TWI655702B - Substrate processing device and substrate processing method - Google Patents

Abstract

The substrate processing apparatus includes: a plurality of processing units for processing the substrate; a processing liquid supply source for supplying the processing liquid to the processing unit; and a processing liquid supply path for guiding the processing liquid. The processing liquid supply path includes: a main supply path connected to the processing liquid supply source; and a plurality of branched supply paths branching from the main supply path to a plurality of processing units. A processing liquid related unit and a processing liquid valve are arranged in each branch supply path. The controller controls a plurality of processing liquid valves, and plans to eliminate bubbles (bubble removal processing) for eliminating bubbles in the flow paths of the divergent supply paths regardless of whether or not abnormalities occur in the processing liquid-related unit, and controls according to the plan Multiple treatment fluid valves.

Description

Substrate processing device and substrate processing method

The invention relates to a substrate processing device and a substrate processing method for processing substrates. The substrates to be processed include, for example, semiconductor wafers, liquid crystal display device substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disc substrates, magnetic disc substrates, and optical magnetic disc substrates Substrates, substrates for photomasks, ceramic substrates, substrates for solar cells, etc.

Patent Document 1 discloses an example of a substrate processing apparatus that processes a substrate with a processing liquid. The substrate processing apparatus includes a plurality of processing units, a transport robot for transporting substrates to each processing unit, and a master device for device control. The processing unit includes a spin chuck that holds the substrate and rotates the substrate, and a processing liquid nozzle that supplies the processing liquid to the substrate held by the spin chuck. A processing liquid supply pipe is connected to the processing liquid nozzle. The first chemical liquid supply pipe, the second chemical liquid supply pipe, and the rinse liquid supply pipe are connected to the processing liquid supply pipe. A flow meter and an electric needle valve are interposed between each of the first chemical liquid supply piping, the second chemical liquid supply piping, and the cleaning liquid supply piping. The flow meter detects the flow rate of the processing liquid flowing through each supply pipe, and inputs the detection result to the main device. The main device controls the opening of the electric needle valve according to the feedback of the flow detection result.

[Prior Technical Literature]

[Patent Literature]

Patent Document 1: US Patent Publication No. 2015/220468.

There is a case where gas bubbles appear in the supply path of the processing liquid, and the bubbles are caused by the gas dissolved in the processing liquid. When the bubbles are trapped to the supply path, there is a possibility that the correct supply path of the processing liquid and the detection of the flow rate may be obstructed. For example, when bubbles are captured in the detection target area of the flowmeter, the flow rate cannot be detected correctly.

Therefore, in the case where an error signal is output from the flowmeter, it is necessary to send the processing hydraulic pressure to the supply path of the processing liquid at a large flow rate to thereby press out bubbles in the flow path. Specifically, the procedure performed by the operator is as follows.

Sequence 1: Stop the substrate processing operation for the substrate processing device.

Sequence 2: Take out the substrate in the process from the processing unit corresponding to the flowmeter that has output the error signal.

Sequence 3: The valves of the processing liquid nozzles connected to all the processing units are closed.

Sequence 4: Open the valve of the processing liquid supply path of the flowmeter equipped with the output error signal.

With this, the processing liquid is pressure-fed from the pump provided in the processing liquid supply source to the processing liquid supply path of one processing unit, and the processing liquid is discharged from the processing liquid nozzle through the detection target area of the flowmeter that has generated an error signal. With this, the bubble system in the detection target area of the flowmeter is sprayed toward the processing liquid together with the processing liquid Mouth flows and discharges.

After that, the operator closes the valve opened in sequence 4 and restarts the normal operation of the substrate processing apparatus.

In such a sequence, an operation to stop the substrate processing operation of the substrate processing apparatus and remove air bubbles is required. Therefore, since the processing of all the processing units is stopped, the utilization rate of the substrate processing apparatus is reduced. In addition, there is a possibility that the substrate taken out in order 2 becomes useless.

Therefore, one of the objects of the present invention is to provide a substrate processing apparatus and a substrate processing method that can increase the utilization rate of the substrate processing apparatus.

In addition, another object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of suppressing useless substrates caused by bubbles generated in a flow path.

The present invention provides a substrate processing device including: a plurality of processing units for processing a substrate with a processing liquid; a processing liquid supply source for supplying the foregoing processing liquid; a processing liquid supply path including: a main supply path , Connected to the processing liquid supply source; and a plurality of branched supply paths, branching from the main supply path to the plurality of processing units; a processing liquid related unit, respectively configured on the plurality of branched supply paths, and functioning Or in response to the processing liquid in the flow path of the divergent supply path; a plurality of the process liquid valves respectively opening and closing the plural divergent supply paths and controlling the supply of the processing liquid to the processing unit; and a controller controlling the aforesaid Multiple treatment fluid valves. The controller is programmed to eliminate any abnormalities in the flow path of the divergent supply path regardless of the abnormality of the processing liquid-related unit The bubble elimination action of the bubbles, and control of the plurality of processing liquid valves described above in accordance with the plan.

According to this configuration, the processing liquid valve is controlled so that the bubble elimination operation for eliminating bubbles in the flow path of the divergent supply path is performed regardless of the abnormality of the processing liquid-related unit. That is, there is no need to wait for an abnormality in the processing liquid-related unit, and the air bubble elimination operation is planned in advance and implemented preventively. With this, the substrate processing apparatus can be suppressed or prevented from being shut down due to the abnormality of the processing liquid connection unit, so that the utilization rate of the substrate processing apparatus can be improved. In addition, the bubbles in the branched supply path can be eliminated before the bubbles are trapped in the branched supply path and affect the substrate processing, so that the substrate can be suppressed or prevented from being useless.

In one embodiment of the present invention, the bubble elimination operation includes the operation of pre-determining a predetermined amount (a number smaller than the total number of divergent supply paths, for example, one) of the treatment liquid of the divergent supply path The valve is set to an open state, and the processing liquid valves of the other branch supply paths are set to a closed state. Thereby, the processing liquid from the processing liquid supply source can be collectively sent to a predetermined number of divergent supply paths. As a result, the flow rate of the branch supply path can be increased and bubbles in the branch supply path can flow out.

In one embodiment of the present invention, the controller is programmed to plan the substrate processing operation in the processing unit, and the bubble elimination operation is planned in a manner to avoid interference with the substrate processing operation. With this, the influence on the substrate processing operation can be suppressed, and the bubble eliminating operation can be performed preventively. Therefore, it is possible to suppress a decrease in the utilization rate of the substrate processing apparatus Low and perform preventive bubble elimination actions.

In one embodiment of the present invention, the processing liquid related unit includes a flow meter that measures the flow rate of the processing liquid flowing through the flow path of the divergent supply path. With this, since the flow rate of the processing liquid supplied to the substrate can be monitored, high-quality processing can be applied to the substrate. Furthermore, since the air bubbles can be suppressed or prevented from being caught by the flow path of the branch supply path, it is possible to suppress or prevent the flow rate detection from becoming incorrect or impossible due to the presence of the air bubbles. Therefore, since it is possible to suppress or prevent the substrate processing apparatus from stopping due to a poor flow detection, the utilization rate of the substrate processing apparatus can be improved.

In addition, the present invention provides a substrate processing method, which is applied to a substrate processing apparatus including: a plurality of processing units for processing a substrate with a processing liquid; and a processing liquid supply source for supplying the aforementioned processing Liquid; the processing liquid supply path includes: a main supply path connected to the processing liquid supply source; and a plurality of branched supply paths branching from the main supply path to the plurality of processing units; a processing liquid related unit , Which are respectively disposed in the plurality of branched supply paths and act or respond to the processing liquid in the flow paths of the branched supply paths; and a plurality of processing liquid valves, which respectively open and close the plurality of branched supply paths and control The processing liquid is supplied to the aforementioned processing unit. The substrate processing method includes: a step of planning a bubble elimination operation for eliminating bubbles in the flow path of the divergent supply path regardless of whether the processing liquid connection unit is abnormal or not; and the bubble elimination step is based on the above plan The plurality of processing liquid valves described above are opened and closed so as to perform the bubble removal operation of the foregoing plan.

In the substrate processing method according to one embodiment of the present invention, the gas The bubble elimination step sets the predetermined number of the processing liquid valves of the divergent supply paths to an open state, and sets the processing liquid valves of the other diverging supply paths to a closed state.

The substrate processing method according to one embodiment of the present invention further includes a step of planning a substrate processing operation in the processing unit; a step of planning the bubble elimination operation is to avoid interference with the substrate processing operation Plan the aforementioned bubble elimination action.

In the substrate processing method according to one embodiment of the present invention, the processing liquid related unit includes a flow meter that measures the flow rate of the processing liquid flowing through the flow path of the divergent supply path.

