TWI655699B - Electronic component mounting device - Google Patents

Abstract

An object of the present invention is to prevent an insulating resin from adhering to a mounting tool in an electronic component mounting apparatus 100 that moves a mounting head in a horizontal direction. The present invention is an electronic component assembly apparatus 100 that thermally seals a semiconductor wafer 150 to a substrate and seals a gap between the semiconductor wafer 150 and the substrate by using an insulating resin, and includes: a film cutting mechanism 200, and the long film 210 is formed The slice is cut; and the tool 110 is vacuum-adsorbed to the semiconductor wafer 150 and thermocompression bonded to the substrate.

Description

Electronic component mounting device

The present invention relates to a configuration of an electronic component mounting device for thermocompression bonding electronic components such as semiconductor wafers to a substrate.

One of the methods of attaching an electronic component such as a semiconductor wafer to a substrate is to apply a liquid resin insulating resin or a film-shaped insulating resin to the back side of the electronic component, and then use the package. The tool thermocompresses the electronic components onto the substrate. In the mounting method, the bonding between the substrate and the electronic component and the curing of the sealing resin between the electronic component and the substrate can be performed at one time. However, in this mounting method, there is a problem that the insulating resin protruding from the electronic component and the substrate contaminates the mounting tool. Therefore, a method of preventing the insulating resin extending from the electronic component and the substrate from adhering to the mounting tool is prevented by thermocompression bonding between the mounting tool and the electronic component. In this method, a film sandwiched between the mounting tool and the electronic component is renewed each time the electronic component is assembled by transporting the film by the film transport mechanism (see, for example, Patent Document 1).

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2015-35493

The electronic component mounting device described in Patent Document 1 includes a mounting head that moves the mounting tool up and down with respect to the substrate, and holds the substrate and moves the substrate in the horizontal direction to position the bonding position of the substrate and the position of the mounting tool. The substrate platform and the film transport mechanism that sequentially updates the film are mounted on the construction head.

On the other hand, in recent years, an electronic component mounting apparatus has been used in which a semiconductor wafer is thermocompression bonded to a substrate by moving the mounting head in a horizontal direction, and the mounting head is a mounting tool for adsorbing a semiconductor wafer. Move in the up and down direction.

In such an electronic component mounting device, there is also a problem that the insulating resin protruding from the electronic component and the substrate contaminates the mounting tool. However, since the film transport mechanism as described in Patent Document 1 is large and has a large weight, there is a problem that the electronic component mounting device is increased in size when mounted on an electronic component mounting device that moves the mounting head in the horizontal direction. .

Therefore, an object of the present invention is to suppress adhesion of an insulating resin to a mounting tool by a simple method.

The electronic component mounting device of the present invention thermocompresses electronic components to a substrate or other electronic components, and seals a gap between the electronic component and the substrate or a gap between the electronic component and other electronic components by using an insulating resin, and the electronic component mounting device The invention comprises the following steps: a film cutting mechanism for cutting the long film into a slice film; and a forming tool for vacuum-adsorbing the electronic component through the slice film to thermocompress the electronic component to the substrate or other electronic parts.

In the electronic component mounting apparatus of the present invention, it is preferable that the film collecting mechanism that receives the sliced film is formed on the surface of the self-assembling tool.

In the electronic component mounting device of the present invention, preferably, the mounting tool comprises: a base a bottom, and an island protruding from the base and vacuum-adsorbing the electronic component to the surface, the film cutting mechanism comprising: a base portion having a shape larger than a planar shape of the island; the clamp having the same shape as the base portion a hole, sandwiching the long film between the base portion; and a punch, inserting and inserting the hole of the base portion and the hole of the holder, and cutting the slice film from the long film, the punch and the long film The interface is the plane that delivers the film to the surface of the tool.

In the electronic component mounting apparatus of the present invention, preferably, the film recovery mechanism includes: a flat plate-shaped platform; and an adsorption belt that moves along the surface of the platform to sequentially receive the slice-like film from the surface of the self-assembling tool.

The present invention can suppress adhesion of an insulating resin to a mounting tool by a simple method.

