JP6704778B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate. The substrate to be processed is, for example, a semiconductor wafer, a liquid crystal display device substrate, a plasma display substrate, an FED (Field Emission Display) substrate, an optical disc substrate, a magnetic disc substrate, a magneto-optical disc substrate, a photo substrate. It includes a mask substrate, a ceramic substrate, a solar cell substrate, and the like.

Patent Document 1 discloses an example of a substrate processing apparatus that processes a substrate with a processing liquid. This substrate processing apparatus includes a plurality of processing units, a transfer robot that transfers a substrate to each processing unit, and a master device for controlling the apparatus. The processing unit includes a spin chuck that holds and rotates a substrate, and a processing liquid nozzle that supplies a processing liquid to the substrate held by the spin chuck. A treatment liquid supply pipe is connected to the treatment liquid nozzle. A first chemical liquid supply pipe, a second chemical liquid supply pipe, and a rinse liquid supply pipe are connected to the treatment liquid supply pipe. A flow meter and an electric needle valve are provided in each of the first chemical liquid supply pipe, the second chemical liquid supply pipe, and the rinse liquid supply pipe. The flow meter detects the flow rate of the processing liquid flowing through each supply pipe and inputs the detection result to the master device. The master device feedback-controls the opening degree of the electric needle valve according to the flow rate detection result.

JP, 2005-144182, A

Bubbles resulting from the gas dissolved in the treatment liquid may appear in the treatment liquid supply path. If the air bubbles are trapped in the supply passage, there is a possibility that the supply of the processing liquid and the detection of the flow rate may be hindered. For example, if air bubbles are trapped in the detection target area of the flow meter, the flow rate cannot be accurately detected.
Therefore, when an error signal is output from the flow meter, it is necessary to push out the processing liquid at a large flow rate to the processing liquid supply path to push out the bubbles in the flow path. Specifically, the procedure performed by the worker is as follows.

Step 1: Stop the substrate processing operation by the substrate processing apparatus.
Step 2: Take out the substrate being processed from the processing unit corresponding to the flow meter that has output the error signal.
Step 3: Close the valves connected to the processing liquid nozzles of all the processing units.
Step 4: Open the valve of the processing liquid supply path in which the flow meter that outputs the error signal is arranged.

As a result, the pump provided in the processing liquid supply source pumps the processing liquid toward the processing liquid supply path of one processing unit, and the processing liquid is processed through the detection target area of the flow meter that generated the error signal. It is ejected from the liquid nozzle. As a result, the bubbles in the detection target area of the flow meter flow to the processing liquid nozzle together with the processing liquid and are discharged.
After that, the worker closes the valve opened in step 4 and restarts the normal operation of the substrate processing apparatus.

In such a procedure, it is necessary to stop the substrate processing operation of the substrate processing apparatus and perform an operation for removing bubbles. Therefore, the processing in all the processing units is stopped, and the operating rate of the substrate processing apparatus is reduced. In addition, the substrate taken out in step 2 may be wasted.
Therefore, one object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of improving the operating rate of the substrate processing apparatus.

Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of suppressing waste of the substrate due to generation of bubbles in the flow path.

The present invention is directed to a plurality of processing units for processing a substrate with a processing liquid, a processing liquid supply source for supplying the processing liquid, a main supply path connected to the processing liquid supply source, and a plurality of main processing units from the main supply path. Processing liquid supply paths each including a plurality of branch supply paths branched to the processing unit, and a processing liquid that is disposed in each of the plurality of branch supply paths and that acts or responds to the processing liquid in the flow paths of the branch supply paths. Substrate including a related unit, a plurality of processing liquid valves for respectively opening and closing the plurality of branch supply paths to control the supply of the processing liquid to the processing unit, and a control unit for controlling the plurality of processing liquid valves A processing device is provided. The control unit plans a bubble elimination operation for eliminating bubbles in the flow path of the branch supply path regardless of the presence or absence of abnormality in the treatment liquid-related unit, and based on the plan, the plurality of treatment liquids. Programmed to control the valve.

According to this configuration, the treatment liquid valve is controlled for the bubble elimination operation for eliminating the bubbles in the flow path of the branch supply path, regardless of the presence or absence of abnormality in the treatment liquid related unit. That is, the bubble elimination operation is planned in advance and carried out proactively without waiting for the occurrence of an abnormality in the processing liquid-related unit. Accordingly, it is possible to suppress or prevent the operation stop of the substrate processing apparatus due to the abnormality of the processing liquid-related unit, and thus it is possible to improve the operating rate of the substrate processing apparatus. Moreover, since the bubbles in the branch supply path can be eliminated before the bubbles are captured in the branch supply path and affect the substrate processing, it is possible to suppress or prevent waste of the substrate.

In one embodiment of the present invention, in the bubble elimination operation, a predetermined number (a number smaller than the total number of branch supply passages, for example, one) of the processing liquid valves of the branch supply passages are opened, and the other ones are opened. The operation includes closing the processing liquid valve in the branch supply path. As a result, the processing liquid from the processing liquid supply source can be intensively sent to a predetermined number of branch supply paths, thereby increasing the flow paths of the branch supply paths and letting out the bubbles in the branch supply paths. be able to.
More specifically, the bubble eliminating operation includes an operation of opening the processing liquid valves of one of the branch supply passages and closing the processing liquid valves of all the other branch supply passages. You may stay.
Further, the control unit may be planned to sequentially execute the bubble elimination operation for eliminating bubbles in the flow path of the branch supply path for a plurality of the processing units.

In one embodiment of this invention, the control unit is programmed to schedule a substrate processing operation at the processing unit and to schedule the bubble elimination operation to avoid interference with the substrate processing operation. .. This makes it possible to preventively perform the bubble elimination operation while suppressing the influence on the substrate processing operation. Therefore, a preventive bubble elimination operation can be executed while suppressing a decrease in the operating rate of the substrate processing apparatus.
More specifically, the control unit plans a processing liquid supply operation of supplying a processing liquid from the processing liquid supply source to the substrate in the processing unit, and avoids the period of the processing liquid supply operation. It may be programmed to schedule a bubble clearing action.

In one embodiment of this invention, the processing liquid-related unit includes a flow meter that measures the flow rate of the processing liquid flowing through the flow path of the branch supply path. Accordingly, since the flow rate of the processing liquid supplied to the substrate can be monitored, the substrate can be subjected to high-quality processing. Further, since it is possible to suppress or prevent the bubbles from being captured in the flow path of the branch supply path, it is possible to suppress or prevent the flow rate detection from being inaccurate or impossible due to the presence of the bubbles. Therefore, it is possible to suppress or prevent the operation stop of the substrate processing apparatus due to the poor flow rate detection, so that the operating rate of the substrate processing apparatus can be improved.

The present invention also provides a plurality of processing units for processing a substrate with a processing liquid, a processing liquid supply source that supplies the processing liquid, a main supply path connected to the processing liquid supply source, and a main supply path. A treatment liquid supply path including a plurality of branch supply passages branched into the plurality of treatment units, and the treatment liquid supply passages are respectively disposed in the plurality of branch supply passages, and act or respond to the treatment liquid in the flow passages of the branch supply passages. Provided is a substrate processing method applied to a substrate processing apparatus including a processing liquid-related unit and a plurality of processing liquid valves for controlling the supply of the processing liquid to the processing unit by opening and closing the plurality of branch supply paths, respectively. To do. This method includes a step of planning a bubble elimination operation for eliminating bubbles in the flow path of the branch supply passage, and performing the planned bubble elimination operation regardless of whether or not there is an abnormality in the processing liquid-related unit. In order to do so, a bubble elimination step of opening and closing the plurality of processing liquid valves based on the plan.

In the substrate processing method according to one embodiment of the present invention, the bubble elimination step opens the processing liquid valves of the predetermined number of the branch supply paths and closes the processing liquid valves of the other branch supply paths. And
The bubble elimination operation may include an operation of opening the processing liquid valves of one of the branch supply paths and closing the processing liquid valves of all the other branch supply paths.
Further, the step of planning the bubble elimination operation may be designed to sequentially execute the bubble elimination operation for eliminating bubbles in the flow path of the branch supply path for a plurality of the processing units.
In the substrate processing method of one embodiment of the present invention, the method further comprises the step of planning a substrate processing operation in the processing unit, and the step of planning the bubble elimination operation avoids interference with the substrate processing operation. Plan the bubble elimination operation.
More specifically, the substrate processing method further includes a step of planning a processing liquid supply operation of supplying a processing liquid from the processing liquid supply source to the substrate in the processing unit, and a step of planning the bubble elimination operation. However, the bubble elimination operation may be planned so as to avoid the period of the processing liquid supply operation.