In addition, the present invention provides a substrate processing apparatus including: a first processing zone, including: a first processing unit for processing a substrate with a processing liquid; and a first processing liquid supply source for supplying the aforementioned processing The first processing liquid supply path includes: a first main supply path connected to the first processing liquid supply source; and a first branched supply path branching from the first main supply path to the first A processing unit; a first processing liquid connection unit, which is disposed in the first branched supply path and acts or responds to the processing liquid in the flow path of the first branched supply path; and a first processing liquid valve, which connects the first A branch supply path is opened and closed, and the supply of the processing liquid to the first processing unit is controlled; the second processing area includes: a second processing unit that processes the substrate with the processing liquid; a second processing liquid supply source, which is used To supply the processing liquid; the second processing liquid supply path includes: a second main supply path connected to the second processing liquid supply source; and a second branched supply path diverging from the second main supply path To the aforementioned second processing order Element; a second processing liquid connection unit, which is disposed in the second branched supply path and acts or responds to the processing liquid in the flow path of the second branched supply path; and a second processing liquid valve, which connects the second The branch supply path is opened and closed, and the supply of the processing liquid to the second processing unit is controlled; and the controller controls the first processing liquid valve and the second processing liquid valve and the first processing unit and the second processing unit.

The aforementioned controller is programmed to: when instructed by the bubble elimination action plan, plan the bubble elimination action with the processing area corresponding to the aforementioned bubble elimination action plan; after the aforementioned bubble elimination action plan, when instructed When performing a plan for substrate processing using the first processing zone or the second processing zone, select a process zone that does not interfere with the bubble elimination plan, and plan the substrate process with the selected process zone.

According to this configuration, when the plan for instructing substrate processing after the plan for the bubble elimination operation is selected, the process division that does not interfere with the bubble elimination operation plan can be selected, and the plan uses a processing unit that belongs to the process division Substrate processing. As a result, it is possible to effectively utilize a plurality of processing divisions and perform substrate processing, whereby it is possible to suppress or prevent the stoppage time of the substrate processing apparatus accompanying the execution of the bubble eliminating operation.

The above objects, features, and effects of the present invention and other objects, features, and effects can be made clear by referring to the drawings and the description of the following embodiments.

1‧‧‧Substrate processing device

2‧‧‧Carrier Holder

3‧‧‧ Index Department

4‧‧‧ Processing Department

5‧‧‧Handling path

10‧‧‧medicine supply block

11, 21, 22 ‧‧‧ hand

12‧‧‧Multi-joint arm

13, 25, 36‧‧‧ rotation axis

15‧‧‧Substrate mounting table

23.24‧‧‧Hand advance and retreat mechanism

31‧‧‧Process chamber

32‧‧‧Processing hood

33‧‧‧Rotating fixture

34‧‧‧Medicinal liquid nozzle

40‧‧‧medicine supply piping

41‧‧‧Main supply path

41A‧‧‧Rising Department

41B‧‧‧ Crossing Department

41C

42、43‧‧‧Different supply paths

45‧‧‧Flow regulating valve

46‧‧‧Flowmeter

47‧‧‧Medicine valve

51‧‧‧drug solution export

52‧‧‧Return port

55‧‧‧medicine tank

56‧‧‧Pump

57‧‧‧ medicine liquid path

58‧‧‧Temperature Regulator

60‧‧‧Computer

61‧‧‧Control Department

62‧‧‧Output input section

63‧‧‧ Memory Department

64‧‧‧Host computer

65‧‧‧Scheduling function

66‧‧‧Process execution instruction department

70‧‧‧Program

71‧‧‧ Scheduler

72‧‧‧Process execution program

80‧‧‧ process work information

81‧‧‧ Schedule data

82‧‧‧Use history data

90‧‧‧Flow

91‧‧‧First sensor

92‧‧‧Second sensor

93‧‧‧Bubble

Blocks B1, B2, B3, B4, B6, B7, B8, B9, B11, B12, B13, B14, B15, B16‧‧‧

B5‧‧‧ processing block

B10‧‧‧medicine supply block

C‧‧‧Carrier

CC‧‧‧medicine tank

CC1‧‧‧ First medicine tank

CC2‧‧‧Second medicine liquid tank

CC3‧‧‧ third medicine liquid tank

CR1‧‧‧The first main handling robot

CR2‧‧‧The second main handling robot

IR‧‧‧ Index Robot

LP, LP1, LP2, LP3, LP4

MPC, MPC1 to MPC24‧‧‧‧ processing unit

PASS1‧‧‧The first unit

PASS2‧‧‧Second Grant Unit

PZ, PZ2 ‧‧‧ processing division

PZ1‧‧‧The first processing zone (processing zone)

PZ2‧‧‧Second processing division (processing division)

PZ3‧‧‧third processing division (processing division)

T1, T2, T3 ‧‧‧ Division last use time

TW, TW1 to TW6 ‧‧‧ unit tower

V‧‧‧Flow rate

W, W1 to W4 ‧‧‧ substrate

t1, t2, t9, t17 ‧‧‧ unit last use time

FIG. 1 is a schematic plan view for explaining the structure of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view corresponding to the section line II-II of FIG. 1.

3 is a system diagram for explaining the chemical liquid piping system in the substrate processing apparatus.

FIG. 4 is a block diagram illustrating the electrical structure of the aforementioned substrate processing apparatus.

5 is a schematic cross-sectional view for explaining a configuration example of a flowmeter arranged in a chemical liquid supply path.

6 is a flowchart for explaining an example of processing performed by a computer included in the substrate processing apparatus.

7 is a flowchart for explaining an example of processing performed by a computer included in the substrate processing apparatus.

FIG. 8A is an example of a temporary schedule created during scheduling.

FIG. 8B shows another example of the temporary schedule created during scheduling.

FIG. 8C is another example of a temporary schedule created during scheduling.

FIG. 9 is a diagram showing an example of the schedule of the bubble removing process (bubble removing operation).

FIG. 10A is an example for showing a schedule of substrate processing.

FIG. 10B is an example for showing a schedule of substrate processing.

FIG. 11A is used to show an example of a schedule including bubble removal processing and substrate processing.

FIG. 11B is used to show the inclusion of bubble removal processing and substrate processing An example of scheduling.

FIG. 12 is a diagram showing another example of a schedule including bubble removal processing and substrate processing.

FIG. 1 is a schematic plan view for explaining the structure of a substrate processing apparatus according to an embodiment of the present invention. In addition, FIG. 2 is a schematic cross-sectional view corresponding to the cross-sectional line II-II of FIG. 1.

The substrate processing apparatus 1 includes a carrier holding unit 2, an indexer unit 3, and a processing unit 4. The carrier holding portion 2 includes a plurality of load ports LP, and holds carriers C belonging to the substrate container that can accommodate a plurality of substrates W, respectively. The index unit 3 includes an index robot IR. The index robot IR executes: a loading operation, which takes out the unprocessed substrate W from the carrier C held by the carrier holding unit 2 and transfers it to the processing unit 4; and a storage operation, which takes the processed substrate from the processing unit 4 W is accommodated in the carrier C held by the carrier holding part 2.

The processing unit 4 includes a plurality of processing units MPC1 to MPC24 (hereinafter collectively referred to as "processing unit MPC"), a first main transport robot CR1 (first transport robot), a second main transport robot CR2 (second transport robot ), the first grant unit PASS1 and the second grant unit PASS2. In the plan view, a conveying path 5 extending linearly from the index section 3 is formed in the processing section 4. The first transfer unit PASS1, the first main transfer robot CR1, the second transfer unit PASS2, and the second main transfer robot CR2 are sequentially arranged in the transfer path 5 from the index unit 3 side. The first transfer unit PASS1 is used to mediate the substrate W between the index robot IR and the first main transfer robot CR1 Accepted by the unit. The second transfer unit PASS2 is a unit for mediating the transfer of the substrate W between the first main transfer robot CR1 and the second main transfer robot CR2.

The index robot IR, the first main transport robot CR1 and the second main transport robot CR2 constitute a substrate transport unit for transporting the substrate W between the carrier holding portion 2 and the processing unit MPC.

The plurality of processing units MPC are distributedly arranged in such a manner as to form a plurality of unit towers TW1 to TW6 (hereinafter collectively referred to as "unit tower TW"). Each unit tower TW is formed by stacking a plurality of processing units MPC into a plurality of layers (four layers in this embodiment). In this embodiment, each unit tower TW is formed by stacking four processing units MPC in the vertical direction. A plurality of unit towers TW are distributed on both sides of the transportation path 5 and are arranged along the transportation path 5. Specifically, in this embodiment, three unit towers TW1, TW3, and TW5 are arranged on one side of the conveyance path 5, and three unit towers TW2, TW4, and TW6 are arranged on the other side of the conveyance path 5. Next, the unit tower TW1 and the unit tower TW2 are a pair and face each other across the conveyance path 5, the unit tower TW3 and the unit tower TW4 are a pair and face each other across the conveyance path 5, the unit tower TW5 and the unit tower The TW6 is a pair and faces the conveying path 5 in a pair. Therefore, in the unit towers TW1, TW2 as a pair, the unit towers TW3, TW4 as a pair, and the unit towers TW5, TW6 as a pair, the unit towers TW1, TW2, unit towers TW3, TW4, unit tower TW5, The board conveyance distance between the TW6 and the index unit 3 is approximately equal to each other. Accordingly, in the unit towers TW1, TW2 as a pair, the unit towers TW3, TW4 as a pair, and the unit towers TW5, TW6 as a pair, the unit tower TW1 The substrate transfer time between TW2, unit towers TW3, TW4, unit towers TW5, TW6, and index unit 3 is approximately equal.