10‧‧‧Building platform

11‧‧‧Main frame

12, 86‧‧‧ linear guides

15‧‧‧Substrate

20‧‧‧Door frame

23‧‧‧ feet

24‧‧‧arm

26, 75‧‧‧ slider

27‧‧‧Linear Guides

30‧‧‧X direction fixings

35‧‧‧X direction linear motor

40‧‧‧X direction movable parts

42, 62‧‧‧ coil

50‧‧‧Y direction fixing parts

51‧‧‧Frame

52‧‧‧ permanent magnet

53‧‧‧Connecting components

55‧‧‧Y direction linear motor

60‧‧‧Y direction movable parts

61‧‧‧Frame

65‧‧‧XY direction drive mechanism

70‧‧‧Construction head

72‧‧‧Axis

73‧‧‧Z-direction drive mechanism

74‧‧‧ hanging components

76, 77, 78, 114, 115, 121, 122, 123‧‧‧ vacuum holes

80‧‧‧Substitute

81, 82‧‧ ‧ column

84, 85‧‧ ‧ beams

90‧‧‧Control Department

100‧‧‧Electronic part assembly device

110‧‧‧Building tools

111‧‧‧Base

112‧‧‧ island

116, 124‧‧‧ slots

118‧‧‧ surface

119‧‧‧ lower surface

120‧‧‧heater

150‧‧‧Semiconductor wafer

151, 154‧‧‧ electrodes

152‧‧‧Insulating resin film

153‧‧‧Insulating resin

156‧‧‧residue

200‧‧‧membrane cutting mechanism

201‧‧‧Base Department

201a, 203a, 301a‧‧‧ upper surface

202, 205‧ ‧ holes

203‧‧‧ Punch

204‧‧‧Clamps

204a‧‧‧ lower surface

206‧‧‧film feed roller

207, 209, 303, 305‧‧‧ central axis

208‧‧‧film take-up roll

210‧‧‧ long film

211, 212‧ ‧ holes

220‧‧‧ sliced film

300‧‧‧membrane recycling agency

301‧‧‧ platform

302‧‧‧With feed roller

304‧‧‧With take-up roll

310‧‧‧Adsorption belt

Fig. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

Fig. 2 is a plan view showing an electronic component mounting apparatus according to an embodiment of the present invention.

Fig. 3 is a cross-sectional view showing a door frame of the electronic component mounting device according to the embodiment of the present invention.

Fig. 4 is a cross-sectional view showing the details of the portion A shown in Fig. 3.

Fig. 5 is a perspective view showing a film cutting mechanism of the electronic component mounting device according to the embodiment of the present invention.

Fig. 6 is a perspective view showing a film collecting mechanism of the electronic component mounting apparatus according to the embodiment of the present invention.

Fig. 7A is an explanatory view showing a film transfer operation in a film cutting mechanism of the electronic component mounting device according to the embodiment of the present invention.

Fig. 7B is an explanatory view showing a film clamping operation in the film cutting mechanism of the electronic component mounting device according to the embodiment of the present invention.

Fig. 7C is an explanatory view showing a slicing film cutting operation in the film cutting mechanism of the electronic component mounting apparatus according to the embodiment of the present invention.

Fig. 8 is a perspective view showing the sliced film cut out in Fig. 7C.

Fig. 9A is an explanatory view (1) showing a delivery operation of a sliced film in the electronic component mounting apparatus according to the embodiment of the present invention.

Fig. 9B is an explanatory view (2) showing a delivery operation of the sliced film in the electronic component mounting apparatus according to the embodiment of the present invention.

Fig. 10A is an explanatory view showing an operation of a semiconductor wafer to be attached to a mounting tool of an electronic component mounting apparatus according to an embodiment of the present invention.

Fig. 10B is an explanatory view showing an operation of thermocompression bonding a semiconductor wafer to a substrate by an electronic component mounting apparatus according to an embodiment of the present invention.

Fig. 11A is an explanatory view showing a mounting tool and a film collecting mechanism after thermocompression bonding shown in Fig. 9B.

Fig. 11B is an explanatory view showing a receiving operation of a sliced film in the electronic component mounting device of the present invention.

Fig. 11C is an explanatory view showing a film transfer operation of the film recovery mechanism of the electronic component mounting device of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, the overall structure of the electronic component mounting apparatus 100 of the present embodiment will be described with reference to Figs.