In the substrate processing method of one embodiment of the present invention, the processing liquid-related unit includes a flow meter that measures a flow rate of the processing liquid flowing through the flow path of the branch supply path.
An embodiment of the present invention is directed to a first processing unit for processing a substrate with a processing liquid, a first processing liquid supply source for supplying the processing liquid, and a first main supply connected to the first processing liquid supply source. A first processing liquid supply path including a path and a first branch supply path branched from the first main supply path to the first processing unit; and the first branch supply path, a first processing liquid associated unit acting or response to the treatment liquid in the flow path by opening and closing the first minute Toki supply path, a first treatment liquid for controlling the supply of treatment liquid to the first processing unit A first processing compartment including a valve,
A second processing unit for processing a substrate with a processing liquid, a second processing liquid supply source for supplying the processing liquid, a second main supply path connected to the second processing liquid supply source, and the second main supply. A second processing liquid supply path including a second branch supply path branched from a path to the second processing unit, and a processing liquid in the flow path of the second branch supply path, which is disposed in the second branch supply path. A second processing compartment including a second processing liquid-related unit that operates or responds, and a second processing liquid valve that controls the supply of the processing liquid to the second processing unit by opening and closing the second branch supply path. When,
And a control unit for controlling the first and second processing liquid valves and the first and second processing units,
When the plan of the bubble eliminating operation is instructed, the control unit plans the bubble eliminating operation in the processing section corresponding to the bubble eliminating operation plan, and after the bubble eliminating operation is planned, the first or second process is performed. When planning the substrate processing is instructed by the partition, and select the processing compartment that does not interfere with the bubble resolving plan, it is programmed to schedule the substrate treated with the selected processing compartment, the substrate processing apparatus you provide.

According to this configuration, when the substrate processing plan is instructed after the bubble elimination operation plan, the processing section that does not interfere with the bubble elimination operation plan is selected, and the substrate processing using the processing units belonging to this processing section is performed. You can plan. As a result, the substrate processing can be executed by effectively utilizing the plurality of processing sections, and it is possible to suppress or prevent the stop time of the substrate processing apparatus accompanying the execution of the bubble elimination operation.

FIG. 1 is a schematic plan view for explaining the configuration of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic sectional view corresponding to section line II-II in FIG. 1. FIG. 3 is a system diagram for explaining a chemical liquid piping system in the substrate processing apparatus. FIG. 4 is a block diagram for explaining the electrical configuration of the substrate processing apparatus. FIG. 5 is a schematic sectional view for explaining a configuration example of a flow meter arranged in the chemical liquid supply passage. FIG. 6 is a flowchart for explaining a processing example by a computer provided in the substrate processing apparatus. FIG. 7 is a flow chart for explaining a processing example by a computer provided in the substrate processing apparatus. FIG. 8A shows an example of a temporary time table created at the time of scheduling. FIG. 8B shows another example of the provisional time table created at the time of scheduling. FIG. 8C shows still another example of the temporary timetable created at the time of scheduling. FIG. 9 shows an example of scheduling of bubble removal processing (bubble elimination operation). FIG. 10A shows an example of scheduling of substrate processing. FIG. 10B shows an example of scheduling of substrate processing. FIG. 11A shows an example of scheduling including bubble removal processing and substrate processing. FIG. 11B shows an example of scheduling including bubble removal processing and substrate processing. FIG. 12 shows another example of scheduling including bubble removal processing and substrate processing.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a schematic plan view for explaining the configuration of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic sectional view corresponding to the section line II-II in FIG.
The substrate processing apparatus 1 includes a carrier holding unit 2, an indexer unit 3, and a processing unit 4. The carrier holding unit 2 includes a plurality of load ports LP each holding a carrier C that is a substrate container that can accommodate a plurality of substrates W. The indexer unit 3 includes an indexer robot IR. The indexer robot IR takes out the unprocessed substrate W from the carrier C held by the carrier holding unit 2 and transfers it to the processing unit 4, and receives the processed substrate W from the processing unit 4 and stores it in the carrier holding unit 2. The storing operation of storing in the held carrier C is executed.

The processing unit 4 includes a plurality of processing units MPC1 to MPC24 (hereinafter, collectively referred to as “processing unit MPC”), a first main transfer robot CR1 (first transfer robot), and a second main transfer robot CR2 (second). Transport robot), a first transfer unit PASS1, and a second transfer unit PASS2. A transport path 5 linearly extending from the indexer unit 3 in a plan view is formed in the processing unit 4. A first transfer unit PASS1, a first main transfer robot CR1, a second transfer unit PASS2, and a second main transfer robot CR2 are arranged in this transfer path 5 in order from the indexer section 3 side. The first transfer unit PASS1 is a unit that mediates the transfer of the substrate W between the indexer robot IR and the first main transfer robot CR1. The second transfer unit PASS2 is a unit that mediates the transfer of the substrate W between the first main transfer robot CR1 and the second main transfer robot CR2.

The indexer robot IR, the first main transfer robot CR1 and the second main transfer robot CR2 form a substrate transfer unit that transfers the substrate W between the carrier holding unit 2 and the processing unit MPC.
The plurality of processing units MPC are arranged in a distributed manner so as to form a plurality of unit towers TW1 to TW6 (hereinafter collectively referred to as “unit tower TW”). Each unit tower TW is formed by stacking a plurality of processing units MPC in a plurality of layers (four layers in this embodiment). In this embodiment, each unit tower TW is formed by vertically stacking four processing units MPC. The plurality of unit towers TW are distributed to both sides of the transport path 5 and are arranged along the transport path 5. Specifically, in this embodiment, three unit towers TW1, TW3, TW5 are arranged on one side of the transport path 5, and three unit towers TW2, TW4, TW6 are arranged on the other side of the transport path 5. Are arranged. Then, the three pairs of unit towers TW1, TW2; TW3, TW4; TW5, TW6 are opposed to each other across the transport path 5. Therefore, the substrate transport distances between the pair of unit towers TW1, TW2; TW3, TW4; TW5, TW6 are substantially equal to the indexer unit 3, and accordingly, the substrate transport time between the indexer unit 3 is almost equal. equal.

The pair of unit towers TW1, TW2; TW3, TW4; TW5, TW6 having the same distance from the indexer section 3 respectively form processing sections PZ1, PZ2, PZ3 (hereinafter collectively referred to as "processing section PZ"). ing. That is, the pair of unit towers TW1 and TW2 facing each other across the transport path 5 at the position closest to the indexer unit 3 form the first processing section PZ1. Next, the pair of unit towers TW3 and TW4 facing each other across the transport path 5 at a position near the indexer unit 3 form a second processing section PZ2. Next, the pair of unit towers TW5 and TW6 facing each other across the transport path 5 at the position closest to the indexer unit 3, that is, the position farthest from the indexer unit 3 in this embodiment forms a third processing section PZ3.

The first transfer unit PASS1 is arranged between the first processing section PZ1 and the indexer unit 3. The first main transfer robot CR1 is arranged on the side opposite to the indexer unit 3 with respect to the first transfer unit PASS1. The first main transfer robot CR1 is arranged at a position close to the first processing section PZ1, more specifically at a position between the pair of unit towers TW1 and TW2 forming the first processing section PZ1. A second transfer unit PASS2 is arranged on the opposite side of the first main transfer robot CR1 from the first transfer unit PASS1. Thus, the first main transfer robot CR1 is arranged so as to face the first transfer unit PASS1, the unit towers TW1 and TW2 of the first processing section PZ1, and the second transfer unit PASS2.

The second main transfer robot CR2 is arranged on the side opposite to the first main transfer robot CR1 with respect to the second transfer unit PASS2. The second main transfer robot CR2 is located at a position close to the second processing section PZ2 and the third processing section PZ3, more specifically, two pairs of unit towers TW3, TW4 that form the second and third processing sections PZ2, PZ3; It is arranged at a position surrounded by TW5 and TW6. Accordingly, the second main transfer robot CR2 is arranged so as to face the second transfer unit PASS2 and the unit towers TW3 to TW6 of the second and third processing sections PZ2 and PZ3.