Each pair of unit towers TW1, TW2, unit towers TW3, TW4, unit towers TW5, TW6 are formed with processing zones PZ1, PZ2, PZ3 (hereinafter collectively referred to as "processing zone PZ") ). That is, the pair of unit towers TW1 and TW2 facing each other with the conveying path 5 sandwiched at the position closest to the index section 3 form the first processing zone PZ1. A pair of unit towers TW3 and TW4 facing each other with the conveying path 5 sandwiched at the next position close to the index section 3 forms a second processing zone PZ2. A pair of unit towers TW5 and TW6 facing the conveyance path 5 at the next position closest to the index section 3, that is, the position farthest from the index section 3 in this embodiment, forms the third processing zone PZ3.

The first grant unit PASS1 is arranged between the first processing zone PZ1 and the index unit 3. The first main transport robot CR1 is disposed on the opposite side of the index unit 3 in the first transfer unit PASS1. The first main transport robot CR1 is disposed at a position close to the first processing zone PZ1, more specifically, at a position between the pair of unit towers TW1, TW2 forming a first processing zone PZ1. A second transfer unit PASS2 is arranged on the side opposite to the first transfer unit PASS1 in the first main transport robot CR1. As a result, the first main transport robot CR1 is arranged so as to face the unit towers TW1, TW2 of the first receiving unit PASS1, the first processing zone PZ1, and the second receiving unit PASS2.

The second main transport robot CR2 is arranged on the opposite side of the first main transport robot CR1 in the second transfer unit PASS2. The second main transport robot CR2 is disposed close to the second processing zone PZ2 and the third processing zone The position of PZ3 is more specifically arranged at a position surrounded by unit towers TW3, TW4 unit towers TW5, TW6 forming two pairs of the second processing zone PZ2 and the third processing zone PZ3. As a result, the second main transport robot CR2 is arranged to face the unit towers TW3 to TW6 of the second transfer unit PASS2 and the second processing zone PZ2 and the third processing zone PZ3.

In this embodiment, the index robot IR is a horizontal articulated arm type robot. The indexing robot IR system includes: a hand 11 which holds the substrate W; a multi-joint arm 12 which is coupled to the hand 11; an arm rotation mechanism (not shown) which makes the multi-joint arm 12 go around the vertical The rotation axis 13 rotates; and the arm lifting mechanism (not shown) causes the multi-joint arm 12 to move up and down. With this configuration, the indexing robot IR causes the hand 11 to access the carrier C held by the arbitrary loading port LP and the first transfer unit PASS1, and to carry the substrate W or out relative to the destination of the access Substrate W. With this, the index robot IR transfers the substrate W between the processing unit 4 (more precisely, the first transfer unit PASS1) and an arbitrary carrier C.

For the first main transfer robot CR1 and the second main transfer robot CR2, a substrate transfer robot having substantially the same configuration can be used. Preferably, such a substrate transport robot includes: a pair of hands 21, 22 to hold the substrate W; a pair of hand advance and retreat mechanisms 23, 24 to advance and retreat a hand 21, 22 in the horizontal direction (radiation direction), respectively ; Hand rotation mechanism (not shown), which rotates a hand forward and backward mechanism 23, 24 around the vertical axis of rotation 25; and hand lift mechanism (not shown), which causes the hand forward and backward mechanism 23, 24 Move up and down. Thereby, the substrate W can be taken out from the access destination with one hand 21 and 22 and the substrate W can be carried into the access destination with the other hand 21 and 22. By The substrate transport robot of such a configuration is applied to the first main transport robot CR1, which enables the hands 21, 22 to pair the first transfer unit PASS1, the unit tower TW1 used to form the first processing zone PZ1 The multiple processing units MPC of TW2 and the second grant unit PASS2 directly access and carry the substrate W in or out of the substrate W relative to the destination of the access. In addition, by applying the substrate transfer robot of such a configuration to the second main transfer robot CR2, the second main transfer robot CR2 enables the hands 21, 22 to pair the second transfer unit PASS2 and to form the second processing zone PZ2 The plurality of processing units MPC of the cell towers TW3 to TW6 of the third processing zone PZ3 directly access and carry the substrate W in or out of the substrate W with respect to the destination of the access.

The first transfer unit PASS1 and the second transfer unit PASS2 are provided with a substrate mounting table 15 that temporarily holds the substrate W.

Three chemical liquid tanks CC1, CC2, and CC3 are provided corresponding to the first processing zone PZ1, the second processing zone PZ2, and the third processing zone PZ3 (medical solution supply source, which is an example of the processing fluid supply source. It is called "drug tank CC"). The first chemical liquid tank CC1 supplies a chemical liquid (an example of a processing fluid) for processing the substrate W to the plurality of processing units MPC forming the first processing zone PZ1. That is, the first chemical liquid tank CC1 is shared by the plurality of processing units MPC included in the first processing zone PZ1. Similarly, the second chemical liquid tank CC2 supplies the chemical liquid for processing the substrate W to the plurality of processing units MPC for forming the second processing zone PZ2. That is, the second chemical solution tank CC2 is shared by the plurality of processing units MPC included in the second processing zone PZ2. Furthermore, in the same way, the third chemical liquid tank CC3 is used to form the third processing zone PZ3 A plurality of processing units MPC supplies a chemical solution for processing the substrate W. That is, the third chemical liquid tank CC3 is shared by a plurality of processing units MPC included in the third processing zone PZ3.

In FIG. 1, although the first chemical liquid tank CC1, the second chemical liquid tank CC2, and the third chemical liquid tank CC3 are provided on one side of the processing unit 4, they may be disposed in other places. For example, part or all of the first chemical liquid tank CC1, the second chemical liquid tank CC2, and the third chemical liquid tank CC3 may be disposed near the end of the conveyance path 5 on the opposite side to the index portion 3. In addition, part or all of the first chemical liquid tank CC1, the second chemical liquid tank CC2, and the third chemical liquid tank CC3 may be disposed at a lower portion below the floor surface of the substrate processing apparatus body including the processing unit MPC, etc. Space. That is, in order to reduce the occupied area of the entire device, the chemical solution tank CC may be three-dimensionally arranged on the substrate processing device body.

FIG. 3 is a system diagram for explaining the chemical liquid piping system in the substrate processing apparatus 1. The processing unit MPC includes: a processing chamber 31; a processing cup 32 arranged in the processing chamber 31; a spin chuck 33 arranged in the processing cover 32; and The chemical liquid nozzle 34 is used to supply the chemical liquid to the substrate W. The rotation jig 33 is configured to hold one substrate W to be processed in a horizontal posture and rotate the substrate W about a vertical rotation axis 36. The chemical liquid nozzle 34 is disposed in the processing chamber 31 and discharges the chemical liquid and the cleaning liquid toward the upper surface of the substrate W held by the rotation jig 33, respectively. The chemical liquid is supplied from the chemical liquid tank CC to the chemical liquid nozzle 34 via the chemical liquid supply pipe 40.

A chemical liquid tank CC is provided for each processing zone PZ. The medical fluid piping system includes: the medical fluid supply piping 40, which is used to The processing unit MPC supplies the chemical solution.

The chemical liquid supply piping 40 includes a main supply path 41 that is spanned between two unit towers TW that constitute a processing zone PZ, and is arranged in a gate shape. The main supply path 41 includes: an upright portion 41A, which stands up along one unit tower TW; a crossing portion 41B, which is coupled to the upright portion 41A, and crosses the unit above the transportation path 5 to the other unit The tower TW; and the hanging portion 41C are coupled to the crossing portion 41B and hang down along the other unit tower TW. The chemical liquid outlet 51 of the chemical liquid tank CC is coupled to the inlet portion of the main supply path 41, and the chemical liquid return port 52 of the chemical liquid tank CC is coupled to the outlet portion of the main supply path 41. The chemical liquid supply piping 40 further includes: a plurality of branched supply paths 42 branching from the rising portion 41A to a plurality of processing units MPC constituting the unit tower TW; and a plurality of branched supply paths 43 hanging from the The sections 41C branch into a plurality of processing units MPC that constitute the unit tower TW, respectively. A flow rate adjustment valve 45, a flow meter 46, and a chemical liquid valve 47 are interposed between the branch supply paths 42 and 43. The front ends of the respective branch supply paths 42 and 43 are introduced into the processing unit MPC and are coupled to the chemical liquid nozzle 34. The flow rate adjustment valve 45 is a valve for adjusting the flow rate of the chemical liquid flowing through the branch supply paths 42 and 43. The flow meter 46 is a device for measuring the flow rate of the chemical liquid flowing through the branch supply paths 42 and 43. The chemical liquid valve 47 is a valve for opening and closing the branch supply paths 42 and 43 to control the discharge of the chemical liquid from the chemical liquid nozzle 34 and to stop the discharge of the chemical liquid from the chemical liquid nozzle 34.