As shown in FIG. 1, the electronic component mounting apparatus 100 of the present embodiment includes: a main The gantry 11 supports the gantry frame 20 above the main gantry 11, supports the styling head 70 of the gantry frame 20, drives the X-direction linear motor 35 in the X direction of the gantry frame 20, and moves the gantry 70 along the Y The Y-direction linear motor 55 that is driven in the direction, the sub-frame 80 that is disposed apart from the main frame 11 and the Y-direction load receiving portion 54 that is attached to the sub-frame 80. One end of the Y-direction stator 50 of the Y-direction linear motor 55 and the Y-direction load receiving portion 54 are connected by a connecting member 53. Further, the X direction and the Y direction are directions orthogonal to each other on the horizontal plane. In the present embodiment, as shown in FIG. 1, the direction in which the portal frame 20 extends is referred to as the Y direction, and the direction orthogonal thereto is referred to as the X direction. And explain. Further, the Z direction is perpendicular to the XY plane and the upper and lower directions.

As shown in FIG. 1, the main gantry 11 is a gantry having a square shape, and a mounting platform 10 for vacuum absorbing the substrate 15 on which the semiconductor wafer 150 as an electronic component is mounted is mounted on the upper surface thereof, and the film cutting mechanism is provided. 200, and a membrane recovery mechanism 300. Linear guides 12 are mounted in parallel with each other in the vicinity of opposite sides of the upper surface of the main gantry 11. The slider 26 is movably mounted on the linear guide 12 in the X direction. Further, the leg portions 23 of the portal frame 20 are attached to the respective sliders 26 of the two linear guides 12, respectively. That is, the portal frame 20 extends in the Y direction so as to straddle the main gantry 11, and the leg portions 23 at both ends are attached to the slider 26 and are movably supported in the X direction.

Further, as shown in FIG. 1, the electronic component mounting apparatus 100 of the present embodiment includes a sub-frame 80 that is spaced apart from the main gantry 11 so as to surround the periphery of the main gantry 11. The sub-mount 80 is a frame composed of the columns 81 and 82 and the beam 84 connecting the columns 81 and 82. An X-direction stator 30 of a slot-shaped X-direction linear motor 35 in which the permanent magnets 52 are opposed to each other is attached to the beam 84 extending in the X direction. Further, at the front end of the arm 24 extending from the leg portion 23 of the door frame 20, the permanent magnet 52 mounted in the X direction fixing member 30 is moved in the X direction. The X-direction movable member 40 of the coil 42 is included. The X-direction movable member 40 of the X-direction linear motor 35 moves together with the respective portal frames 20 in the X direction.

As shown in FIGS. 1 and 3, the portal frame 20 supports the construction head 70. The Z-direction drive mechanism 73 is stored in the assembly head 70. The Z-direction drive mechanism 73 moves the heater 120 and the shaft 72 of the assembly tool 110 in the Z direction up and down. The Z-direction driving mechanism 73 moves the heater 120 and the mounting tool 110 up and down to press the semiconductor wafer 150 onto the substrate 15 adsorbed and fixed to the mounting platform 10. As shown in FIG. 3, a space is provided inside the door frame 20, and two linear guides 27 extending in the Y direction are attached to both sides of the inner surface of the portal frame 20. A slider 75 is attached to each linear guide 27, and a hanging member 74 of the construction head 70 is attached to the two sliders 75.

As shown in FIGS. 1 and 2, the Y-direction stator 50 of the Y-direction linear motor 55 is attached between the leg portions 23 of the portal frame 20 via the leaf springs 58. As shown in FIG. 3, the Y-direction fixing member 50 is formed by arranging the permanent magnets 52 in a space on the inner surface of the grooved frame 51. A space between the permanent magnets 52 of the Y-direction fixing member 50 is disposed with a frame 61 in which the coil 62 is mounted and the self-contained head 70 extends. With this configuration, the Y-direction movable member 60 moves together with the configuration head 70 in the Y direction.

As shown in FIGS. 1 and 2, a linear guide 86 is attached to the beam 85 of the sub-frame 80, and a Y-direction load receiving portion 54 is slidably attached to the linear guide 86 in the X direction. The Y-direction load receiving portion 54 and the Y-direction stator 50 are connected by the connecting member 53, and the Y-direction load receiving portion 54 transmits the Y-direction load to the beam 85.

