TWI654481B - Exposure device - Google Patents

Abstract

The photomask has a pattern (Pm) on an outer peripheral surface formed around a specific axis (J). The outer peripheral surface includes a part of a spherical surface (Ma) forming a part of a spherical surface whose center point is disposed on the axis. Sphere.

Description

   Exposure device   

The present invention relates to a photomask, a photomask unit, an exposure device, a substrate processing device, and a device manufacturing method.

This application is based on Japanese Patent Application No. 2012-50664 filed on March 7, 2012 and claims priority, the content of which is incorporated herein by reference.

As a display element constituting a display device such as a display device, a liquid crystal display element, an organic electroluminescence (Organic Electroluminescence) element, an electrophoretic element for electronic paper, and the like are well known.

At present, as such display elements, the following active devices have become mainstream, and a switching element (TFT, Thin Film Transistor) called a thin film transistor is formed on the surface of a substrate, and the substrate is formed on the substrate. Form each display element.

In recent years, a technique for forming a display element on a sheet-like substrate (such as a film member) has been proposed. As such a technique, a method called a roll-to-roll method (hereinafter, referred to simply as a “winding method”) is well known (for example, refer to Patent Document 1).

The winding method is to send out a sheet substrate (for example, a tape-shaped film member) that is wound on a supply roller on the substrate supply side, and to transport the substrate while winding the sent substrate with a recovery roller on the substrate recovery side.

The gate electrode, the gate oxide film, the semiconductor film, the source / drain electrode, etc. constituting the TFT are formed by a plurality of processing devices from the time when the substrate is taken out to the time when the substrate is taken up. Thereafter, other constituent elements of the display element are sequentially formed on the substrate. For example, when an organic EL element is formed on a substrate, a light-emitting layer, an anode, a cathode, and a circuit are sequentially formed on the substrate.

These constituent elements may be formed using, for example, a photolithography method using an exposure device that exposes a substrate with exposure light through a photomask.

As an example of a photomask of an exposure apparatus, a cylindrical photomask is known, for example. This cylindrical photomask has a rotating body containing a pattern. The rotating body is formed into, for example, a cylindrical shape or a cylindrical shape, and a pattern is formed on a cylindrical surface thereof.

By using a cylindrical mask, there is no need to move the platform back and forth or use a plurality of platforms holding the mask, thereby reducing costs. In addition, the pattern can be transferred to a plurality of positions on the exposed body by moving the exposed body in one direction, so the number of times of acceleration and deceleration of the platform can be reduced. As a result, exposure accuracy can be improved.

[Prior technical literature]

[Patent Literature]

[Patent Document 1] International Publication No. 2006/100868

However, in the above exposure processing, in order to project a pattern image on a cylindrical surface onto a substrate that is a flat surface, it is necessary to perform an optical design to correct the image surface, which causes a problem that the structure becomes complicated.

An object of aspects of the present invention is to provide a photomask, a photomask unit, an exposure device, a substrate processing device, and a device manufacturing method that can prevent the structure from being complicated.

According to a first aspect of the present invention, there is provided a photomask, which is formed on a peripheral surface having a pattern formed around a specific axis, and the peripheral surface includes a part of a spherical surface forming a part of a spherical surface whose center point is disposed on the axis. The pattern is arranged on the part of the spherical surface.

According to a second aspect of the present invention, there is provided a photomask unit including a plurality of photomasks according to the first aspect of the present invention, and the plurality of photomasks are arranged so that the axes are parallel to each other.

According to a third aspect of the present invention, there is provided an exposure device that transfers a pattern to a substrate, and includes a supporting device that supports the first aspect of the present invention having the above pattern on an outer peripheral surface formed around a specific axis Aspects of the mask; and a projection optical system that projects an image of the pattern of the mask supported on the supporting device onto the substrate; and the projection optical system has a radius of curvature corresponding to the partial spherical surface of the mask The size of Pezfal and the negative.

According to a fourth aspect of the present invention, there is provided an exposure device that transfers a pattern to a substrate, and includes: a support device that supports a plurality of photomasks having the above pattern on an outer peripheral surface formed around a specific axis; A mask unit according to a second aspect of the present invention; and a plurality of projection optical systems, which are provided corresponding to each of the plurality of masks supported by the supporting device, and project an image of the pattern onto the substrate And the projection optical system has a negative Pezfal sum of a magnitude corresponding to a radius of curvature of the partial spherical surface of the mask.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus for processing a strip-shaped substrate, comprising: a substrate transfer unit that transfers the substrate along a length direction of the substrate; and a substrate processing unit that transfers the substrate along The substrate transfer section of the substrate transfer section is configured to process the substrate transferred along the transfer path; and the substrate processing section includes an exposure device of a fourth aspect of the present invention that transfers a pattern to the substrate.

According to a sixth aspect of the present invention, there is provided a component manufacturing method which includes processing a substrate to manufacture a component, including the steps of: using an exposure device of the fourth aspect of the present invention to transfer a pattern onto the substrate; And processing the substrate on which the pattern is transferred based on the pattern.

In one aspect of the present invention, a mask can be provided which can prevent the structure from being complicated.

20‧‧‧Light source department

60‧‧‧treatment device

70‧‧‧ transfer device

80‧‧‧ alignment device

81‧‧‧ aiming at the camera

82‧‧‧ adjusting device

AS‧‧‧aperture diaphragm (light path restriction member)

BS‧‧‧ Beamsplitter

CL‧‧‧ Substrate Recycling Department

CONT‧‧‧Control Department

EL‧‧‧Exposure light

EX‧‧‧Exposure device

FB‧‧‧ Sheet Substrate (Substrate)

Fp‧‧‧ treated surface

FPA (FPA1) ‧‧‧Substrate processing equipment

IB‧‧‧illumination light

IU, ILU ‧‧‧lighting optical system

J‧‧‧center axis (specific axis)

L11, L21 ‧‧‧ Optical Elements (Part 1 Optical System)

L12, L14, L15, L16, L17, L18, L19, L22, L23, L24, L25, L27, L28, L29, L32, L33 ...

