KR101475305B1 - Lithographic apparatus and device manufacturing method - Google Patents

Abstract

There is provided a lithographic apparatus including an optical column for projecting a beam onto a target portion of a substrate, the optical column including a projection system configured to project the beam onto the target portion. The lithographic apparatus may further include an actuator for moving the optical column or at least a portion thereof relative to the substrate and an actuator for moving a moving portion of the optical column and a target portion of the substrate and / Wherein the window is configured and arranged in the lithographic apparatus to reduce or minimize movement of the window.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a lithographic apparatus,

The present invention relates to a lithographic apparatus, a programmable patterning device, and a device manufacturing method.

A lithographic apparatus is a device that imparts a desired pattern onto a substrate or a portion of a substrate. Lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs), flat panel displays and other devices or structures having microstructures. In existing lithographic apparatus, a patterning device, which may be referred to as a mask or a reticle, may be used to generate a circuit pattern corresponding to an individual layer of an IC, flat panel display or other device. Such a pattern may be transferred onto (some of) a substrate (e.g., a silicon wafer or a glass plate) through imaging onto a layer of radiation sensitive material (resist) provided on the substrate, for example.

Instead of a circuit pattern, such a patterning device may be used to create another pattern, for example a color filter pattern, or a dot matrix. Instead of a conventional mask, the patterning device may include a patterning array that includes an array of individually controllable elements that produce a circuit or other applicable pattern. The advantage of this "maskless" system over conventional mask based systems is that the pattern can be provided and / or changed more quickly at less cost.

Thus, the maskless system includes a programmable patterning device (e.g., a spatial light modulator, a contrast device, etc.). Such a programmable patterning device is programmed (e.g., electronically or optically programmed) to form a desired patterned beam using an array of individually controllable elements. Types of programmable patterning devices include micro-mirror arrays, liquid crystal display (LCD) arrays, grating light valve arrays, and the like.

It would be desirable to provide a lithographic apparatus that is flexible and low cost, including, for example, a programmable patterning device.

In one embodiment, a lithographic apparatus is disclosed, which includes a modulator configured to expose an exposed region of a substrate to a plurality of beams modulated according to a desired pattern, and a projection system configured to project the modulated beam onto the substrate . The modulator may be movable relative to the exposure area, and / or the projection system may have an array of lenses for receiving a plurality of beams and such an array of lenses may be movable relative to the exposure area.

In one embodiment, the lithographic apparatus may include an optical column, for example, that can generate a pattern on a target portion of a substrate. The optical column may include a self-emitting contrast device configured to emit a beam, and a projection system configured to project at least a portion of the beam onto the target portion. Such an apparatus may include an actuator for moving the optical column or a portion thereof relative to the substrate. A window is provided between a moving part of the optical column and a target portion of the substrate and / or a window is provided between the moving part of the optical column and a non-moving part of the optical column .

The window between the movable optical column or a portion thereof and the window between the target portion and / or the movable portion of the optical column and the fixed portion of the optical column can move. This movement of the window may cause movement of the beam to be projected onto the target portion, which is detrimental to projecting the beam onto the target portion of the substrate.

According to an embodiment of the present invention, there is provided a lithographic apparatus comprising:

An optical column for projecting a beam onto a target portion of a substrate, comprising: an optical column comprising a projection system configured to project the beam onto the target portion;

An actuator for moving the optical column or at least a portion thereof relative to the substrate; And

A window between the moving part of the optical column and the target part of the substrate and / or between the moving part of the optical column and the fixed part of the optical column

Lt; / RTI >

Wherein the window is constructed and arranged in the lithographic apparatus to reduce or minimize movement of the window.

According to an embodiment of the present invention, there is provided a device manufacturing method comprising projecting a patterned beam of radiation onto a substrate,

Projecting a beam onto a substrate using a projection system of an optical column to generate a pattern on a target portion of the substrate using the optical column;

Causing the beam to pass through a window; And

Moving the optical column or at least a portion thereof relative to the substrate while reducing or minimizing movement of the window

A device manufacturing method is provided.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention and to enable a person skilled in the art to make and use the invention . In the drawings, like reference numbers may indicate identical or functionally similar elements.
1 is a schematic side view of a lithographic apparatus according to an embodiment of the present invention.
2 is a schematic plan view of a lithographic apparatus according to an embodiment of the present invention.
3 is a schematic plan view of a lithographic apparatus according to an embodiment of the present invention.
4 is a schematic plan view of a lithographic apparatus according to an embodiment of the present invention.
Figure 5 is a schematic plan view of a lithographic apparatus according to an embodiment of the invention.
6A-6D are schematic plan and side views of a portion of a lithographic apparatus according to an embodiment of the invention.
7A-7O are schematic plan and side views of a portion of a lithographic apparatus according to an embodiment of the invention.
Figure 7P illustrates a graph of power / forward current of individually addressable elements in accordance with an embodiment of the present invention.
Figure 8 is a schematic side view of a lithographic apparatus according to an embodiment of the invention.
9 is a schematic side view of a lithographic apparatus according to an embodiment of the invention.
10 is a schematic side view of a lithographic apparatus according to an embodiment of the present invention.
Figure 11 is a schematic plan view of an array of individually controllable elements for a lithographic apparatus according to an embodiment of the present invention.
12 shows a mode of transferring a pattern onto a substrate using an embodiment of the present invention.
Figure 13 shows a schematic arrangement of the optical engine.
14A and 14B are schematic side views of a portion of a lithographic apparatus according to an embodiment of the present invention.
15 is a schematic plan view of a lithographic apparatus according to an embodiment of the present invention.
16A is a schematic side view of a portion of a lithographic apparatus according to an embodiment of the present invention.
16B shows a schematic position of the detection area of the sensor with respect to the substrate.
17 is a schematic plan view of a lithographic apparatus according to an embodiment of the present invention.
18 is a schematic side cross-sectional view of a lithographic apparatus according to an embodiment of the present invention.
Figure 19 is a schematic plan layout of a portion of a lithographic apparatus having an individually controllable element and a movable optical element relative thereto that are substantially fixed in an XY plane, in accordance with an embodiment of the present invention.
Figure 20 is a schematic three-dimensional view of a portion of the lithographic apparatus of Figure 19;
Figure 21 is a schematic side view layout of a portion of a lithographic apparatus having an individually controllable element and an optical element moveable therewith substantially fixed in the XY plane, according to one embodiment of the present invention, Lt; RTI ID = 0.0 > 242 < / RTI >
Figure 22 is a schematic side view layout of a portion of a lithographic apparatus having an individually controllable element and an optical element moveable therewith substantially fixed in the XY plane, according to one embodiment of the present invention, Lt; RTI ID = 0.0 > 242 < / RTI >
Figure 23 is a schematic side view layout of a portion of a lithographic apparatus having an individually controllable element and an optical element movable relative thereto that is substantially fixed in the XY plane, according to one embodiment of the present invention, Lt; RTI ID = 0.0 > 242 < / RTI >
Figure 24 shows a schematic layout of some of the individually controllable elements 102 when a standard laser diode having a diameter of 5.6 mm is used to obtain full coverage over the width of the substrate.
Figure 25 shows a schematic layout for the details of Figure 24;
Figure 26 is a schematic side view layout of some of the lithographic apparatus having individually controllable elements and movable optical elements that are substantially fixed in the XY plane, in accordance with one embodiment of the present invention.
Figure 27 is a schematic side view layout of some of the lithographic apparatus having individually controllable elements and moving optical elements that are substantially fixed in the XY plane, in accordance with one embodiment of the present invention.
Figure 28 is a schematic side view layout of a portion of a lithographic apparatus having an individually controllable element and a movable optical element relative thereto that are substantially fixed in the XY plane, according to one embodiment of the present invention, Lt; RTI ID = 0.0 > 242 < / RTI >
29 is a schematic three-dimensional view of a portion of the lithographic apparatus of FIG.
Figure 30 schematically shows a configuration in which eight lines are simultaneously recorded by one movable optical element 242 set of Figures 28 and 29;
Fig. 31 shows a schematic configuration for controlling focus using a mobile roof rooftop in the configuration of Figs. 28 and 29; Fig.
32 is a schematic side cross-sectional view of a lithographic apparatus according to an embodiment of the present invention, having an individually controllable element and an optical element moveable therewith substantially fixed in the XY plane, in accordance with an embodiment of the present invention. to be.
33 shows a part of the lithographic apparatus.
34 is a plan view of the lithographic apparatus of FIG. 33;
Figure 35 schematically depicts a lithographic apparatus.
Figure 36 schematically depicts a lithographic apparatus.
Figure 37 schematically depicts a lithographic apparatus.
Figures 38A-C schematically illustrate a lithographic apparatus.
Figure 39 schematically depicts a lithographic apparatus according to an embodiment of the present invention.

One or more embodiments of a maskless lithographic apparatus, a maskless lithographic method, a programmable patterning device, and other apparatus, articles, and methods are described herein. In one embodiment, a low cost and / or flexible maskless lithographic apparatus is provided. Since it is a maskless type, no conventional mask is needed to expose, for example, an IC or flat panel display. Likewise, no more than one ring is required for a packaging application; The programmable patterning device may provide a digital edge processing "ring" for the packaging application to avoid edge projection. The maskless type (digital patterning) can be used with a flexible substrate.

In one embodiment, the lithographic apparatus is capable of super-non-critical applications. In one embodiment, the lithographic apparatus is capable of a resolution of 0.1 탆 or more, for example, a resolution of 0.5 탆 or more, or a resolution of 1 탆 or more. In one embodiment, the lithographic apparatus is capable of a resolution of 20 microns or less, for example, a resolution of 10 microns or less, or a resolution of 5 microns or less. In one embodiment, the lithographic apparatus is capable of 0.1 to 10 μm resolution. In one embodiment, the lithographic apparatus is capable of an overlay of 50 nm or more, for example, an overlay of 100 nm or more, an overlay of 200 nm or more, or an overlay of 300 nm or more. In one embodiment, the lithographic apparatus is capable of an overlay of 500 nm or less, for example, an overlay of 400 nm or less, an overlay of 300 nm or less, or an overlay of 200 nm or less. Such overlay and resolution values may be independent of substrate size and material.

In one embodiment, the lithographic apparatus is highly flexible. In one embodiment, the lithographic apparatus are scalable for substrates having different sizes, types, and characteristics. In one embodiment, the lithographic apparatus has a substantially unlimited field size. Thus, a lithographic apparatus may enable a number of applications (e.g., IC, flat panel display, packaging, etc.) using a single lithographic apparatus or a plurality of lithographic apparatuses using a generally common lithographic apparatus platform. In one embodiment, the lithographic apparatus permits automated job creation for flexible manufacturing. In one embodiment, the lithographic apparatus provides 3D integration.

In one embodiment, the lithographic apparatus is low cost. In one embodiment, only conventional off-the-shelf components are used (e.g., a radiation emitting diode, a simple movable substrate holder, and a lens array). In one embodiment, pixel-grid imaging is used to enable simple projection optics. In one embodiment, a substrate holder having a single scan direction is used to reduce cost and / or complexity.

Figure 1 schematically depicts a lithographic projection apparatus 100 according to one embodiment of the present invention. The apparatus 100 includes a patterning device 104, an object holder 106 (e.g., an object table, e.g., a substrate table), and a projection system 108.

In one embodiment, the patterning device 104 includes a plurality of individually controllable elements 102 that modulate radiation to add a pattern to the beam 110. In one embodiment, the position of the plurality of individually controllable elements 102 may be fixed relative to the projection system 108. However, in an alternative configuration, the plurality of individually controllable elements 102 may be configured to accurately position one or more of the plurality of individually controllable elements (e.g., relative to the projection system 108) (Not shown).

In one embodiment, the patterning device 104 is a self-emitting contrast device. This patterning device 104 precludes the need for a radiation system, which can, for example, reduce the cost and size of the lithographic apparatus. For example, each individually controllable element 102 may be a radiation emitting diode, such as a light emitting diode (LED), an organic LED (OLED), a polymer LED (PLED), or a laser diode to be. In one embodiment, each individually controllable element 102 is a laser diode. In one embodiment, each individually controllable element 102 is a blue violet laser diode (e.g., Sanyo model number DL-3146-151). Such diodes can be supplied by companies such as Sanyo, Nichia, Osram, and Nitride. In one embodiment, the diode emits radiation having a wavelength of about 365 nm or about 405 nm. In one embodiment, the diode may provide a selected output power in the 0.5 to 100 mW range. In one embodiment, the size of the laser diode (the size of the naked die) is selected in the range of 250 to 600 micrometers. In one embodiment, the laser diode has a selected emission area in the range of 1 to 5 square micrometers. In one embodiment, the laser diode has a selected divergence angle in the range of 7 to 44 degrees. In one embodiment, the patterning device 104 is configured to provide a brightness of about 1 (e.g., about 1 x 10 < ⁸ > W / × 10 ⁵ diodes.

In one embodiment, the self-emitting contrast device is required to allow an "extra" individually controllable element 102 to be utilized, in the event that another individually controllable element 102 fails or does not operate properly ≪ / RTI > and more individually addressable elements 102 than do < RTI ID = 0.0 > In one embodiment, redundant individually controllable elements can be advantageously utilized in embodiments that utilize moveable, individually controllable elements 102, for example, as discussed below in connection with FIG.

In one embodiment, the individually controllable element 102 of the self-emitting contrast device operates in a sloped portion of the power / forward current curve of the individually controllable element 102 (e.g., a laser diode). This may be more efficient and may result in less power dissipation / heat. In one embodiment, in use, the light output per individually controllable element is at least 1 mW, such as at least 10 mW, at least 25 mW, at least 50 mW, at least 100 mW, or at least 200 mW. In one embodiment, in use, the light output per individually controllable element is less than 300 mW, less than 250 mW, less than 200 mW, less than 150 mW, less than 100 mW, less than 50 mW, less than 25 mW, or less than 10 mW. In one embodiment, in use, the power consumption per programmable patterning device to operate the individually controllable elements is less than 10 kW, for example less than 5 kW, less than 1 kW, or less than 0.5 kW. In one embodiment, in use, the power consumption per programmable patterning device to operate the individually controllable element is greater than or equal to 100W, such as greater than 300W, greater than 500W, or greater than 1kW.

The lithographic apparatus 100 includes an objective holder 106. In this embodiment, the object holder comprises an object table 106 for holding a substrate 114 (e.g., a resist-coated silicon wafer or glass substrate). The object table 106 is movable and can be connected to a positioning mechanism 116 for accurately positioning the substrate 114 according to certain parameters. For example, the positioning mechanism 116 can accurately position the substrate 114 with respect to the projection system 108 and / or the patterning device 104. In one embodiment, movement of the object table 106 is accomplished using a long-stroke module (not shown) and optionally a short-stroke module (E.g., fine positioning). In one embodiment, such a device does not have at least one short-stroke module for moving the object table 106. A similar system can be used to locate the individually controllable element 102. It will be appreciated that while the beam 110 may alternatively / additionally be movable, the object table 106 and / or the individually controllable element 102 may have a fixed position to provide the required relative movement Should be. This configuration can help limit the size of the device. For example, in one embodiment applicable to the manufacture of flat panel displays, the object table 106 can be fixed and the positioning mechanism 116 can be moved relative to the object table 106 (e.g., above the object table) (114). For example, the object table 106 may have a system for scanning the substrate 114 at a substantially constant rate. If this is done, the object table 106 can be provided with a plurality of openings on a flat top surface and gas can be supplied through these openings to provide a gas cushion that can support the substrate 114. This is commonly referred to as a gas bearing configuration. The substrate 114 is moved over the object table 106 using one or more actuators (not shown) that can accurately position the substrate 114 relative to the path of the beam 110. Alternatively, the substrate 114 can be moved relative to the object table 106 by selectively starting and stopping the passage of gas through the opening. In one embodiment, the object holder 106 may be a roll system in which the substrate rolls and the positioning mechanism 116 may be a motor for rotating such roll system to provide a substrate on the object table 106 .