The liquid medicine tank CC includes: a liquid medicine tank 55 for storing the liquid medicine; a pump 56 for drawing up the liquid medicine from the liquid medicine tank 55 and sending it to the main supply path 41; and a temperature regulator ( Heater) 58, clamped between the chemical liquid tank 55 and the chemical liquid outlet 51的的液液PATH57. The chemical liquid system pumped from the chemical liquid tank 55 by the pump 56 is supplied to the processing unit MPC through the chemical liquid path 57 and the chemical liquid supply piping 40. The chemical solution that is not used by the processing unit MPC is returned to the chemical solution tank 55 through the chemical solution supply pipe 40 to circulate the chemical solution. Since the temperature regulator 58 is interposed in the circulation path of the chemical liquid, the temperature of the chemical liquid in the chemical liquid tank 55 can be maintained by driving the pump 56 and circulating the chemical liquid. The pressure feeding of the chemical solution toward the main supply path 41 is not limited to the configuration using the pump 56, but can also be configured by pressurizing the inside of the closed-shaped chemical solution tank 55 with a pressurized gas (for example, an inert gas such as nitrogen). get on.

FIG. 4 is a block diagram for explaining the electrical structure of the substrate processing apparatus 1. The substrate processing apparatus 1 is provided with a computer 60 as a controller. The computer 60 controls the processing units MPC1 to MPC8, the processing units MPC9 to MPC16, the processing units MPC17 to MPC24, the chemical tanks CC1, CC2, CC3, the main transport robots CR1, CR2, and the indexing robot IR. The computer 60 may also be in the form of a personal computer (FA (Factory Automation) computer). The computer 60 includes a control unit 61, an output input unit 62, and a memory unit 63. The control unit 61 includes an arithmetic unit such as a CPU (Central Processing Unit). The input/output unit 62 includes output devices such as a display unit, input devices such as a keyboard, a pointing device, and a touch panel. Furthermore, the input/output unit 62 includes a communication module for communicating with a host computer 64 belonging to an external computer. The memory portion 63 includes a solid-state memory device (hard-state memory device), a hard disk drive (hard disk drive) and other memory devices.

The control unit 61 includes a scheduling function unit 65 and a process execution instruction unit 66. The scheduling function part 65 is a plan (scheduling) for making the resources of the substrate processing apparatus 1 act according to a time series, so as to carry out the substrate W from the carrier C, and use the processing units MPC1 to MPC24 After processing one or more of the substrates W, the processed substrates W are housed in the carrier C. The processing execution instruction unit 66 activates the resources of the substrate processing apparatus 1 according to the schedule created by the schedule function unit 65. The resource refers to various units included in the substrate processing apparatus 1 for performing substrate processing, and specifically includes processing units MPC1 to MPC24, indexing robot IR, main transport robots CR1, CR2, and chemical tank CC1. CC2, CC3 and their constituent elements.

The memory section 63 is configured to memorize the program 70 to be executed by the control section 61, the process job data (process job information) 80 received from the host computer 64, and the schedule created by the schedule function section 65 Process data 81, and various data such as the usage history data 82 of the processing unit MPC and the processing zone PZ.

The program 70 memorized in the memory part 63 includes: a schedule creation program 71 for actuating the control part 61 as a schedule control function part 65; and a process execution program 72 for the control part 61 as a process execution The instruction section 66 operates.

The process work data 80 includes: a process work (PJ) symbol, which is assigned to each substrate W; and a recipe, which corresponds to the process work symbol. The recipe is the data that defines the content of substrate processing, and includes the substrate processing conditions and substrate processing sequence. More specifically, it includes substrate type information, parallel processing unit information, used processing liquid information, processing time information, and so on. The substrate type information is information indicating the type of the substrate W to be processed. base Specific examples of the type of the board W are non-product substrates that are used for manufacturing product substrates used in products, used for maintenance of the processing unit MPC, and are not used for manufacturing products. The so-called parallel processing unit information refers to the processing unit designation information used to designate the usable processing unit MPC, and indicates that the parallel processing that the designated processing unit MPC can be performed. That is, as long as the substrate W can be processed by any one of the designated processing units. The used processing liquid information refers to information for specifying the type of processing liquid used for substrate processing. Specific examples are information used to specify the type of chemical liquid and the temperature of the chemical liquid. The so-called processing time information is used to provide the duration of the processing liquid. The processing liquid information and processing time information are examples of processing condition information.

The so-called process work refers to the processing performed on one or a plurality of substrates W subjected to common processing. The so-called process work symbol is the identification information (substrate group identification information) used to identify the process work. That is, the plurality of substrates W to which the common process work symbol is given are subjected to a process common to the recipes corresponding to the process work symbol. For example, when a common process is applied to a plurality of substrates W in which the processing order (the order of taking out from the carrier C) is continuous, a common process work symbol is given to the plurality of substrates W. However, there may be cases where the substrate processing contents (recipes) corresponding to different process work symbols are the same.

The control unit 61 acquires process work data for each substrate W from the host computer 64 via the output input unit 62 and stores it in the memory unit 63. The process work data can be acquired and memorized only before the schedule for each substrate W is executed. For example, the carrier C can also be held at the loading ports LP1 to LP4 Immediately after, the host computer 64 immediately gives the control unit 61 the process work data corresponding to the substrate W housed in the carrier C. The scheduling function part 65 plans each process work based on the process work data 80 stored in the memory part 63, and stores the schedule data 81 representing the plan in the memory part 63. The processing execution instruction part 66 controls the index robot IR, the main transfer robots CR1, CR2, the processing units MPC1 to MPC24, and the chemical tanks CC1, CC2, and CC3 according to the schedule data 81 stored in the memory part 63, thereby enabling the substrate processing apparatus 1 Perform process work.

The output signal of the flow meter 46 is input to the control unit 61 from each processing unit MPC. With this, the control unit 61 monitors whether or not a proper flow of chemical solution is discharged in each processing unit MPC. In addition, the control unit 61 opens and closes the chemical liquid valve 47 of each processing unit MPC. Thereby, the control part 61 controls the discharge of the chemical liquid in each processing unit MPC. In addition, in order to prevent the bubbles from entering the flowmeter 46, the control unit 61 performs the bubble removal process periodically or in response to an instruction input from the output input unit 62. In order to perform this bubble removal process, the control unit 61 opens and closes the chemical liquid valve 47 of the processing unit MPC.

FIG. 5 is a schematic cross-sectional view for explaining a configuration example of the flow meter 46. In this example, the flow meter 46 is an ultrasonic flow meter. The flow meter 46 includes a first sensor 91 and a second sensor 92 arranged on the outer peripheral surfaces of the branched supply paths 42 and 43. The first sensor 91 and the second sensor 92 are arranged along the flow direction of the flow path 90 of the branched supply paths 42 and 43 with an interval therebetween, and are arranged so as to face each other across the flow path. The first sensor 91 and the second sensor 92 are composed of, for example, piezoelectric elements capable of generating and receiving ultrasonic waves. That is, the first sensor 91 can generate ultrasonic waves, and the second sensor 92 detects this Ultrasound. On the contrary, the second sensor 92 can generate ultrasonic waves, and the first sensor 91 detects the ultrasonic waves. The time α 1 after the ultrasonic wave is generated by the first sensor 91 until the ultrasonic wave is detected by the second sensor 92 is measured. In addition, the time α 2 after the generation of the ultrasonic wave by the second sensor 92 until the detection of the ultrasonic wave by the first sensor 91 is detected. In the case where the fluids in the flow path 90 are equal to each other at rest and the fluids in the flow path 90 have a meaningful flow velocity V, the times α1 and α2 are different depending on the flow velocity V. Therefore, the flow rate in the flow path 90 can be obtained by measuring the times α1 and α2.

The transmission speed of ultrasonic waves depends on the type of fluid occupying the flow path 90. That is, as long as the entire flow path 90 is filled with the chemical solution, the correct flow rate can be obtained by measuring the time α1, α2. On the other hand, when the bubble 93 is caught by the flow path 90, that is, when so-called bubble dissolution occurs, the correct flow rate cannot be obtained.

Since this bubble dissolution system represents an abnormal flow value, the computer 60 can detect the bubble dissolution in the flow meter 46 by monitoring the output signal of the flow meter 46. When the computer 60 detects the dissolution of air bubbles, it will issue an alarm. For example, the computer 60 outputs the alarm display to the display of the output input unit 62.

In the case where such an alarm display has been output, it is necessary to push out the bubbles 93 in the flow path 90 by sending a large flow of medicine hydraulic pressure to the flow path 90 in which bubbles have been dissolved. Specifically, the operator performs the following procedure by operating the output input unit 62.

Sequence 1: Stop the substrate processing operation.

Step 2: The substrate W in the process is taken out from the processing unit MPC corresponding to the flow meter 46 in which bubbles have been dissolved.

Sequence 3: The chemical liquid valve 47 of the chemical liquid nozzle 34 connected to all the processing units MPC is closed.