In the electronic component mounting apparatus 100 configured as described above, the door frame 20 is moved in the X direction by the X-direction linear motor 35, and is attached to the linear motor 55 in the Y direction. The gantry 70 of the gantry frame 20 moves in the Y direction. Further, in the electronic component mounting apparatus 100, the heater 120 and the mounting tool 110 are moved in the Z direction by the Z-direction driving mechanism 73 attached to the mounting head 70. Therefore, the X-direction linear motor 35, the Y-direction linear motor 55, and the portal frame 20 constitute an XY-direction drive mechanism 65 that is a horizontal drive mechanism that drives the assembly head 70 in the horizontal direction. Further, the electronic component mounting apparatus 100 of the present embodiment receives the reaction force in the X direction when the door frame 20 is moved in the X direction by the sub-frame 80 disposed apart from the main gantry 11, and causes the constituting head 70 The reaction force in the Y direction when moving in the Y direction. Therefore, the main gantry 11 on which the structuring platform 10, the film dicing mechanism 200, and the film recovery mechanism 300 are mounted hardly vibrates.

Next, the configuration of the heater 120 and the mounting tool 110 attached to the front end of the shaft 72 will be described with reference to FIG.

As shown in FIG. 4, the mounting tool 110 includes a square plate-shaped base 111 and islands 112 projecting in a square shape from the lower surface 119 of the base 111. The island 112 vacuum adsorbs the semiconductor wafer 150 shown in FIG. 3 on the surface 118. The island 112 is substantially quadrilateral in shape that is smaller than the substrate 111 and is substantially identical to the semiconductor wafer 150 that is vacuum adsorbed onto the surface 118. A vacuum hole 114 for vacuum absorbing the semiconductor wafer 150 is disposed at the center of the mounting tool 110. Further, a plurality of vacuum holes 115 are provided at a position of the base 111 adjacent to the outer peripheral surface of the island 112. The vacuum holes 115 communicate with each other by an annular groove 116 provided on the upper surface of the base 111.

As shown in FIG. 4, the heater 120 is formed in a square plate shape in which a heating resistor made of platinum or tungsten is embedded in a ceramic such as aluminum nitride, and the size thereof is substantially the same as the base 111 of the mounting tool 110. the same. A vacuum hole 122 communicating with the vacuum hole 114 of the forming tool 110 is disposed at the center of the heater 120. Moreover, a groove 124 is provided on the lower surface of the heater 120 in the groove One end of the 124 is connected to a vacuum hole 123 penetrating the heater 120 in the thickness direction. Further, a vacuum hole 121 is provided at a position of the heater 120 that communicates with the annular groove 116 of the mounting tool 110. Each of the vacuum holes 121, 122, and 123 of the heater 120 penetrates in the thickness direction.

As shown in FIG. 4, vacuum holes 76, 77, and 78 are respectively disposed in the shaft 72 corresponding to the vacuum holes 121, 122, and 123 of the heater 120, and the vacuum holes 121, 122, and 123 of the heater 120 are respectively Each of the vacuum holes 76, 77, 78 of the shaft 72 is in communication. As shown in FIG. 4, when the vacuum hole 78 is made vacuum by a vacuum device (not shown), the vacuum hole 123 communicating with the vacuum hole 78 and the groove 124 communicating with the vacuum hole 123 are evacuated, so that the assembly tool 110 is The adsorption is fixed to the lower surface of the heater 120.

Next, the details of the film cutting mechanism 200 will be described with reference to Fig. 5 . The film cutting mechanism 200 moves the punch 203 in the Z direction in a state in which the long film 210 is sandwiched between the upper surface 201a of the base portion 201 and the lower surface 204a of the holder 204, and is cut from the long film 210. The square slice film 220 shown in FIG. As shown in FIG. 5, when the slice film 220 is cut, the square hole 212 having the same size as the slice film 220 remains in the long film 210.

The film cutting mechanism 200 includes a base portion 201 having a rectangular parallelepiped having a square hole 202 in the center, a square-shaped holder 204 disposed on the upper side of the base portion 201, and a punch 203 disposed in the hole 202 of the base portion 201. A cylindrical film feed roller 206 that rotates about the central axis 207, and a cylindrical film take-up roller 208 that is disposed on the opposite side of the base portion 201 from the film feed roller 206 and that rotates about the central axis 209. In the initial state, the long film 210 is wound around the film feed roller 206, and one end thereof extends beyond the upper surface 201a of the base portion 201 and extends along the film take-up roll 208, and is fixed to the film take-up roll 208.