The indexer robot IR is a horizontal articulated arm type robot in this embodiment. The indexer robot IR includes a hand 11 that holds the substrate W, an articulated arm 12 coupled to the hand 11, an arm rotation mechanism (not shown) that rotates the articulated arm 12 around a vertical rotation axis 13. An arm lifting mechanism (not shown) for vertically moving the multi-joint arm 12 is included. With such a configuration, the indexer robot IR causes the hand C to access the carrier C and the first transfer unit PASS1 held in an arbitrary load port LP, and carries in/out the substrate W to/from the access destination. Thereby, the indexer robot IR carries the substrate W between the processing unit 4 (more accurately, the first delivery unit PASS1) and the arbitrary carrier C.

Substrate transfer robots having substantially the same configuration can be used as the first main transfer robot CR1 and the second main transfer robot CR2. Such a substrate transfer robot preferably includes a pair of hands 21 and 22 for holding the substrate W, and a pair of hand advancing and retracting mechanisms 23 and 24 for advancing and retracting the pair of hands 21 and 22 in the horizontal direction (radial direction), respectively. , A hand rotating mechanism (not shown) for rotating the pair of hand advancing/retreating mechanisms 23, 24 about a vertical rotation axis 25, and a hand elevating mechanism (not shown) for vertically moving the hand advancing/retreating mechanisms 23, 24. .. As a result, the substrate W can be taken out from the access destination with the one hand 21 or 22, and the substrate W can be carried into the access destination with the other hand 21 or 22. By applying the substrate transfer robot having such a configuration to the first main transfer robot CR1, the first main transfer robot CR1 forms plural unit towers TW and TW2 of the first transfer unit PASS1 and the first processing section PZ1. It is possible to directly access the hands 21 and 22 to the processing unit MPC and the second transfer unit PASS2, and load/unload the substrate W to/from the access destination. In addition, by applying the substrate transfer robot having the above-described configuration to the second main transfer robot CR2, the second main transfer robot CR2 can control the second transfer unit PASS2 and the second and third processing sections PZ2 and PZ3. It is possible to directly access the plurality of processing units MPC forming the unit towers TW3 to TW6 with the hands 21 and 22 and carry in/out the substrate W to/from the access destination.

The first and second transfer units PASS1 and PASS2 include a substrate platform 15 that temporarily holds the substrate W.
Three chemical solution cabinets CC1, CC2, CC3 (chemical solution supply source. An example of a processing fluid supply source) corresponding to the first processing section PZ1, the second processing section PZ2, and the third processing section PZ3, respectively. Cabinet CC".) is provided. The first chemical liquid cabinet CC1 supplies a chemical liquid (an example of a processing fluid) for processing the substrate W to the plurality of processing units MPC forming the first processing section PZ1. That is, the first chemical liquid cabinet CC1 is shared by the plurality of processing units MPC included in the first processing section PZ1. Similarly, the second chemical liquid cabinet CC2 supplies the chemical liquid for processing the substrate W to the plurality of processing units MPC forming the second processing section PZ2. That is, the second chemical solution cabinet CC2 is shared by the plurality of processing units MPC included in the second processing section PZ2. Furthermore, similarly, the third chemical liquid cabinet CC3 supplies the chemical liquid for processing the substrate W to the plurality of processing units MPC forming the third processing section PZ3. That is, the third chemical liquid cabinet CC3 is shared by the plurality of processing units MPC included in the third processing section PZ3.

Although the first to third chemical liquid cabinets CC1, CC2, CC3 are illustrated on one side of the processing unit 4 in FIG. 1, they may be arranged at other places. For example, some or all of the first to third chemical liquid cabinets CC1, CC2, CC3 may be arranged near the end of the transport path 5 on the side opposite to the indexer unit 3. Further, some or all of the first to third chemical liquid cabinets CC1, CC2, CC3 may be arranged in a space below the floor where the substrate processing apparatus main body including the processing unit MPC and the like is arranged. .. That is, in order to reduce the occupied area of the entire apparatus, the chemical solution cabinet CC may be three-dimensionally arranged with respect to the substrate processing apparatus main body.

FIG. 3 is a system diagram for explaining the chemical liquid piping system in the substrate processing apparatus 1. The processing unit MPC includes a processing chamber 31, a processing cup 32 arranged in the processing chamber 31, a spin chuck 33 arranged in the processing cup 32, and a chemical solution nozzle 34 for supplying a chemical solution to the substrate W. The spin chuck 33 is configured to hold one substrate W to be processed in a horizontal posture and rotate the substrate W around a vertical rotation axis 36. The chemical liquid nozzle 34 is disposed in the processing chamber 31, and discharges the chemical liquid and the rinse liquid toward the upper surface of the substrate W held by the spin chuck 33. The chemical liquid is supplied to the chemical liquid nozzle 34 from the chemical liquid cabinet CC via the chemical liquid supply pipe 40.

One chemical solution cabinet CC is provided for each processing section PZ. The chemical liquid piping system includes a chemical liquid supply pipe 40 that supplies the chemical liquid from the chemical liquid cabinet CC to the processing unit MPC.
The chemical liquid supply pipe 40 includes a main supply passage 41 that is arranged in a gate shape across two unit towers TW that constitute one processing section PZ. The main supply passage 41 has a rising portion 41A that is raised along one unit tower TW, and a transition portion 41B that is connected to the rising portion 41A and that extends to the other unit tower TW above the transport passage 5. It includes a hanging portion 41C that is coupled to the crossing portion 41B and hangs along the other unit tower TW. The chemical solution outlet 51 of the chemical solution cabinet CC is coupled to the inlet section of the main supply path 41, and the chemical solution return port 52 of the chemical solution cabinet CC is coupled to the exit section of the main supply channel 41. The chemical liquid supply pipe 40 further includes a plurality of branch supply paths 42 branched from the rising portion 41A into a plurality of processing units MPC forming the unit tower TW, and a plurality of processing units MPC forming a unit tower TW from the hanging portion 41C. And a plurality of branch supply passages 43 that are respectively branched. A flow rate adjusting valve 45, a flow meter 46, and a chemical liquid valve 47 are provided in each of the branch supply paths 42 and 43. The ends of the branch supply paths 42, 43 are introduced into the processing unit MPC and are connected to the chemical liquid nozzle 34. The flow rate adjusting valve 45 is a valve for adjusting the flow rate of the chemical liquid flowing through the branch supply passages 42 and 43. The flow meter 46 is a device that measures the flow rate of the chemical liquid flowing through the branch supply paths 42 and 43. The chemical liquid valve 47 is a valve for opening/closing the branch supply paths 42, 43, and thereby controlling the discharge/stop of the chemical liquid from the chemical liquid nozzle 34.

The chemical solution cabinet CC has a chemical solution tank 55 for storing the chemical solution, a pump 56 for pumping the chemical solution from the chemical solution tank 55 and sending it under pressure to the main supply path 41, and a chemical solution path 57 between the chemical solution tank 55 and the chemical solution outlet 51. Mounted temperature controller (heater) 58. The chemical liquid pumped from the chemical liquid tank 55 by the pump 56 is supplied to the processing unit MPC through the chemical liquid path 57 and the chemical liquid supply pipe 40. The chemical liquid not used in the processing unit MPC returns to the chemical liquid tank 55 through the chemical liquid supply pipe 40, whereby the chemical liquid circulates. Since the temperature controller 58 is provided in the circulation route of the chemical liquid, the temperature of the chemical liquid in the chemical liquid tank 55 can be maintained by driving the pump 56 to circulate the chemical liquid. The pumping of the chemical liquid to the main supply passage 41 may be performed by a structure in which the inside of the sealed chemical liquid tank 55 is pressurized by a pressurized gas (for example, an inert gas such as nitrogen) in addition to the configuration using the pump 56. it can.

FIG. 4 is a block diagram for explaining the electrical configuration of the substrate processing apparatus 1. The substrate processing apparatus 1 includes a computer 60 as a control unit. The computer 60 controls the processing units MPC1 to MPC8; MPC9 to MPC16; MPC17 to MPC24, the chemical solution cabinets CC1, CC2 and CC3, the main transfer robots CR1 and CR2, and the indexer robot IR. The computer 60 may have the form of a personal computer (FA personal computer). The computer 60 includes a control unit 61, an input/output unit 62, and a storage unit 63. The control unit 61 includes an arithmetic unit such as a CPU. The input/output unit 62 includes an output device such as a display unit and an input device such as a keyboard, a pointing device, and a touch panel. Further, the input/output unit 62 includes a communication module for communicating with the host computer 64 which is an external computer. The storage unit 63 includes a storage device such as a solid-state memory device or a hard disk drive.