L13, L26, L31, L35 ‧‧‧ concave mirror

L20, L30, L36 ‧‧‧ Optics (Part 2 Optical System)

L34‧‧‧ convex mirror

M‧‧‧Photomask

M'‧‧‧ cylinder

M1, M2, M3, M21, M32‧‧‧ flat mirror

M31‧‧‧Plane Mirror (Part 1 Optical System)

Ma‧‧‧Spherical

MJ‧‧‧Rotary shaft (shaft part)

MJ'‧‧‧shared rotation axis

Mp‧‧‧Pattern

MST‧‧‧Support device

MU‧‧‧Mask unit

PA‧‧‧Pattern area

PA1, PA2, PA3‧‧‧‧ projection area

PN‧‧‧Unpatterned area

Pm, Pm ', Pm1, Pm2, Pm3‧‧‧ patterns

PR‧‧‧Substrate Processing Department

PU, PU1, PU2, PU3‧‧‧ projection optical system

R‧‧‧ roller device

RD‧‧‧Rotary drive device (rotary device)

RST‧‧‧Platform

RT‧‧‧Plane Mask

SU‧‧‧ Substrate Supply Department

XYZ‧‧‧ Orthogonal Coordinate System

FIG. 1 is a diagram showing the configuration of a substrate processing apparatus according to this embodiment.

FIG. 2 is a diagram showing a schematic configuration of an exposure apparatus.

Figure 3 is a front view of the photomask viewed from the -X side.

FIG. 4 is a diagram showing values of elements of a projection optical system.

FIG. 5 is a diagram showing aspherical data of each surface number formed as an aspherical surface.

Fig. 6 is a diagram showing a schematic configuration of an exposure apparatus according to a second embodiment.

FIG. 7 is a diagram showing values of elements of the projection optical system according to the second embodiment.

FIG. 8 is a view showing aspherical surface data of each surface number formed as an aspherical surface in the second embodiment.

Fig. 9 is a diagram showing a schematic configuration of an exposure apparatus according to a third embodiment.

FIG. 10 is a diagram showing values of elements of a projection optical system according to a third embodiment.

FIG. 11 is a view showing aspherical data of each surface number formed as an aspherical surface in the third embodiment.

FIG. 12 is a diagram showing a schematic configuration of an exposure apparatus having a mask unit.

FIG. 13 is a flowchart illustrating an example of manufacturing steps of a micro-device.

FIG. 14 is a diagram illustrating an example of a method of forming a mask according to this embodiment.

Hereinafter, embodiments of a photomask, a photomask unit, an exposure device, a substrate processing device, and a device manufacturing method according to the present invention will be described with reference to FIGS. 1 to 14.

(First Embodiment)

FIG. 1 is a diagram showing a configuration of a substrate processing apparatus FPA according to a first embodiment of the present invention.

As shown in FIG. 1, the substrate processing apparatus FPA includes a substrate supply unit SU that supplies a sheet substrate (for example, a strip-shaped film member) FB, and a substrate processing unit PR that faces the surface (processed surface) of the sheet substrate FB. Processing; a substrate recovery section CL that recovers the sheet substrate FB; and a control section CONT that controls each of these sections. The substrate processing apparatus FPA is installed in, for example, a factory.

Hereinafter, in the description of the substrate processing apparatus FPA, the XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described while referring to the XYZ orthogonal coordinate system.

In the XYZ orthogonal coordinate system, the transport direction of the sheet substrate FB (the length direction of the sheet substrate FB) is set to the X-axis direction, and the direction orthogonal to the transport direction of the sheet substrate FB (the shortness of the sheet substrate FB) is set. The side direction or the width direction of the sheet substrate FB) is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction is the Z-axis direction.

The substrate processing apparatus FPA is a roll-to-roll method that performs various processes on the surface of the sheet substrate FB from the time when the sheet substrate FB is sent from the substrate supply unit SU to the recovery of the sheet substrate FB by the substrate recovery unit CL (hereinafter, it is only expressed as "Winding mode").

The substrate processing apparatus FPA can be used when a display element (electronic element) such as an organic EL element or a liquid crystal display element is formed on the sheet substrate FB. Of course, the substrate processing apparatus FPA can also be used when forming elements other than these elements.

In the substrate processing apparatus FPA, as the sheet substrate FB to be processed, for example, a foil such as a resin film or stainless steel can be used.

For example, as the resin film, polyethylene resin, polypropylene resin, polyester resin, ethylene-ethylene copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, and polyacrylate resin can be used. , Polystyrene resin, vinyl acetate resin and other materials.

The size in the Y direction (short side direction) of the sheet substrate FB is, for example, about 1 to 2 m, and the size in the X direction (long side direction) is, for example, 10 m or more.

Of course, this size is only an example, and it is not limited to this. For example, the dimension in the Y direction of the sheet substrate FB may be 1 m or less than 50 cm, or may be 2 m or more. The dimension in the X direction of the sheet substrate FB may be 10 m or less.

The sheet substrate FB is formed to have flexibility, for example. Here, the term "flexible" refers to a property that, for example, the substrate can be bent without a wire break or break even if a specific force of at least a certain degree of self-weight is applied to the substrate. Further, for example, the property of being bent by the above-mentioned specific force is also included in the flexibility. The flexibility described above varies depending on the environment such as the material, size, thickness, and temperature of the substrate.