To project the patterned beam modulated by the individually controllable element 102 onto a target portion 120 (e.g., one or more dies) of the substrate 114, a projection system 108 (e.g., For example, a quartz and / or CaF ₂ lens system or a refraction system including a lens element made of such material, or a mirror system) may be used. The projection system 108 may project an image of a pattern provided by a plurality of individually controllable elements 102 so that the pattern is coherently formed on the substrate 114. [ Alternatively, the projection system 108 may project an image of a secondary source, in which elements of the plurality of individually controllable elements 102 act as shutters.

In this regard, the projection system may include, for example, a focusing element, or a plurality of focusing elements (generally referred to herein as a lens array), for example to form a secondary source and to image a spot on a substrate 114, Array (also known as MLA) or a Fresnel lens array. In one embodiment, the lens array (e.g., MLA) includes at least 10 focusing elements, such as at least 100 focusing elements, at least 1,000 focusing elements, at least 10,000 focusing elements, at least 100,000 focusing elements, Includes 1,000,000 focusing elements. In one embodiment, the number of individually controllable elements in the patterning device is greater than or equal to the number of focusing elements in the lens array. In one embodiment, the lens array comprises one or more individually controllable elements in the array of individually controllable elements, for example, only one individually controllable element in the array of individually controllable elements, or an individually controllable element Such as three or more, five or more, ten or more, twenty or more, twenty-five or more, thirty-five or more, or more than 50 individually controllable elements A focusing element; In one embodiment, such a focusing element is optically associated with less than 5,000 individually controllable elements, for example less than 2,500, less than 1,000, less than 500, or less than 100 individually controllable elements. In one embodiment, the lens array includes two or more focusing elements (e.g., more than 1,000, most or nearly all) optically associated with one or more individually controllable elements in an array of individually controllable elements do.

In one embodiment, the lens array is movable at least toward and away from the substrate using, for example, one or more actuators. If the lens array can be moved toward and away from the substrate, for example, focus adjustment is possible without moving the substrate. In one embodiment, the individual lens elements of the lens array, e.g., each individual lens element of the lens array, are movable at least toward and away from the substrate (e.g., on a non-flat substrate) For local focus adjustment, or to have each optical column at the same focal distance).

In one embodiment, the lens array comprises a plastic focusing element (e.g., easy to manufacture and / or cost-effective by injection molding), wherein the wavelength of the radiation is, for example, For example, 405 nm). In one embodiment, the wavelength of the radiation is selected in the range of about 400 nm to 500 nm. In one embodiment, the lens array comprises a quartz focusing element. In one embodiment, each focusing element or plurality of focusing elements may be an asymmetric lens. This asymmetry may be the same for each of the plurality of focusing elements, or may differ from one or more of the plurality of focusing elements for one or more of the plurality of focusing elements. An asymmetric lens can facilitate converting an elliptical radiation output to a circularly projected spot or vice versa.

In one embodiment, the focusing element has a high numerical aperture (NA) configured to project radiation onto the substrate away from focus to obtain a low numerical aperture (NA) for the system. The higher NA of the lens may be more economical, more general, and / or better quality than an available lens with a lower NA. In one embodiment, the low NA is less than or equal to 0.3, and in other embodiments is less than or equal to 0.18 and less than or equal to 0.15. Thus, higher NA lenses have an NA greater than the designed NA for the system, e.g., greater than 0.3, greater than 0.18, or greater than 0.15.

In one embodiment, the projection system 108 is separate from the patterning device 104, but need not be. The projection system 108 may be integrated with the patterning device 104. For example, the lens array block or plate may be attached (integrated) to the patterning device 104. In one embodiment, the lens array may be in the form of a separate spatially separated lenslet, and each small lens may be attached to an individually addressable element of the patterning device 104 as described in more detail below Integration).

Alternatively, the lithographic apparatus may include a radiation system for supplying radiation (e.g., ultraviolet (UV) radiation) to a plurality of individually controllable elements 102. If the patterning device is itself a radiation source, such as a laser diode array or LED array, the lithographic apparatus may be designed without a radiation system, i. E. Without a radiation source other than the patterning device, or at least a simplified radiation system.

The radiation system includes an illumination system (illuminator) configured to receive radiation from a radiation source. The illumination system includes one or more of the following elements: a radiation delivery system (e.g., a suitable directing mirror), a radiation conditioner (e.g., a beam expander), an angular intensity distribution of the radiation (generally, the outer radius and / or the inner radius range of the intensity distribution in the pupil plane of the illuminator, typically referred to as outer-sigma and inner-sigma, respectively) are adjusted A collector, an integrator, and / or a condenser. The illumination system may be used to adjust the radiation to be provided to the individually controllable element 102 so as to have a desired uniformity and intensity distribution in the cross-section of the radiation. The illumination system may be configured to split the radiation into a plurality of sub-beams, each of which may be associated with, for example, one or more of a plurality of individually controllable elements. A two-dimensional diffraction grating may be used, for example, to split the radiation into sub-beams. As used herein, the terms "beam of radiation" and "radiation beam" encompass but are not limited to situations in which the beam is comprised of a plurality of such radiation sub-beams.

The radiation system also includes a radiation source (e.g., an excimer laser) that generates radiation for supply to a plurality of individually controllable elements 102 or for supply by a plurality of individually controllable elements 102 . For example, where the radiation source is an excimer laser, the radiation source and lithographic apparatus 100 may be separate components. In this case, the radiation source is not considered to form part of the lithographic apparatus 100, and radiation is transmitted from the radiation source to the illuminator. In other cases, for example, where the radiation source is a mercury lamp, such a radiation source may be a component integrated into the lithographic apparatus 100. It is to be understood that both of these cases are included within the scope of the present invention.

In one embodiment, the radiation source, which in one embodiment may be a plurality of individually controllable elements 102, may include, in one embodiment, at least 5 nm, such as at least 10 nm, at least 50 nm, at least 100 nm, at least 150 nm, a wavelength of at least 200 nm, at least 250 nm, at least 275 nm, at least 300 nm, at least 325 nm, at least 350 nm, or at least 360 nm. In one embodiment, the radiation has a wavelength of 450 nm or less, such as 425 nm or less, 375 nm or less, 360 nm or less, 325 nm or less, 275 nm or less, 250 nm or less, 225 nm or less, 200 nm or less, Respectively. In one embodiment, the radiation has a wavelength comprising 436 nm, 405 nm, 365 nm, 355 nm, 248 nm, 193 nm, 157 nm, 126 nm, and / or 13.5 nm. In one embodiment, the radiation comprises a wavelength of about 365 nm or about 355 nm. In one embodiment, the radiation comprises a broad band of wavelengths, including for example 365 nm, 405 nm and 436 nm. A 355 nm laser source may be used. In one embodiment, the radiation has a wavelength of about 405 nm.

In one embodiment, the radiation is guided from the illumination system to the patterning device 104 at an angle of 0 to 90 degrees, for example 5 to 85 degrees, 15 to 75 degrees, 25 to 65 degrees, or 35 to 55 degrees . The radiation from the illumination system may be provided directly to the patterning device 104. In an alternative embodiment, the radiation can be guided from the illumination system to the patterning device 104 using a beam splitter (not shown), where the radiation is initially reflected by the beam splitter, As shown in FIG. The patterning device 104 modulates the beam and reflects it back to the beam splitter, which transmits the modulated beam toward the substrate 114. However, it should be appreciated that alternative configurations may be used to guide the radiation to the patterning device 104 and subsequently the substrate 114. In particular, if the transmissive patterning device 104 (e.g., an LCD array) is used or the patterning device 104 is a self-emissive type (e.g., a plurality of diodes), then the fixture system configuration may not be required.

In operation of the lithographic apparatus 100, radiation may be emitted from a radiation system (e.g., an illumination system and / or a radiation source) to the patterning device 104 ) (E. G., A plurality of individually controllable elements) and modulated by the patterning device 104. The patterned beam 110 is generated by a plurality of individually controllable elements 102 and then passes through the projection system 108 and the projection system 108 directs the beam 110 onto the target portion 120 of the substrate 114. [ (Not shown).

Using a positioning mechanism 116 (and, optionally, a position sensor 134 (e.g., interferometric measuring device, linear encoder or capacitive sensor receiving interferometer beam 138) on base 136) The substrate 114 may be moved accurately to position a different target portion 120 in the path of the beam 110, for example. A positioning mechanism for a plurality of individually controllable elements 102 may be used to accurately correct the position of a plurality of individually controllable elements 102 relative to the path of the beam 110, for example during a scan .

Although the lithographic apparatus 100 according to an embodiment of the present invention is described as being for exposing a resist on a substrate, the lithographic apparatus 100 may be used to project the patterned beam 110 for use in resist- .

As shown therein, the lithographic apparatus 100 is of a reflective type (e.g. employing reflective, individually controllable elements). Alternatively, the lithographic apparatus may be of a transmissive type (e.g. employing a transmissive, individually controllable element).

The depicted apparatus 100 may be used, for example, in one or more of the following modes:

1. In step mode, the entire patterned radiation beam 110 is projected onto the target portion 120 at one time while keeping the individually controllable element 102 and the substrate 114 essentially stationary A single stop exposure). The substrate 114 is then moved in the X and / or Y directions so that a different target portion 120 may be exposed to the patterned beam of radiation 110. In step mode, the maximum size of the exposure field limits the size of the target portion 120 imaged in a single stop exposure.

2. In the scan mode, the patterned radiation beam 110 is projected onto the target portion 120 (i.e., a single dynamic exposure) while synchronously scanning the individually controllable element 102 and the substrate 114. [ . The velocity and direction of the substrate relative to the individually controllable elements can be determined by the magnification (reduction factor) and image reversal characteristics of the projection system PS. In scan mode, the maximum size of the exposure field limits the width (non-scanning direction) of the target portion in a single dynamic exposure while the length of the scanning movement limits the height of the target portion (the scanning direction).

3. In pulse mode, the individually controllable element 102 is kept essentially stationary and pulsed (e.g., provided by a pulsed radiation source or provided by pulsing individually controllable elements) The entire pattern is projected onto the target portion 120 of the substrate 114. The substrate 114 is moved at a substantially constant rate to cause the patterned beam 110 to scan the line across the substrate 114. [ The pattern provided by the individually controllable element is updated as necessary between the pulses and the pulses and the timing of the pulses is set such that successive target portions 120 at a desired location on the substrate 114 are exposed. As a result, the patterned beam 110 can be scanned across the substrate 114 to expose a complete pattern for the strip of substrate 114. This process is repeated until the entire substrate 114 is exposed line by line.

4. In the continuous scan mode, the substrate 114 is scanned at a substantially constant speed relative to the modulated radiation beam B and the patterned beam 110 is scanned across the substrate 114 and exposed It is basically the same as the pulse mode except that the pattern on the array of controllable elements is updated. A substantially constant radiation source or pulsed radiation source synchronized with the updating of the pattern on the array of individually controllable elements may be used.

Combinations and / or variations on the above described modes of use, or entirely different modes of use, may also be employed.

2 is a schematic plan view of a lithographic apparatus according to an embodiment of the present invention for use with a wafer (e.g., a 300 mm wafer). As shown in FIG. 2, the lithographic apparatus 100 includes a substrate table 106 for holding a wafer 114. A positioning mechanism 116 for moving the substrate table 106 at least in the X direction is associated with the substrate table 106. Alternatively, the positioning mechanism 116 may move the substrate table 106 in the Y and / or Z directions. The positioning mechanism 116 may also rotate the substrate table 106 about the X direction, the Y direction, and / or the Z direction. Accordingly, the positioning mechanism 116 can provide movement of less than six degrees of freedom. In one embodiment, the substrate table 106 provides movement only in the X direction, which has the advantage of reducing cost and making it less complex. In one embodiment, the substrate table 106 includes relay optics.

The lithographic apparatus 100 further includes a plurality of individually addressable elements 102 arranged on the frame 160. The frame 160 may be mechanically isolated from the substrate table 106 and the positioning mechanism 116. [ Mechanical isolation may be provided, for example, by connecting the frame 160 to a solid base or ground separate from the frame for the substrate table 106 and / or positioning mechanism 116. Additionally or alternatively, between the frame 160 and the structure to which the frame 160 is connected, such a structure may be used as a frame, a frame or the like supporting the ground, the rigid base or substrate table 106 and / Regardless of whether or not a damper is provided, a damper can be provided.

In this embodiment, each individually addressable element 102 is a radiation emitting diode, for example, a violet laser diode. As shown in FIG. 2, the individually addressable elements 102 may be arranged in at least three distinct arrays of individually addressable elements 102 extending along the Y direction. In one embodiment, the arrays of individually addressable elements 102 are staggered in the X direction from adjacent arrays of individually addressable elements 102. The lithographic apparatus 100, and specifically the individually addressable element 102, can be configured to provide pixel-grid imaging as described in more detail herein.

Each array of individually addressable elements 102 may be part of a separate optical engine component that may be manufactured as a unit for easy reproduction. Further, the frame 160 can be configured to be expandable and configurable to easily employ any number of such optical engine components. The optical engine component may include an array of individually addressable elements 102 and a combination of lens arrays 170 (see, e.g., FIG. 8). For example, in FIG. 2 there are shown three optical engine components (the associated lens array 170 being under each individual array of individually addressable elements 102). Thus, in one embodiment, multiple optical column configurations may be provided and each optical engine forms a column.

In addition, the lithographic apparatus 100 includes an alignment sensor 150. The alignment sensor is used to determine the alignment between the individually addressable element 102 and the substrate 114 prior to exposure of the substrate 114 and / or during exposure. The result of the alignment sensor 150 may be used by the controller of the lithographic apparatus 100 to control the positioning mechanism 116 to position the substrate table 106, for example, to improve alignment. Additionally or alternatively, the controller can position one or more of the individually addressable elements 102 to improve alignment, for example by controlling a positioning mechanism associated with the individually addressable element 102. [ In one embodiment, the alignment sensor 150 may include pattern recognition functionality / software for performing alignment.

Additionally or alternatively, the lithographic apparatus 100 includes a level sensor 150. The level sensor 150 is used to determine whether the substrate 114 is level with respect to the projection of the pattern from the individually addressable element 102. The level sensor 150 may determine the level prior to and / or during exposure of the substrate 114. The result of the level sensor 150 may be used by the controller of the lithographic apparatus 100 to control the positioning mechanism 116 to position the substrate table 106 for example to improve leveling have. Additionally or alternatively, the controller may control the positioning mechanism associated with, for example, the projection system 108 (e.g., a lens array) Lens array). In one embodiment, the level sensor may operate by projecting an ultrasonic beam onto substrate 114 and / or by projecting an electromagnetic radiation beam onto substrate 114.

In one embodiment, the results from the alignment sensor and / or the level sensor can be used to alter the pattern provided by the individually addressable element 102. [ The pattern may include, for example, distortion resulting from the optical instrument (if present) between the individually addressable element 102 and the substrate 114, unevenness in positioning the substrate 114, (unevenness), and the like. Thus, the results from the alignment sensor and / or the level sensor can be used to modify the projected pattern to effect nonlinear distortion correction. Nonlinear distortion correction may be useful, for example, for flexible displays that may not have consistent linear or nonlinear distortion.

In operation of the lithographic apparatus 100, the substrate 114 is loaded onto the substrate table 106 using, for example, a robot handler (not shown). Substrate 114 is then displaced in the X direction under frame 160 and individually addressable element 102. The substrate 114 is exposed to the pattern using the individually addressable element 102 after being measured by the level sensor and / or the alignment sensor 150. For example, while the substrate 114 is being scanned through the focal plane (image plane) of the projection system 108, the sub-beam and thus the image spot S (see, e.g., Figure 12) 104 at least partially or fully ON or OFF. A feature corresponding to the pattern of the patterning device 104 is formed on the substrate 114. The individually addressable element 102 may, for example, be operable to provide pixel-grid imaging as described herein.

In one embodiment, the substrate 114 may be fully scanned in the positive X direction and then completely in the negative X direction. In this embodiment, an additional level sensor and / or alignment sensor 150 on the opposite side of the individually addressable element 102 may be needed for negative X-directional scanning.