The shape of the square hole 202 of the base portion 201 shown in FIG. 5 is larger than that described with reference to FIG. The shape of the island 112 in the shape of a square. The shape of the island 112 is a square shape of substantially the same size as the semiconductor wafer 150. Thus, the hole 202 of the base portion 201 is larger than the square of the semiconductor wafer 150 of the electronic component mounting device 100. Moreover, the aperture 205 of the clamp 204 is the same size as the aperture 202 of the base portion 201.

The lower surface 204a of the holder 204 is separated from the upper surface 201a of the base portion 201, and is moved in the Z direction by a driving device (not shown). As previously explained, the hole 205 of the holder 204 is the same size as the hole 202 of the base portion 201, so that if the lower surface 204a of the holder 204 is in contact with the upper surface 201a of the base portion 201, the base portion 201 is The aperture 202 and the aperture 205 of the holder 204 form a hole that communicates with one of the bodies.

The punch 203 is disposed in the hole 202 of the base portion 201 and moves in the Z direction. The outer surface of the punch 203 has a size slightly smaller than the inner surface of the hole 202, the hole 205, and a small gap formed between the hole 202 and the inner surface of the hole 205. The upper surface 203a of the punch 203 is a flat surface and is a surface that is in contact with the long film 210.

The long film 210 shown in FIG. 5 is provided with a heat-resistant property capable of withstanding the temperature when the semiconductor wafer 150 is thermocompression-bonded to the substrate 15, and the adhesion preventing property of the insulating resin 153 shown in FIG. 10B is not easily adhered. membrane. For the long film 210, it is preferably, for example, polytetrafluoroethylene (PTFE) or tetrafluoroethylene. A fluororesin such as a perfluoroalkyl vinyl ether copolymer (PFA). Further, the thickness of the long film 210 is preferably about 20 to 50 μm in consideration of mechanical strength and thermal conductivity to the semiconductor wafer 150. As shown in FIG. 5, a hole 211 is provided in the center in the width direction of the long film 210 so as not to block the vacuum hole 114 of the semiconductor wafer 150 which is vacuum-adsorbed in the center of the mounting tool 110. The holes 211 are disposed along the length direction of the long film 210 at a distance greater than the length of the holes 202 in the longitudinal direction.

In addition, the long film 210 is not limited to the above-mentioned fluororesin or the like as long as it has heat resistance and anti-adhesive property, and a non-woven fabric or a porous resin material which has air permeability and water repellency in addition to heat resistance and anti-adhesive property may be used. . In the case where a non-woven fabric or a porous resin material is used, since the slit film 220 does not block the vacuum hole 114 of the vacuum-adsorbing semiconductor wafer 150, it is not necessary to previously provide the hole 211 in the long film 210.

Next, a film facing mechanism 300 will be described with reference to Fig. 6 . The film recovery mechanism 300 adsorbs the slice film 220 held on the surface 118 and the lower surface 119 of the mounting tool 110 to the adsorption tape 310 located on the upper surface 301a of the platform 301, as shown in FIGS. 11A to 11C which will be described later. And the adsorption tape 310 to which the sliced film 220 is adsorbed is taken up by the take-up roll 304.

As shown in FIG. 6, the film recovery mechanism 300 includes a flat plate-shaped platform 301, a cylindrical belt feed roller 302 that rotates about a central axis 303, and a platform 301 that is disposed on the opposite side of the platform 301 from the belt feed roller 302. A cylindrical tape take-up roll 304 that rotates about a central axis 305. In the initial state, the adsorption belt 310 is wound around the belt feeding roller 302, and one end thereof extends beyond the upper surface 301a of the stage 301 to the belt take-up roller 304, and is fixed to the belt take-up roller 304. Moreover, the upper surface 301a of the platform 301 is a flat surface.

As shown in FIG. 1, the electronic component assembly apparatus 100 of the present embodiment includes a control unit 90 inside the main gantry 11, and the control unit 90 controls the X-direction linear motor 35, the Y-direction linear motor 55, and the Z-direction drive mechanism 73, The operation of the film cutting mechanism 200 and the film recovery mechanism 300. The control unit 90 is a computer including a CPU (Central Processing Unit) that performs arithmetic processing, a storage control program, and a memory unit that controls data.

Next, the electronic zero of the embodiment is faced with reference to FIGS. 7A to 11C. The operation of the component mounting apparatus 100 will be described.