In addition, as the sheet substrate FB, one strip-shaped substrate may be used, or a configuration in which a plurality of unit substrates are connected and formed into a strip shape may be used.

Even if the sheet substrate FB is subjected to a relatively high temperature (for example, about 200 ° C.), the thermal expansion coefficient can be reduced in such a manner that the size does not change substantially (the thermal deformation is small). For example, the inorganic filler may be mixed in a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, and silicon oxide.

The substrate supply unit SU sends out and supplies the sheet substrate FB wound into a roll shape to the substrate processing unit PR, for example. The substrate supply unit SU is provided with, for example, a shaft portion around which the sheet substrate FB is wound or a rotation drive source for rotating the shaft portion. In addition, it is also possible to have a configuration in which a cover portion or the like is provided to cover the sheet substrate FB in a state of being rolled into a roll.

The substrate recovery unit CL winds up the sheet substrate FB from the substrate processing unit PR into, for example, a roll shape and recovers it. In the substrate recovery portion CL, a rotation drive source for winding or rotating the shaft portion of the sheet substrate FB, a cover portion covering the recovered sheet substrate FB, and the like are provided in the same manner as the substrate supply portion SU.

Furthermore, in the substrate processing unit PR, when the sheet substrate FB is cut into, for example, a panel shape, for example, the sheet substrate FB may be recovered in a state where the sheet substrate FB is overlapped and wound in a roll shape. The constitution of the sheet substrate FB is recovered in different states.

The substrate processing unit PR transfers the sheet substrate FB supplied from the substrate supply unit SU to the substrate recovery unit CL, and processes the processed surface Fp of the sheet substrate FB during the transfer. The substrate processing unit PR includes, for example, a processing device 60, a transfer device 70, an alignment device 80, and the like.

The processing device 60 has various devices for forming, for example, an organic EL element with respect to the processing surface Fp of the sheet substrate FB. Examples of such a device include a partition wall forming device for forming a partition wall on the surface to be processed Fp, an electrode forming device for forming an electrode for driving an organic EL element, and a light emitting layer forming device for forming a light emitting layer. .

More specifically, a droplet coating device (e.g., an inkjet type coating device, a spin coating type coating device, etc.), a vapor deposition device, a sputtering device, and atmospheric pressure CVD (Chemical Vapor Deposition) ) Equipment, mist deposition equipment, electroless plating equipment and other film-forming equipment or exposure equipment, developing equipment, surface modification equipment, cleaning equipment, etc. Each of these devices is appropriately provided on, for example, a conveyance path of the sheet substrate FB.

In the present embodiment, among various devices constituting the processing device 60, an exposure device will be mainly described.

The transfer device 70 includes a roller device R that transfers, for example, the sheet substrate FB to the substrate recovery portion CL side in the substrate processing unit PR. A plurality of roller devices R are provided along the conveyance path of the sheet substrate FB, for example. A driving mechanism (not shown) is attached to at least a part of the plurality of roller devices R.

By rotating such a roller device R, the sheet substrate FB is conveyed in the X-axis direction. A configuration may be adopted in which, for example, a part of the plurality of roller devices R is movably provided in a direction orthogonal to the conveying direction.

The alignment device 80 performs an alignment operation on the sheet substrate FB. The alignment device 80 includes: an alignment camera 81 that detects the position state of the sheet substrate FB; and an adjustment device 82 that positions the sheet base FB in the X direction, the Y direction, and the Z direction based on the detection result of the alignment camera 81. Direction, θX direction, θY direction, θZ direction for fine adjustment.

The alignment camera 81 detects, for example, an alignment mark formed on the sheet substrate FB, and sends the detection result to the control unit CONT. The control unit CONT obtains the position information of the sheet substrate based on the detection result, and controls the adjustment amount using the adjustment device 82 based on the position information.

FIG. 2 is a diagram showing a schematic configuration of an exposure device EX used as the processing device 60. As shown in FIG.

As shown in FIG. 2, the exposure device EX is a device that projects an image of the pattern Pm formed on the mask M onto the sheet substrate FB. The exposure device EX includes: an illumination optical system IU that illuminates the exposure light of the mask M; a support device MST that supports the mask M in a rotatable manner around a rotation axis (axis portion) MJ; and a projection optical system PU that is formed by projection Image of the pattern Pm on the mask M.

FIG. 3 is a front view of the photomask M viewed from the -X side.

As shown in FIG. 2 and FIG. 3, the mask M in this embodiment is formed into a substantially disc shape with a center axis (specific axis) J parallel to the Y axis as a center. The outer peripheral surface of the mask M includes a partial spherical surface Ma that forms a part of a spherical surface whose center point is disposed on the central axis J. The center point of the spherical surface is located at a substantial central portion of the spherical surface Ma in a direction along the above-mentioned central axis J.

The pattern Pm is formed in the pattern area PA in which the non-pattern area PN is removed in the circumferential direction in the partial spherical surface Ma. As the pattern Pm, a configuration formed directly on the spherical surface Ma or a configuration in which a sheet on which the pattern Pm is formed is attached to the spherical surface Ma can be adopted.

The pattern Pm formed in the pattern area PA is patterned by a material that reflects the illumination light for exposure and a material that absorbs the illumination light. The pattern Pm is drawn, for example, as a circuit pattern for forming pixel electrodes, TFTs, wirings, and the like of a display panel section of a liquid crystal or organic EL, and for forming a circuit pattern of a display panel section and a peripheral circuit section for a mobile terminal device.

In addition, the partial spherical surface Ma is formed into a band shape around the center axis J so as to pass through the center point of the spherical surface and intersect an axis intersection line orthogonal to the center axis J, and includes the axis intersection line and a portion of the spherical surface Ma. A tangent plane that intersects and is tangent to a part of the spherical surface Ma is formed so as to be substantially parallel to the above-mentioned central axis J.