3 is a schematic plan view of a lithographic apparatus for exposing a substrate in the manufacture of, for example, a flat panel display (e.g., LCD, OLED display, etc.), in accordance with an embodiment of the present invention. 2, the lithographic apparatus 100 includes a substrate table 106 for holding a flat panel display substrate 114, a substrate table 106 for holding the substrate table 106 at a speed of 6 degrees or less, An alignment sensor 150 for determining the alignment between the individually addressable element 102 and the substrate 114 and an alignment sensor 150 for determining the alignment of the pattern 114 from the individually addressable element 102. [ And a level sensor 150 for determining whether it is horizontal with respect to the projection.

The lithographic apparatus 100 further includes a plurality of individually addressable elements 102 arranged on the frame 160. In this embodiment, each of the individually addressable elements 102 is a radiation emitting diode, for example a violet laser diode. 3, the individually addressable elements 102 are arranged in a plurality (e.g., eight or more) of fixedly discrete arrays of individually addressable elements 102 that extend along the Y direction . In one embodiment, the array is substantially fixed, i.e. it does not move significantly during projection. Also, in one embodiment, multiple arrays of individually addressable elements 102 are staggered alternating in the X direction from adjacent arrays of individually addressable elements 102. The lithographic apparatus 100, in particular the individually addressable element 102, can be configured to provide pixel-grid imaging.

In operation of the lithographic apparatus 100, the panel display substrate 114 is loaded onto the substrate table 106 using, for example, a robot handler (not shown). Substrate 114 is then displaced in the X direction under frame 160 and individually addressable element 102. The substrate 114 is exposed to the pattern using the individually addressable element 102 after being measured by the level sensor and / or the alignment sensor 150. The individually addressable element 102 may, for example, be operable to provide pixel-grid imaging as described herein.

Figure 4 is a schematic plan view of a lithographic apparatus for use with a roll-to-roll flexible display / electronic device, in accordance with an embodiment of the present invention. As with the lithographic apparatus 100 shown in FIG. 3, the lithographic apparatus 100 includes a plurality of individually addressable elements 102 arranged on a frame 160. In this embodiment, each of the individually addressable elements 102 is a radiation emitting diode, for example a violet laser diode. The lithographic apparatus also includes an alignment sensor 150 for determining the alignment between the individually addressable element 102 and the substrate 114 and an alignment sensor 150 for determining the alignment of the pattern from the individually addressable element 102 And a level sensor 150 for determining whether it is horizontal or not.

The lithographic apparatus may also include an object holder having an object table 106 on which the substrate 114 is moved. The substrate 114 is flexible and is rolled onto a roll that is connected to the positioning mechanism 116, and such positioning mechanism 116 may be a motor that rotates the roll. Additionally or alternatively, in one embodiment, the substrate 114 may be rolled from a roll that is coupled to a positioning mechanism 116, which may be a motor that rotates the roll. In one embodiment, at least two rolls are provided, from which the substrate is rolled and the substrate is rolled onto the other roll. In one embodiment, the object table 106 need not be provided if, for example, the substrate 114 is sufficiently stiff between rolls. In this case, the object holder, for example one or more rolls, may still be provided. In one embodiment, the lithographic apparatus can be used to provide substrate carrier-less (e.g., carrier-less-foil (CLF)) and / or roll-to-roll manufacturing . In one embodiment, the lithographic apparatus may provide for sheet-to-sheet manufacture.

In operation of the lithographic apparatus 100, the flexible substrate 114 is rolled in the X direction, rollwise and / or roll under the frame 160 and the individually addressable element 102. The substrate 114 is exposed to the pattern using the individually addressable element 102 after being measured by the level sensor and / or the alignment sensor 150. The individually addressable element 102 may, for example, be operable to provide pixel-grid imaging as described herein.

5 is a schematic plan view of a lithographic apparatus having a moveable individually addressable element 102, in accordance with an embodiment of the present invention. 2, the lithographic apparatus 100 includes a substrate table 106 for holding a substrate 114, a positioning system (not shown) for moving the substrate table 106 to a degree of freedom of 6 or less, An alignment sensor 150 for determining the alignment between the individually addressable element 102 and the substrate 114 and an alignment sensor 150 for determining the alignment of the pattern from the individually addressable element 102 And a level sensor 150 for determining whether it is horizontal or not.

The lithographic apparatus 100 further includes a plurality of individually addressable elements 102 arranged on the frame 160. In this embodiment, each of the individually addressable elements 102 is a radiation emitting diode, for example a laser diode, for example a violet laser diode. 5, the individually addressable elements 102 are arranged in a plurality of discrete arrays 200 of individually addressable elements 102 extending along the Y direction. Also, in one embodiment, multiple arrays 200 of individually addressable elements 102 are staggered alternating in the X direction from adjacent arrays of individually addressable elements 102. The lithographic apparatus 100, in particular the individually addressable element 102, can be configured to provide pixel-grid imaging. However, in one embodiment, the lithographic apparatus 100 need not provide pixel-grid imaging. Rather, the lithographic apparatus 100 may be configured to project the radiation of a diode onto a substrate in a manner that does not form individual pixels for projection onto the substrate but rather forms a substantially continuous image for projection onto the substrate .

In one embodiment, one or more of the plurality of individually addressable elements 102 may include an exposure area in which one or more individually addressable elements 102 are used to project all or a portion of the beam 110, One or more individually addressable elements 102 are movable between positions outside the exposure area that do not project the beam 110 at all. In one embodiment, the one or more individually addressable elements 102 are configured to turn on or at least partially turn on, i.e., emit radiation, in the exposure region 204 (region of light shade in Figure 5) And is turned off when it is located outside the exposure area 204, that is, does not emit radiation.

In one embodiment, the one or more individually addressable elements 102 are radiation emitting devices that can be turned on within the exposure region 204 and outside the exposure region 204. In this situation, the one or more individually addressable elements 102 may be configured to provide a compensating exposure if the radiation is not appropriately projected, e.g., by the one or more individually addressable elements 102, And may be turned on outside the exposure area 204. [ For example, referring to FIG. 5, one or more of the individually addressable elements 102 of the array on the opposite side of the exposure region 204 may be turned on to correct for missed or improper projection of the radiation in the exposure region 204 .

In one embodiment, the exposure area 204 is an elongated line. In one embodiment, the exposure region 204 is a one-dimensional array of one or more individually addressable elements 102. In one embodiment, the exposure region 204 is a two-dimensional array of one or more individually addressable elements 102. In one embodiment, the exposure area 204 is diagonal.

In one embodiment, each moveable individually addressable element 102 may be moved separately and need not be moved together as a unit.

In one embodiment, such one or more individually addressable elements are movable and, in use, move in a direction transverse to the propagation direction of the beam 110 at least during projection of the beam 110. For example, in one embodiment, the one or more individually addressable elements 102 are radiation-emitting devices that move in a direction substantially perpendicular to the propagation direction of the beam 110 during projection of the beam 110.

In one embodiment, each array 200 is a laterally displaceable plate having a plurality of spatially separated individually addressable elements 102 arranged along the plate as shown in FIG. In use, each plate translates along direction 208. In use, movement of the individually addressable element 102 is properly timed to be positioned in the exposure area 204 (shown as a dark shaded area in FIG. 6) to project all or a portion of the beam 110 . For example, in one embodiment, the one or more individually addressable elements 102 are radiation-emitting devices, and the turn-on or turn-off of the individually addressable elements 102 is controlled by one or more individually addressable elements 102 Are turned on when they are in the exposure area 204 and turned off when they are outside the exposure area 204. [ For example, in Figure 6 (a), a plurality of two-dimensional arrays of radiation-emitting diodes 200 translate in a direction 208-the two arrays are arranged in a positive direction 208, The middle array is in the negative direction 208. The turn-on or turn-off of the radiation-emitting diode 102 is turned on when the particular radiation-emitting diode 102 of each array 200 is in the exposure region 204 and is turned off when it is outside the exposure region 204 , Timing is set. Of course, the array 200 can move in the opposite direction, for example when the array 200 reaches the end of travel, that is, the two arrays can be moved in the negative direction 208, The intermediate array can move in the positive direction 208. [ 6B, a plurality of interleaved one-dimensional arrays of radiation emitting diodes 200 translate in a direction 208 - alternating in the positive direction 208 and the negative direction 208, So. The turn-on or turn-off of the radiation-emitting diode 102 is turned on when the particular radiation-emitting diode 102 of each array 200 is in the exposure region 204 and is turned off when it is outside the exposure region 204 , Timing is set. Of course, the array 200 can move in the opposite direction. As a further example, in FIG. 6 (c), a single array of radiation-emitting diodes 200 translates in a direction 208 (shown, but not necessarily, one-dimensional). The turn-on or turn-off of the radiation-emitting diode 102 is turned on when the particular radiation-emitting diode 102 of each array 200 is in the exposure region 204 and is turned off when it is outside the exposure region 204 , Timing is set.

In one embodiment, each array 200 is a rotatable plate having a plurality of spatially separated individually addressable elements 102 arranged about the plate. In use, each plate rotates about its axis 206 in the direction indicated by the arrow in Fig. 5, for example. In other words, the array 200 can alternately rotate clockwise and counterclockwise as shown in Fig. Alternatively, each array 200 may rotate clockwise or counterclockwise. In one embodiment, the array 200 rotates about its entire periphery. In one embodiment, the array 200 rotates by less than the entire circumference. In one embodiment, for example when the substrate is scanned in the Z direction, the array 200 may rotate about an axis extending in the X or Y direction. 6D, the individually addressable elements 102 of the array 200 can be arranged at the edges and projected radially outwardly toward the substrate 114. In one embodiment, The substrate 114 may extend around at least a portion of one side of the array 200. In this case, the array 200 rotates about an axis extending in the X direction and the substrate 114 moves in the X direction.

In use, the movement of the individually addressable element 102 may be suitably timed to be positioned in the exposure area 204 to project all or a portion of the beam 110. For example, in one embodiment, the one or more individually addressable elements 102 are radiation-emitting devices, and the turn-on or turn-off of the individually addressable elements 102 is controlled by one or more individually addressable elements 102 Are turned on when they are in the exposure area 204 and turned off when they are outside the exposure area 204. [ Therefore, in one embodiment, the radiation-emitting device 102 can all remain on during movement, and then a particular one of the radiation-emitting devices 102 is modulated into an off state in the exposure area 204. [ An appropriate shield between the substrate outside the exposure region 204 and the radiation emitting device 102 is required to shield the exposed region 204 from the turned on radiation emitting device 102 outside the exposed region 204 . By continuously putting the radiation-emitting device 102 in an on-state, it becomes easy to maintain the radiation-emitting device 102 at a substantially uniform temperature during use. In one embodiment, the radiation-emitting device 102 may be kept off for most of the time and may be turned on when one or more of the radiation-emitting devices 102 is in the exposure area 204.

In one embodiment, the rotatable plate may have a configuration as shown in Fig. For example, Figure 7 (a) shows a schematic plan view of a rotatable plate. This rotatable plate has a plurality of individually addressable elements 102 (as compared to the rotatable plate of FIG. 5, which schematically depicts a single array 200 of individually addressable elements 102 arranged about the plate) Subarrays 210 may have arrays 200 arranged around such plates. In FIG. 7 (a), the sub-array 210 is configured so that the individually addressable elements 102 of one sub-array 210 are between two individually addressable elements 102 of the other sub- Are shown staggered relative to one another. However, the individually addressable elements 102 of the sub-array 210 may be aligned with each other. In this example, the individually addressable elements 102 can be rotated individually or together by the motor 216 via the motor 216 about an axis in the Z direction in Fig. 7 (a). The motor 216 can be attached to a rotatable plate and connected to a frame, for example a frame 160, or to a frame, for example a frame 160, and to a rotatable plate. In one embodiment, the motor 216 (or any motor located elsewhere, for example) may cause different motions of the individually addressable element 102, either individually or together. For example, the motor 216 may cause one or more translational movements of the individually addressable elements 102 in the X, Y, and / or Z directions. Additionally or alternatively, the motor 216 may cause one or more rotations (i.e., R _x and / or R _y motion) of the individually addressable elements 102 about the X and / or Y direction .

In an embodiment of the rotatable plate shown schematically in plan view in Figure 7 (b), the rotatable plate may have an opening 212 in the central region, and the array 200 of individually addressable elements 102 Is arranged on the plate outside such opening (212). Thus, for example, the rotatable plate can form an annular disk as shown in FIG. 7 (b), and the array of individually addressable elements 102 is arranged around the disk. The openings may reduce the weight of the rotatable plate and / or facilitate cooling of the individually addressable element 102.

In one embodiment, the rotatable plate can be supported at the outer periphery using a support 214. The support 214 may be a bearing, for example a roller bearing or a gas bearing. (And / or other motions, e.g., translational motion in the X, Y, and / or Z directions and / or R _x motions and / or motions), as shown in Figure 7 (a) Or R _y motion) may be provided. Additionally or alternatively, the support 214 may be configured to cause the individually addressable element 102 to rotate about axis A (and / or other motions, e.g., X, Y, and / or Z Direction and / or R _x motion and / or R _y motion).

Referring to Figures 7 (d) and 7 (e), in one embodiment, a rotatable plate having an array 200 of individually addressable elements 102 may be attached to the rotatable structure 218. The rotatable structure 218 can be rotated by the motor 220 about the axis B. [ The rotatable plate can also be rotated by the motor 216 relative to the rotatable structure 218 and the motor 216 causes the rotatable plate to rotate about the axis A. [ In one embodiment, the rotational axes A and B do not coincide with one another and thus these axes are spatially separated as shown in Figs. 7 (d) and 7 (e). In one embodiment, the rotational axes A and B are substantially parallel to each other. During use during exposure, both the rotatable structure 218 and the rotatable plate rotate. This rotation can be adjusted so that the individually addressable elements 102 in the exposure area 204 can be aligned substantially in a straight line. This can be compared, for example, to the embodiment of FIG. 5 in which the individually addressable elements 102 in the exposure area 204 may not be aligned in a substantially straight line.

As described above, the use of moveable individually addressable elements can reduce the number of individually addressable elements by moving individually addressable elements into the exposure area 204, if desired. Thus, the heat load can be reduced.

In one embodiment, more movable individually addressable elements may be provided (e.g., on a rotatable plate) than are theoretically necessary. A possible advantage of such a configuration is that, in the event that one or more moveable individually addressable elements are not corrupted or otherwise in operation, the other one or more moveable individually addressable elements can be used instead. Additionally or alternatively, the redundantly moveable individually addressable elements may have the advantage of being able to control the heat load on the individually addressable elements, as more movable individually addressable elements are provided Since it is more likely that the movable individually addressable elements outside the exposure area 204 can be cooled.

In one embodiment, the moveable individually addressable elements 102 are embedded in a material having a low thermal conductivity. For example, such materials may be ceramics, such as cordierite or cordierite ceramics and / or Zerodur ceramics. In one embodiment, the moveable individually addressable element 102 is embedded in a material having a high thermal conductivity, such as a metal, e.g., a metal having a relatively light mass, such as aluminum or titanium.

In one embodiment, the array 200 may include a temperature control configuration. For example, referring to FIG. 7 (f), the array 200 may include a plurality of arrays 200 on the array 200 for cooling the arrays, a fluid for transporting cooling fluid around the arrays 200, (E.g., liquid) conduction channel 222. The channel 222 may be connected to a suitable heat exchanger and pump 228 for circulating fluid through this channel. A supply portion 224 and a return portion 226 may be connected between the channel 222 and the heat exchanger and the pump 228 to facilitate fluid circulation and temperature control. A sensor 234 may be provided within the array to measure the parameters of the array 200 on or around the array, and such measurements may be performed, for example, by controlling the temperature of the fluid flow provided by the heat exchanger and the pump Can be used. In one embodiment, the sensor 234 can measure the rate of expansion and / or shrinkage of the array 200 body and such measurements can be used to control the temperature of the fluid flow provided by the heat exchanger and pump. This rate of expansion and / or shrinkage is a proxy for temperature. In one embodiment, the sensor 234 may be integrated with the array 200 (as shown by the dotted sensor 234), and / or may be separate from the array 200 As indicated by sensor 234 of FIG. The sensor 234, which is separate from the array 200, may be an optical sensor.

