particles of plastic (for example, PC, PET, PI, PP, PA, etc.) containing conductive additives (for example, carbon black, carbon fiber, metal powder, conductive polymer, etc.) are supplied to the feed hopper 612 of the second extruder 602. The plastic particles containing a conductive additive are conveyed to the second branch line 631 of the dispenser 604 in the same manner as the plastic particles containing a thermal conductive additive in the hopper 611 of the first extruder 601.

Note that plastic particles containing thermally conductive additives and plastic particles containing conductive additives The operations of the sub-transport to the first branch line 630, the second branch line 631, and the third branch line 632 are performed simultaneously.

Similar to the extrusion process of the production line shown in Figure 5, in Figure 6, enter the dispenser 604 The first branch plastic 630 contains a thermally conductive additive-containing first molten plastic, the second branch line 631 of the distributor 604 contains a conductive plastic-containing molten plastic, and the third branch line 632 contains a thermal conductive additive-containing second plastic The molten plastic will be merged and superimposed together at the outlet 633 of the dispenser, and then enter the cavity 635 of the die 605 through the conduit 634 connected to the outlet 633 of the dispenser, so that the molten plastic is molded into a flat melt in the cavity 635. The molded flat melt is conveyed between the forming rolls 610.1 and 610.2 to receive the stretching and pressing force applied by the forming rolls 610.1 and 610.2, thereby forming a sheet or film 100 'of a predetermined thickness. The film 100 'is continuously supplied between the forming rolls 610.2 and 610.3 to be further cooled or annealed to form an insulating film or sheet 100 according to an embodiment of the present invention. If necessary, the molded flat melt output from the die head can pass through only two forming rolls or more than two forming rolls to form a film.

The co-extrusion process has high-quality insulation films, but the co-extrusion process also requires high equipment. Equipment requirements. Therefore, the present invention further provides a method for manufacturing an insulating film in a composite process, which requires lower equipment requirements.

FIG. 7 is a composite production line 700 for a composite process according to an embodiment of the present invention. The insulating film 100 is manufactured and includes a pair of pressure rollers 704.1 and 704.2. The upper layer 701, the intermediate layer 702, and the lower layer 703 of the insulating film 100 are respectively wound on three conveying rollers (not shown), and are output between the pressing rollers 704.1 and 704.2. When the pressing rollers 704.1, 704.2 rotate relative to each other, a tensile force is generated on the upper layer 701, the intermediate layer 702, and the lower layer 703, causing the conveying roller to move, and the upper roller 701, the intermediate layer 702, and the lower layer 703 are released respectively. In this way, the upper layer 701, the intermediate layer 702, and the lower layer 703 are wound and traveled between the pressing rollers 704.1 and 704.2 therebetween to form the insulating film 100 by laminating the upper layer 701, the intermediate layer 702, and the lower layer 703.

In FIG. 7, the upper layer 701 and the lower layer 703 of the insulating film 100 are made of plastic containing a thermally conductive additive. The intermediate layer 702 of the insulating film 100 contains conductive additives (such as carbon black, carbon fiber, metal powder, Conductive polymers, etc.). After each conveying roller releases the upper layer 701, the intermediate layer 702, and the lower layer 703 of the insulating film 100, and before winding and passing through the pressing rollers 704.1, 704.2, apply adhesive to the lower surface of the upper layer 701 and / or the upper layer 702 The surface, and the adhesive is applied to the lower surface of the intermediate layer 702 and / or the upper surface of the lower layer 703, so that the upper layer 701, the intermediate layer 702, and the lower layer 703 of the insulating film 100 are adhered together after being pressed by the pressure rollers 704.01 and 704.02 Thus, an insulating film 100 is formed.

FIG. 8 is another composite production line 800 of a composite process according to an embodiment of the present invention. Used to manufacture the insulating film 100. The composite production line 800 of FIG. 8 is similar to the composite production line 700 of FIG. 7. The only difference is that in the eighth figure, the ovens 805, 806, and 807 are respectively provided on the side of the path from the conveying rollers for the upper layer 801, the intermediate layer 802, and the lower layer 803 for the insulating film 100 to the pressing rollers 804.01 and 804.02. .

In FIG. 8, each conveying roller releases the upper layer 801, the intermediate layer 802, and the lower layer of the insulating film 100. After the layer 803 is wound and before passing through the pressure rollers 804.1 and 804.2, the upper layer 801, the intermediate layer 802, and the lower layer 803 of the insulating film 100 are heated by each oven to soften them. The upper layer 801, the intermediate layer 802, and the lower layer 803 of the softened insulating film 100 are adhered together to form the insulating film 100.

Although FIG. 8 only illustrates the upper layer 801, the intermediate layer 802, and The method of the lower layer 803, but those skilled in the art should understand that the upper layer 801, the middle layer 802, and the lower layer 803 can be softened by other softening methods.

It should be noted that any numerical value within the numerical range described in this specification can be applied to the present invention.

The insulating film of the present invention can be used in a composite electronic device structure. Generally speaking, an electronic device includes a housing, a shielding and heat-dissipating metal sheet layer, an insulating film, and an electronic component that surrounds (or partially surrounds) the shielding and heat-dissipating metal sheet layer from the outside to the inside. The electronic component includes a printed circuit board on which electronic components and circuit components are mounted. The insulating film of the present invention can be placed between the inside of the casing and the electronic component. With this structure, there is no need to place another shielding interlayer (usually a metal sheet layer) between the inside of the housing and the electronic component (or printed circuit board).