The rotation axis MJ is provided on both sides in the Y direction of the mask M so that the axis line coincides with the center axis J (becomes the axis center). In addition, the rotation axis MJ is rotatably held together with the outer peripheral surface of the mask M by the support device MST, and is connected to a rotation drive device (rotation device) RD to give a rotation drive. The driving of the rotary driving device RD (i.e., the rotary driving of the mask M) is controlled by the control unit CONT.

The illumination optical system IU illuminates the exposure light EL to the mask M. The illumination optical system IU includes a light source section 20, a flat mirror M1, an optical element (first optical system) L11 constituting a part of the projection optical system PU, and an optical element L12, a concave mirror L13, and a flat mirror M2.

As the light source section 20, a configuration in which a light source device such as a mercury lamp or a laser generator is provided, or a configuration in which a secondary light source such as a compound eye optical element is provided can be adopted.

The projection optical system PU projects an image of the pattern Pm formed on the mask M onto the sheet substrate FB. The projection optical system PU has the above-mentioned optical elements L11, L12, concave mirror L13, plane mirror M2, and optical element L14, aperture stop (optical path restriction member) AS, and optical element L15, which are sequentially arranged along the traveling direction of the exposure light EL. L19, and optical element (part 2 optical system) L20.

The aperture stop AS specifies the numerical aperture of the projection optical system PU. The aperture stop AS is disposed at a position of a pupil surface of a projection optical system PU that is conjugate to an exit pupil (or an entrance pupil). In addition, the reflective surface of the concave mirror L13 is also disposed at the position of the pupil surface in the projection optical system PU.

After the exposure light EL from the light source part 20 is sequentially reflected by the flat mirror M1 and the concave mirror L13, it sequentially passes through the optical elements L12 and L11 to illuminate the pattern Pm formed on a part of the spherical surface Ma of the mask M.

After the exposure light EL reflected by the mask M (partial spherical Ma) is received (transmitted) by the optical element L11, it passes through the optical element L12 and is reflected by the concave mirror L13 and the flat mirror M2. The exposure light EL reflected by the plane mirror M2 sequentially passes through the optical elements L14 to L19, and is projected on the sheet substrate FB through the optical element L20.

The values of the elements of the projection optical system PU are shown in FIG. 4.

In FIG. 4, at the left end, the optical surfaces of the exposure light EL on the above-mentioned optical elements L11, L12, concave mirror L13, flat mirror M2, and optical element L14, aperture stop AS, and optical elements L15 to L20 are sequentially incident or emitted. Face number.

In addition, r represents a curvature radius of each optical surface, and d represents a surface interval between the optical surfaces. In addition, a column of r indicates a paraxial curvature radius of each optical surface, and a column of d indicates an interval between the surfaces.

FIG. 5 shows aspherical data of each surface number formed as an aspheric surface.

In FIG. 5, K is a conic coefficient, and A to F are aspherical coefficients of 4th, 6th, 8th,...

In addition, in FIG. 4 and FIG. 5, the sign of the paraxial curvature radius r is set to be positive when it protrudes toward the object surface side (pattern Pm surface side), and the surface interval d is set to the symbol before and after the optical surface. Reverser.

The projection optical system PU system has, for example, a wavelength (exposure wavelength) of 365 nm, a reduction ratio of 1 (equal magnification), a numerical aperture NA of the object side of 0.055, and the above-mentioned optical elements L11, L12, concave mirror L13, and plane mirror. M2, and the optical element L14, the aperture stop AS, and the optical elements L15 to L20 are set to a negative Pezfal sum.

Here, in an optical system composed of a plurality of optical elements, if the focal length of the optical surface of the i-number is set to fi and the refractive index of the optical surface is set to ni and ni ', then Pezfal and Psum is expressed by the following formula.

At this time, if the curvature radius of the image plane is set to R0, Pezfal and Psum are as follows.

Psum = -1 / R0

For example, in the case of the concave mirror L13, it has a positive power, and the Pezfal sum becomes a negative value. As shown in FIG. 4, the focal length fi of the concave mirror L13 having a negative curvature radius ri is expressed by the following formula.

[Number 2]

In addition, Pezfal and Psum of the concave mirror L13 are expressed by the following formula.

Further, in the present embodiment, the size of the Pezfal sum of the projection optical system PU is set to be substantially equal to the reciprocal (that is, curvature) of the radius of curvature of the spherical surface Ma where the pattern Pm is formed. Specifically, as shown in FIG. 4, when the curvature radius of a part of the spherical surface Ma is 500 mm, the size of the Pezfal sum of the projection optical system PU is −0.00199 (≒ −1 / 500).

Thereby, the image of the pattern Pm formed on the partial spherical surface Ma is projected onto the processed surface Fp of the sheet substrate FB in a substantially planar shape.

The substrate processing apparatus FPA configured as described above is manufactured by, for example, the display substrate 1 in a so-called roll-to-roll method (hereinafter referred to as a winding method) under the control of the control unit CONT. Hereinafter, the steps for manufacturing the display substrate 1 using the substrate processing apparatus FPA having the above-described configuration will be described.

First, a state is obtained in which a belt-shaped sheet substrate FB is wound on a roller provided in the substrate supply unit SU. From this state, the control unit CONT sends out the sheet substrate FB from the substrate supply unit SU, winds up the fed-out sheet substrate FB by a roller of the substrate recovery unit CL, and transfers the sheet substrate FB.