In one embodiment, referring to Figure 7 (g), the array 200 may have one or more fins 230 to increase the surface area for heat dissipation. The pin (s) 230 may be, for example, on the top surface of the array 200 and / or on the side of the array 200. Optionally, one or more additional pins 232 may be provided to cooperate with pin (s) 230 to facilitate heat dissipation. For example, the pin (s) 232 may absorb heat from the pin (s) 230 and may be fluid (e.g., liquid) conduction channels similar to those shown and described with respect to Figure 7 (f) And an associated heat exchanger / pump.

7H, the array 200 includes a fluid confinement structure 236 configured to maintain fluid 238 in contact with the array 200 body to facilitate heat dissipation through the fluid. In one embodiment, ) Or around the fluid confinement structure 236. [0050] In one embodiment, fluid 238 may be a liquid, such as water. In one embodiment, the fluid confinement structure 236 provides a seal between the fluid confinement structure 236 and the array 200 body. In one embodiment, such sealing may be, for example, a contactless seal provided through a gas flow or capillary force. In one embodiment, the fluid 238 is circulated to promote heat dissipation, as described for the fluid conduction channel 222. Fluid 238 may be supplied by fluid supply device 240.

7 (h), the array 200 may be disposed in or adjacent to the fluid supply device 240 configured to project fluid 238 toward the array 200 body. In one embodiment, Thereby facilitating heat dissipation through the fluid. In one embodiment, the fluid 238 is a gas, such as clean dry air, N ₂ , an inert gas, or the like. The fluid confinement structure 236 and the fluid supply device 240 are shown together in Figure 7 (h), but need not necessarily be provided together.

In one embodiment, the array 200 body is a substantially solid structure having cavities for fluid conduction channel 222, for example. In one embodiment, the array 200 body is a substantially frame-like structure that is largely open, to which various components, such as individually addressable elements 102, fluid conduction channels 222, etc., are attached . This open structure facilitates gas flow, and / or increases surface area. In one embodiment, the array 200 body is a substantially solid structure having a plurality of cavities into or through the body to facilitate gas flow and / or increase surface area.

While embodiments to provide cooling have been described heretofore, alternatively or additionally embodiments may provide heating.

In one embodiment, the array 200 is preferably maintained at a substantially constant steady state temperature during exposure use. Thus, for example, all or most of the individually addressable elements 102 of the array 200 can be powered on to reach a desired steady state temperature or near this temperature, prior to exposure, and the array 200 ) May be cooled and / or heated to maintain a steady state temperature. In one embodiment, any one or more temperature control configurations may be used to heat the array 200 prior to exposure to reach the desired steady state temperature or near this temperature. Any one or more temperature control configurations may then be used to allow the array 200 to cool and / or heat to a steady state temperature during exposure. Measurements from sensor 234 may be used in a feedforward and / or feedback manner to maintain steady state temperatures. In one embodiment, each of the plurality of arrays 200 may have the same steady state temperature, or at least one of the arrays 200 of the plurality of arrays 200 may be the array 200 of the plurality of arrays 200. [ Lt; RTI ID = 0.0 > temperature. ≪ / RTI > In one embodiment, the array 200 is heated to a temperature greater than the desired steady-state temperature, and then cooled individually to maintain a temperature higher than the desired steady-state temperature and / or due to cooling applied by any one or more temperature- Since the use of the addressable element 102 is insufficient, the temperature falls during exposure.

In one embodiment, to improve thermal control and overall cooling, the number of arrays 200 bodies is increased along the exposure areas and / or over the exposure areas. Thus, for example, five, six, seven, eight, nine, ten or more arrays 200 may be provided instead of the four arrays 200 shown in FIG. A smaller number of arrays, for example, one array 200, for example a single large array covering the entire width of the substrate, may be provided.

In one embodiment, a lens array as described herein is associated with or integrated with a moveable individually addressable element. For example, a lens array plate may be attached to each movable array 200, and thus movable (e.g., rotatable) with the individually addressable element 102. As discussed above, the lens array plate may be displaceable relative to the individually addressable element 102 (e.g., in the Z direction). In one embodiment, a plurality of lens array plates may be provided for array 200, and each lens array plate may be associated with a different subset of a plurality of individually addressable elements 102.

7 (i), a single discrete lens 242 may be attached in front of each individually addressable element 102 and may be moved along with the individually addressable element 102. In one embodiment, (For example, it is rotatable about the axis A). The lens 242 may also be displaceable (e.g., in the Z direction) with respect to the individually addressable element 102 using an actuator 244. 7 (j), individually addressable element 102 and lens 242 may be displaced together by actuator 244 relative to body 246 of array 200 . In one embodiment, the actuator 244 is configured to displace the lens 242 only in the Z direction (i.e., displace with respect to the individually addressable element 102 or with the individually addressable element 102) .

In one embodiment, the actuator 244 is configured to displace the lens 242 in three degrees of freedom or less (rotation in the Z direction, rotation about the X direction and / or rotation about the Y direction). In one embodiment, the actuator 244 is configured to displace the lens 242 to a degree of freedom of 6 or less. When the lens 242 is movable relative to the individually addressable element 102, the lens 242 may be moved by the actuator 244 to change the focal position of the lens 242 relative to the substrate. When the lens 242 is movable with the individually addressable element 102, the focal position of the lens 242 is substantially constant, but displaced with respect to the substrate. In one embodiment, the movement of the lens 242 is controlled individually for each lens 242 associated with each individually addressable element 102 of the array 200. In one embodiment, a subset of the plurality of lenses 242 is movable with or for a corresponding subset of the plurality of individually addressable elements 102. [ In the latter situation, the precision of focus control may be sacrificed for lower data overhead and / or faster response. In one embodiment, the size of the radiation spot provided by the individually addressable element 102 can be adjusted by defocusing, i. E., The larger the defocusing, the larger the spot size.

In one embodiment, referring to FIG. 7 (k), an aperture structure 248 having an aperture therein may be located below the lens 242. In one embodiment, the aperture structure 248 may be located on the lens 242, between the lens 242 and the corresponding individually addressable element 102. The aperture structure 248 may limit the diffraction effect of the lens 242, the corresponding individually addressable element 102, and / or the adjacent lens 242 / individually addressable element 102. [

In one embodiment, the individually addressable element 102 may be a radiation emitting device, for example a laser diode. Such a radiation-emitting device can have a high spatial coherence, and thus a speckle problem can be posed. To avoid this speckle problem, the radiation emitted by the radiation emitting device must be scrambled by shifting the phase of the beam portion relative to the other beam portion. 7 (1) and 7 (m), plate 250 may be positioned, for example, on frame 160, and individually addressable element 102 may be positioned on a plate 250). When the individually addressable element 102 is moved over the plate 250, the plate 250 is subjected to a collapse of the spatial coherence of the radiation emitted toward the substrate by the individually addressable element 102 disruption. In one embodiment, when the individually addressable element 102 is moved over the plate 250, the plate 250 is positioned between the lens 242 and the corresponding individually addressable element 102 do. In one embodiment, the plate 250 may be positioned between the lens 242 and the substrate.

7 (n), a spatial coherence decay device 252 may be positioned between the substrate and at least the individually addressable element 102 that projects radiation onto the exposure area . In one embodiment, the spatial coherence decay device 252 may be located between the individually addressable element 102 and the lens 242 and attached to the body 246. In one embodiment, the spatial coherence decay device 252 is a phase modulator, a vibrating plate, or a rotating plate. As the individually addressable element 102 projects the radiation toward the substrate, the spatial coherence decay device 252 causes the spatial coherence of the radiation emitted by the individually addressable element 102 to collapse do.

In one embodiment, the lens array is attached to the array 200 (preferably either as a unit or as a separate lens) through a material with a high thermal conductivity to facilitate thermal conduction from the lens array to the array 200 And thus cooling can be made more advantageous.

In one embodiment, the array 200 may include one or more focus or level sensors 254, similar to the level sensor 150. For example, the sensor 254 may be configured to measure focus for each individually addressable element 102 of the array 200 or for a plurality of individually addressable elements 102 of the array 200 have. Thus, when an out of focus condition is detected, the focus may be focused on each of the individually addressable elements 102 of the array 200 or on a plurality of individually addressable elements 102 of the array 200 Lt; / RTI > For example, the focus can be modified by moving the lens 242 in the Z direction (and / or about the X direction and / or the Y direction).

In one embodiment, the sensor 254 is integrated with the individually addressable element 102 (or may be integrated with a plurality of individually addressable elements 102 of the array 200). Referring to Figure 7 (o), an exemplary sensor 254 is schematically illustrated. The focus detection beam 256 is redirected (e.g., reflected) from the substrate surface and passes through the lens 242 and is directed towards the detector 262 by a half-silvering mirror 258. In one embodiment, the focus detection beam 256 may be radiation used for exposure purposes, which may be redirected from the substrate. In one embodiment, the focus detection beam 256 can be a dedicated beam that is guided to the substrate, which becomes beam 256 when redirected by the substrate. The knife edge 260 (which may be an opening) is placed in the path of the beam 256 before the beam 256 collides on the detector 262. In this embodiment, the detector 262 includes at least two radiation sensitive portions (e.g., regions or detectors) by a split of the detectors 262 as shown in Fig. 7 (o). If the substrate is in focus, a sharp image is formed on the edge 260 and the radiation sensitive portion of the detector 262 receives the same amount of radiation. If the substrate is out of focus, the beam 256 is shifted and the image will be formed either before the edge 260 or behind the edge 260. Thus, edge 260 may intercept a particular portion of beam 256 and one radiation sensitive portion of detector 262 may receive a smaller amount of radiation than other radiation sensitive portions of detector 262. By comparing the output signals from the radiation sensitive portion of the detector 262, it can be seen how the reoriented substrate plane of the beam 256 is different from the desired position and in what direction. Such a signal may be electronically processed, for example, to provide a control signal to adjust the lens 242. Mirror 258, edge 260, and detector 262 may be mounted to array 200. In one embodiment, the detector 262 may be a quad-cell.

In one embodiment, there may be 400 individually addressable elements 102 (at any one time) operating at 133. In one embodiment, the individually addressable elements 102, which operate from 600 to 1,200, may be provided with additional individually addressable elements (e.g., as described above) for use in, for example, preliminary and / (102) may be provided. The number of individually addressable elements 102 that operate may depend on, for example, resist, which requires a specific amount of radiation for patterning. When the individually addressable element 102 is rotatable, this individually addressable element 102 may be rotated at a rotational frequency of 6 Hz with the individually addressable element 102 operating at 1,200. When there are fewer individually addressable elements 102, the individually addressable elements 102 can rotate at a higher number of revolutions; When there are more individually addressable elements 102, the individually addressable elements 102 can rotate at a lower number of revolutions.

In one embodiment, the number of individually addressable elements 102 can be reduced using an individually addressable element 102 that is moveable relative to an array of individually addressable elements 102. For example, an individually addressable element 102 may be provided that operates from 600 to 1,200 (at any time). Further, this reduced number can produce results that are substantially similar to the array of individually addressable elements 102, but have one or more advantages. For example, an array of 100,000 blue-violet diodes may be required for sufficient exposure capacity using an array of bluish-purple diodes, for example, 200 diodes by 500 diodes. When operating at 10 kHz, the optical power per laser diode will be 0.33 mW. The power per laser diode will be 150 mW = 35 mA x 4.1 V. Therefore, for the array, the power will be 15 kW. In one embodiment using movable individually addressable elements, 400 bluish-purple diodes operating at 133 may be provided. When operating at a rotational frequency of 9 MHz, the optical power per laser diode will be 250 mW. The power per laser diode will be 1000 mW = 240 mA x 4.2 V. Therefore, for the array, the power will be 133 W. Thus, the diodes of the movable individually addressable element 102 configuration can be operated at the slope portion (240 mA versus 35 mA) of the optical output power versus the forward current curve, for example, as shown in Figure 7 (p) And will produce a low power (133 W vs. 15 kW) for a plurality of individually addressable elements, while producing a high output power per diode (250 mW vs. 0.33 mW). Therefore, such a diode can be used more efficiently, and power consumption and / or heat generation is reduced.

Thus, in one embodiment, the diode operates at the slope portion of the power / forward current curve. Operating in a non-tilted portion of the power / forward current curve may cause incoherence of the radiation. In one embodiment, the diode operates at an optical power greater than 5 mW but no greater than 20 mW, or no greater than 30 mW, or no greater than 40 mW. In one embodiment, the diode does not operate with optical power greater than 300 mW. In one embodiment, the diode operates in a single-mode rather than a multi-mode.

The number of individually addressable elements 102 on the array 200 may vary, in particular (and to the extent mentioned above), the length of the exposure area to be covered by the array 200, the rate at which the array is moved during exposure, (E.g., the dimensions of the spots projected onto the substrate from individually addressable elements 102, e.g., width / diameter), the desired intensity that each individually addressable element 102 should provide For example, whether it is necessary to diffuse the intended dose of radiation for a spot on the substrate through two or more individually addressable elements to prevent damage to the substrate or resist on the substrate), a predetermined scan rate of the substrate, , The frequency at which the individually addressable element is turned on or off, and the frequency at which the individually addressable element 102 Necessity; may depend on the (As previously discussed, for example, if the addressable elements in at least one individual faulty or for example pre-corrected exposure purposes). In one embodiment, the array 200 includes at least 100 individually addressable elements 102, e.g., at least 200 individually addressable elements, at least 400 individually addressable elements, at least 600 individually addressable elements Elements, at least 1,000 individually addressable elements, at least 1,500 individually addressable elements, at least 2,500 individually addressable elements, or at least 5,000 individually addressable elements. In one embodiment, the array 200 includes less than 50,000 individually addressable elements 102, such as less than 25,000 individually addressable elements, less than 15,000 individually addressable elements, less than 10,000 individually An addressable element, less than 7,500 individually addressable elements, less than 5,000 individually addressable elements, less than 2,500 individually addressable elements, less than 1,200 individually addressable elements, less than 600 individually An addressable element, or less than 300 individually addressable elements.

In one embodiment, the array 200 includes at least 100 individually addressable elements (i. E., A number of individually addressable elements of the array is normalized to a 10 cm long exposure area) 102), for example at least 200 individually addressable elements, at least 400 individually addressable elements, at least 600 individually addressable elements, at least 1,000 individually addressable elements, at least 1,500 individually addressable elements, , At least 2,500 individually addressable elements, or at least 5,000 individually addressable elements. In one embodiment, the array 200 includes less than 50,000 individually addressable elements 102 for each 10 cm long exposure area (i. E., Normalizing the number of individually addressable elements in the array to a 10 cm long exposure area) Such as less than 25,000 individually addressable elements, less than 15,000 individually addressable elements, less than 10,000 individually addressable elements, less than 7,500 individually addressable elements, less than 5,000 individually addressable elements Elements, less than 2,500 individually addressable elements, no more than 1,200 individually addressable elements, no more than 600 individually addressable elements, or no more than 300 individually addressable elements.

In one embodiment, the array 200 includes less than 75% of the extra individually addressable elements 102, such as less than 67%, less than 50%, less than about 33%, less than 25%, less than 20%, less than 10% , Or no more than 5% of the extra individually addressable elements 102. In one embodiment, the array 200 includes at least 5% of redundant individually addressable elements 102, such as at least 10%, at least 25%, at least 33%, at least 50%, or at least 65% Lt; RTI ID = 0.0 > 102 < / RTI > In one embodiment, the array includes about 67% of the extra individually addressable elements 102.

In one embodiment, the spot size of the individual addressable elements on the substrate is less than 10 microns, 5 microns or less, such as 3 microns or less, 2 microns or less, 1 micron or less, 0.5 microns or less, 0.3 microns or less, to be. In one embodiment, the spot size of the individual addressable elements on the substrate is at least 0.1 micron, at least 0.2 micron, at least 0.3 micron, at least 0.5 micron, at least 0.7 micron, at least 1 micron, at least 1.5 micron, at least 2 micron, Micron. In one embodiment, the spot size is about 0.1 micron. In one embodiment, the spot size is about 0.5 microns. In one embodiment, the spot size is about 1 micron.