Sequence 4: The chemical liquid valve 47 corresponding to the flow meter 46 in which bubbles have been dissolved is opened.

As a result, a chemical solution is pressure-fed from the chemical solution tank CC to the branch supply paths 42 and 43 of one processing unit MPC, and the chemical solution is discharged from the chemical solution nozzle 34 through the flow path of the flow meter 46 in which bubbles are generated. As a result, the bubbles 93 in the flow path 90 of the flow meter 46 flow along with the chemical liquid toward the chemical liquid nozzle 34 and are discharged.

After that, the operator closes the chemical liquid valve 47 opened in sequence 4 and reopens the normal operation of the substrate processing apparatus 1.

In such a sequence, an operation to stop the substrate processing operation and remove bubbles 93 is required. Therefore, since the processing of all the processing units MPC is stopped, the utilization rate of the substrate processing apparatus 1 is reduced. In addition, there is a possibility that the substrate W taken out in order 2 becomes useless.

Therefore, in the present embodiment, there is no need to wait for an alarm, that is, whether or not the flowmeter 46 is abnormal or not, it is performed preventively to remove air bubbles in the chemical liquid supply pipe 40, especially to remove air bubbles from the flow path of the flow meter 46 Removal processing.

6 and 7 are flowcharts for explaining processing examples performed by the scheduling function 65. More specifically, the control unit 61 (computer 60) executes the schedule creation program 71 and repeats the processing in a predetermined control cycle. In other words, a step group is incorporated in the schedule creation program 71 to enable the computer 60 to execute the processing shown in FIGS. 6 and 7.

The host computer 64 assigns the process work data to the control unit 61, and instructs It indicates that the process work defined in the process work data is started, that is, the substrate processing is started. The control part 61 receives the process work data and stores it in the memory part 63. The scheduling function 65 uses the process work data to perform scheduling for executing the process work. The start of the process work can also be instructed by the operator by operating the operation unit of the output input unit 62. In addition, the host computer 64 instructs to start the bubble removal process to prevent the bubbles of the flowmeter 46 from dissolving, for example, at a certain time interval. The start of this bubble removal process may be instructed by the operator by operating the operation unit of the output input unit 62. Alternatively, the computer 60 can instruct the computer 60 to start the bubble removal process when the computer 60 detects that the bubble is dissolved based on the output signal of the flow meter 46.

As shown in FIG. 6, when there is an instruction input (step S1 ), the scheduling function unit 65 determines whether the given instruction is substrate processing (process work) or bubble removal processing (step S2 ). In the case of substrate processing, it is determined whether or not there is already a bubble removal process indicating completion of the acceptance (step S3). When there is a bubble removal process indicating that the acceptance is completed (step S3: YES), the scheduling function unit 65 plans the bubble removal process (step S4), and then executes a plan for substrate processing (process work) (Step S5). On the other hand, when the given instruction is the bubble removal process (step S2), the instruction is first received and then it is determined whether there is a planned substrate process (step S6). When there is no planned substrate processing (step S6: No), the schedule of the bubble removal process is started (step S4). When there is a planned substrate processing (step S6: YES), it waits until the end of the substrate processing schedule (step S7), and then the air bubble removal processing schedule (step S4). With this process, the bubble removal process can be planned in a manner that avoids interference with the substrate processing operation. After finishing the air bubble removal processing schedule, the processing execution The line instruction unit 66 executes the bubble removal process of the plan (step S8); similarly, when the schedule of the substrate processing is ended, the process execution instruction unit 66 executes the substrate process of the plan (step S9).

FIG. 7 shows a detailed flow of the substrate processing plan. The scheduling function part 65 performs the scheduling for the substrate W corresponding to the process work data one by one in sequence. First, the scheduling function unit 65 refers to the recipe corresponding to the process work data, and specifies one or more processing units MPC that can be used for the processing of the substrate W based on the parallel processing unit information of the recipe (step S51). Next, the scheduling function section 65 executes a processing zone selection process for selecting one processing zone PZ that should be used for substrate processing (step S52). For example, in the processing division selection processing, any one of the processing divisions PZ is selected in such a manner that the plurality of processing divisions PZ1, PZ2, and PZ3 are equally selected. In addition, in step S52, it is also possible to select a processing zone PZ that should be used for substrate processing in such a manner that the processing zone PZ for performing substrate processing does not interfere with the processing zone PZ during the execution of the bubble removal process 11A and FIG. 11B, described later).

Next, the scheduling function unit 65 creates a temporary schedule for processing one substrate W (step S53). For example, the first processing zone PZ1 is selected in the processing zone selection process, and the parallel processing unit information of the recipe corresponding to the process work data includes all the processing units MPC1 to MPC8 of the first processing zone PZ1. That is, it is considered that the substrate processing according to the recipe can be executed in any of the eight processing units MPC1 to MPC8. In this case, there are eight paths through which the substrate W passes for processing. That is, the paths that can be selected for processing the substrate W are eight paths that pass through any one of the processing units MPC1 to MPC8. Therefore, the scheduling function 65 A temporary schedule corresponding to the eight paths is produced for this piece of substrate W.

FIG. 8A shows a temporary schedule corresponding to the path through the processing unit MPC1. The temporary timetable includes: block B1, which means that the substrate W is removed from the carrier C by the index robot IR; block B2, which means that the substrate W is put (Put) by the index robot IR to The first transfer unit PASS1; block B3, which means that the substrate W is carried out (Get) from the first transfer unit PASS1 by the first main transfer robot CR1; block B4, which means that the first main transfer robot CR1 The substrate W is put into the processing unit MPC1; the processing block B5 indicates that the substrate W is processed by the processing unit MPC1; the block B6 indicates that the first transport robot CR1 is removed from the processing unit MPC1 (Get ) The processed substrate W; block B7, which means that the substrate W is put into the first transfer unit PASS1 by the first main transport robot CR1; block B8, which means the substrate is used by the index robot IR W is taken out (Get) from the first grant unit PASS1; and block B9 means that the substrate W is put into the carrier C by the index robot IR. The scheduling function unit 65 sequentially arranges these blocks so as not to overlap each other on the time axis, thereby creating a temporary schedule. In addition, the temporary schedule of FIG. 8A includes: a chemical solution supply block B10, which indicates that the chemical solution is supplied from the first chemical solution tank CC1 during a predetermined chemical solution processing period in the period in which the processing block B5 is disposed .

The processing block B5 is described in detail. The processing block B5 includes, for example, the following plural steps. For example, the following steps are included: the substrate fixing step is to fix the substrate W transferred to the processing unit MPC by the first main transfer robot CR1 (or the second main transfer robot CR2) to the rotation jig 33 (refer to FIG. 3); The step of supplying the chemical liquid drawn from the chemical liquid tank CC from the chemical liquid nozzle 34 to the substrate W fixed to the rotation jig 33; the replacement step is to replace the chemical liquid with the cleaning liquid; the drying step is to dry the cleaning liquid; and fixing In the releasing step, the fixation of the substrate W by the rotation jig 33 is released. In this way, since the processing block B5 includes steps other than the chemical solution supply step, the time of the processing block B5 is shorter than that of the chemical solution supply block B10. In addition, since the substrate fixing step and the like are performed before the chemical liquid supply block B10, the chemical liquid supply block B10 is delayed from the start of the processing block B5 by a predetermined time.

Although omitted from the figure, the scheduling function 65 creates the same temporary schedule corresponding to the paths passing through the processing units MPC2 to MPC8 for the same substrate W (processing blocks have been arranged in the processing units MPC2 to MPC8, respectively) Temporary schedule). In this way, a temporary timetable for a total of eight paths is produced for one substrate W.

The created temporary schedule is stored in the memory 63 as part of the schedule data 81. In the production stage of the temporary schedule, the interference with the blocks on other substrates W (overlapping each other on the time axis) is not considered.

The schedule function unit 65 executes the official schedule (step S55 to step S58) after all temporary schedules corresponding to one substrate W have been created (step S54). The so-called formal scheduling refers to arranging the blocks of the created temporary schedule on the time axis so as not to overlap with other blocks of each resource. Among them, since the chemical solution tank CC is equipped with the ability to supply the chemical solution to all the processing units MPC of the corresponding processing zone PZ, the chemical solution supply block is allowed to be repeatedly arranged in the chemical solution tank CC. The schedule data created by the official schedule is stored in the memory 63.

More specifically, the scheduling function unit 65 selects one of the plurality of temporary schedules corresponding to the substrate W and has been completed, and obtains a block for constituting the temporary schedule (step S55). The block obtained at this time is the block arranged at the earliest position on the time axis of the temporary schedule among the unallocated blocks. Furthermore, the scheduling function unit 65 searches for the position where the obtained block can be arranged (step S56), and arranges the block at the searched position (step S57). Each block is made of the same resource and will not be reused at the same time, and is arranged at the earliest position on the time axis. The same action is repeated for all the blocks that constitute the selected temporary schedule (step S58). In this way, all the blocks that constitute the selected temporary schedule are configured, thereby ending the official schedule corresponding to the temporary schedule. This official schedule is executed for all the created temporary schedules (step S59). That is, for the case where the processing units MPC1 to MPC8 made with the possibility of being useful to process the substrate W process all of the substrate W, that is, the formal scheduling is performed for the case of eight paths.