The control unit 61 includes a scheduling function unit 65 and a process execution instruction unit 66. The scheduling function unit 65 carries out the substrate W from the carrier C, processes the substrate W in one or more of the processing units MPC1 to MPC24, and then stores the processed substrate W in the carrier C. A plan (schedule) for operating the resources of the substrate processing apparatus 1 in time series is created. The process execution instruction unit 66 activates the resources of the substrate processing apparatus 1 according to the schedule created by the scheduling function unit 65. The resources are various units provided in the substrate processing apparatus 1 and used for processing the substrate, and specifically, the processing units MPC1 to MPC24, the indexer robot IR, the main transfer robots CR1 and CR2, and the chemical liquid cabinet. It includes CC1, CC2, CC3 and their components.

The storage unit 63 includes a program 70 executed by the control unit 61, process job data (process job information) 80 received from the host computer 64, schedule data 81 created by the scheduling function unit 65, a processing unit MPC and a process. It is configured to store various data including the usage history data 82 of the section PZ.
The program 70 stored in the storage unit 63 includes a schedule creation program 71 for operating the control unit 61 as the scheduling function unit 65 and a process execution program 72 for operating the control unit 61 as the process execution instruction unit 66. Including.

The process job data 80 includes a process job (PJ) code assigned to each substrate W and a recipe associated with the process job code. The recipe is data defining the substrate processing content and includes the substrate processing conditions and the substrate processing procedure. More specifically, it includes substrate type information, parallel processing unit information, used processing liquid information, processing time information, and the like. The substrate type information is information indicating the type of the substrate W to be processed. Specific examples of the type of the substrate W are a product substrate used for manufacturing a product, a non-product substrate used for maintenance of the processing unit MPC and the like and not used for manufacturing a product. The parallel processing unit information is processing unit designation information that designates a usable processing unit MPC, and indicates that parallel processing can be performed by the designated processing unit MPC. That is, the substrate W may be processed by any of the designated processing units. The used processing liquid information is information that specifies the type of processing liquid used for substrate processing. A specific example is information that specifies the type of chemical liquid and the temperature of the chemical liquid. The processing time information is, for example, the duration of supplying the processing liquid. The used processing liquid information and the processing time information are examples of processing condition information.

The process job is a process performed on one or a plurality of substrates W to be subjected to a common process. The process job code is identification information (board group identification information) for identifying the process job. That is, the plurality of substrates W to which the common process job code is given are subjected to common processing by the recipe associated with the process job code. For example, when a common process is performed on a plurality of substrates W in which the processing order (the delivery order from the carrier C) is continuous, the common process job code is applied to the plurality of substrates W. Granted. However, the substrate processing contents (recipe) corresponding to different process job codes may be the same.

The control unit 61 acquires the process job data for each substrate W from the host computer 64 via the input/output unit 62, and stores the process job data in the storage unit 63. The acquisition and storage of the process job data may be performed before the scheduling for each substrate W is executed. For example, immediately after the carrier C is held in the load ports LP1 to LP4, the process job data corresponding to the substrates W accommodated in the carrier C may be given from the host computer 64 to the control unit 61. The scheduling function unit 65 plans each process job based on the process job data 80 stored in the storage unit 63, and stores schedule data 81 representing the plan in the storage unit 63. The process execution instructing unit 66 controls the indexer robot IR, the main transfer robots CR1 and CR2, the processing units MPC1 to MPC24, and the chemical solution cabinets CC1, CC2, and CC3 based on the schedule data 81 stored in the storage unit 63. This causes the substrate processing apparatus 1 to execute a process job.

The output signal of the flow meter 46 is input to the control unit 61 from each processing unit MPC. As a result, the control unit 61 monitors whether or not the chemical liquid of the appropriate flow rate is discharged in each processing unit MPC. Further, the control unit 61 opens and closes the chemical liquid valve 47 of each processing unit MPC. Thereby, the control unit 61 controls the discharge of the chemical liquid in each processing unit MPC. Further, the control unit 61 executes the bubble removal processing periodically or in response to an instruction input from the output/input unit 62, in order to prevent bubble clogging in the flow meter 46. For this bubble removal processing, the controller 61 opens and closes the chemical liquid valve 47 of the processing unit MPC.

FIG. 5 is a schematic sectional view for explaining a configuration example of the flow meter 46. In this example, flow meter 46 is an ultrasonic flow meter. The flow meter 46 includes a first sensor 91 and a second sensor 92 arranged on the outer peripheral surfaces of the branch supply paths 42, 43. The first and second sensors 91, 92 are arranged at intervals along the flow direction of the flow passage 90 of the branch supply passages 42, 43, and are arranged so as to face each other across the flow passage. The first and second sensors 91, 92 are composed of piezoelectric elements that can generate and receive ultrasonic waves, for example. That is, the first sensor 91 generates an ultrasonic wave, and the ultrasonic wave can be detected by the second sensor 92. On the contrary, the second sensor 92 generates an ultrasonic wave, and the ultrasonic wave can be detected by the first sensor 91. The time α1 from the generation of the ultrasonic wave from the first sensor 91 to the detection of the ultrasonic wave by the second sensor 92 is measured. Further, the time α2 from the generation of the ultrasonic wave from the second sensor 92 to the detection of the ultrasonic wave by the first sensor 91 is detected. The times α1 and α2 are equal to each other when the fluid in the flow channel 90 is stationary, and when the fluid in the flow channel 90 has a significant flow velocity V, differ depending on the flow velocity V. Therefore, the flow rate in the flow path 90 can be obtained by measuring the times α1 and α2.

The propagation velocity of ultrasonic waves depends on the type of fluid occupying the flow path 90. That is, if the entire flow path 90 is filled with the chemical solution, an accurate flow rate can be obtained by measuring the times α1 and α2. On the other hand, if bubbles 93 are trapped in the flow path 90 and so-called bubble biting occurs, it is no longer possible to obtain an accurate flow rate.
Since such bubble clogging appears as an abnormal flow rate value, the computer 60 can detect bubble clogging in the flow meter 46 by monitoring the output signal of the flow meter 46. The computer 60 generates an alarm when detecting the bubble bite. For example, the computer 60 outputs an alarm display on the display of the input/output unit 62.

When such an alarm display is output, it is necessary to push out the bubbles 93 in the flow path 90 by pumping a large flow rate of the chemical solution into the flow path 90 in which the bubble is clogged. Specifically, the operator performs the following procedure by operating the output/input unit 62.
Step 1: Stop the substrate processing operation.
Step 2: The substrate W in the process of being taken out is taken out from the processing unit MPC corresponding to the flow meter 46 in which the bubble is caught.

Step 3: Close the chemical liquid valves 47 connected to the chemical liquid nozzles 34 of all the processing units MPC.
Step 4: Open the chemical liquid valve 47 corresponding to the flow meter 46 in which bubble clogging has occurred.
As a result, the chemical solution is pressure-fed from the chemical solution cabinet CC toward the branch supply paths 42 and 43 of one processing unit MPC, and the chemical solution is discharged from the chemical solution nozzle 34 through the flow path of the flow meter 46 in which bubble clogging has occurred. To be done. Thereby, the bubbles 93 in the flow path 90 of the flowmeter 46 flow to the chemical liquid nozzle 34 together with the chemical liquid and are discharged.

After that, the worker closes the chemical liquid valve 47 opened in the procedure 4 and restarts the normal operation of the substrate processing apparatus 1.
In such a procedure, it is necessary to stop the substrate processing operation and perform an operation for removing the bubbles 93. Therefore, since the processing in all the processing units MPC is stopped, the operating rate of the substrate processing apparatus 1 is reduced. Further, the substrate W taken out in the procedure 2 may be wasted.

Therefore, in this embodiment, a bubble removing process for removing bubbles from the chemical liquid supply pipe 40, particularly from the flow path of the flow meter 46 is performed without waiting for an alarm, that is, regardless of whether or not the flow meter 46 is abnormal. It is done prophylactically.
6 and 7 are flowcharts for explaining an example of processing by the scheduling function unit 65. More specifically, the control unit 61 (computer 60) executes the schedule creation program 71 to represent the process that is repeatedly performed at a predetermined control cycle. In other words, the schedule creation program 71 incorporates a group of steps for causing the computer 60 to execute the processing shown in FIGS. 6 and 7.