The control unit CONT is used to appropriately transfer the sheet substrate FB in the substrate processing unit PR by the transfer device 70 of the substrate processing unit PR during the period from the time when the sheet substrate FB is fed to the winding, and the processing device 60 The constituent elements of the display substrate 1 are sequentially formed on the sheet substrate FB.

When the processing by the processing device 60 is performed, the control unit CONT performs the position alignment of the sheet substrate FB on the alignment device 80.

The control unit CONT is in the processing device 60 while the sheet substrate FB is appropriately transferred in the substrate processing unit PR by the transfer device 70 of the substrate processing unit PR during the period from the time when the sheet substrate FB is fed to the winding. The exposure device EX projects the pattern Pm of the mask M onto the processed surface Fp of the sheet substrate FB.

At this time, the control unit CONT controls the driving of the rotation driving device RD and the driving of the roller device R, and synchronously drives the rotation of the photomask M around the rotation axis MJ and the sheet substrate FB.

More specifically, the control unit CONT performs drive control such that the ratio of the moving speed (conveying speed) of the sheet substrate FB to the moving speed of the partial spherical surface Ma of the mask M around the rotation axis MJ, It is equal to the projection magnification (equal magnification in this embodiment) of the projection optical system PU.

Thereby, the image of the pattern Pm of the rotating mask M illuminated by the illumination optical system IU is sequentially projected onto the sheet substrate FB through the projection optical system PU at a size corresponding to the projection magnification.

As described above, in the present embodiment, a mask M having a pattern Pm formed on a part of the spherical surface forming a spherical surface is used. Therefore, an optical design for correcting the image plane is not required, and the structure can be prevented from being complicated.

In particular, in this embodiment, by using the concave mirror L13, a projection optical system PU having a negative Pezfal and sum can be easily realized, and an image of the pattern Pm can be easily projected onto the sheet substrate FB.

(Second Embodiment)

Next, a second embodiment of the exposure apparatus EX will be described with reference to FIGS. 6 to 8.

In the second embodiment, the configurations of the illumination optical system IU and the projection optical system PU are different from those of the first embodiment. Therefore, the illumination optical system IU and the projection optical system PU will be described below.

In these drawings, the same components as those in the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and descriptions thereof are omitted or simplified.

As shown in FIG. 6, the illumination optical system IU in this embodiment includes a light source section 20, a beam splitter BS sequentially arranged along the optical path of the exposure light EL, optical elements L25 and L24, an aperture stop AS, and optical elements L23 and L22. , L21. The beam splitters BS, optical elements L25, L24, aperture stop AS, and optical elements L23, L22, and L21 constitute a part of the projection optical system PU as described below.

The projection optical system PU includes the above-mentioned optical elements (part 1 optical system) L21, optical elements L22 to L23, aperture stop AS, optical elements L24, L25, beam splitter BS, and concave mirror arranged sequentially along the optical path of the exposure light EL. L26, plane mirror M21, optical elements L27 to L29, and optical element (part 2 optical system) L30. The concave mirror L26 is disposed on the pupil surface of the projection optical system PU.

After the exposure light EL from the light source unit 20 is incident and reflected by the beam splitter BS as the illumination optical system IU, the illumination is formed on the mask M through the optical elements L25, L24, the aperture stop AS, and the optical elements L23, L22, and L21. The pattern Pm of a part of the spherical Ma.

The exposure light EL reflected by the mask M (partial spherical surface Ma) enters the beam splitter BS through the optical elements L21 to L23, the aperture stop AS, and the optical elements L24 and L25 as the projection optical system PU.

After the exposure light EL incident on the beam splitter BS passes through the beam splitter BS, it is reflected by the concave mirror L26, passes through the beam splitter BS, the optical elements L25, and L24 in sequence and is reflected by the plane mirror M21.

The exposure light EL reflected by the plane mirror M21 sequentially passes through the optical elements L27 to L30, and the image of the pattern Pm of the mask M is projected on the sheet substrate FB.

FIG. 7 shows the values of the elements of the projection optical system PU in this embodiment.

In FIG. 7, the left side shows the optical surfaces where the exposure light EL enters or exits sequentially from the above-mentioned optical elements L21 to L23, aperture stop AS, optical elements L24, L25, beam splitter BS, concave mirror L26, and optical elements L27 to L30. Face number.

In addition, r represents a curvature radius of each optical surface, and d represents a surface interval between the optical surfaces. In addition, a column of r indicates a paraxial curvature radius of each optical surface, and a column of d indicates an interval between the surfaces.

FIG. 8 shows aspherical data of each surface number formed as an aspheric surface.

In FIG. 8, K represents a conic coefficient, and A to F represent aspheric coefficients of 4th, 6th, 8th, ....

In FIGS. 7 and 8, the sign of the paraxial curvature radius r is set to be positive when it protrudes toward the object surface side (pattern Pm surface side), and the surface interval d is set in front of and behind the optical surface. Reverser.

The projection optical system PU system has, for example, a wavelength (exposure wavelength) of 365 nm, a projection magnification of 2 (expanded), and a numerical aperture NA on the object side of 0.054. The size of the Pezfal sum set by the above-mentioned optical elements L21 to L23, aperture stop AS, optical elements L24, L25, beam splitter BS, concave mirror L26, and optical elements L27 to L30 is -0.00200 (-1 / 500).

Therefore, in this embodiment, a mask M having a pattern Pm formed on a part of the spherical surface forming a spherical surface is used, and a projection optical system PU having a negative Pezfal sum is used to prevent the complexity of the structure. And can project good optical performance from a part of the spherical surface Ma to a plane (the processed surface Fp of the sheet substrate FB).

Furthermore, according to this embodiment, since the optical element is shared between the illumination optical system IU and the projection optical system PU, the device can be miniaturized.