When the official schedule of the eight routes is ended, a processing unit selection process is performed (step S60). In the processing unit selection process, a formal schedule is selected, that is, a formal schedule through a processing unit MPC is selected, thereby selecting a processing unit MPC for processing one substrate W. In the processing unit selection process, the earliest official schedule for processing the substrate W and returning to the carrier C is selected. If there are a plurality of official schedules equal to the time when the substrate W returns to the carrier C, the processing unit MPC with the longest use interval from the previous use is selected, that is, the oldest processing unit MPC with the last use time of the selection unit is selected The official schedule. By this, one processing area can be used equally Select the processing unit MPC by dividing the processing unit MPC in PZ.

In this way, when a formal schedule corresponding to a temporary schedule is selected, the schedule corresponding to the one piece of substrate W is completed. Next, the schedule data indicating the selected official schedule is stored in the memory 63. The process execution instruction unit 66 actually starts the process corresponding to the substrate W at any subsequent timing (step S62). That is, the substrate transfer operation is started. The substrate transfer operation transfers the substrate W from the carrier C by the index robot IR, and transfers the substrate W to the processing unit MPC by the main transfer robots CR1 and CR2.

The same operation is sequentially performed on all the substrates W constituting the process work (step S61).

When the second processing zone PZ2 is selected in the processing zone selection process (step S52), the scheduling function unit 65 creates a temporary schedule corresponding to the paths passing through the processing units MPC9 to MPC16, respectively, The blocks are respectively allocated to the temporary schedules of the processing units MPC9 to MPC16). With this, a temporary timetable for a total of eight paths is produced for one substrate W. FIG. 8B shows a temporary schedule corresponding to the path through the processing unit MPC9. The temporary timetable includes: block B1, which means that the substrate W is removed from the carrier C by the index robot IR; block B2, which means that the substrate W is put (Put) by the index robot IR to The first transfer unit PASS1; block B3, which means that the substrate W is carried out (Get) from the first transfer unit PASS1 by the first main transfer robot CR1; block B11, which means that the first main transfer robot CR1 The substrate W is put into the second grant unit PASS2; block B12 indicates that the substrate W is removed from the second grant unit PASS2 by the second main transfer robot CR2; block B13 indicates that the Second master The transfer robot CR2 puts the substrate W into the processing unit MPC9; the processing block B5 indicates that the substrate W is processed by the processing unit MPC9; the block B14 indicates that the second master transfer robot CR2 The processing unit MPC9 carries out (Get) the processed substrate W; the block B15 indicates that the substrate W is transferred (Put) to the second grant unit PASS2 by the second main transport robot CR2; the block B16 indicates that the The first main transport robot CR1 transfers (Get) the substrate W from the second transfer unit PASS2; Block B7 indicates that the first main transfer robot CR1 transfers (Put) the substrate W to the first transfer unit PASS1; Block B8 indicates that the substrate W is removed from the first transfer unit PASS1 by the index robot IR; and block B9 indicates that the substrate W is put into the carrier C by the index robot IR. The scheduling function part 65 arranges these blocks in sequence so as not to overlap each other on the time axis, thereby creating a temporary schedule. In addition, the temporary schedule in FIG. 8B includes a chemical solution supply block B10, which indicates that the chemical solution is supplied from the second chemical solution tank CC2 during a predetermined chemical solution processing period in the period in which the processing block is arranged.

When the third processing zone PZ3 is selected in the processing zone selection process (step S52), the scheduling function unit 65 creates a temporary schedule corresponding to the paths passing through the processing units MPC17 to MPC24, respectively, The blocks are respectively allocated to the temporary schedules of the processing units MPC17 to MPC24). With this, a temporary timetable for a total of eight paths is produced for one substrate W. FIG. 8C shows a temporary schedule corresponding to the path through the processing unit MPC17. This temporary schedule is substantially the same as the temporary schedule of FIG. 8B. Among them, the difference is: through the processing unit MPC17; and the configuration in the third chemical tank CC3 There is a chemical liquid supply block for indicating the chemical liquid supply.

FIG. 9 shows an example of the schedule of the bubble removal process. In this example, the bubble removal process is planned for the processing units MPC1 to MPC8 of the first processing zone PZ1 sharing the chemical tank CC1. The scheduling function unit 65 sequentially arranges the bubble removal processing blocks for the processing units MPC1 to MPC8 so as not to overlap each other on the time axis. In this way, it is planned to perform the bubble removal processing for the processing units MPC1 to MPC8 in sequence.

In the present embodiment, the air bubble removal process is a process for pressurizing and feeding a medical solution from one medical solution tank CC to only a predetermined number (one in the present embodiment) of the processing units MPC. By this, the chemical liquid is circulated at a large flow rate through the chemical liquid supply pipe 40 and only through one flow meter 46, thereby eliminating bubbles in the flow meter 46 and the branch supply paths 42 and 43 where the flow meter 46 is arranged . Since the chemical liquid tank CC connected to the target processing unit MPC is used for the bubble removal process, a chemical liquid supply block of a length corresponding to the period of the bubble removal process is arranged in the corresponding chemical liquid tank CC.

More specifically, the so-called air bubble removal process for the processing unit MPC1 refers to all the other processing units that will open the chemical liquid valve 47 of the processing unit MPC1 in the first processing zone PZ1 and belong to the first processing zone PZ1 The process of closing the liquid valve 47 of MPC2 to MPC8 for a certain period of time. Therefore, the computer 60 executes the bubble removal process by controlling the chemical liquid valves 47 of the processing units MPC1 to MPC8. The same applies to the bubble removal process for other processing units MPC.

10A and 10B show an example of a schedule of substrate processing. In this example, imagine the following scenario: process work data assigned from the host computer 64 It stipulates the processing of four substrates W1 to W4 using the recipe for designating the processing units MPC1 to MPC24 as parallel processing units.

When planning the processing of the first substrate W1, since the first processing zone PZ1, the second processing zone PZ2, and the third processing zone PZ3 are not used for substrate processing, the scheduling function 65 selects, for example, The first processing zone PZ1 with the smallest number makes eight temporary schedules, which respectively represent eight paths through the effective processing units MPC1 to MPC8 in the first processing zone PZ1, respectively. The scheduling function unit 65 performs formal scheduling for each of these temporary schedules, and prepares a plan for processing the first substrate W1 by one processing unit MPC (eg, processing unit MPC1). The time when the processing of the substrate W1 in the processing unit MPC1 ends is the unit last use time t1 which becomes the processing unit MPC1, and the zone last use time T1 which becomes the first processing zone PZ1. The last use time t1 of these units and the last use time T1 of the division are examples of use history data 82 (refer to FIG. 4 ). Similarly, regarding the other processing unit MPC and the processing zone PZ, the unit last use time and the zone last use time are also stored in the memory section 63 as the use history data 82.

When planning the processing of the second substrate W2, the processing of one substrate W1 has been planned for the first processing zone PZ1; for the second processing zone PZ2 and the third processing zone PZ3, the substrate process has not been planned. Therefore, the scheduling function unit 65 selects the second processing zone PZ2 with the smallest number among the second processing zone PZ2 and the third processing zone PZ3 that have not yet been planned by the substrate processing and creates eight temporary schedules, and the eight temporary schedules Respectively represent eight effective processing units MPC9 to MPC16 in the second processing zone PZ2 respectively path. The scheduling function unit 65 performs formal scheduling on each of these temporary schedules and prepares a plan for processing the second substrate W2 by one processing unit MPC (for example, processing unit MPC9). At the time when the processing of the substrate W2 by the processing unit MPC9 is ended, the unit last usage time t9 which becomes the processing unit MPC19 and the division last usage time T2 which becomes the second processing division PZ2.

When planning the processing of the third substrate W3, since the substrate processing for the first processing zone PZ1 and the second processing zone PZ2 has been planned, the scheduling function unit 65 selects the third processing zone PZ3 and makes eight A temporary schedule, the eight temporary schedules respectively represent eight paths through the effective processing units MPC17 to MPC24 in the third processing zone PZ3. The scheduling function unit 65 performs formal scheduling on each of these temporary schedules, and prepares a plan for processing the third substrate W3 by one processing unit MPC (eg, processing unit MPC17). At the time when the processing of the substrate W3 by the processing unit MPC17 is ended, the unit last usage time t17 which becomes the processing unit MPC17 and the division last usage time T3 which becomes the third processing division PZ3.