As shown in Fig. 7A, in the initial state, the holder 204 of the film cutting mechanism 200 is located above the base portion 201, and a gap is formed between the upper surface 201a of the base portion 201 and the lower surface 204a of the holder 204. The long film 210 is wound around the film feed roller 206, and one end extends along the film take-up roll 208 through the gap between the upper surface 201a of the base portion 201 and the lower surface 204a of the holder 204, and is fixed to the film take-up roll. Roller 208. Further, the upper surface 203a of the punch 203 stored in the hole 202 of the base portion 201 is located slightly lower than the upper surface 201a of the base portion 201 in the Z direction.

As shown in Fig. 7A, the control unit 90 rotates the film feed roller 206 and the film take-up roller 208, and as shown in Fig. 5, is placed at the center of the punch 203 at a predetermined interval in the hole 211 of the long film 210. In this manner, the long film 210 is sent out in the X direction.

Next, as shown in FIG. 7B, the control unit 90 lowers the holder 204 in the Z direction, and sandwiches and fixes the long film 210 between the upper surface 201a of the base portion 201 and the lower surface 204a of the holder 204. The hole 202 of the base portion 201 is the same size as the hole 205 of the holder 204, and the hole 202 and the hole 205 are disposed at the same position. Therefore, as shown in FIG. 7B, when the long film 210 is sandwiched, the hole 202 and the hole 205 sandwich the long film 210 to form a hole that communicates with one body.

Next, as shown in FIG. 7C, the control unit 90 causes the upper surface 203a of the punch 203 to exceed the upper surface 201a of the base portion 201 to raise the punch 203 in the Z direction until it enters the hole 205 of the holder 204. Thereby, the slice film 220 having substantially the same size as the hole 205 of the base portion 201 is cut out from the long film 210 (see FIG. 7). The cut slice film 220 has a hole 211 at the center. In the state shown in Fig. 7C, the cut slice film 220 is placed on the upper surface 203a of the flat punch 203.

After the cutting of the sliced film 220 is completed, the control unit 90 is made as shown in FIG. 9A. The X-direction linear motor 35, the Y-direction linear motor 55, and the Z-direction drive mechanism 73 are driven in such a manner that the vacuum hole 114 of the mounting tool 110 is at the position of the hole 211 of the slice film 220 shown in FIG. The position is adjusted such that the surface 118 of the forming tool 110 is lowered to the upper surface 203a of the punch 203. Further, as shown in FIG. 9B, the control unit 90 causes the vacuum hole 76 of the shaft 72 to be vacuumed by a vacuum device (not shown). Thus, the groove 116 of the upper surface of the tool 110 is vacuumed by the vacuum hole 121 communicating with the vacuum hole 76, and the plurality of vacuum holes 115 communicating with the groove 116 are vacuum. Thereby, the slice film 220 located on the upper surface 203a of the punch 203 is adsorbed to cover the surface 118 of the island 112, the side surface of the island 112, and the lower surface 119 of the substrate 111 as shown in FIG. 9B. The lower side of the tool 110 is in the Z direction. In addition, the vacuum hole 114 of the mounting tool 110 is not blocked by the presence of the hole 211 of the sliced film 220.

As shown in FIG. 9B, the control unit 90 rotates the film feed roller 206 and the film take-up roller 208 from the upper surface 203a of the punch 203 to the slice film 220 on the lower surface of the mounting tool 110, as shown in FIG. As shown in FIG. 5, a portion of the long film 210 including the hole 212 obtained by cutting the slice film 220 is taken up by the film take-up roll 208, and a new long film 210 is fed from the film feed roll 206 to the base portion. 201, above the punch 203.

As shown in FIG. 10A, the control unit 90 drives the X-direction linear motor 35 and the Y-direction linear motor 55 to move the structuring tool 110 onto the semiconductor wafer 150, and the Z-direction driving mechanism 73 lowers the structuring tool 110 to the semiconductor. Up to the upper surface of the wafer 150. Then, when the vacuum hole 77 is made vacuum, the vacuum hole 114 of the mounting tool 110 that communicates with the vacuum hole 77 is vacuumed, and the semiconductor wafer 150 is vacuum-adsorbed to the surface 118 via the slice film 220. As shown in FIG. 10A, an electrode 151 is formed on the surface of the semiconductor wafer 150 which is thermocompression bonded, and an insulating resin film 152 is attached to the electrode side surface.