In operation of the lithographic apparatus 100, the substrate 114 is loaded onto the substrate table 106 using, for example, a robot handler (not shown). Substrate 114 is then displaced in the X direction under frame 160 and individually addressable element 102. Substrate 114 is exposed to the pattern using individually addressable elements 102 after being measured by level sensor and / or alignment sensor 150, as discussed above. The individually addressable element 102 may, for example, be operable to provide pixel-grid imaging as described herein.

Figure 8 is a schematic side view of a lithographic apparatus according to an embodiment of the invention. As shown in FIG. 8, the lithographic apparatus 100 includes a patterning device 104 and a projection system 108. The projection system 108 includes two lenses 176, The first lens 176 is configured to receive the modulated radiation beam 110 from the patterning device 104 and to focus the beam onto the aperture stop 174 through the contrast aperture. An additional lens (not shown) may be located in the opening. The radiation beam 110 then diverges and is focused by the second lens 172 (e.g., a field lens).

The projection system 108 further includes a lens array 170 configured to receive the modulated radiation beam 110. A different portion of the modulated radiation beam 110, corresponding to one or more individually controllable elements in the patterning device 104, passes through each different lens of the lens array 170. Each lens focuses each portion of the modulated radiation beam 110 at a point on the substrate 114. In this way, an array of radiation spots S (see Figure 12) is exposed on the substrate 114. It will be appreciated that although only five of the lens arrays 170 shown are shown, the lens arrays may include hundreds or even thousands of lenses (the same is used individually for the patterning device 104 Also applies to controllable elements).

A free working distance FWD is provided between the substrate 114 and the lens array 170, as shown in Fig. This distance enables movement of the substrate 114 and / or the lens array 170, for example, to enable focus correction. In one embodiment, the free working distance is in the range of 1 to 3 mm, e.g., about 1.4 mm. The individually addressable elements of the patterning device 104 are arranged at a pitch P which is consequently associated with the pitch P of the imaging spots in the substrate 114. In one embodiment, the lens array 170 may provide a NA of 0.15 or 0.18. In one embodiment, the imaging spot size is about 1.6 占 퐉.

In this embodiment, the projection system 108 may be a 1: 1 projection system in that the array spacing of image spots on the substrate 114 is the same as the array spacing of the pixels of the patterning device 104. In order to provide improved resolution, the image spot may be much smaller than the pixels of the patterning device 104.

9 is a schematic side view of a lithographic apparatus according to an embodiment of the invention. In this embodiment, in addition to the lens array 170, there is no optical device between the patterning device 104 and the substrate 114. [

The lithographic apparatus 100 of FIG. 9 includes a patterning device 104 and a projection system 108. In this case, the projection system 108 includes only a lens array 170 configured to receive the modulated radiation beam 110 only. A different portion of the modulated radiation beam 110, corresponding to one or more individually controllable elements of the patterning device 104, passes through each of the different lenses of the lens array 170. Each lens focuses each portion of the modulated radiation beam 110 at a point on the substrate 114. In this way, an array of radiation spots S (see FIG. 12) is exposed on the substrate 114. It will be appreciated that although only five of the lens arrays 170 shown are shown, the lens array may include hundreds or even thousands of lenses (the same contents may be individually controlled Applicable to possible elements).

As in Fig. 8, a free working distance FWD is provided between the substrate 114 and the lens array 170. Fig. This distance allows the substrate 114 and / or the lens array 170 to be moved, for example, to effect focus correction. The individually addressable elements of the patterning device 104 are arranged at a pitch P which is consequently associated with the pitch P of the imaging spots in the substrate 114. In one embodiment, the lens array 170 may provide a NA of 0.15. In one embodiment, the imaging spot size is about 1.6 占 퐉.

Figure 10 is a schematic side view of a lithographic apparatus using a movable individually addressable element 102 as discussed above in connection with Figure 5 in accordance with an embodiment of the present invention. In this embodiment, in addition to the lens array 170, there is no optical device between the patterning device 104 and the substrate 114. [

The lithographic apparatus 100 of FIG. 10 includes a patterning device 104 and a projection system 108. In this case, the projection system 108 includes only a lens array 170 configured to receive the modulated radiation beam 110 only. A different portion of the modulated radiation beam 110, corresponding to one or more individually controllable elements of the patterning device 104, passes through each of the different lenses of the lens array 170. Each lens focuses each portion of the modulated radiation beam 110 at a point on the substrate 114. In this way, an array of radiation spots S (see FIG. 12) is exposed on the substrate 114. It will be appreciated that although only five of the lens arrays 170 shown are shown, the lens array may include hundreds or even thousands of lenses (the same contents may be individually controlled Applicable to possible elements).

As in Fig. 8, a free working distance FWD is provided between the substrate 114 and the lens array 170. Fig. This distance allows the substrate 114 and / or the lens array 170 to be moved, for example, to effect focus correction. The individually addressable elements of the patterning device 104 are arranged at a pitch P which is consequently associated with the pitch P of the imaging spots in the substrate 114. In one embodiment, the lens array 170 may provide a NA of 0.15. In one embodiment, the imaging spot size is about 1.6 占 퐉.

FIG. 11 shows a plurality of individually addressable elements 102, specifically six individually addressable elements 102. In this embodiment, each of the individually addressable elements 102 is a radiation emitting diode, for example a violet laser diode. Each radiation-emitting diode bridges two power lines for supplying current to the radiation-emitting diode to control the diode. Thus, such a diode forms an addressable grid. The width between the two power supply lines is approximately 250 mu m, and the radiation emitting diode has a pitch of approximately 500 mu m.

12 schematically illustrates how a pattern on substrate 114 can be generated. The filled circle represents a spot (S) array projected onto the substrate 114 by a lens array (MLA) of the projection system 108. The substrate 114 is moved relative to the projection system 108 in the X direction as a series of exposures are exposed on the substrate. The hollow circle represents the spot exposure (SE) that was previously exposed on the substrate. As shown, each spot projected onto substrate 114 by lens array 170 in projection system 108 exposes row R of spot exposure on substrate 114. The complete pattern for the substrate 114 is produced by the sum of all the rows R of the spot exposure SE exposed by each spot S. [ This configuration is commonly referred to as "pixel grid imaging ". It will be appreciated that FIG. 12 is a schematic representation and that the spots S may be substantially overlapping.

It can be seen that the array of radiation spots S is arranged at an angle a relative to the substrate 114 (the edge of the substrate 114 lies parallel to the X and Y directions). This is so that when the substrate 114 is moved in the scanning direction (X direction), each radiation spot passes over a different area of the substrate so that the entire substrate can be covered by the array of radiation spots S. In one embodiment, the angle alpha is less than 20 degrees, less than 10 degrees, such as less than 5 degrees, less than 3 degrees, less than 1 degrees, less than 0.5 degrees, less than 0.25 degrees, less than 0.10 degrees, less than 0.05 degrees, Or less. In one embodiment, the angle alpha is at least 0.0001 degrees, for example at least 0.001 degrees. The inclination angle a of the array and the width of the array in the scanning direction are determined according to the image spot size and the array spacing in the direction perpendicular to the scanning direction so that the entire surface area of the substrate 114 is addressed.

FIG. 13 schematically shows how an entire optical disk drive can be exposed with a single scan using a plurality of optical engines, each optical engine including one or more individually addressable elements. Eight arrays SA of radiation spots S (not shown) are created by eight optical engines, where the edges of one array of radiation spots S are aligned with the radiation spots S, Are arranged in two rows (R1, R2) or in a staggered configuration in the "chess board" such that they slightly overlap the edges of the adjacent arrays of rows. In one embodiment, the optical engine is arranged in at least three rows, e.g., four rows or five rows. In this way, the band of radiation extends across the width of the substrate W, allowing exposure of the entire substrate to be performed in a single scan. This "full width" single pass exposure helps to avoid the problem of stitching connecting two or more passes, and since the substrate need not be moved in a direction across the substrate passing direction, . It will be appreciated that any suitable number of optical engines may be used. In one embodiment, the number of optical engines is at least 1, such as at least 2, at least 4, at least 8, at least 10, at least 12, at least 14, or at least 17. In one embodiment, the number of optical engines is less than 40, such as less than 30 or less than 20. Each optical engine may include a separate patterning device 104 and may optionally include a separate projection system 108 and / or a radiation system as described above. However, it will be appreciated that two or more optical engines may share at least some of the radiation system, patterning device 104 and / or one or more of the projection system 108.

In the embodiment described herein, a controller is provided for controlling individually addressable elements. For example, in embodiments where the individually addressable element is a radiation emitting device, such a controller may control when the individually addressable element is turned on or off and enable high frequency modulation of the individually addressable element do. The controller can control the power of the radiation emitted by the one or more individually addressable elements. The controller may modulate the intensity of the radiation emitted by the one or more individually addressable elements. The controller can control / adjust intensity uniformity for all or a portion of the arrays of individually addressable elements. The controller can adjust the radiation output of the individually addressable elements to correct imaging errors, such as etendue and optical aberrations (e.g., coma, astigmatism, etc.).

In lithography, a desired feature can be created on a substrate by selectively exposing the resist layer on the substrate to radiation, for example by exposing the resist layer to patterned radiation. The area of the resist that receives a particular minimum radiation dose (the "radiation dose threshold") undergoes a chemical reaction, while the other area remains unchanged. The chemical difference generated in this way in the resist layer makes it possible to develop the resist, that is to say selectively remove the area receiving the least amount of radiation, or selectively remove the area not receiving the minimum amount of radiation. As a result, some of the substrate is still protected by the resist, but the area of the substrate from which the resist has been removed may be exposed to produce desired features, for example by additional processing steps such as selective etching of the substrate, . The radiation transmitted to the region of the resist layer on the substrate in the desired feature has a sufficiently high intensity that this region receives a radiation dose exceeding the radiation dose threshold during exposure while the other region on the substrate is at or near zero By setting the corresponding individually controllable elements to provide a low radiation intensity, the patterning of the radiation can be accomplished by setting the individually controllable elements in the patterning device to receive a radiation dose below the radiation dose threshold.

In practice, even though the individually controllable element is set to provide the maximum radiation intensity to one side of the feature boundary and to provide the minimum radiation intensity to the other side, the radiation dose at the edge of the desired feature is the radiation dose of zero from a given maximum radiation dose It may not change suddenly. Instead, due to the diffraction effect, the level of radiation dose can fall over the transition region. The boundary position of the desired feature, which is ultimately formed after the development of the resist, is then determined by the position at which the received radiation dose falls below the radiation dose threshold. The profile of the decrease in the amount of radiation across the transition area, i.e., the precise location of the feature boundary, can be achieved by providing individually controllable elements that provide radiation to points on the substrate that are on or around the feature boundary, But can be more accurately controlled by setting the intensity level between the maximum intensity level and the minimum intensity level. This is commonly referred to as "gray scaling" or "gray leveling ".

Grayscaling is more efficient than control possible in a lithography system where the radiation intensity provided to a substrate by a given individually controllable element can be set to only two values (i.e., only minimum and maximum values) It is possible to provide better control. In one embodiment, at least three different radiation intensity values, e.g., at least four radiation intensity values, at least eight radiation intensity values, at least sixteen radiation intensity values, at least 32 radiation intensity values, at least 64 radiation intensity values, 100 radiation intensity values, at least 128 radiation intensity values, or at least 256 radiation intensity values may be projected onto the substrate. If the patterning device is the radiation source itself (e.g., an array of light emitting diodes or laser diodes), gray scaling may be performed, for example, by controlling the intensity level of the transmitted radiation. When the contrast device is a micro mirror device, gray scaling can be performed, for example, by controlling the inclination angle of the micromirror. Gray scaling may also be performed by grouping a plurality of programmable elements in the contrast device and controlling the number of elements that are switched on or off at any given time in the group.

In one example, the patterning device may have a series of states including: (a) a black state in which the radiation provided contributes a minimum or zero to the intensity distribution of the corresponding pixel; (b) a whitest state in which the provided radiation makes a maximum contribution; And (c) a plurality of states in between, wherein the provided radiation has a moderate contribution. This state is divided into a normal set used for normal beam patterning / printing, and a compensation set used to compensate for the effects of defective elements. The normal set includes a first group of dark states and intermediate states. This first group will be described as a gray state and can be selected to provide a gradually increasing contribution to the corresponding pixel intensity, from the minimum dark state value to a particular normal maximum value. The compensation set includes the remaining second group of intermediate states, together with the nominal state. This second group of intermediate states will be described as a white state and can be selected to provide a contribution greater than the normal maximum and gradually increase to a true maximum corresponding to the light state. While the second group of intermediate states is described as being white, it will be appreciated that this is only to facilitate distinction between the normal exposure step and the compensating exposure step. The entire plurality of states may alternatively be described as a series of gray states between a dark state and a light state, and may be selected to enable gray scale printing.

It should be appreciated that grayscaling may be used for additional or alternative purposes in the foregoing. For example, the processing of the substrate after exposure can be tuned such that there are more than two potential reaction areas in the substrate, depending on the received radiation dose level. For example, a portion of a substrate receiving a radiation dose below a first threshold reacts in a first manner; A portion of the substrate that receives a radiation dose that is above a first threshold but below a second threshold reacts in a second manner; The portion of the substrate receiving the radiation dose beyond the second threshold reacts in a third manner. Thus, gray scaling may be used such that a radiation dose profile having three or more desired dose levels is provided across the substrate. In one embodiment, the radiation dose profile includes at least two desired radiation dose levels, such as at least three desired radiation dose levels, at least four desired radiation dose levels, at least six desired radiation dose levels, or at least eight desired radiation dose levels Respectively.

It should also be appreciated that the radiation dose profile can be controlled by any other means than simply controlling the intensity of the radiation received at each point on the substrate, as described above. For example, the amount of radiation received by each point on the substrate may alternatively or additionally be controlled by controlling the exposure duration of such points. As a further example, each point on the substrate may receive radiation in a plurality of successive exposures. Therefore, the amount of radiation received by each point may alternatively or additionally be controlled by exposing such points using a selected subset of such a plurality of successive exposures.

In order to form a pattern on a substrate, it is necessary to set each individually controllable element of the patterning device to a required state at each stage of the exposure process. Therefore, a control signal indicating the required state must be transmitted to each individually controllable element. Preferably, the lithographic apparatus includes a controller 400 that generates a control signal. The pattern to be formed on the substrate may be provided to the lithographic apparatus in a vector-defined format, for example GDSII. To convert design information to control signals for each individually controllable element, the controller includes one or more data manipulation devices, each of which manipulates the data stream representing the pattern . The data manipulation device may collectively be referred to as a "data path ".

The data manipulation device of the data path may be configured to perform one or more of the following functions: Converting vector-based design information into bitmap pattern data; Converting the bitmap pattern data into a desired radiation dose map (i.e., the desired radiation dose profile across the substrate); Converting the desired radiation dose map to a desired radiation intensity value for each individually controllable element; And converting the desired radiation intensity value to a corresponding control signal for each individually controllable element.

In one embodiment, the control signals may be provided to the individually controllable element 102 and / or one or more other devices (e.g., sensors) by wire or wireless communication. Further, signals from the individually controllable elements 102 and / or one or more other devices (e.g., sensors) may be communicated to the controller 400.

Referring to Figure 14 (a), in a wireless embodiment, a transceiver (or just a transmitter) 406 emits a signal comprising a control signal to be received by a transceiver (or receiver only) The control signals are transmitted to each individually controllable element 102 by one or more lines 404. In one embodiment, the signal from the transceiver 406 may comprise a plurality of control signals and the transceiver 402 may transmit this signal to each of the individually controllable elements 102 and / or one or more other devices (e.g., For example, a sensor can be demultiplexed into a plurality of control signals. In one embodiment, the wireless transmission may be by radio frequency (RF).