When planning the processing of the fourth substrate W4 (see FIG. 10 ), the scheduling function 65 compares the last use times T1 and T2 of the first processing zone PZ1, the second processing zone PZ2, and the third processing zone PZ3 , T3, and select the first processing zone PZ1 corresponding to the last usage time T1 of the oldest zone (refer to FIG. 10A). Furthermore, the scheduling function unit 65 creates eight temporary schedules, which respectively represent eight paths respectively passing through the effective processing units MPC1 to MPC8 in the first processing zone PZ1. The scheduling function unit 65 executes a formal schedule for each of these temporary schedules and selects a process Unit MPC. In the example of FIG. 10B, at the time a1 when the first main transport robot CR1 can carry the substrate W4, since the processing units MPC1 to MPC8 of the first processing zone PZ1 have not processed the substrate W, even in any of the processing units MPC1 to MPC8 Both can plan the processing of the substrate W4, and the estimated timing of the substrate processing end (the time when the substrate W4 returns to the carrier C) is also substantially equal. On the other hand, the last use time t1 of the unit of the processing unit MPC1 is a meaningful value other than the initial value, and the last use time of the units of the other processing units MPC2 to MPC8 is the initial value. Therefore, the scheduling function unit 65 selects the official schedule that has used the temporary schedule of the processing unit MPC2 having the smallest number among the processing units MPC2 to MPC8, and prepares the substrate W4 for processing the fourth piece by the processing unit MPC2 plan. Since the processing time of the substrate W4 for which the processing unit MPC2 is completed is the last use time t2 of the unit of the processing unit MPC2 and the time after the last use time t1 of the unit, it becomes the last use time T1 of the division of the first processing division PZ1 =t2.

FIGS. 11A and 11B show an example of a schedule in which an instruction for substrate removal (process work) is given immediately before the end of the plan for the instruction for removing bubbles in the first processing zone PZ1. As in the case of FIG. 9, the scheduling function unit 65 is when the bubble removal instruction is input at time t0 (“Yes” in “Present instruction input?” in step S1 of FIG. 6, and “Yes” in step S2 "Substrate processing/bubble removal?" is "bubble removal processing"), and is made to perform the bubble removal processing of the processing units MPC1 to MPC8 of the first processing zone PZ1 of the common chemical tank CC1 from time t1 to time t10 Plan (in step S2 of FIG. 6 is "bubble removal processing", in step S6 "basic Board processing plan? "Is "No", and in step S4 it is "planned bubble removal process"). When a substrate processing instruction is input at time t2 after the end of the scheduling of the bubble removal process, the scheduling function unit 65 plans the process operation ("Yes" in "Existence instruction input?" in step S1 of FIG. 6) , "Substrate processing" in "Substrate processing/Bubble removal?" in step S2, "Yes" in "Accepted bubble removal processing completed?" in Step S3, "Planning substrate processing" in Step S5) .

At the first timing (time t3) when the first substrate W1 can be carried into the processing unit MPC, the first processing zone PZ1 is used to remove bubbles, so the first chemical solution tank CC1 cannot be used for Carry out chemical treatment. That is, none of the scheduling function part 65 can create a plan for transferring the substrate W1 to each of the processing units MPC1 to MPC8 belonging to the first processing zone PZ1. Therefore, the scheduling function unit 65 searches for the processing zone PZ that can plan the substrate process without interfering with the planned bubble removal process ("process zone selection" in step S52 of FIG. 7). Here, the processing unit MPC (the processing unit MPC9 in the example of FIG. 11A) for processing by the second processing division PZ2 belonging to the processing division PZ other than the first processing division PZ1 in which the bubble removal processing is planned is created Plan of substrate W1. That is, the scheduling function unit 65 arranges the processing block starting from time t4 for the processing unit MPC9, and arranges the chemical supply block corresponding to the processing block for the second chemical tank CC2. As described above, since the chemical liquid is not used in the entire period of the processing block, the chemical liquid supply block has a length corresponding to a period shorter than the processing block in the processing block. That is, the chemical solution supply block starting at time t5 delayed from the predetermined time by time t4 is arranged in the second chemical solution tank CC2.

As shown in FIG. 11B, at the first timing (time t6) at which the second substrate W2 can be carried into the processing unit MPC, although the bubble removal processing in the first processing zone PZ1 has not ended (before time t10) However, since the bubble removal process of the first processing zone PZ1 ends at the timing (time t11) for starting the use of the chemical solution for substrate processing, the first chemical solution tank CC1 can be used. Therefore, the schedule function section 65 is a plan for processing the substrate W2 by the processing unit MPC (the processing unit MPC1 in the example of FIG. 11B) of the first processing zone PZ1. That is, the scheduling function part 65 is to arrange the processing block from time t6 on the processing unit MPC1, and to arrange the medical solution supply block corresponding to the processing block on the first medicine from time 11 Liquid tank CC1.

In this way, the substrate processing is planned so as not to interfere with the bubble removal processing.

FIG. 12 shows an example of a schedule in the case where an instruction (time t01) for bubble removal processing is given to the first processing zone PZ1 immediately before the end of the plan (time t0) of substrate processing (program operation). The scheduling function unit 65 retains the plan of the bubble removal process, and prepares the process of planning four substrates W1 to W4 in the same manner as in the case of FIGS. 10A and 10B. That is, when there is an instruction for substrate processing at time t0 ("Yes" in the "presence instruction input?" in step S1 of FIG. 6, and "substrate in "substrate processing/bubble removal?" in step S2 Processing"), the scheduling function unit 65 plans the substrate processing as follows ("Substrate processing/Bubble removal?" in step S2 of FIG. 6 is "substrate processing", and the "bubble removal processing is accepted in step S3" "?" is "No", in step S5 it is "planned substrate processing").

First, the processing block for the first substrate W1 is arranged in the processing unit MPC1 from time t1. Furthermore, the chemical solution supply block corresponding to the processing block is arranged in the period from time t11 to time t12 in the first chemical solution tank CC1.

Next, the processing block for the second substrate W2 is arranged in the processing unit MPC9 from time t2. In addition, the chemical solution processing block corresponding to the processing block is arranged in the period from time t21 to time t22 in the second chemical solution tank CC2.

In the processing unit MPC17, a processing block for the third substrate W3 is arranged from time t3. Furthermore, the chemical solution processing block corresponding to the processing block is arranged in the period from time t31 to time t32 in the third chemical solution tank CC3.

Finally, the processing block for the fourth substrate W4 is arranged in the processing unit MPC2 from time t4. In addition, the chemical solution processing block corresponding to the processing block is disposed in the period from time t41 to time t42 in the first chemical solution tank CC1.

Next, as in the case of FIG. 9, the bubble removal process of the processing units MPC1 to MPC8 of the first processing zone PZ1 is planned so as not to cause interference with the planned substrate processing. More specifically, in the first processing zone PZ1, from the time t42 when the use of the first chemical solution tank CC1 for substrate processing of the substrate W1 and the substrate W4 starts, the bubble removal is sequentially arranged from the processing unit MPC1 Processing blocks.

In this way, the bubble removal process is planned so as not to interfere with the substrate process previously received.

As described above, the substrate processing apparatus 1 of this embodiment includes: a plurality of processing units MPC, which processes the substrate W with the processing liquid; and a chemical tank CC, which supplies the chemical liquid as an example of the processing liquid to the processing unit MPC; and the chemical liquid supply piping 40, which guides the chemical liquid from the chemical liquid tank CC to the processing unit MPC. The chemical liquid supply piping 40 includes a main supply path 41 connected to the chemical liquid tank CC, and a plurality of branched supply paths 42 and 43 branched from the main supply path 41 to a plurality of processing units MPC. The branch supply paths 42 and 43 are provided with: a flow meter 46 that detects the flow rate of the chemical liquid flowing through the flow paths of the branch supply paths 42 and 43; and a chemical liquid valve 47 that opens and closes the branch supply paths 42 and 43 And control the supply of the chemical liquid to the processing unit MPC (especially the chemical liquid nozzle 34). The computer 60 as a controller controls a plurality of chemical liquid valves 47, and plans to eliminate bubbles (bubble removal processing) for eliminating bubbles in the flow paths of the branch supply paths 42, 43 regardless of whether or not an abnormality occurs in the flow meter 46. , And control a plurality of liquid medicine valves 47 according to the plan.

According to this configuration, the chemical liquid valve 47 is controlled regardless of whether there is an abnormality in the flow meter 46, so as to perform a bubble elimination operation for eliminating bubbles in the flow paths of the branch supply paths 42, 43. That is, it is not necessary to wait for the flowmeter 46 to generate an abnormality, and the bubble elimination operation is planned in advance and is implemented preventively. With this, since the operation of the substrate processing apparatus 1 due to the abnormality of the flowmeter 46 is suppressed or prevented, the utilization rate of the substrate processing apparatus 1 can be improved. In addition, the bubbles in the branch supply paths 42 and 43 can be eliminated before the bubbles are trapped in the branch supply paths 42 and 43 and affect the substrate processing, so that the substrate W can be suppressed or prevented from becoming useless.

In addition, in this embodiment, the computer 60 is the program processing unit MPC In the substrate processing operation in the process, and to avoid interference with the aforementioned substrate processing operation, the bubble removal process is planned. With this, the influence of the substrate processing operation can be suppressed, and the bubble eliminating operation can be performed preventively. Therefore, it is possible to perform a preventive bubble elimination operation while suppressing a decrease in the utilization rate of the substrate processing apparatus 1.