(Third Embodiment)

Next, a third embodiment of the exposure apparatus EX will be described with reference to FIGS. 9 to 11.

In the third embodiment, the configurations of the illumination optical system IU and the projection optical system PU are different from those of the first embodiment. Therefore, the illumination optical system IU and the projection optical system PU will be described below.

In these drawings, the same elements as those in the first embodiment shown in FIG. 1 to FIG. 5 are denoted by the same symbols, and descriptions thereof are omitted or simplified.

As shown in FIG. 9, the illumination optical system IU in this embodiment includes a convex mirror L34, optical elements L33, L32, a concave mirror L31, and a flat mirror M31 which are sequentially arranged along the optical path of the exposure light EL. The convex mirror L34, the optical elements L33, L32, the concave mirror L31, and the flat mirror M31 constitute a part of the projection optical system PU as described below.

The convex mirror L34 is semi-transmissive, and causes the exposure light EL incident from the surface opposite to the surface facing the optical element L33 to be emitted toward the optical element L33.

After the exposure light EL incident on the optical element L33 passes through the optical elements L33 and L32, it is reflected by the concave mirror 31 and the plane mirror M31, and travels toward the center axis J of the mask M, and illuminates the pattern Pm formed on a part of the spherical surface Ma of the mask M .

The projection optical system PU includes the above-mentioned plane mirror (part 1 optical system) M31, concave mirror L31, optical elements L32, L33, and convex mirror L34, which are sequentially arranged along the optical path of the exposure light EL, and also includes a concave mirror L35 and a plane reflection Mirror M32, aperture stop AS, optical element (second optical system) L36.

The concave mirrors L31 and L35 are arranged on the pupil surface of the projection optical system PU. The concave mirror L35 is arranged near the aperture stop AS.

After the exposure light EL reflected from the mask M (partial spherical Ma) is reflected by the plane mirror M31 and the concave mirror L31 as the projection optical system PU, it sequentially passes through the optical elements L32 and L33 and is reflected by the convex mirror L34.

After the exposure light EL reflected by the convex mirror L34 passes through the optical elements L33 and L32 in sequence, it is reflected by the concave mirror L35 and the plane mirror M32.

The exposure light EL reflected by the plane mirror M32 passes through the optical element L36, and the image of the pattern Pm of the mask M is projected on the sheet substrate FB.

Fig. 10 shows the values of the elements of the projection optical system PU in this embodiment.

In FIG. 10, at the left end, the surface numbers of the optical surfaces in which the exposure light EL enters or exits from the concave mirror L31, the optical elements L32, L33, the convex mirror L34, the concave mirror L35, the aperture stop AS, and the optical element L36 in sequence are shown at the left end.

In addition, r represents a curvature radius of each optical surface, and d represents a surface interval between the optical surfaces. In addition, a column of r indicates a paraxial curvature radius of each optical surface, and a column of d indicates an interval between the surfaces.

FIG. 11 shows aspherical data of each surface number formed as an aspheric surface.

In FIG. 11, K represents a conic coefficient, and A to F represent aspheric coefficients of 4th, 6th, 8th, ....

In addition, in FIG. 10 and FIG. 11, the sign of the paraxial curvature radius r is set to be positive when it protrudes toward the object surface side (pattern Pm surface side), and the surface interval d is set to the symbol before and after the optical surface. Reverser.

The projection optical system PU system has, for example, a wavelength (exposure wavelength) of 365 nm, a projection magnification of 1.25 times (expanded), and a numerical aperture NA on the object side of 0.055. With the above-mentioned concave mirror L31, optical elements L32, L33, convex mirror L34, and concave mirror L35 , The aperture stop AS, and the Pezfal sum set by the optical element L36 are -0.00175 (≒ -1 / 560).

Therefore, in this embodiment, a mask M having a pattern Pm formed on a part of the spherical surface forming a spherical surface is used, and a projection optical system PU having a negative Pezfal sum is used to prevent the complexity of the structure. And can project good optical performance from a part of the spherical surface Ma to a plane (the processed surface Fp of the sheet substrate FB).

(Fourth Embodiment)

Next, a fourth embodiment of the exposure apparatus EX will be described with reference to FIG. 12.

The exposure apparatus EX in the fourth embodiment has a configuration in which a mask unit in which a plurality of the above-mentioned masks M are arranged so that axes are parallel to each other is provided, and a projection optical system is provided corresponding to each mask.

In these drawings, the same components as those in the first embodiment shown in FIG. 1 to FIG. 5 are denoted by the same symbols, and descriptions thereof are omitted or simplified.

As shown in FIG. 12, the exposure apparatus EX in this embodiment includes a photomask unit MU provided with a plurality of (here, three) photomasks M1 to M3 each having the partial spherical surface Ma described above. The photomasks M1 to M3 are arranged at intervals in the Y direction.

The center axes J of the photomasks M1 to M3 extend in the Y-axis direction and are arranged in parallel with each other. In this embodiment, the masks M1 to M3 are provided with a common rotation axis MJ ', which extends in the Y-axis direction and has a common axis as an axis center together with a part of the spherical surface Ma, and can be rotated around the common axis. . The central axis J of each of the photomasks M1 to M3 is arranged so as to be coaxial with the common axis of the common rotation axis MJ ′.

The following projection optical systems PU1 to PU3 are provided, each of which has an image corresponding to each of the masks M1 to M3 and projects the images of the patterns Pm1 to Pm3 of each of the masks M1 to M3 on the sheet substrate FB. The projection optical system PU has the same configuration, and has a negative Pezfal sum of a magnitude corresponding to the curvature radius of a part of the spherical surface Ma of each of the masks M1 to M3.