As shown in FIG. 10B, the control unit 90 drives the X-direction linear motor 35 and the Y-direction linear motor 55 to move the structuring tool 110 directly above the mounting position of the substrate 15. Then, the control unit 90 turns on the heater 120 to heat the temperature of the semiconductor wafer 150 from 250 ° C to about 300 ° C. Then, the control unit 90 lowers the mounting tool 110 by the Z-direction driving mechanism 73, thermally crimps the electrode 151 of the semiconductor wafer 150 to the electrode 154 of the substrate 15, and causes an insulating resin film between the semiconductor wafer 150 and the substrate 15. 152 is thermally hardened to form an insulating resin 153 to seal the gap. At this time, one portion of the insulating resin 153 protrudes toward the periphery of the semiconductor wafer 150 and the insulating resin 153 reaches the side of the island 112 of the mounting tool 110. However, since the surface of the portion is covered by the dicing film 220, the insulating resin 153 does not adhere to the surface of the structuring tool 110.

After the semiconductor wafer 150 is thermocompression-bonded to the substrate 15 for a predetermined period of time, the control unit 90 releases the vacuum of the vacuum holes 77 and 114 to release the adsorption of the semiconductor wafer 150, turns off the heater 120, and causes the mounting by the Z-direction driving mechanism 73. The tool 110 is raised to drive the X-direction linear motor 35 and the Y-direction linear motor 55, and as shown in FIG. 11A, the construction tool 110 is moved to directly above the stage 301 of the film recovery mechanism 300. At this time, the residue 156 of the insulating resin 153 is adhered to the surface of the sliced film 220.

Next, as shown in FIG. 11B, the control unit 90 operates the Z-direction drive mechanism 73 to lower the assembly tool 110 onto the stage 301 of the film recovery mechanism 300, thereby releasing the vacuum of the vacuum hole 76, the groove 116, and the vacuum hole 115. . Thus, the portion of the lower surface 119 of the substrate 111 is removed from the lower surface 119 by the vacuum hole 115 of the slice film 220. Then, a portion of the surface 118 of the cover film 220 covering the mounting tool 110 is adsorbed to the surface of the adsorption belt 310. The adsorption tape 310 has the adhesion, gravity, etc. of the slice film 220 with the surface 118 of the mounting tool 110. The adhesion and the adsorption force can be, for example, an adhesive tape or the like.

As shown in FIG. 11C, when the control unit 90 operates the Z-direction drive mechanism 73 to raise the structuring tool 110, the dicing film 220 adsorbed on the adsorption belt 310 remains in a state of being adsorbed. Then, after the adsorption belt 310 receives the slice film 220 from the surface 118 and the lower surface 119 on the lower side of the tool 110, the control belt 90 drives the tape feed roller 302 and the tape roll as shown in FIGS. 6 and 11C. The roller 304 is taken up and the portion to which the sliced film 220 is adsorbed is taken up to the take-up reel 304, and the new feed surface of the adsorption belt 310 is fed to the upper surface 301a of the stage 301 by the self-feeding roller 302.

As described above, according to the electronic component mounting apparatus 100 of the present embodiment, the cut slice film 220 is adsorbed on the surface 118 and the lower surface 119 of the mounting tool 110, and the semiconductor wafer 150 is made via the slice film 220. When the substrate 15 is thermocompression-bonded, the film transfer mechanism having a large weight is not mounted in the structuring head 70 that moves in the XY direction, and the insulating resin 153 is prevented from being adsorbed to the structuring tool 110. Further, on the one hand, the insulating resin 153 can be prevented from adhering to the structuring tool 110, and the structuring head 70 can be moved at a high speed, whereby the mounting time of the semiconductor wafer 150 can be shortened.

Further, in the electronic component mounting apparatus 100 of the present embodiment, as in the film transport mechanism of the prior art described in Patent Document 1, it is not necessary to always arrange a roll-shaped film on the side of the surface 118 of the mounting tool 110, so that it can be subjected to hot pressing. The type of semiconductor wafer 150 is simply replaced with the tool 110. Further, it is also possible to carry out an additional operation such as position correction by a glass mark in a state where the sliced film 220 is not adsorbed, and the assembly accuracy can be improved.