14 (b), in a wired embodiment, one or more lines 404 connect the controller 400 to an individually controllable element 102 and / or one or more other devices (e.g., sensors) . In one embodiment, a single line 404 may be provided to transfer the respective control signals to and / or from the array 200 body. Control signals may then be separately provided to the individually controllable element 102 and / or one or more other devices (e.g., sensors) in the array 200 body. For example, as in the wireless embodiment, the control signals can be multiplexed to be transmitted on a single line, and then transmitted to the individually controllable element 102 and / or to one or more other devices (e.g., sensors) Can be demultiplexed. In one embodiment, a plurality of lines 404 may be provided to convey individual control signals of the individually controllable element 102 and / or one or more other devices (e.g., sensors). When the array 200 is rotatable, the line (s) 404 may be provided along the axis of rotation A. In one embodiment, the signal may be provided to the array 200 body or from the array 200 body via a sliding contact around the motor 216 or around the motor 216. This may be advantageous for a rotatable embodiment. The sliding contact can be made, for example, through a brush contacting the plate.

In one embodiment, line (s) 404 may be an optical line. In this case, the signal may be, for example, an optical signal over which different control signals can be transmitted at different wavelengths.

Power can be supplied to the individually controllable element 102 or to one or more other devices (e.g., sensors), by wired or wireless means, in a manner similar to control signals. For example, in a wireline embodiment, power may be supplied by one or more lines 404, regardless of whether it is the same as the line carrying the signal. A sliding contact configuration may be provided as described above to transmit power. In a wireless embodiment, power can be delivered by RF coupling.

While the previous discussion has focused on the control signals supplied to the individually controllable elements 102 and / or one or more other devices (e.g., sensors), it is alternatively or additionally And the transmission of signals from the controllable element 102 and / or one or more other devices (e.g., sensors) to the controller 400. [ Thus, communication can be performed in one direction (e.g., only with individually controllable elements 102 and / or with one or more other devices (e.g., sensors) or with individually controllable elements 102 and / (E.g., from a sensor) or bi-directional (i.e., from an individually controllable element 102 and / or from one or more other devices (e.g., sensors) (E. G., A sensor). ≪ / RTI > For example, transceiver 402 may multiplex multiple signals from an individually controllable element 102 and / or one or more other devices (e.g., sensors) for transmission to transceiver 406, In the transceiver 406, these signals may be demultiplexed into separate signals.

In one embodiment, the control signal for providing the pattern may be altered to take into account factors that may affect the proper supply and / or realization of the pattern on the substrate. For example, a correction may be applied to the control signal to account for the heating of one or more arrays 200. Such heating may cause a change in the direction of orientation of the individually controllable element 102 and may change the uniformity of the radiation from the individually controllable element 102, and the like. In one embodiment, the temperature and / or the expansion / contraction rate measured in association with the array 200 (e.g., an array of one or more of the individually controllable elements 102) from the sensor 234, for example, May be used to change the control signal that would have been provided to form the signal. Thus, for example, during exposure, the temperature of the individually controllable element 102 can change, and this change can cause a change in the projected pattern to be provided at a single constant temperature. Therefore, the control signal can be changed to account for such a change. Likewise, in one embodiment, the results from the alignment sensor and / or level sensor 150 may be used to alter the pattern provided by the individually controllable element 102. [ The pattern can be generated from positioning of the substrate 114 between the individually controllable element 102 and the substrate 114, for example, an optical device (if present), irregularities in the substrate 114, , E.g., to correct for distortion.

In one embodiment, the change in the control signal is based on a theory of the physical / optical results for the desired pattern, resulting from the measured parameters (e.g., temperature measured by the level sensor, measured distance, etc.) Can be determined. In one embodiment, a change in the control signal may be determined based on an empirical or empirical model of the physical / optical results for the desired pattern, resulting from the measured parameters. In one embodiment, changes in the control signal may be applied in a feedforward and / or feedback manner.

In one embodiment, the lithographic apparatus may comprise a sensor 500 for measuring the characteristics of radiation to be transmitted or transmitted towards the substrate by one or more of the individually controllable elements 102. [ Such a sensor may be a spot sensor or a transmission image sensor. The radiation intensity from the individually controllable element 102, the uniformity of the radiation from the individually controllable element 102, the cross-sectional size or area of the radiation spot from the individually controllable element 102, and / Such a sensor can be used to determine the position (on the XY plane) of the radiation spot from the controllable element 102.

Figure 15 is a schematic plan view of a lithographic apparatus according to an embodiment of the present invention and shows some exemplary locations of the sensor 500. [ In one embodiment, one or more sensors 500 are provided on or in the substrate table 106 for holding the substrate 114. For example, the sensor 500 may be provided at the leading edge of the substrate table 106 and / or at the trailing edge of the substrate table 106. In this embodiment, four sensors 500, one for each array 200, are shown. Preferably, such a sensor is located in a position that may not be covered by the substrate 114. In an alternative, additional example, the sensor may be provided at a lateral edge of the substrate table 106, preferably at a location that may not be covered by the substrate 114. The sensor 500 at the leading edge of the substrate table 106 may be used for pre-exposure detection of the individually controllable element 102. The sensor 500 at the trailing edge of the substrate table 106 may be used for post-exposure detection of the individually controllable element 102. The sensor 500 at the lateral edge of the substrate table 106 may be used for detection during exposure ("on-the-fly" detection) of the individually controllable element 102.

Referring to Figure 16 (a), there is shown a schematic side view of a portion of a lithographic apparatus according to an embodiment of the invention. In this example, only one array 200 is shown and other parts of the lithographic apparatus are omitted for simplicity; The sensors described herein may be applied to each of the arrays 200 or some of the arrays 200. Some additional or alternative embodiments of the position of the sensor 500 are shown in Figure 16 (a) (in addition to the sensor 500 of the substrate table 106). The first embodiment is a sensor 500 on a frame 160 that receives radiation from an individually controllable element 102 through a beam redirecting structure 502 (e.g., a reflective mirror configuration). In this first embodiment, the individually controllable element 102 moves in the XY plane, so that different elements of the individually controllable element 102 can be positioned to provide radiation to the beam redirecting structure 502 have. An additional or alternate second embodiment is a system that receives radiation from an individually controllable element 102 from the rear side of the individually controllable element 102, i.e., from the opposite side of the side from which exposure radiation is provided, And a sensor 500 on the frame 160. In this second embodiment, the individually controllable element 102 moves in the X-Y plane, so that different elements of the individually controllable element 102 can be positioned to provide radiation to the sensor 500. [ Although the sensor 500 in the second embodiment is shown in the path of the individually controllable element 102 in the exposure area 204, the sensor 500 can be located where the sensor 510 is shown . In one embodiment, the sensor 500 on the frame 160 may be in a fixed position, or may be movable, e.g., by a corresponding actuator. The first and second embodiments may be used to provide "on-the-fly" sensing in addition to or as an alternative to pre- and / or post-exposure sensing. The third embodiment is a sensor 500 on the structures 504 and 506. Structures 504 and 506 may be movable by an actuator 508. [ In one embodiment, the structure 504 is located below the path through which the substrate table is movable (as shown in Figure 16 (a)) or on the side of such a path. In one embodiment, the structure 504 can be moved by the actuator 508 to the position of the sensor 500 of the substrate table 106 shown in Figure 16 (a) if the substrate table 106 is not there And if the structure 504 is on the side of the path, this movement can be in the Z-direction (as shown in Figure 16 (a)) or in the X and / or Y directions. In one embodiment, the structure 506 is located on a path over which the substrate table can be moved (as shown in Figure 16 (a)) or on the side of such a path. In one embodiment, the structure 506 can be moved by the actuator 508 to the position of the sensor 500 of the substrate table 106 shown in Figure 16 (a) if the substrate table 106 is not there have. The structure 506 can be attached to the frame 160 and be displaceable relative to the frame 160. [

By moving the radiation beam of the sensor 500 and / or the individually controllable element 102, as an operation for measuring the characteristics of the radiation to be transferred or transmitted to the substrate by the one or more individually controllable elements 102 , Placing the sensor (500) in the path of radiation from the individually controllable element (102). Thus, by way of example, the substrate table 106 can be moved to position the sensor 500 in the path of radiation from the individually controllable element 102 as shown in Figure 16 (a). In this case, the sensor 500 is located in the path of the individually controllable element 102 in the exposure area 204. [ In one embodiment, the sensor 500 is configured to control the individually controllable elements 102 (e.g., the beam re-directing structure 502, if it is not there, Lt; / RTI > possible element 102). Once located in the path of radiation, the sensor 500 can detect the radiation and measure the characteristics of the radiation. To facilitate sensing, the sensor 500 can move relative to the individually controllable element 102, and / or the individually controllable element 102 can be moved relative to the sensor 500.

As a further example, the individually controllable element 102 may be moved to a position such that radiation from the individually controllable element 102 collides against the beam redirecting structure 502. The beam redirecting structure 502 directs the beam to the sensor 500 on the frame 160. To facilitate sensing, the sensor 500 may move relative to the individually controllable element 102, and / or the individually controllable element 102 may be moved relative to the sensor 500. In this example, the individually controllable element 102 is measured outside the exposure area 204.

In one embodiment, the sensor 500 may be fixed or movable. When fixed, the individually controllable element 102 is preferably movable relative to the stationary sensor 500 to facilitate sensing. For example, the array 200 may be moved (e.g., rotated or translated) relative to the sensor 500 (e.g., the sensor 500 on the frame 160) to facilitate sensing by the sensor 500. For example, ). When the sensor 500 is movable (e.g., the sensor 500 on the substrate table 106), the individually controllable element 102 can be kept stationary for sensing, Lt; RTI ID = 0.0 > speed. ≪ / RTI >

The sensor 500 may be used to calibrate one or more of the individually controllable elements 102. For example, the position of the spot of the individually controllable element 102 can be detected by the sensor 500 before exposure, and the system is thereby calibrated. The exposure can then be adjusted based on this expected position of the spot (e.g., the position of the substrate 114 is controlled, the position of the individually controllable element 102 is controlled, The turn-off or turn-on of the controllable element 102 is controlled, etc.). Furthermore, calibration may be performed subsequently. For example, calibration may be performed immediately after exposure, prior to additional exposure, e.g., using sensor 500 on the trailing edge of substrate table 106. Calibration may be performed before each exposure, after a specific number of exposures. Further, the position of the spots of the individually controllable element 102 can be detected with the sensor 500 as "on-the-fly" The individually controllable element 102 may be re-calibrated based on perhaps "on-the-fly" sensing.

In one embodiment, one or more of the individually controllable elements 102 can be coded to detect which of the individually controllable elements 102 is in a particular position or in use. In one embodiment, the individually controllable element 102 may include a marker, and the sensor 510 may be used to detect markers, barcodes, and the like, which may be RFID tags. For example, each of the plurality of individually controllable elements 102 may be moved adjacent the sensor 510 to read the marker. Knowing which of the individually controllable elements 102 are adjacent to the sensor 510 determines which of the individually controllable elements 102 is adjacent to the sensor 500, in the exposure area 204, etc. . In one embodiment, each individually controllable element 102 may be used to provide radiation having a different frequency, and the sensors 500, 510 may be any of the individually controllable elements 102, 500, < RTI ID = 0.0 > 510). ≪ / RTI > For example, each of a plurality of individually controllable elements 102 may be moved adjacent a sensor 500, 510 that receives radiation from an individually controllable element 102, , 510 may demultiplex the received radiation to determine which of the individually controllable elements 102 is adjacent to the sensor 500, 510 at a particular time. From this information, it can be seen which of the individually controllable elements 102 is adjacent to the sensor 500, in the exposure area 204, and so on.

In one embodiment, as discussed above, a position sensor may be provided to determine the position of one or more individually controllable elements 102 with a freedom of six or less. For example, the sensor 510 may be used for position detection. In one embodiment, the sensor 510 may comprise an interferometer. In one embodiment, the sensor 510 may include an encoder that may be used to detect one or more one-dimensional encoder gratings and / or one or more two-dimensional encoder gratings.

In one embodiment, the sensor 520 may be provided to determine the characteristics of the radiation delivered to the substrate. In this embodiment, the sensor 520 captures the radiation guided by the substrate. For example purposes, the re-directed radiation captured by the sensor 520 may be used to facilitate determining the position of the radiation spot from the individually controllable element 102 (e.g., In the case of misalignment of the radiation spot from the controllable element 102). In particular, the sensor 520 can capture the redirected radiation, i.e., latent image, from the portion just exposed in the substrate. The measurement of the intensity of the re-directed radiation of this tail may provide an indication as to whether or not the spot is properly aligned. For example, repeated measurements of these tail may provide a repetitive signal, and deviations from this signal will indicate a misalignment of the spot (e.g., out-of-phase signals may indicate misalignment). 16B shows the schematic position of the detection area of the sensor 520 with respect to the exposed area 522 of the substrate 114. As shown in Fig. In this embodiment, three detection regions are shown and the results thereof may be compared and / or combined to aid in the recognition of misalignment. Only one detection area, for example, the detection area on the left side needs to be used. In one embodiment, the detector 262 of the individually controllable element 102 may be used in a manner similar to the sensor 520. [ For example, one or more individually controllable elements 102 outside the exposure area 204 of the array 200 on the right hand side can be used to detect the redirected radiation from the latent image on the substrate.

17 shows an embodiment of a lithographic apparatus. In the present embodiment, a plurality of individually controllable elements 102 direct radiation toward a rotatable polygon 600 (polygon). The surface 604 of the polygon 600 where the radiation impinges redirects the radiation toward the lens array 170. The lens array 170 redirects the radiation toward the substrate 114. During exposure, polygon 600 rotates about axis 602 to move individual beams from each of a plurality of individually controllable elements 102 across lens array 170 in the Y direction. Specifically, this beam will scan repeatedly across the lens array 170 in the positive Y direction as each new face of the polygon 600 collides with the radiation. As described herein, the individually controllable element 102 is modulated during exposure to provide the desired pattern. The polygon may have any number of suitable sides. Further, the individually controllable element 102 is modulated in timing with the rotatable polygon 600 such that each beam impinges on the lens of the lens array 170. [ In one embodiment, an additional plurality of individually controllable elements 102 may be provided on the opposite side of the polygon, i.e., on the right side, to cause radiation to impinge on the surface 606 of the polygon 600. [

In one embodiment, a vibrating optical element may be used in place of the polygon 600. The oscillating optical element has an arbitrary fixed angle to the lens array 170 and translates back and forth in the Y direction so that the beam can be scanned back and forth in the Y direction across the lens array 170. In one embodiment, a rotatable optical element may be used in place of the polygon 600 before and after arcing about an axis 602. By rotating the optical element back and forth while drawing the arc, the beam is scanned back and forth in the Y direction across the lens array 170. In one embodiment, the polygon 600, the vibration optical element, and / or the rotatable optical element have one or more mirror surfaces. In one embodiment, polygon 600, oscillating optical element, and / or rotatable optical element comprise a prism. In one embodiment, an acousto-optic modulator may be used in place of the polygon 600. [ An acousto-optic modulator may be used to scan the beam across the lens array 170. In one embodiment, a lens array 170 is disposed between the plurality of individually controllable elements 102 in the radiation path and the polygon 600, oscillating optical element, rotatable optical element, and / or acousto-optical modulator .

Thus, in general, the width of the exposure area (e.g., substrate) can be covered with a radiation output that is less than the width of the radiation output divided by the width of the exposure area. In one embodiment, this may include moving the radiation beam source relative to the exposure area or moving the radiation beam relative to the exposure area.

18 is a schematic side cross-sectional view of a lithographic apparatus 100 having an individually controllable element 102 movable in accordance with an embodiment of the present invention. 5, the lithographic apparatus 100 includes a substrate table 106 for holding a substrate and a positioning mechanism 116 for moving the substrate table 106 to a degree of freedom of 6 or less .

The lithographic apparatus 100 further includes a plurality of individually controllable elements 102 arranged on the frame 160. In this embodiment, each individually controllable element 102 is a radiation emitting diode, e.g., a laser diode, such as a violet laser diode. The individually controllable elements 102 are arranged in an array 200 of individually controllable elements 102 that extend along the Y direction. Although one array 200 is shown, the lithographic apparatus may include a plurality of arrays 200, for example, as shown in FIG.

In this embodiment, the array 200 is a rotatable plate, and a plurality of spatially separated, individually controllable elements 102 are arranged around this rotatable plate. In use, the plate rotates about its axis 206, for example in the direction indicated by the arrow in Fig. The plate of the array 200 rotates about an axis 206 using a motor 216. In addition, the plate of the array 200 can be moved in the Z direction by the motor 216 so that the individually controllable elements 102 can be displaced with respect to the substrate table 106.