The projection areas PA1 to PU3 of the projection optical systems PU1 to PU3 that are respectively projected on the sheet substrate FB according to the projection magnification are arranged adjacent to each other in the Y direction. In addition, the so-called adjacent arrangement includes not only a configuration in which the edges of adjacent projection areas are in contact with each other, but also a concept in which the edges of adjacent projection areas overlap each other.

In the exposure device EX configured as described above, part of the spherical surface Ma of the masks M1 to M3 rotates integrally in accordance with the rotation of the common rotation axis MJ ', and the images of the patterns Pm1 to Pm3 of the masks M1 to M3 illuminated by the exposure light EL pass through The projection optical systems PU1 to PU3 are respectively projected onto the projection areas PA1 to PA3.

At this time, when, for example, the patterns Pm1 to Pm3 formed on the photomasks M1 to M3 are the same, a plurality of the same patterns are formed on the sheet substrate FB, so that a plurality of patterns can be manufactured.

On the other hand, in the case where the patterns Pm1 to Pm3 formed on the photomasks M1 to M3 are synthesized to form a single pattern, a large-scale and large-area pattern can be formed on the sheet substrate FB.

Furthermore, in the mask unit MU in the above embodiment, the three masks M1 to M3 are coaxially arranged by using the common shaft portion MJ ′, and the projection optical systems PU1 to PU3 are also arranged in the Y direction. .

On the other hand, when it is difficult to arrange the three projection optical systems PU1 to PU3 along the common axis due to space constraints, for example, the mask M2 and the projection optical system PU2 may be made relative to the masks M1, M3, and projection. The optical systems PU1 and PU3 are arranged in a so-called zigzag configuration spaced apart in the X direction.

In addition, the number of the masks M1 to M3 and the number of the projection optical system PU included in the mask unit MU shown in the above-mentioned embodiment are examples, and it may be a configuration with two masks or four or more lights. The structure of the hood.

In this case, for example, when it is difficult to arrange a plurality of projection optical systems along a common axis due to space constraints, regarding a mask and a projection optical system adjacent to a direction (Y direction) orthogonal to the conveying direction, It is also possible to have a configuration having a zigzag arrangement spaced from the conveyance direction (X direction).

The preferred embodiment of the present invention has been described above with reference to the accompanying drawings, but the present invention is not limited to this example. Each shape or combination of the constituent members illustrated in the above examples is an example, and various changes can be made based on design requirements and the like without departing from the spirit of the present invention.

The exposure apparatus of the above-mentioned embodiment is manufactured by assembling various subsystems including each constituent element listed in the scope of the patent application for the present application in such a manner as to maintain specific mechanical accuracy, electrical accuracy, and optical accuracy.

In order to ensure these various precisions, before and after the assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are used to achieve electrical accuracy. Adjustment.

The assembly steps from various subsystems to the exposure device include the mechanical connections of various subsystems, wiring connections of electrical circuits, and piping connections of pneumatic circuits. Before the assembling steps from the various subsystems to the exposure device, there are respective assembling steps of each subsystem.

After the assembly steps of the various subsystems to the exposure device are completed, comprehensive adjustment is performed to ensure various accuracy as a whole of the exposure device. Furthermore, the manufacturing of the exposure device can be performed in a clean room in which temperature and cleanliness are managed.

Microelements such as semiconductor elements are manufactured as shown in FIG. 13 through the following steps: step 201, designing the function and performance of the microelement; step 202, making a reticle based on the design step; step 203, producing as the element Substrate (long sheet-shaped flexible substrate); substrate processing step 204 including substrate processing (exposure processing), the substrate processing (exposure processing) includes using a pattern of a photomask to expose according to the above embodiment; The substrate is exposed by light, and the exposed substrate (photosensitizer) is developed; the component assembling step (including the cutting process, the bonding step, the packaging step and other processing processes) 205; and the inspection step 206 and the like.

Furthermore, step 204 includes the following: developing the photosensitizer to form an exposure pattern layer (developed photosensitizer layer) corresponding to the pattern of the photomask, and processing the substrate through the exposure pattern layer.

In addition, in recent years, as an ecological manufacturing process, an additive manufacturing process that does not require a photosensitizer is more desirable.

In this case, the substrate processing step 204 is constituted by a step of changing the state of showing a high liquid repellency from the irradiation of ultraviolet light to light-sensitive SAM ( Self-Assembled Monolayer agent is coated on the surface of the substrate; according to the above embodiment, the pattern Pm of the photomask M is used to expose the substrate coated with the photosensitive SAM agent with exposure light; This exposure selectively coats conductive ink or paste for wiring, or a solution of a semiconductor material for TFT on a portion of the substrate on which the lyophilic property is improved by a printing method or an inkjet method.

Furthermore, a material which exhibits reduction energy of plating, such as a portion irradiated by exposure light, is also known. When using such a material, a metal layer for wiring can be formed by directly immersing the exposed substrate in an electroless plating solution (containing ions such as palladium).

In addition, in the step 202 of making the mask in FIG. 13, the projection optical system PU described in the previous embodiments can be used to easily transfer the pattern of the planar mask as the mother board to the mask M. On a cylindrical body with a spherical outer peripheral surface. Here, an example in which a spherical cylindrical mask M is produced using the projection optical system PU of the exposure apparatus shown in FIG. 6 before using FIG. 14 will be described.

The projection optical system PU shown in FIG. 14 is the reverse of the relationship between the object plane and the image plane of the projection optical system PU shown in FIG. 6, and is arranged on the image plane side of the substrate FB as the object to be exposed in FIG. 6. As the planar mask RT as the mother board, a cylindrical body M ′ having a spherical surface as the mask M is disposed on the object surface side where the mask M is located in FIG. 6.