The film recovery mechanism 300 of the electronic component assembly apparatus 100 described above is described as the adsorption and recovery of the sliced film 220 on the adsorption tape 310. However, the present invention is not limited thereto, and for example, a vacuum may be disposed on the upper surface 301a of the stage 301. Suction hole, using the table of the relatively constructed tool 110 The surface 118 holds the force of the adhesion of the sliced film 220, the force of gravity, and the like, and vacuum suction, and the sliced film 220 is vacuum-sucked and recovered. Further, in the case where the vacuum suction hole is disposed on the lower side, the front end of the construction tool 110 is placed, the vacuum of the vacuum hole 115 of the construction tool 110 is released, and the inside of the case is vacuumed to suck the slice film 220. And recycled to the box.

Further, although the upper surface 203a of the punch 203 of the film cutting mechanism 200 of the electronic component mounting apparatus 100 of the present embodiment has been described as a flat surface, it may be disposed at the position of the hole 211 shown in FIG. Push the needle. Further, when the punch 203 is raised and the slice film 220 is cut from the long film 210, the hole 211 is opened in the long film 210 by the push-up needle, and the push pin is pushed into the vacuum hole 114 of the mounting tool 110. In a manner, the forming tool 110 is lowered to the upper surface 203a of the punch 203, and the vacuum hole 115 is vacuumed, and the slice film 220 is delivered from the upper surface 203a of the punch 203 to the surface 118 and the lower surface 119 of the mounting tool 110.

Further, in the above description, the description has been made on the surface of the substrate 15 by thermocompression bonding of the semiconductor wafer 150. However, the present invention can also be applied to the case where the semiconductor wafer 150 is thermocompression bonded onto the substrate 15 Other semiconductor wafers are thermocompression bonded onto the semiconductor wafer 150.

Further, in the above description, the case where the insulating resin film 152 is attached to the electrode side surface of the semiconductor wafer 150 and the semiconductor wafer 150 is thermally bonded to the substrate 15 between the semiconductor wafer 150 and the substrate 15 has been described. The insulating resin film 152 is thermally cured to form the insulating resin 153 and seals the gap. However, instead of the insulating resin film 152, the insulating resin paste may be applied to the electrode side surface of the semiconductor wafer 150, and when the semiconductor wafer 150 is thermocompression bonded, the above The insulating resin paste is thermally cured to form an insulating resin 153. Further, an insulating resin slurry may be applied onto the surface of the substrate 15 to thermally cure the insulating resin paste when the semiconductor wafer 150 is thermocompression bonded. Insulating resin 153. In the electronic component assembly apparatus 100 of the present embodiment, the cut slice film 220 is adsorbed on the surface 118 and the lower surface 119 of the mounting tool 110, and the semiconductor wafer 10 is thermocompression bonded to the substrate 15 via the slice film 220. Therefore, in any case, the adhesion of the insulating resin 153 to the mounting tool 110 can be suppressed.

Claims (4)

An electronic component mounting device for thermocompression bonding electronic parts to a substrate or other electronic parts, and sealing the gap between the electronic parts and the substrate or the gap between the electronic parts and the other electronic parts by using an insulating resin, the electronic parts The structuring device is characterized by comprising: a film cutting mechanism for cutting a long film in a strip shape film except for an end portion in the width direction; and a structuring tool for vacuum-absorbing the electronic component via the dicing film The electronic component is thermocompression-bonded to the substrate or other electronic component; the film cutting mechanism includes: a base portion; a film feeding roller disposed on one of the base portions, and the long film is wound; the film winding roller is disposed One of the ends of the long film is fixed to the other of the base portions, the film feeding roller supplies the long film, and the film winding roller recovers the long film after the slice film is cut. The electronic component mounting apparatus of claim 1, comprising a film recovery mechanism for receiving the sliced film from a surface of the mounting tool. The electronic component mounting device of claim 1, wherein the mounting tool comprises: a substrate; and an island protruding from the substrate and vacuum-adsorbing the electronic component to a surface, the substrate of the film cutting mechanism The portion has a hole having a shape larger than a planar shape of the island; the film cutting mechanism further includes: a holder having a hole having the same shape as the base portion and sandwiching the long film from the base portion; and a punch for inserting and inserting the hole of the base portion and the hole of the holder The strip film is cut out from the long film, and the surface of the punch that is in contact with the long film is a flat surface on which the slice film is delivered to the surface of the mounting tool. The electronic component assembly device of claim 2, wherein the film recovery mechanism comprises: a flat plate-shaped platform; and an adsorption belt that moves along the surface of the platform to sequentially receive the slice shape from the surface of the construction tool membrane.