The host computer 64 gives the process job data to the control unit 61 to instruct the start of the process job defined by the process job data, that is, the start of the substrate processing. The control unit 61 receives the process job data and stores it in the storage unit 63. The scheduling function unit 65 uses the process job data to perform scheduling for executing the process job. The start of the process job can also be instructed by the operator by operating the operation unit of the input/output unit 62. Further, the host computer 64 gives an instruction to start a bubble removal process for preventing bubble clogging of the flowmeter 46 at regular time intervals, for example. The start of this bubble removal process can also be instructed by the operator by operating the operation unit of the input/output unit 62. Alternatively, the computer 60 can instruct the start of the bubble removal processing when the computer 60 detects bubble trapping based on the output signal of the flow meter 46.

As shown in FIG. 6, when an instruction is input (step S1), the scheduling function unit 65 determines whether the given instruction is substrate processing (process job) or bubble removal processing (step S2). .. If it is substrate processing, it is determined whether or not there is bubble removal processing for which instructions have already been received (step S3). If there is a bubble removal process for which an instruction has been received (step S3: YES), the scheduling function unit 65 plans the bubble removal process (step S4), and then executes the plan for the substrate process (process job). (Step S5). On the other hand, if the given instruction is the bubble removal processing (step S2), the instruction is first received and it is determined whether or not there is a planned substrate processing (step S6). If there is no substrate processing being planned (step S6: NO), scheduling of bubble removal processing is started (step S4). If there is a planned substrate process (step S6: YES), the process waits until the scheduling of the substrate process is completed (step S7), and then the bubble removal process is scheduled (step S4). By such processing, the bubble removal processing can be planned so as to avoid interference with the substrate processing operation. As soon as the scheduling of the bubble removal processing is completed, the process execution instruction unit 66 executes the planned bubble removal processing (step S8). The performed substrate processing is executed (step S9).

The detailed flow of the substrate processing plan is shown in FIG. The scheduling function unit 65 sequentially executes the scheduling for each of the substrates W corresponding to the process job data. First, the scheduling function unit 65 refers to the recipe corresponding to the process job data, and specifies one or more processing units MPC that can be used for processing the substrate W based on the parallel processing unit information of the recipe. (Step S51). Next, the scheduling function unit 65 executes a processing section selection process for selecting one processing section PZ to be used for substrate processing (step S52). For example, in the processing section selection process, one of the processing sections PZ is selected so that the plurality of processing sections PZ1, PZ2, PZ3 are evenly selected. Further, in step S52, one processing section PZ to be used for the substrate processing may be selected so that the section PZ for performing the substrate processing does not interfere with the processing section PZ for which the bubble removal processing is being performed (details will be described. , Which will be described later with reference to FIGS. 11A and 11B).

Next, the scheduling function unit 65 creates a temporary timetable for processing one substrate W (step S53). For example, it is assumed that the first processing section PZ1 is selected in the processing section selection process, and the parallel processing unit information of the recipe corresponding to the process job data includes all the processing units MPC1 to MPC8 of the first processing section PZ1. That is, consider a case where the substrate processing according to the recipe can be executed in any of the eight processing units MPC1 to MPC8. In this case, there are eight paths through which the substrate W is processed. That is, the paths that can be selected for processing the substrate W are eight paths that pass through any of the processing units MPC1 to MPC8. Therefore, the scheduling function unit 65 creates a provisional time table corresponding to the eight routes for the one substrate W.

FIG. 8A shows a temporary timetable corresponding to the route passing through the processing unit MPC1. This tentative timetable is a block B1 representing the carry-out (Get) of the substrate W from the carrier C by the indexer robot IR, and a block B2 representing the carry-in (Put) of the substrate W into the first transfer unit PASS1 by the indexer robot IR. And a block B3 representing the carry-out (Get) of the substrate W from the first transfer unit PASS1 by the first main transfer robot CR1, and the carry-in (Put) of the substrate W into the processing unit MPC1 by the first main transfer robot CR1. A block B4 that represents processing of the substrate W by the processing unit MPC1, a block B6 that represents unloading (Get) of the processed substrate W from the processing unit MPC1 by the first main transfer robot CR1, A block B7 representing the loading (Put) of the substrate W into the first delivery unit PASS1 by the first main transport robot CR1 and a block representing the unloading (Get) of the substrate W from the first delivery unit PASS1 by the indexer robot IR. B8, and a block B9 representing the loading (Put) of the substrate W into the carrier C by the indexer robot IR. The scheduling function unit 65 creates a temporary timetable by arranging these blocks in order so that they do not overlap on the time axis. Further, the temporary timetable of FIG. 8A includes a chemical liquid supply block B10 that represents the supply of the chemical liquid from the first chemical liquid cabinet CC1 during the predetermined chemical liquid processing period during which the processing block B5 is arranged.

The processing block B5 will be described in detail. The processing block B5 includes, for example, the following steps. For example, a substrate fixing process of fixing the substrate W transferred to the processing unit MPC by the first main transfer robot CR1 (or the second main transfer robot CR2) to the spin chuck 33 (see FIG. 3), and fixed to the spin chuck 33. A step of supplying a chemical solution pumped from the chemical solution cabinet CC toward the substrate W from a chemical solution nozzle 34, a substitution step of replacing the chemical solution with a rinse solution, a drying step of drying the rinse solution, and a fixing of the substrate W by a spin chuck 33. It also includes a fixing release process for releasing. This processing block B 5 as because it contains the steps other than the chemical supply step, processing block B5 is temporally have length than chemical supply block B 10. Moreover, since such substrate fixing step prior to the chemical supply block B 10 is executed, chemical supply block B10 starts with a delay predetermined time from the start of the processing block B5.

Although illustration is omitted, the scheduling function unit 65 has the same temporary time table (temporary blocks in which processing blocks are respectively arranged in the processing units MPC2 to MPC8) corresponding to the paths passing through the processing units MPC2 to MPC8 for the same substrate W. Create a timetable). In this way, temporary timetables for a total of 8 routes are created for one substrate W.
The created provisional time table is stored in the storage unit 63 as a part of the schedule data 81. At the stage of creating the temporary timetable, interference with a block relating to another substrate W (overlap on the time axis) is not considered.

When the scheduling function unit 65 finishes creating all the temporary time tables corresponding to one substrate W (step S54), it executes the main scheduling (steps S55 to S58). The main scheduling is to arrange the blocks of the created temporary timetable on the time axis so as not to overlap with other blocks of each resource. However, since the chemical solution cabinet CC has the ability to supply the chemical solution to all the processing units MPC of the corresponding processing section PZ, overlapping arrangement of the chemical solution supply blocks is allowed for the chemical solution cabinet CC. The schedule data created by this scheduling is stored in the storage unit 63.

More specifically, the scheduling function unit 65 selects one of a plurality of provisional timetables created corresponding to the substrate W and acquires one block that constitutes the provisional timetable. (Step S55). The block acquired at this time is the block arranged at the earliest position on the time axis of the temporary timetable among the unarranged blocks. Further, the scheduling function unit 65 searches for a position where the acquired block can be arranged (step S56), and arranges the block at the searched position (step S57). Each block is arranged at the earliest position on the time axis while preventing the same resource from being used twice at the same time. The same operation is repeatedly executed for all the blocks constituting the selected temporary timetable (step S58). By arranging all the blocks constituting the selected temporary timetable in this way, the main scheduling corresponding to the temporary timetable is completed. This main scheduling is executed for all the created temporary timetables (step S59). That is, this scheduling is executed in all the cases in which the processing units MPC1 to MPC8 that may process the substrate W process the substrate W, that is, in eight cases.

When the eight main schedulings are completed, processing unit selection processing is performed (step S60). In the processing unit selection processing, one main scheduling, that is, the main scheduling that passes one processing unit MPC is selected, and thereby the processing unit MPC that processes one substrate W is selected. In the processing unit selection processing, one main scheduling in which the substrate W is processed and returned to the carrier C earliest is selected. If there are a plurality of main schedulings in which the substrate W returns to the carrier C at the same time, the main scheduling using the processing unit MPC having the longest use interval from the previous use, that is, the processing unit MPC having the oldest last use time. Is selected. Thereby, the processing units MPC can be selected so that the processing units MPC in one processing section PZ are used evenly.

In this way, when one main scheduling corresponding to one provisional timetable is selected, the scheduling for the one substrate W is completed. Then, the scheduling data representing the selected main scheduling is stored in the storage unit 63. The process execution instructing unit 66 actually starts the process on the substrate W at an arbitrary timing thereafter (step S62). That is, the substrate transfer operation of transferring the substrate W out of the carrier C by the indexer robot IR and transferring the substrate W to the processing unit MPC by the main transfer robots CR1 and CR2 is started.