A photoresist is uniformly applied to the spherical outer peripheral surface of the cylindrical body M ′, and exposure is performed by a pattern Pm ′ projected from the planar mask RT through the projection optical system PU. In this embodiment, the optimal focusing surface (pattern image plane) of the pattern Pm ′ is a curve along the spherical outer periphery of the cylindrical body M ′ in each of the two directions of the Y axis and the Z axis in FIG. 14.

In FIG. 14, the stage RST that moves one-dimensionally at least in the X direction supports the mask RT such that the pattern surface Mp of the mask RT is parallel to the XY plane. An illumination optical system ILU is provided above the photomask RT. The illumination optical system ILU radiates a slit-shaped (or rectangular) illumination light IB extending in the Y-axis direction toward the pattern surface Mp.

As described above, in this embodiment, a spherical cylindrical mask M can be produced from a planar mask RT by using the projection optical system PU described in FIG. 6 as it is or using it with a slight modification.

FIG. 14 illustrates an example in which the projection optical system PU shown in FIG. 6 is used. A spherical cylindrical mask M can be similarly manufactured from a flat mask RT using other projection optical systems PU shown in FIGS. 2 and 9. .

Claims (10)

An exposure device that exposes a pattern formed on the outer peripheral surface of a rotating photomask that rotates around a predetermined axis and exposes it to a substrate that moves at a predetermined speed in the longitudinal direction. The exposure device includes a support device that uses a plurality of the aforementioned rotating photomasks. In a manner in which the aforementioned axes are coaxial with the common axis and arranged at predetermined intervals in the direction of the aforementioned axis, the shaft portion provided in the aforementioned rotating reticle is rotatably supported; a plurality of projection optical systems are rotated with the aforementioned plurality of rotations Each of the photomasks is separately arranged correspondingly in the direction of the aforementioned axis, and the images of the respective patterns of the plurality of rotating photomasks are projected on the substrate; and a plurality of illumination optical systems are provided correspondingly to the respective projection optical systems. , The outer peripheral surface of the rotating mask is illuminated with illumination light; each of the outer peripheral surfaces of the plurality of rotating masks constitutes a part of a spherical surface with a center point set on the axis, and is formed to be formed in a band shape around the axis A part of the sphere having the aforementioned pattern, and each of the aforementioned plurality of projection optical systems has Outside circumferential surface of the rotating mask portion corresponding to a radius of curvature of the spherical surface of the magnitudes of the negative and Peizifaer. For example, the exposure device of the first scope of the application for a patent, wherein each of the plurality of projection optical systems is to project the image of the pattern of the rotary reticle onto the substrate at any magnification or equal magnification. For example, the exposure device according to item 2 of the patent application, wherein the plurality of projection optical systems each include a beam splitter for the illumination light from the illumination optical system to be incident on the outer peripheral surface of the rotating mask, And the exposure light of the said pattern from the said rotating reticle is irradiated to the said substrate. For example, the exposure device according to the second or third aspect of the patent application, wherein the plurality of projection optical systems each include at least one concave mirror, and each of the plurality of illumination optical systems transmits the illumination light to the rotation through at least a part of the concave mirror. The outer surface of the mask. For example, the exposure device according to item 4 of the patent application, wherein the plurality of projection optical systems each include an optical element formed by making an aspherical surface through which the exposure light of the pattern from the rotary mask passes. An exposure device is a pattern formed by a material that reflects the illumination light on the outer peripheral surface of a rotating mask that rotates around a predetermined axis, and is exposed on a flexible sheet substrate that moves at a predetermined speed in the long side direction. The device includes: The supporting device is coaxially arranged with the aforementioned axis in a manner that a plurality of the aforementioned rotary masks are arranged at predetermined intervals in a direction of the aforementioned axes in a state where the aforementioned axes are coaxial with the common axis or in a state where they are parallel to each other. The shaft portion is rotatably supported; a plurality of projection optical systems are arranged separately from each other in the direction of the axis corresponding to each of the plurality of rotating photomasks, and are used for exposure for reflecting the aforementioned patterns in the plurality of rotating photomasks. Light is incident and the image of the pattern is projected onto the sheet substrate; and a plurality of illumination optical systems are provided corresponding to each of the plurality of projection optical systems, and pass through a plurality of optical elements or a plurality of reflections constituting the projection optical system. At least a part of the mirror illuminates the outer peripheral surface of the rotating reticle with the illumination light; Each of the outer peripheral surfaces of the reticle forms a part of a spherical surface with a center point set on the axis, and is formed as a part of a spherical surface formed in a band shape around the axis and provided with the pattern. Each of the plurality of projection optical systems, A negative Pezfal sum having a magnitude corresponding to the radius of curvature of the aforementioned partial spherical surface formed on the outer peripheral surface of the aforementioned rotating reticle. For example, the exposure device of the sixth scope of the application for a patent, wherein each of the plurality of projection optical systems is to project the image of the pattern of the rotary reticle onto the sheet substrate at any magnification or equal magnification. . For example, the exposure device of the seventh scope of the patent application, wherein the plurality of projection optical systems each include at least one concave mirror, and each of the plurality of illumination optical systems transmits the illumination light to the rotating photomask through at least a part of the concave mirror. Outside perimeter. For example, the exposure device according to item 7 of the patent application, wherein the plurality of projection optical systems each include a beam splitter for the illumination light from the illumination optical system to be incident on the outer peripheral surface of the rotating mask, The exposure light reflected on the pattern of the rotating photomask is directed toward the sheet substrate. For example, the exposure device according to any one of claims 6 to 9, wherein the plurality of projection optical systems each include an aspheric surface formed by passing a surface through which the exposure light from the pattern from the rotating mask passes. Optical components.