In addition, the substrate processing apparatus 1 of the present embodiment is provided with the chemical liquid supply piping 40 independent of each of the plurality of processing zones PZ1 to PZ3. In addition, it is determined whether the bubble elimination operation can be started for each chemical solution supply pipe 40. For example, in the example of FIG. 12, the start timing of the bubble removal process in the first processing zone PZ1 is set at the time t42 when the use of the chemical tank CC1 of the first processing zone PZ1 is stopped. This time t42 is earlier than the use time of the chemical tanks CC2 and CC3 of the other processing zones PZ2 and PZ3. Therefore, without waiting for the other processing zones PZ2 and PZ3 to stop being used, the bubble elimination operation of the first management zone PZ1 can be quickly started.

In addition, in the present embodiment, in a case where a bubble elimination operation is planned for a certain processing zone PZ, another process zone PZ where no bubble elimination action is planned is explored, and the substrate is executed in the other process zone PZ The processing method is planned for substrate processing.

With this, even in the case where an instruction for bubble removal processing is given immediately after the substrate processing instruction, the bubble removal processing can be started without waiting for the completion of the planned substrate processing. With this, the bubble removal process can be executed in advance.

In the examples of FIGS. 11A and 11B, when the substrate processing plan is instructed, the scheduling function unit 65 selects a process that does not interfere with the existing bubble removal process plan from the plurality of processing zones PZ1 to PZ3 Processing unit MPC in the division PZ (substrate W1 is the processing unit in the second processing division PZ2 MPC9, substrate W2 is MPC8 of the first processing zone PZ1), and the substrate processing plan is filed.

With this, even in the case where the instruction for substrate processing is given immediately after the instruction for substrate processing, the substrate processing can be started without waiting for the completion of the planned bubble removal processing to be completed. By this, the substrate processing can be performed in advance.

Although the specific embodiments of the present invention have been described above, the present invention can also be implemented in other forms as exemplified below.

For example, in the foregoing embodiment, the first chemical liquid tank CC1, the second chemical liquid tank CC2, and the third chemical liquid tank CC3 are provided corresponding to the first processing area PZ1, the second processing area PZ2, and the third processing area PZ3 . However, it is also possible for a plurality of treatment zones PZ to share a chemical liquid tank, and a plurality of pump equal pressure delivery devices respectively corresponding to the plurality of treatment zones PZ are provided in the one chemical liquid tank.

Furthermore, in the foregoing embodiment, although the flow meter 46 for detecting the flow rate of the chemical liquid passing through the divergent supply paths 42 and 43 is an example of the processing liquid related unit, as the processing liquid related unit, other such as concentration sensing may be exemplified. Sensor, liquid quality sensor, pressure sensor, temperature sensor, heat exchanger, etc. These are devices that may cause an obstacle to the operation or detection due to bubbles generated in the branch supply paths 42 and 43.

Although the embodiments of the present invention have been described in detail, these are only specific examples to clarify the technical content of the present invention, and the present invention should not be construed as being limited to these specific examples, and the scope of the present invention is only applied for patents The scope is limited.

The present invention was proposed at the Japan Patent Office on April 15, 2016 Japanese Patent Application No. 2016-082422 corresponds, all contents of this application are cited and incorporated herein.

Claims (13)

A substrate processing device comprising: a plurality of processing units for processing a substrate with a processing liquid; a processing liquid supply source for supplying the foregoing processing liquid; a processing liquid supply path including: a main supply path and a connection To the aforementioned processing liquid supply source; and a plurality of branched supply paths branching from the main supply path to the plurality of processing units; a processing liquid related unit, respectively disposed on the plurality of branched supply paths and responding to the branched supply Processing liquid in the flow path of the path; a plurality of processing liquid valves that respectively open and close the plurality of divergent supply paths and control the supply of processing liquid to the processing unit; and a controller that controls the plurality of processing liquid valves; The controller is programmed to plan a bubble elimination operation to eliminate bubbles in the flow paths of the divergent supply paths regardless of whether the processing liquid related unit is abnormal or not, and to control the plurality of processing liquid valves according to the plan; The bubble elimination operation includes the following operations: setting a predetermined number of the processing liquid valves of the divergent supply paths to an open state and setting the processing liquid valves of the other diverging supply paths to a closed state, and continuing for a certain time time. The substrate processing apparatus according to claim 1, wherein the bubble elimination operation includes the operation of setting the processing liquid valve of one of the branched supply paths to an open state and setting the processing of all the other branched supply paths The liquid valve is set to a closed state and lasts for a certain period of time. The substrate processing apparatus as described in claim 1, further comprising: a plurality of flow regulating valves respectively sandwiched between the plurality of divergent supply paths and used to adjust the processing liquid flowing through the corresponding divergent supply path flow. The substrate processing apparatus according to claim 1, wherein the processing liquid connection unit includes a flow meter, a concentration sensor, a liquid quality sensor, a pressure sensor, or a temperature sensor. The substrate processing apparatus according to claim 1, wherein the controller sequentially plans a bubble elimination operation for eliminating bubbles in the flow paths of the divergent supply paths for the plurality of processing units. The substrate processing apparatus according to any one of claims 1 to 5, wherein the controller is programmed to plan the substrate processing operation in the processing unit and to avoid interference with the substrate processing operation Bubble elimination action. A substrate processing method is applied to a substrate processing apparatus. The substrate processing apparatus includes: a plurality of processing units for processing a substrate with a processing liquid; a processing liquid supply source for supplying the foregoing processing liquid; a processing liquid supply path , Which includes: a main supply path, which is connected to the processing liquid supply source; and a plurality of branched supply paths, which branch from the main supply path to the plurality of processing units; a processing liquid connection unit, which is respectively configured in the A plurality of branched supply paths, and a processing liquid in a flow path responsive to the branched supply path; and a plurality of processing liquid valves that respectively open and close the plurality of branched supply paths and control the supply of the processing liquid to the processing unit; The substrate processing method includes: a step of planning a bubble eliminating operation for eliminating bubbles in the flow path of the divergent supply path regardless of whether the processing liquid connection unit is abnormal or not; and a bubble eliminating step according to the above plan A plurality of processing liquid valves are opened and closed to perform the bubble elimination operation of the aforementioned plan; the bubble eliminating step is to set the predetermined number of the processing liquid valves of the divergent supply paths to the open state and set the other divergent The aforementioned processing liquid valve of the supply path is set in a closed state and continues for a certain period of time. The substrate processing method according to claim 7, wherein the air bubble eliminating step sets the processing liquid valves of one of the branch supply paths to an open state and sets the processing liquid valves of all the other branch supply paths to a closed state And last for a certain period of time. The substrate processing method as recited in claim 7, wherein the substrate processing apparatus further includes: a plurality of flow adjustment valves respectively sandwiched between the plurality of divergent supply paths and used to adjust the corresponding divergent supply paths flowing through The flow rate of the treatment liquid. The substrate processing method according to claim 7, wherein the processing liquid connection unit includes a flow meter, a concentration sensor, a liquid quality sensor, a pressure sensor, or a temperature sensor. The substrate processing method according to claim 7, wherein the step for planning the bubble elimination operation is to sequentially plan the bubble elimination operation for eliminating bubbles in the flow paths of the divergent supply paths for the plurality of processing units . The substrate processing method as described in any one of claims 7 to 11, further comprising a step of planning a substrate processing operation in the aforementioned processing unit; a step of planning the aforementioned bubble eliminating operation is to avoid the aforementioned substrate processing operation The method of interference plans the aforementioned bubble elimination action. A substrate processing apparatus includes: a first processing zone, a second processing zone, and a controller; the first processing zone includes: a first processing unit that processes a substrate with a processing liquid; and a first processing liquid supply source , Is used to supply the processing liquid; the first processing liquid supply path includes: a first main supply path, which is connected to the first processing liquid supply source; and a first branch supply path, which is from the first main The supply path diverges to the first processing unit; the first processing liquid connection unit is a processing liquid disposed in the first branched supply path and acts or responds to the first branched supply path; and the first processing The liquid valve opens and closes the first branch supply path and controls the supply of the processing liquid to the first processing unit; the second processing area includes: a second processing unit that processes the substrate with the processing liquid; the second The processing liquid supply source is used to supply the foregoing processing liquid; the second processing liquid supply path includes: a second main supply path connected to the second processing liquid supply source; and a second branched supply path The second main supply path branches to the second processing unit; the second processing liquid connection unit is disposed in the second branch supply path and acts or responds to the processing liquid in the flow path of the second branch supply path; And a second processing liquid valve that opens and closes the second branched supply path and controls the supply of processing liquid to the second processing unit; the controller controls the first processing liquid valve and the second processing liquid valve and the foregoing The first processing unit and the second processing unit; the controller is programmed to: when instructed to plan the bubble-eliminating action, plan the bubble-eliminating action with the processing area corresponding to the bubble-eliminating action plan, and After the plan for the bubble elimination operation, when instructed to perform the substrate processing with the first processing zone or the second processing zone, select a process zone that does not interfere with the bubble elimination plan. The selected processing zones plan the substrate processing.