FIG. 9 illustrates the assembly of an electronic device (such as a power adapter or a power supply) 900 structure. As shown in FIG. 9, the printed circuit board (not shown) is surrounded (or partially surrounded) by a conventional insulating film layer 902, and the traditional insulating film layer 902 is surrounded by a shielding interlayer (usually a metal sheet interlayer) 910 and shielded. The interlayer has a function of preventing EMI (electromagnetic interference). Electronic components and circuit parts (such as resistors, capacitors, inductors, transistors, diodes, wires, pins, etc.) are mounted on a printed circuit board. The printed circuit board surrounded by the conventional insulating film layer 902 and the shielding interlayer 910 is assembled in the casing.

FIG. 10 illustrates a structural detail of a conventional electronic device. As shown in Figure 10, the printed circuit The board is surrounded (or partially surrounded) by a conventional insulating film layer 902 and a shielding interlayer 910. It should be noted that the insulating films 100 and 200 of the present invention can be applied to any electronic device having a structure similar to or an assembly structure of an electronic device (such as a power adapter or a power supply) 900 shown in FIG. 9.

When the conventional insulating film layer 902 is replaced with the insulating film of the present invention, the electronic device 900 may be omitted In the shielding interlayer 910, the insulating film of the present invention has a function of preventing EMI (electromagnetic interference). Therefore, after the parts of the electronic device are completely or partially covered by the insulating film of the present invention, the parts and the printed circuit board on which the parts are mounted are installed in a housing (not shown) made of an insulating material (such as plastic), and The shielding interlayer 910 shown in FIGS. 9 and 10 is not required.

Although the description explains, describes, and points out that the novel features of the present invention can be applied to Preferred embodiments of the present invention, but it should be understood that those skilled in the art can omit, replace or change the form and details of the illustrated equipment and operations without departing from the spirit of the invention. For example, it is particularly noted that combinations of such elements and / or method steps that perform substantially the same function in substantially the same way to achieve the same result also fall within the scope of the invention. In addition, it should be understood that the structures and / or components shown in the forms and / or embodiments described in the present invention and / or the method steps may be combined into other forms or embodiments according to design choices. So this The scope of the invention is determined by the scope of the attached patent application.

Claims (10)

An insulating film includes: an upper film layer and a lower film layer, wherein the upper film layer and the lower film layer are each made of a first plastic selected from the group consisting of PC, PET, PI, PP, and PA. The plastic contains a thermally conductive additive; and a film intermediate layer is located between the film upper layer and the film lower layer, wherein the film intermediate layer is made of a second plastic selected from the group consisting of PC, PET, PI, PP, and PA. Therefore, the second plastic contains a conductive additive, wherein an upper surface of the film intermediate layer is combined with a lower surface of the film upper layer, and a lower surface of the film intermediate layer is combined with an upper surface of the lower layer of the film. . An insulating film includes: a film upper layer, wherein the film upper layer is made of a first plastic selected from the group consisting of PC, PET, PI, PP, and PA, and the first plastic contains a material selected from the group consisting of silicon carbide and boron nitride And a metal oxide, a thermally conductive additive; and a lower film layer, wherein the lower film layer is made of a second plastic selected from the group consisting of PC, PET, PI, PP, and PA, and the plastic contains an optional A conductive additive consisting of free carbon black, carbon fiber, metal powder and conductive polymer, wherein the lower surface of the upper layer of the film is combined with an upper surface of the lower layer of the film. An electronic component includes a printed circuit board, a plurality of electronic components and circuit components are mounted on the printed circuit board, an insulating film surrounds or partially surrounds the printed circuit board, and is characterized in that the insulating film includes: a film upper layer and A lower film layer, wherein the upper film layer and the lower film layer are made of a first plastic selected from the group consisting of PC, PET, PI, PP, and PA, the first plastic contains a thermally conductive additive; and a film intermediate layer Located between the upper layer and the lower layer of the film, wherein the intermediate layer of the film is made of a second plastic selected from the group consisting of PC, PET, PI, PP and PA, the second plastic contains a conductive additive, An upper surface of the intermediate layer of the film is combined with a lower surface of the upper layer of the film, and a lower surface of the intermediate layer of the film is joined with an upper surface of the lower layer of the film. The electronic component according to claim 3, wherein the electronic component is used in an electronic device, wherein the electronic device includes a casing for the electronic component to be mounted, the insulating film is located between the casing and the printed circuit board, and There is no other shielding interlayer in the shell between the shell and the printed circuit board. The electronic component according to claim 4, wherein the electronic component is an adapter. The electronic component according to claim 4, wherein the electronic component is a power supply. An electronic component includes a printed circuit board, a plurality of electronic components and circuit parts are mounted on the printed circuit board, and an insulating film surrounds or partially surrounds the printed circuit board, characterized in that the insulating film includes: a film upper layer, The upper layer of the film is made of a first plastic selected from the group consisting of PC, PET, PI, PP, and PA, the first plastic contains a thermally conductive additive; and a lower layer of the film, wherein the lower layer of the film is made of PC A second plastic group consisting of PET, PI, PP, and PA. The second plastic contains a conductive additive, wherein the lower surface of the upper layer of the film is combined with an upper surface of the lower layer of the film. The electronic component according to claim 7, wherein the electronic component is used in an electronic device, wherein the electronic device includes a casing for the electronic component to be mounted, the insulating film is located between the casing and the printed circuit board, and There is no other shielding interlayer in the shell between the shell and the printed circuit board. The electronic component according to claim 8, wherein the electronic component is an adapter. The electronic component according to claim 8, wherein the electronic component is a power supply.