In this embodiment, the array 200 may include one or more pins 230 to increase the surface area for heat dissipation. The pin (s) 230 may be, for example, on the top surface of the array 200. Optionally, one or more additional pins 232 may be provided to cooperate with pin (s) 230 to facilitate heat dissipation. For example, the pin (s) 232 may absorb heat from the pin (s) 230 and may be a fluid (e.g., liquid) conduction channel similar to that shown and described with respect to Figure 7 (f) And an associated heat exchanger / pump.

In this embodiment, a lens 242 may be positioned in front of each individually controllable element 102 and may be movable with the individually controllable element 102 (e.g., As shown in Fig. In FIG. 18, two lenses 242 are shown and attached to the array 200. In addition, the lens 242 may be displaceable relative to the individually controllable element 102 (e.g., in the Z direction).

In this embodiment, an aperture structure 248 having an aperture therein may be located on the lens 242, between the lens 242 and the corresponding individually controllable element 102. The aperture structure 248 may limit the diffraction effects of the lens 242, the corresponding individually addressable element 102, and / or the adjacent lens 242 / individually controllable element 102. [

In this embodiment, the sensor 254 may be provided with an individually addressable element 102 (or a plurality of individually addressable elements 102 of the array 200). In this embodiment, the sensor 254 is configured to detect focus. The focus detection beam 256 is redirected (e.g., reflected) from the substrate surface and is directed through the lens 242 towards the detector 262, for example, by a half-silvering mirror 258. In one embodiment, the focus detection beam 256 may be radiation used for exposure purposes, which may be redirected from the substrate. In one embodiment, the focus detection beam 256 can be a dedicated beam that is guided to the substrate, which becomes beam 256 when redirected by the substrate. An exemplary focus sensor has been described above with respect to Figure 7 (o). Mirror 258 and detector 262 may be mounted to array 200.

In this embodiment, the control signals may be provided to the individually controllable element 102 and / or one or more other devices (e.g., sensors) by wire or wireless communication. In addition, signals from the individually controllable element 102 and / or one or more other devices (e.g., sensors) may be communicated to the controller. In FIG. 18, line (s) 404 may be provided along the axis of rotation 206. In one embodiment, line (s) 404 may be an optical line. In this case, the signal may be, for example, an optical signal over which different control signals can be transmitted at different wavelengths. Power can be supplied to the individually controllable element 102 or to one or more other devices (e.g., sensors), by wired or wireless means, in a manner similar to control signals. For example, in a wireline embodiment, power may be supplied by one or more lines 404, regardless of whether it is the same as the line carrying the signal. In a wireless embodiment, power may be delivered by RF coupling, as shown at 700.

In the present embodiment, the lithographic apparatus may comprise a sensor 500 for measuring the characteristics of radiation to be transmitted or transmitted towards the substrate by one or more of the individually controllable elements 102. [ Such a sensor may be a spot sensor or a transmission image sensor. The radiation intensity from the individually controllable element 102, the uniformity of the radiation from the individually controllable element 102, the cross-sectional size or area of the radiation spot from the individually controllable element 102, and / Such a sensor can be used to determine the position (on the XY plane) of the radiation spot from the controllable element 102. In this embodiment, the sensor 500 is on the frame 160, may be adjacent to the substrate table 106, or accessible through the substrate table 106.

In one embodiment, rather than the individually controllable element 102 being movable in the X-Y plane, the individually controllable element 102 is substantially fixed in the X-Y plane during exposure of the substrate. It does not mean that the individually controllable element 102 can not move in the X-Y plane. For example, these elements may be movable in the X-Y plane to modify their position. A possible advantage of having a substantially fixed individually controllable element 102 is that power and / or data transfer can be made to the individually controllable element 102 more easily. A further or alternative possible advantage is that the ability to locally adjust the focus to compensate for height differences in the substrate that is greater than the focal depth of the system and is higher than the pitch of the movable controllable element is improved.

In this embodiment, the individually controllable element 102 is substantially fixed, but there is at least one optical element that moves relative to the individually controllable element 102. The various configurations of the individually controllable element 102 that are substantially fixed in the X-Y plane and the optical elements that are movable relative thereto are now described.

In the following description, the term "lens" generally refers to any one or any of various types of optical components including refractive, reflective, magnetic, electromagnetic, and electrostatic optical components, Reflective, and / or diffractive optical element that provides the same function as the lens, lens, or combination of lenses, for example, the referenced lens. For example, an imaging lens may be implemented in the form of a conventional refractive lens with optical power, in the form of a Schwarzschild reflective system with optical power, and / or in the form of a zone plate with optical power . Further, the imaging lens may include non-imaging optics if the resulting effect is to produce a beam that converges on the substrate.

In the following description, too, reference is made to a plurality of individually controllable elements 102, such as a mirror of a mirror array modulator or a plurality of radiation sources. However, it should be understood that this description refers more generally to a modulator configured to output a plurality of beams. For example, the modulator may be an acousto-optic modulator for outputting a plurality of beams from a beam provided by the radiation source.

Figure 19 is a schematic diagram of an optical system according to an embodiment of the present invention having a plurality of individually controllable elements 102 (e.g., laser diodes) and a movable optical element 242 Is a schematic plan view layout for some of the lithographic apparatus. In this embodiment, a plurality of individually controllable elements 102 are attached to the frame and are substantially fixed in the XY plane, and the plurality of imaging lenses 242 are substantially (As indicated by the rotational display of wheel 801 in Fig. 19), and the substrate moves in direction 803. In this way, In one embodiment, the imaging lens 242 moves relative to the individually controllable element 102 by rotating about an axis. In one embodiment, the imaging lens 242 is mounted on the rotatable structure about an axis (e.g., in the direction shown in Figure 19) and is mounted in a circular fashion (e. G., Partially shown in Figure 19) As shown in FIG.

Each individually controllable element 102 provides a collimated beam to a mobile imaging lens 242. [ In one embodiment, the individually controllable element 102 is associated with one or more collimating lenses to provide a collimated beam. In one embodiment, the collimating lens (s) is attached to a frame that is substantially fixed to the X-Y plane and to which the individually controllable element 102 is attached.

In this embodiment, the cross-sectional width of the collimated beam is smaller than the cross-sectional width of the imaging lens 242. [ Thus, as soon as the collimated beam enters the optically transmissive portion of the imaging lens 242, the individually controllable element 102 (e.g., a laser diode) can be switched on. The individually controllable element 102 (e.g., a laser diode) is then switched off when the beam exits the optically transmissive portion of the imaging lens 242. Thus, in one embodiment, the beam from the individually controllable element 102 passes through a single imaging lens 242 at any time. The resulting traversal of the imaging lens 242 to the beam from the individually controllable element 102 produces a corresponding imaged line 800 on the substrate from each individually controllable element 102 that is turned on do. 19, three imaged lines 800 are shown for each of the three exemplary individually controllable elements 102 in FIG. 19, but the remaining individually controllable elements 102 in FIG. Lt; RTI ID = 0.0 > 800 < / RTI >

19, the imaging lens 242 pitch can be 1.5 mm, and the cross-sectional width (e.g., diameter) of the beam from each individually controllable element 102 is slightly less than 0.5 mm. With this configuration, it is possible to record a line with a length of about 1 mm, with each individually controllable element 102. Thus, in this configuration of a beam diameter of 0.5 mm and an imaging lens 242 diameter of 1.5 mm, the duty cycle may be as high as 67%. By properly positioning the individually controllable element 102 with respect to the imaging lens 242, complete coverage over the width of the substrate is possible. Therefore, for example, when only a standard 5.6 mm diameter laser diode is used, some concentric rings of laser diodes can be used to obtain full coverage over the substrate width, as shown in FIG. Thus, in the present embodiment, fewer, individually controllable elements 102 (such as those shown in FIG. 1) are used than using a fixed array of individually controllable elements 102 or perhaps using the mobile, individually controllable elements 102 described herein ) (For example, a laser diode) may be used.

In this embodiment, each imaging lens 242 must be identical since each individually controllable element 102 will be imaged by all of the movable imaging lenses 242. [ In this embodiment, a higher NA lens is required, but not all imaging lenses 242 need to image the field, for example an NA lens greater than 0.3, greater than 0.18, or greater than 0.15 is required. With this single optical element, diffraction limited imaging is possible.

The focus of the beam on the substrate is fixed to the optical axis of the imaging lens 242, regardless of where the collimated beam enters the lens (e.g., a schematic three-dimensional 20). A disadvantage of this arrangement is that the beam from the imaging lens 242 towards the substrate is not telecentric, resulting in a focus error and possibly an overlay error.

In this embodiment, adjusting the focus by using an element that does not move in the X-Y plane (e.g., in the individually controllable element 102) is likely to cause vignetting. Thus, adjustment of the desired focus must occur at the mobile imaging lens 242. [ Therefore, it may require an actuator of higher frequency than the mobile imaging lens 242. [

Figure 21 is a schematic side view layout for a portion of a lithographic apparatus having individually controllable elements and movable optical elements that are substantially fixed in the XY plane, according to one embodiment of the present invention, 3 shows three different rotational positions of the set of imaging lenses 242 for element 102. By allowing the imaging lens 242 to include two lenses 802 and 804 for receiving the collimated beam from the individually controllable element 102 in this embodiment, the lithographic apparatus of Figures 19 and 20 are extended . 19, the imaging lens 242 moves relative to the individually controllable element 102 in the XY plane (e.g., when the imaging lens 242 is at least partially circularly arranged, ). In this embodiment, the beam from the individually controllable element 102 is collimated by the lens 806 before it reaches the imaging lens 242, but in one embodiment such a lens need not be provided. The lens 806 is substantially fixed in the X-Y plane. The substrate moves in the X direction.

The two lenses 802 and 804 are arranged in the optical path of the collimated beam from the individually controllable element 102 to the substrate such that the beam towards the substrate is telecentric. Between the individually controllable element 102 and the lens 804, the lens 802 includes two lenses 802A and 802B having substantially the same focal length. The collimated beam from the individually controllable element 102 is focused between the two lenses 802A and 802B such that the lens 802B collimates the beam towards the imaging lens 804. [ Imaging lens 804 implements the beam onto the substrate.

In this embodiment, the lens 802 moves at a predetermined rate (e.g., at a specific RPM (number of revolutions per minute)) in the X-Y plane with respect to the individually controllable element 102. Thus, in this embodiment, the collimated beam exiting lens 802 will have a velocity in the X-Y plane that is twice the velocity of moving imaging lens 242 when traveling at the same speed as lens 802. Thus, in the present embodiment, the imaging lens 804 moves at a different speed than the lens 802 with respect to the individually controllable element 102. In particular, the imaging lens 804 moves in the XY plane at twice the speed of the lens 802 (e.g., twice the RPM of the lens 802) and the beam will be telecentricly focused on the substrate . This alignment of the collimated beam exiting the lens 802 onto the imaging lens 804 is schematically illustrated in three exemplary positions in FIG. Further, since the actual recording on the substrate will be performed at twice the speed of the example of FIG. 19, the power of the individually controllable element 102 must be doubled.

In this embodiment, adjusting the focus by using elements that do not move in the X-Y plane (e.g., in the individually controllable element 102) is likely to cause loss of telecentric characteristics and vignetting. Thus, adjustment of the desired focus must occur at the mobile imaging lens 242. [

Further, in the present embodiment, not all the imaging lenses 242 need to image the field. With this single optical element, diffraction limited imaging is possible. A duty cycle of about 65% is possible. In one embodiment, lenses 806, 802A, 802B, and 804 may include two aspherical lenses and two spherical lenses.

In one embodiment, about 380 individually controllable elements 102 (e.g., standard laser diodes) may be used. In one embodiment, a set of about 1,400 imaging lenses 242 may be used. In an embodiment using a standard laser diode, a set of about 4,200 imaging lenses 242 may be used, which may be arranged in six concentric rings on the wheel. In one embodiment, the rotatable wheel of the imaging lens can rotate at about 12,000 RPM.

Figure 22 is a schematic side view layout for a portion of a lithographic apparatus having individually controllable elements and movable optical elements that are substantially fixed in the XY plane, according to one embodiment of the present invention, 3 shows three different rotational positions of the set of imaging lenses 242 for element 102. In this embodiment, a so-called 4f telecentric in / telecentric out imaging system for moving the imaging lens 242, in order to avoid lenses moving at different speeds as described in connection with Fig. 21, And can be used as shown. The mobile imaging lens 242 includes two imaging lenses 808,810 (e.g., rotating about an axis if the imaging lens 242 is at least partially circularly arranged) moving at substantially the same velocity in the XY plane ) And receives a telecentric beam, i.e., a telecentric imaging beam, as an input and an output to the substrate. In this configuration of magnification ratio 1, the image on the substrate travels at twice the speed of the movable imaging lens 242. The substrate moves in the X direction. In such an arrangement, the optics would need to image the field with a relatively large NA, for example greater than 0.3, greater than 0.18, or greater than 0.15. This configuration may not be possible with two single element optics. To obtain a diffraction limited image, more than six elements with very precise alignment tolerances may be required. A duty cycle of about 65% is possible. In this embodiment, it is relatively easy to locally focus using elements that do not move along the movable imaging lens 242 or that do not move with the movable imaging lens 242. [

Figure 23 is a schematic side view layout for a portion of a lithographic apparatus having an individually controllable element and a movable optical element that are substantially fixed in the XY plane, according to one embodiment of the present invention, Showing the five different rotational positions of the set of imaging lenses 242 for the element 102. FIG. In this embodiment, in order to avoid lenses moving at different velocities as described in connection with Fig. 21 and to have optics that do not image fields as discussed in connection with Fig. 22, they are substantially fixed in the XY plane Is combined with the movable imaging lens (242). Referring to Figure 23, there is provided an individually controllable element 102 that is substantially fixed in the X-Y plane. (Not shown) to collimate the beam from the individually controllable element 102 and to provide the lens 812 with a collimated beam (e.g., having a cross-sectional width (e.g., diameter) of 0.5 mm) An optional collimating lens 806 is provided.

The lens 812 is also substantially fixed in the XY plane and focuses the collimated beam onto a field lens 814 (e.g., having a cross-sectional width (e.g., diameter) of 1.5 mm) of the mobile imaging lens 242 do. The lens 814 has a relatively large focal length (e.g., f = 20 mm).

The field lens 814 of the movable imaging lens 242 moves relative to the individually controllable element 102 (e.g., rotating about an axis if the imaging lens 242 is at least partially circularly arranged) . The field lens 814 directs the beam towards the imaging lens 818 of the mobile imaging lens 242. As with the field lens 814, the imaging lens 818 moves relative to the individually controllable element 102 (e.g., rotating about an axis if the imaging lens 242 is at least partially circularly arranged) . In this embodiment, the field lens 814 moves at substantially the same speed as the imaging lens 818. The pair of field lens 814 and imaging lens 818 are aligned with respect to each other. The substrate moves in the X direction.

There is a lens 816 between the field lens 814 and the imaging lens 242. The lens 816 is substantially fixed in the X-Y plane and collimates the beam from the field lens 814 to the imaging lens 818. The lens 816 has a relatively large focal length (e.g., f = 20 mm).

In this embodiment, the optical axis of the field lens 814 will coincide with the optical axis of the corresponding imaging lens 816. The field lens 814 is designed such that the beam is folded such that the primary light beam of the beam that is collimated by the lens 816 coincides with the optical axis of the imaging lens 818. [ In this way, the beam towards the substrate is telecentric.

Lenses 812 and 816 may be simple spherical lenses due to their large f value. Field lens 814 should not affect image quality and may also be a spherical element. In this embodiment, collimating lens 806 and imaging lens 818 are lenses that do not need to image fields. With such a single element optical instrument, diffraction limited imaging is possible. A duty cycle of about 65% is possible.