The same operation is sequentially executed for all the substrates W that form the process job (step S61).
When the second processing section PZ2 is selected in the processing section selection processing (step S52), the scheduling function unit 65 causes the tentative time corresponding to each path through the processing units MPC9 to MPC16 for one substrate W. A table (temporary time table in which processing blocks are arranged in the processing units MPC9 to MPC16) is created. As a result, a temporary timetable for a total of 8 routes is created for one substrate W. FIG. 8B shows a temporary time table corresponding to the route passing through the processing unit MPC9. This tentative timetable is a block B1 representing the carry-out (Get) of the substrate W from the carrier C by the indexer robot IR, and a block B2 representing the carry-in (Put) of the substrate W into the first transfer unit PASS1 by the indexer robot IR. And a block B3 representing the carry-out (Get) of the substrate W from the first transfer unit PASS1 by the first main transfer robot CR1, and the carry-in (Put) into the second transfer unit PASS2 by the first main transfer robot CR1. A block B11, a block B12 representing unloading (Get) of the substrate W from the second transfer unit PASS2 by the second main transport robot CR2, and a loading of the substrate W into the processing unit MPC9 by the second main transport robot CR2 ( Put), a processing block B5 that represents processing of the substrate W by the processing unit MPC9, and a block B14 that represents unloading (Get) of the processed substrate W from the processing unit MPC9 by the second main transfer robot CR2. And a block B15 representing the loading (Put) of the substrate W into the second transfer unit PASS2 by the second main transfer robot CR2, and the removal (Get) of the substrate from the second transfer unit PASS2 by the first main transfer robot CR1. ), a block B7 representing the loading (Put) of the substrate W into the first transfer unit PASS1 by the first main transfer robot CR1, and a first transfer unit PASS1 of the substrate W from the indexer robot IR. It includes a block B8 representing a carry-out (Get) and a block B9 representing a carry-in (Put) of the substrate W into the carrier C by the indexer robot IR. The scheduling function unit 65 creates a temporary timetable by arranging these blocks in order so that they do not overlap on the time axis. Further, the provisional timetable of FIG. 8B includes a chemical liquid supply block B10 that represents the supply of the chemical liquid from the second chemical liquid cabinet CC2 during the predetermined chemical liquid processing period during the period in which the processing blocks are arranged.

When the third processing section PZ3 is selected in the processing section selection process (step S52), the scheduling function unit 65 causes the provisional time corresponding to each path through the processing units MPC17 to MPC24 for one substrate W. A table (temporary time table in which processing blocks are arranged in the processing units MPC17 to MPC24) is created. As a result, a temporary timetable for a total of 8 routes is created for one substrate W. FIG. 8C shows a temporary timetable corresponding to the route passing through the processing unit MPC17. This temporary time table is almost the same as the temporary time table of FIG. 8B. However, they are different in that they pass through the processing unit MPC17 and that a chemical liquid supply block representing the chemical liquid supply is arranged with respect to the third chemical liquid cabinet CC3.

FIG. 9 shows an example of scheduling of bubble removal processing. In this example, the bubble removal processing is planned for the processing units MPC1 to MPC8 of the first processing section PZ1 that share the chemical liquid cabinet CC1. The scheduling function unit 65 sequentially arranges the bubble removal processing blocks in the processing units MPC1 to MPC8 so that they do not overlap on the time axis. Thereby, the defoaming process to be sequentially executed for the processing units MPC1 to MPC8 is planned.

In this embodiment, the defoaming process is a process in which the chemical solution is pressure-fed only from one chemical solution cabinet CC to a predetermined number (one in this embodiment) of processing units MPC. As a result, the chemical solution flows at a large flow rate through the chemical solution supply pipe 40 so as to pass through only one flow meter 46, whereby bubbles in the flow meter 46 and the branch supply paths 42, 43 in which the flow meter 46 is arranged. Is eliminated. Since the chemical solution cabinet CC connected to the target processing unit MPC is used for the bubble removal processing, a chemical solution supply block having a length corresponding to the period of the bubble removal processing is arranged with respect to the corresponding chemical solution cabinet CC. ..

More specifically, the defoaming process for the processing unit MPC1 means that the chemical liquid valve 47 of the processing unit MPC1 is opened in the first processing section PZ1 and all of the other processing units MPC2 to MPC8 belonging to the first processing section PZ1 are processed. This is a process of keeping the chemical liquid valve 47 closed for a certain period of time. Therefore, the computer 60 executes the bubble removal processing by controlling the chemical liquid valve 47 of the processing units MPC1 to MPC8. The same applies to the defoaming process for other processing units MPC.

10A and 10B show an example of scheduling of substrate processing. In this example, it is assumed that the process job data provided from the host computer 64 defines that the recipes that specify the processing units MCP1 to MPC24 as the parallel processing units are applied to process the four substrates W1 to W4. ing.
When planning the processing of the first substrate W1, none of the first to third processing sections PZ1, PZ2, PZ3 are used for substrate processing, so the scheduling function unit 65 has, for example, the smallest number. The first processing section PZ1 is selected, and eight provisional timetables respectively representing eight paths passing through the effective processing units MPC1 to MPC8 in the first processing section PZ1 are created. The scheduling function unit 65 executes the main scheduling for each of these temporary timetables, and creates a plan for processing the first substrate W1 by one processing unit MPC (for example, the processing unit MPC1). The time when the processing of the substrate W1 in the processing unit MPC1 ends is the unit last use time t1 of the processing unit MPC1 and the section last use time T1 of the first processing section PZ1. These times t1 and T1 are examples of the usage history data 82 (see FIG. 4). Similarly, regarding the other processing units MPC and the processing sections PZ, the unit last use time and the section last use time are stored in the storage unit 63 as the usage history data 82.

When planning the processing of the second substrate W2, the processing of one substrate W1 has been planned for the first processing section PZ1 and the substrate processing has not been planned for the second and third processing sections PZ2, PZ3. Is. Therefore, the scheduling function unit 65 selects the second processing section PZ2 having a smaller number from the processing sections PZ2 and PZ3 for which the substrate processing has not been planned, and selects the effective processing units MPC9 to MPC16 in the second processing section PZ2, respectively. Eight temporary timetables are created to represent the eight paths that the vehicle will travel through. The scheduling function unit 65 executes main scheduling for each of these temporary timetables, and creates a plan for processing the second substrate W2 by one processing unit MPC (for example, the processing unit MPC9). The time when the processing of the substrate W2 in the processing unit MPC9 is finished is the unit last use time t9 of the processing unit MPC19 and the section last use time T2 of the second processing section PZ2.

When planning the processing of the third substrate W3, since the substrate processing has already been planned for the first and second processing sections PZ1 and PZ2, the scheduling function unit 65 selects the third processing section PZ3. , Eight provisional timetables respectively representing eight routes passing through the effective processing units MPC17 to MPC24 in the third processing section PZ3 are created. The scheduling function unit 65 executes main scheduling for each of these temporary timetables, and creates a plan for processing the third substrate W3 by one processing unit MPC (for example, the processing unit MPC17). The time when the processing of the substrate W3 in the processing unit MPC17 ends is the unit last use time t17 of the processing unit MPC17 and the section last use time T3 of the third processing section PZ3.

When planning the processing of the fourth substrate W4 (see FIG. 10B), the scheduling function unit 65 compares the partition final use times T1, T2, T3 of the first to third processing partitions PZ1, PZ2, PZ3, The first processing section PZ1 corresponding to the oldest section last use time T1 (see FIG. 10A) is selected. Further, the scheduling function unit 65 creates eight provisional timetables respectively representing eight paths passing through the effective processing units MPC1 to MPC8 in the first processing section PZ1. The scheduling function unit 65 executes main scheduling for each of those temporary timetables and selects one processing unit MPC. In the example of FIG. 10B, at time a1 when the first main transport robot CR1 can carry in the substrate W4, none of the processing units MPC1 to MPC8 in the first processing section PZ1 are processing the substrate W, so any processing unit MPC1 The processing of the substrate W4 can be planned in the MPC to MPC8, and the estimated substrate processing end times (the times when the substrate W4 is returned to the carrier C) are substantially the same. On the other hand, the unit last use time t1 of the processing unit MPC1 is a significant value other than the initial value, and the unit last use times of the other processing units MPC2 to MPC8 are all initial values. Therefore, the scheduling function unit 65 selects the main scheduling using the temporary timetable that passes through the processing unit MPC2 having the smallest number among the processing units MPC2 to MPC8, and the processing unit MPC2 processes the fourth substrate W4. Make a plan to do. The time when the processing of the substrate W4 in the processing unit MPC2 ends is the unit last use time t2 of the processing unit MPC2, which is the time after the unit last use time t1. Therefore, the partition of the first processing partition PZ1 is performed. The last use time T1=t2.

FIG. 11A and FIG. 11B show an example of scheduling in the case where the instruction of the substrate processing (process job) is given before the completion of the plan following the instruction of the bubble removal processing for the first processing section PZ1. As in the case of FIG. 9, the scheduling function unit 65 receives a bubble removal instruction at time t0 (“YES” in step S1 of FIG. 6 “YES”, step S2 “substrate processing”). “Bubbling removal?” in “Bubbling removal?”), and a plan is created to execute the defoaming processing of the processing units MPC1 to MPC8 of the first processing section PZ1 that shares the chemical solution cabinet CC1 during the period from time t1 to time t10 ( In step S2 of FIG. 6, "foam removal processing", in step S6 "planning of substrate processing?", "NO", and in step S4 "planning of foam removal processing"). When a substrate processing instruction is input at time t2 after the completion of this bubble removal processing scheduling, the scheduling function unit 65 plans a process job (“Instruction input?” in step S1 in FIG. "YES", "substrate processing/foam removal?" in step S2 for "substrate processing", "YES foam removal processing accepted?" in step S3 for "YES", and "plan substrate processing" in step S5).

At the earliest timing (time t3) when the first substrate W1 can be carried into the processing unit MPC, the bubble removal processing is performed in the first processing section PZ1, so the first chemical solution cabinet CC1 is used for chemical solution processing. It cannot be used. That is, the scheduling function unit 65 cannot create a plan for transporting the substrate W1 to any of the processing units MPC1 to PMC8 belonging to the first processing section PZ1. Therefore, the scheduling function unit 65 searches for a processing section PZ in which the substrate processing can be planned without interfering with the planned bubble removal processing (“processing section selection” in step S52 in FIG. 7). Here, a plan for processing the substrate W1 in the processing unit MPC (processing unit MPC9 in the example of FIG. 11A) of the second processing section PZ2 that is the processing section PZ other than the first processing section PZ1 in which the bubble removal processing is planned is provided. create. That is, the scheduling function unit 65 arranges the processing block starting from the time t4 in the processing unit MPC9, and arranges the chemical liquid supply block corresponding to this processing block in the second chemical liquid cabinet CC2. Since the chemical solution is not used in the entire period of the processing block as described above, the chemical solution supply block has a length corresponding to a shorter period than the processing block in the processing block. That is, the chemical liquid supply block starting from time t5 delayed by a predetermined time from time t4 is arranged in the second chemical liquid cabinet CC2.

As shown in FIG. 11B, at the earliest timing (time t6) when the second substrate W2 can be carried into the processing unit MPC, the bubble removal processing in the first processing section PZ1 is not completed (before time t10). However, at the timing (time t11) when the use of the chemical liquid for the substrate processing is started, the bubble removal processing of the first processing section PZ1 is completed, so that the first chemical liquid cabinet CC1 can be used. Therefore, the scheduling function unit 65 creates a plan for processing the substrate W2 in the processing unit MPC of the first processing section PZ1 (processing unit MPC1 in the example of FIG. 11B). That is, the scheduling function unit 65 arranges the processing block starting from the time t6 in the processing unit MPC1, and sets the chemical liquid supply block corresponding to this processing block in the first chemical liquid cabinet CC1 so as to start from the time t11. Deploy.

In this way, substrate processing is planned so that it does not interfere with the bubble removal process.
FIG. 12 shows an example of scheduling in the case where an instruction for defoaming processing (time t01) for the first processing section PZ1 is given before the completion of the plan, following the instruction for the substrate processing (process job) (time t0). Indicates. The scheduling function unit 65 suspends the plan of the bubble removal processing and plans the processing of the four substrates W1 to W4 in the same manner as in the case of FIGS. 10A and 10B. That is, the scheduling function unit 65 receives a substrate processing instruction at time t0 (“YES” in step S1 “instruction input?” in FIG. 6 and “substrate processing/bubble removal?” in step S2). Processing”), and the substrate processing is planned as follows (“substrate processing” in “substrate processing/foam removal?” in step S2 of FIG. 6, “NO” in “absorption processing accepted?” in step S3, "Plan substrate processing" in step S5).

First, the processing block for the first substrate W1 is arranged in the processing unit MPC1 so as to start from time t1. Further, the chemical liquid supply block corresponding to this processing block is arranged in the first chemical liquid processing cabinet CC1 during the period from time t11 to time t12.
Next, the processing block for the second substrate W2 is arranged in the processing unit MPC9 so as to start from time t2. Further, the chemical treatment block corresponding to this treatment block is arranged in the second chemical treatment cabinet CC2 during the period from time t21 to time t22.

The processing block for the third substrate W3 is arranged in the processing unit MPC17 so as to start from time t3. Further, the chemical solution processing block corresponding to this processing block is arranged in the third chemical solution processing cabinet CC3 during the period from time t31 to time t32.
Finally, the processing block for the fourth substrate W4 is arranged in the processing unit MPC2 so as to start from time t4. Further, the chemical solution processing block corresponding to this processing block is arranged in the first chemical solution processing cabinet CC1 during the period from time t41 to time t42.

Then, after that, the bubble removal processing of the processing units MPC1 to MPC8 of the first processing section PZ1 is planned in the same manner as in the case of FIG. 9 so as not to interfere with the planned substrate processing. More specifically, the defoaming processing blocks are sequentially arranged from the processing unit MPC1 so as to start at time t42 when the use of the first chemical liquid cabinet CC1 for the substrate processing of the substrates W1 and W4 in the first processing section PZ1 is finished. Will be placed.

In this way, the bubble removal process is planned so as not to interfere with the previously received substrate process.
As described above, the substrate processing apparatus 1 of this embodiment includes a plurality of processing units MPC that process the substrate W with the processing liquid, a chemical liquid cabinet CC that supplies a chemical liquid as an example of the processing liquid to the processing unit MPC, and a chemical liquid. A chemical liquid supply pipe 40 for guiding the chemical liquid from the cabinet CC to the processing unit MPC is included. The chemical solution supply pipe 40 includes a main supply path 41 connected to the chemical solution cabinet CC, and a plurality of branch supply paths 42 and 43 branched from the main supply path 41 into a plurality of processing units MPC. In each of the branch supply paths 42 and 43, a flow meter 46 that detects the flow rate of the chemical solution flowing through the flow paths of the branch supply paths 42 and 43, and the processing unit MPC (particularly the chemical solution nozzle) by opening and closing the branch supply paths 42 and 43. 34) and a chemical liquid valve 47 for controlling the supply of the chemical liquid to 34). The computer 60 serving as a control unit controls the plurality of chemical liquid valves 47 to remove bubbles in the flow paths of the branch supply passages 42 and 43 regardless of whether or not the flow meter 46 has an abnormality. The removal process) is planned, and the plurality of chemical liquid valves 47 are controlled based on the plan.

With this configuration, the chemical liquid valve 47 is controlled for the bubble elimination operation for eliminating bubbles in the flow paths of the branch supply passages 42 and 43 regardless of whether or not the flow meter 46 is abnormal. That is, the bubble elimination operation is planned in advance and carried out proactively without waiting for the occurrence of an abnormality in the flow meter 46. As a result, the operation stop of the substrate processing apparatus 1 due to the abnormality of the flowmeter 46 can be suppressed or prevented, so that the operating rate of the substrate processing apparatus 1 can be improved. Further, since the bubbles in the branch supply paths 42, 43 can be eliminated before the bubbles are captured in the branch supply paths 42, 43 and affect the substrate processing, the waste of the substrate W can be suppressed or prevented.

Further, in this embodiment, the computer 60 plans the substrate processing operation in the processing unit MPC and plans the bubble removal processing so as to avoid the interference with the substrate processing operation. This makes it possible to preventively perform the bubble elimination operation while suppressing the influence on the substrate processing operation. Therefore, the preventive bubble elimination operation can be executed while suppressing a decrease in the operating rate of the substrate processing apparatus 1.

Further, the substrate processing apparatus 1 according to this embodiment includes independent chemical liquid piping 40 for each of the plurality of processing sections PZ1 to PZ3. Further, whether or not to start the bubble elimination operation is determined for each chemical liquid pipe 40. For example, in the example of FIG. 12, the start timing of the liquid removal processing in the first processing zone PZ1 is set to time t42 when the use of the chemical liquid cabinet CC1 in the first processing zone PZ1 is stopped. This time t42 is earlier than the time when the use of the chemical liquid cabinets CC2 and CC3 in the other processing sections PZ2 and PZ3 is stopped. Therefore, it is possible to quickly start the bubble elimination operation in the first processing section PZ1 without waiting for suspension of use in the other processing sections PZ2 and PZ3.

Further, in this embodiment, when the bubble elimination operation is planned in a certain treatment section PZ, another processing section PZ in which the bubble elimination operation is not planned is searched for, and the substrate processing is performed in the other treatment section PZ. Plan the substrate processing to perform.
As a result, even if an instruction for bubble removal processing is given subsequent to the instruction for substrate processing, the bubble removal processing can be started without waiting for the completion of the planned substrate processing. As a result, it becomes possible to execute the bubble removal process in advance.

In the example of FIGS. 11A and 11B, when the substrate processing plan is instructed, the scheduling function unit 65 selects from among the plurality of processing sections PZ1 to PZ3 the processing section PZ that does not interfere with the existing bubble removal processing plan. The processing unit MPC (the processing unit MPC9 in the second processing section PZ2 for the substrate W1 and the MPC8 of the first processing section PZ1 for the substrate W2) is selected to create a substrate processing plan.

As a result, even if a substrate processing instruction is given subsequent to the bubble removal processing instruction, the substrate processing can be started without waiting for the completion of the planned bubble removal processing. This allows the substrate processing to be performed ahead of time.
Although the specific embodiments of the present invention have been described above, the present invention can also be implemented in other forms, as exemplified below.

For example, in the above-described embodiment, the first, second and third chemical liquid cabinets CC1, CC2 and CC3 are provided corresponding to the first processing sections PZ1, PZ2 and PZ3. However, a plurality of processing sections PZ may share one chemical solution cabinet, and this one chemical solution cabinet may be provided with a plurality of pumps or other pumping devices corresponding to the plurality of processing sections PZ.
Further, in the above-described embodiment, the flow meter 46 that detects the flow rate of the chemical liquid passing through the branch supply passages 42 and 43 is an example of the processing liquid-related unit. A liquid quality sensor, a pressure sensor, a temperature sensor, a heat exchanger, etc. can be illustrated. These are devices that may interfere with the operation or detection due to the generation of bubbles in the branch supply paths 42 and 43.

In addition, various design changes can be made within the scope of the matters described in the claims.

W Substrate MPC1 to MPC24 Processing Unit TW1 to TW6 Unit Tower PZ1, PZ2, PZ3 First, Second, Third Processing Section CC1, CC2, CC3 First, Second, Third Chemical Solution Cabinet 1 Substrate Processing Device 4 Processing Section 31 Processing chamber 32 Processing cup 33 Spin chuck 34 Chemical solution nozzle 36 Rotational axis 40 Chemical solution supply pipe 41 Main supply path 41A Rising part 41B Transit part 41C Hanging part 42,43 Branch supply path 45 Flow rate control valve 46 Flowmeter 47 Chemical solution valve 51 Chemical solution outlet 52 chemical liquid return port 55 chemical liquid tank 56 pump 57 chemical liquid path 58 temperature controller 60 computer 61 control unit 62 input/output unit 63 storage unit 64 host computer 65 scheduling function unit 66 process execution instruction unit 70 program 71 schedule creation program 72 process execution program 80 Process Job Data 81 Schedule Data 90 Flow Path 91 First Sensor 92 Second Sensor 93 Bubble

Claims (7)

A plurality of processing units for processing the substrate with the processing liquid;
A processing liquid supply source for supplying the processing liquid;
A processing liquid supply path including a main supply path connected to the processing liquid supply source, and a plurality of branch supply paths branched from the main supply path into the plurality of processing units, respectively.
A processing liquid-related unit that is disposed in each of the plurality of branch supply paths and that acts or responds to the processing liquid in the flow path of the branch supply path,
A plurality of processing liquid valves for controlling the supply of the processing liquid to the processing unit by respectively opening and closing the plurality of branch supply paths;
A control unit for controlling the plurality of processing liquid valves,
The control unit plans an air bubble elimination operation for eliminating air bubbles in the flow path of the branch supply path regardless of whether there is an abnormality in the treatment liquid related unit, and the plurality of treatment liquids based on the plan. Is programmed to control the valve ,
The bubble elimination operation includes an operation of opening the processing liquid valve of one of the branch supply paths and closing the processing liquid valves of all the other branch supply paths,
The substrate processing apparatus, wherein the control unit plans to sequentially perform the bubble eliminating operation for eliminating bubbles in the flow path of the branch supply path on a plurality of the processing units . The control unit plans a treatment liquid supply operation of supplying a treatment liquid from the treatment liquid supply source to the substrate in the treatment unit , and plans the bubble elimination operation so as to avoid a period of the treatment liquid supply operation. The substrate processing apparatus of claim 1 , wherein the substrate processing apparatus is programmed as follows. Said processing liquid associated unit comprises a flowmeter for measuring the flow rate of the treatment liquid flowing in the flow path of the branch supply path, the substrate processing apparatus according to claim 1 or 2. A plurality of processing units for processing a substrate with a processing liquid, a processing liquid supply source for supplying the processing liquid, a main supply path connected to the processing liquid supply source, and the main supply path to the plurality of processing units. A processing liquid supply path including a plurality of branched supply paths each branched, and a processing liquid-related unit that is arranged in each of the plurality of branch supply paths and that acts or responds to the processing liquid in the flow path of the branched supply path, A method applied to a substrate processing apparatus including: a plurality of processing liquid valves for controlling the supply of a processing liquid to the processing unit by opening and closing the plurality of branch supply paths, respectively,
A step of planning a bubble elimination operation for eliminating bubbles in the flow path of the branch supply path regardless of the presence or absence of abnormality in the processing liquid-related unit;
To perform the planned bubbles resolving, seen including a bubble eliminating step for opening and closing said plurality of processing liquid valve on the basis of the plan,
The bubble elimination operation includes an operation of opening the processing liquid valve of one of the branch supply paths and closing the processing liquid valves of all the other branch supply paths,
The substrate processing method , wherein the step of planning the bubble elimination operation plans to sequentially perform the bubble elimination operation for eliminating bubbles in the flow path of the branch supply path on a plurality of the processing units . Further comprising the step of planning a processing liquid supply operation for supplying the processing liquid from the processing liquid supply source to the substrate in the processing unit,
The substrate processing method according to claim 4 , wherein the step of planning the bubble elimination operation plans the bubble elimination operation so as to avoid the period of the processing liquid supply operation. The substrate processing method according to claim 4 , wherein the processing liquid-related unit includes a flow meter that measures a flow rate of the processing liquid flowing through the flow path of the branch supply path. A first processing unit for processing a substrate with a processing liquid, a first processing liquid supply source for supplying the processing liquid, a first main supply path connected to the first processing liquid supply source, and the first main supply A first processing liquid supply path including a first branch supply path branched from a path to the first processing unit; and a processing liquid in the flow path of the first branch supply path, which is disposed in the first branch supply path. a first processing liquid associated unit acting or response, by opening and closing the first minute Toki supply path, a first processing liquid valve for controlling the supply of treatment liquid to the first processing unit, a first processing including Parcels,
A second processing unit for processing a substrate with a processing liquid, a second processing liquid supply source for supplying the processing liquid, a second main supply path connected to the second processing liquid supply source, and the second main supply. A second processing liquid supply path including a second branch supply path branched from a path to the second processing unit, and a processing liquid in the flow path of the second branch supply path, which is disposed in the second branch supply path. A second processing compartment including a second processing liquid-related unit that operates or responds, and a second processing liquid valve that controls the supply of the processing liquid to the second processing unit by opening and closing the second branch supply path. When,
And a control unit for controlling the first and second processing liquid valves and the first and second processing units,
When the plan of the bubble eliminating operation is instructed, the control unit plans the bubble eliminating operation in the processing section corresponding to the bubble eliminating operation plan, and after the bubble eliminating operation is planned, the first or second process is performed. The substrate processing apparatus is programmed to select a processing section that does not interfere with the bubble elimination operation plan when a section is instructed to perform a substrate processing plan, and to plan the substrate processing in the selected processing section.

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