In one embodiment, when the movable imaging lens 242 is rotatable, at least two concentric rings of lenses and individually controllable elements 102 are provided to obtain full coverage over the width of the substrate. In one embodiment, the individually controllable elements 102 on such a ring are arranged at a pitch of 1.5 mm. If a standard laser diode with a diameter of 5.6 mm is used, at least six concentric rings may be required for full coverage. Figures 24 and 25 illustrate the construction of concentric rings of individually controllable elements 102 in accordance with this configuration. In one embodiment, this would be approximately 380 individually controllable elements 102 with corresponding lenses substantially fixed in the X-Y plane. The mobile imaging lens 242 will have 700 x 6 rings = 4,200 sets of lenses 814, 818. With this arrangement, it is possible to record a line having a length of about 1 mm with each individually controllable element 102. In one embodiment, a set of about 1,400 imaging lenses 242 may be used. In one embodiment, lenses 812, 814, 816, and 818 may comprise four aspherical lenses.

In the present embodiment, adjusting the focus by using an element that does not move in the XY plane (e.g., in the individually controllable element 102) results in loss of telecentric characteristics and is likely to cause vignetting . Thus, adjustment of the desired focus must occur at the mobile imaging lens 242. [ Therefore, it may require an actuator of higher frequency than the movable imaging lens 242. [

Figure 26 is a schematic side view layout for a portion of a lithographic apparatus having an individually controllable element and a movable optical element that are substantially fixed in the X-Y plane, in accordance with an embodiment of the present invention. In this embodiment, an optical derotator is used to couple the individually controllable element 102, which is substantially fixed in the X-Y plane, to the movable imaging lens 242. [

In this embodiment, the individually controllable elements 102 are arranged in a ring with an optional collimating lens. The two parabolic curved mirrors 820 and 822 reduce the ring of collimated beams from the individually controllable elements 102 to an acceptable diameter for the detolator 824. [ In Fig. 26, a Pechan prism is used as the derotator 824. Each separately controllable element 102 appears to be substantially fixed with respect to the individual imaging lens 242 when the di rotator rotates at a speed half the speed of the imaging lens 242. [ Two additional parabolic curved mirrors 826 and 828 expand the rings of the de-rotated beam from the di rotator 824 to an acceptable diameter for the movable imaging lens 242. The substrate moves in the X direction.

In this embodiment, each individually controllable element 102 is paired with an imaging lens 242. Therefore, it may not be possible to mount the individually controllable elements 102 on a concentric ring, and thus the overall coverage across the width of the substrate may not be obtained. A duty cycle of about 33% is possible. In this embodiment, the imaging lens 242 is a lens that does not need to image the field.

Figure 27 is a schematic side view layout for a portion of a lithographic apparatus having an individually controllable element that is substantially fixed in the X-Y plane and a movable optical element therealong, in accordance with an embodiment of the present invention. In this configuration, the imaging lens 242 is configured to rotate about a direction extending in the X-Y plane (e.g., a rotatable drum rather than a rotatable wheel as described in connection with FIGS. 19-26). 27, a movable imaging lens 242 is arranged on a drum configured to rotate, for example, about the Y direction. The movable imaging lens 242 receives radiation from the individually controllable element 102, which extends linearly in the Y direction between the movable imaging lens 242 and the rotational axis of the drum. In principle, the lines that can be written by the movable imaging lens 242 of this drum may be parallel to the scan direction 831 of the substrate. Thus, the di rotator 830 mounted at 45 ° is configured to rotate the line made by the movable imaging lens 242 of the drum by 90 ° so that the imaged line is perpendicular to the scanning direction of the substrate. The substrate moves in the X direction.

For all stripes on the substrate, a circularly arranged imaging lens 242 may be required on the drum. If such a circle can record a 3 mm wide stripe on a substrate and the substrate width is 300 mm, 700 (optics on the circumference of the drum) x 100 = 70,000 optical assemblies may be required on the drum. And may be less when cylindrical optics are used on the drum. Further, in this embodiment, the imaging optics may need to image a particular field, which may make the optics more complex. A duty cycle of about 95% is possible. An advantage of this embodiment is that the imaged stripes can be substantially parallel and straight, with substantially the same length. It is also relatively easy to locally focus using elements that do not move along the movable imaging lens 242 or that do not move with the movable imaging lens 242.

28 is a schematic side view layout for a portion of a lithographic apparatus having individually controllable elements and movable optical elements that are substantially fixed in the XY plane, according to one embodiment of the present invention, Lt; / RTI > shows the five different rotational positions of the set of imaging lenses 242 for the element.

28, there is provided an individually controllable element 102 that is substantially fixed in the X-Y plane. The movable imaging lens 242 includes a plurality of lens sets, each of which includes a field lens 814 and an imaging lens 818. The substrate moves in the X direction.

The field lens 814 (e.g., a spherical lens) of the movable imaging lens 242 moves in direction 815 relative to the individually controllable element 102 (e.g., the imaging lens 242 At least partially circularly arranged, about the axis). The field lens 814 guides the beam toward the imaging lens 818 of the movable imaging lens 242 (e.g., an aspherical lens such as a double aspherical lens). As with the field lens 814, the imaging lens 818 moves relative to the individually controllable element 102 (e.g., rotating about an axis if the imaging lens 242 is at least partially circularly arranged) . In this embodiment, the field lens 814 moves at substantially the same speed as the imaging lens 18.

The focal plane of the field lens 814 coincides at a location 815 with the inverse focal plane of the imaging lens 818, providing a telecentric in / telecentric out system. In contrast to the configuration of FIG. 23, the imaging lens 818 implements a particular field. The focal length of the field lens 814 is such that the field size for the imaging lens 818 is a half angle less than two to three degrees. Even in this case, it is still possible to obtain diffraction-limited imaging with one single-element optical device (e.g., a double aspherical single element). The field lens 814 is configured to be mounted without a gap between each field lens 814. In this case, the duty cycle of the individually controllable element 102 may be about 95%.

The focal length of the imaging lens 818 is such that, in the case of a NA of 0.2 at the substrate, such a lens is not larger than the diameter of the field lens 814. The focal length of the imaging lens 818 that is equal to the diameter of the field lens 814 will provide the diameter of the imaging lens 818 leaving sufficient space to mount the imaging lens 818. [

Because of the field angle, a line slightly larger than the pitch of the field lens 814 can be recorded. Which also provides superimposition between the imaged lines of the neighboring individually controllable elements 102 on the substrate, depending on the focal length of the imaging lens 818. [ Thus, the individually controllable element 102 can be mounted on the same ring at the same pitch as the imaging lens 242.

29 is a schematic three-dimensional view of a portion of the lithographic apparatus of FIG. In the figure, five individually controllable elements 102 are shown with five corresponding movable imaging lens sets 242. In this figure, It will be apparent that additional individually controllable elements 102 and corresponding movable imaging lens set 242 may be provided. The substrate moves in the X direction as indicated by the arrow 819. [ In one embodiment, the field lens 814 is arranged without a gap therebetween. The pupil plane is located at 817.

In order to avoid a relatively small dual aspheric imaging lens 818 and to reduce the amount of optics of the mobile imaging lens 242 and to use a standard laser diode as an individually controllable element 102, There is a possibility to image a number of individually controllable elements 102 with a single lens set of imaging lenses 242. [ The corresponding imaging lens 818 includes an individually controllable element 102 as long as the individually controllable element 102 is telecentricly imaged onto the field lens 814 of each movable imaging lens 242. [ Will re-image the beam from the substrate back onto the substrate telecentrically. For example, if eight lines are to be recorded at the same time, the diameter of the field lens 814 and the focal length of the imaging lens 818 may be increased by 8 times in the same yield, while the amount of the movable imaging lens 242 is 8 It can be reduced by a factor of two. Further, because some of the optics needed to image the individually controllable element 102 on the field lens 814 may be common, the optics that are substantially fixed in the X-Y plane may be reduced. This configuration in which eight lines are simultaneously recorded by a single set of movable imaging lenses 242 is achieved by rotating the imaging lens 242 from the rotational axis 821 and the radius of the set of imaging lenses 242 from that rotational axis 821 , And is schematically shown in Fig. (When eight lines are simultaneously recorded by a single set of movable imaging lenses 242) begins at a pitch of 1.5 mm to 12 mm, sufficient to mount a standard laser diode as an individually controllable element 102 Leaving space. In one embodiment, 224 individually controllable elements 102 (e.g., standard laser diodes) may be used. In one embodiment, a set of 120 imaging lenses 242 may be used. In one embodiment, 28 sets of substantially fixed optics can be used with 224 individually controllable elements 102.

In this embodiment, it is also relatively easy to locally focus using elements that do not move along the movable imaging lens 242 or that do not move with the movable imaging lens 242. As far as the telecentric image of the individually controllable element 102 on the field lens 814 is moved along the optical axis and remains telecentric, only the focal point of the image on the substrate will change and the image will be telecentric It will remain. Fig. 31 shows a schematic configuration for controlling focus using a movable roof top in the configurations of Figs. 28 and 29; Fig. Two folding mirrors 832 with a roof top (e.g., a prism or mirror set) 834 are located in the telecentric beam from the individually controllable element 102 prior to the field lens 814. By moving the roof top 834 in the direction 833 away from the folding mirror 832 or toward the folding mirror 832, the image is shifted along the optical axis and thus also shifted with respect to the substrate. Axial focus shift is F / is the same proportion to the square of the value along the optical axis due to enlargement in size, 25㎛ defocus at the substrate to F / 2.5 beam field to f / 37.5 beam of 5.625mm (37.5 / 2.5) ² Lens 814 will provide a focus shift. In other words, the loop top 834 must move to half thereof.

32 is a schematic side cross-sectional view of a portion of a lithographic apparatus having an individually controllable element and a movable optical element that are substantially fixed in the X-Y plane, in accordance with an embodiment of the present invention. 32 shows a configuration similar to that of FIG. 23, but may be suitably modified to suit any of the embodiments of FIGS. 19-22 and / or 24-31.

32, the lithographic apparatus 100 includes a substrate table 106 for holding a substrate, and a positioning mechanism 116 for moving the substrate table 106 to a degree of freedom of 6 or less.

The lithographic apparatus 100 further includes a plurality of individually controllable elements 102 arranged on the frame 160. In this embodiment, each individually controllable element 102 is a radiation emitting diode, e.g., a laser diode, such as a violet laser diode. The individually controllable elements 102 are arranged on the frame 838 and extend along the Y direction. Although only one frame 838 is shown, the lithographic apparatus may have a plurality of frames 838 as well as the array 200, for example, as shown in FIG. On the frame 838, lenses 812 and 816 are further arranged. The frame 838, and thus the individually controllable element 102, and the lenses 812 and 816 are substantially fixed in the X-Y plane. The frame 838, the individually controllable element 102 and the lenses 812 and 816 can be moved in the Z direction by an actuator 836. [

In this embodiment, the frame 840 is provided so as to be rotatable. A field lens 814 and an imaging lens 818 are arranged on the frame 840 and the combination of the field lens 814 and the imaging lens 818 forms a movable imaging lens 242. [ In use, the plate rotates about its axis 206, e.g., in the direction indicated by the arrow in FIG. 5 relative to the array 200. The frame 840 is rotated about an axis 206 using a motor 216. Frame 840 can also be moved in the Z direction by motor 216 so that movable imaging lens 242 can be displaced relative to substrate table 106. [

In this embodiment, an aperture structure 248 having an aperture therein may be located on the lens 812, between the lens 812 and the corresponding individually controllable element 102. The aperture structure 248 may limit the diffraction effect of the lens 812, the corresponding individually controllable element 102, and / or the adjacent lens 812 / the individually controllable element 102.

In one embodiment, the lithographic apparatus 100 includes one or more movable plates 890 (e.g., rotatable plates, e.g., rotatable disks) that include an optical element, e.g., a lens. In the embodiment of Figure 32, a plate 890 with a field lens 814 and a plate 890 with an imaging lens 818 are shown. In one embodiment, the lithographic apparatus is free of any reflective optical elements that are rotated during use. In one embodiment, the lithographic apparatus does not have any reflective optical element that receives radiation from any individually controllable element 102 or from all individually controllable elements 102 and that rotates during use. In one embodiment, one or more (e. G., All) plates 890 are substantially planar and have any optical element (or portion of the optical element) projecting above or below one or more surfaces of the plate It is not. This may be accomplished, for example, by providing a flat cover plate (not shown) on the plate 890 to allow the plate 890 to be thick enough (i. E. At least to place the optical element at least thicker than the height of the optical element, . Having the at least one surface of the plate substantially planar can help reduce noise, for example, when the device is in use.

33 is a schematic side cross-sectional view of a portion of a lithographic apparatus having individually controllable elements substantially fixed in the X-Y plane. The lithographic apparatus 900 includes a substrate table 902 for holding a substrate and a positioning mechanism 904 for moving the substrate table 902 to a degree of freedom of 6 or less. The substrate may be a resist coated substrate. In one embodiment, the substrate is a wafer. In one embodiment, the substrate is a polygonal (e.g., rectangular) substrate. In one embodiment, the substrate is a glass plate. In one embodiment, the substrate is a plastic substrate. In one embodiment, the substrate is a foil. In one embodiment, the lithographic apparatus is suitable for roll-to-roll manufacturing.

The lithographic apparatus 900 further includes a plurality of individually controllable self-emitting contrast devices 906 configured to emit a plurality of beams. In one embodiment, the self-emitting contrast device 906 includes a radiation emitting diode, for example, a light emitting diode (LED), an organic LED (OLED), a polymer LED (PLED), or a laser diode to be. In one embodiment, each individually controllable element 906 is a blue violet laser diode (e.g., Sanyo model number DL-3146-151). Such diodes can be supplied by companies such as Sanyo, Nichia, Osram, and Nitride. In one embodiment, the diode emits UV radiation having, for example, a wavelength of about 365 nm or about 405 nm. In one embodiment, the diode may provide a selected output power in the 0.5 to 100 mW range. In one embodiment, the size of the laser diode (pure die size) is selected in the range of 100 to 800 micrometers. In one embodiment, the laser diode has a selected emission area in the range of 1 to 5 square micrometers. In one embodiment, the laser diode has a selected divergence angle in the range of 7 to 44 degrees. In one embodiment, the diode has a configuration (e.g., emission region, divergence angle, output power, etc.) to provide a total luminance of about 6.4 x 10 ⁸ W / (m 2.

The individually controllable device 906 may be arranged on the frame 908 and extend along the Y direction and / or the X direction. Although only one frame 908 is shown, the lithographic apparatus may have a plurality of frames 908. On the frame 908, a lens 920 is further arranged. The frame 908, and thus the individually controllable self-emitting contrast device 906 and the lens 920 are substantially fixed in the X-Y plane. The frame 908, the individually controllable contrast device 906 and the lens 920 can be moved in the Z direction by the actuator 910. [ Alternatively, the lens 920 may be moved in the Z direction by an actuator associated with the particular lens. Each lens 920 may be provided with its own actuator.

The self-emitting contrast device 906 may be configured to emit a beam and the projection systems 920, 924, and 930 may be configured to project the beam onto a target portion of the substrate. The self-emitting contrast device 906 and the projection system form an optical column. The lithographic apparatus 900 may include an actuator (e.g., a motor 918) configured to move an optical column or a portion thereof relative to a substrate. A frame 912 on which the field lens 924 and the imaging lens 930 are arranged may be rotatable by an actuator. The combination of the field lens 924 and the imaging lens 930 forms a movable optical device 914. In use, the frame 912 rotates about its axis 916, e.g., in the direction indicated by the arrow in Fig. The frame 912 is rotated about an axis 916 using an actuator, for example, a motor 918. The frame 912 can be moved in the Z direction by the motor 910 so that the movable optical device 914 can be displaced with respect to the substrate table 902. [

An aperture structure 922 having an aperture therein may be positioned on the lens 920 between the lens 920 and the self-emission contrast device 906. The aperture structure 922 is configured to provide a diffractive effect 908 of a lens 920, a corresponding individually controllable self-emitting contrast device 906, and / or an adjacent lens 920 / individually controllable self- .

The depicted apparatus can be used by rotating the frame 912 and simultaneously moving the substrate on the substrate table 902 below the optical column. The self-emitting contrast device 906 may emit a beam through the lenses 920, 924, and 930 when the lenses 920, 924, and 930 are substantially aligned with respect to each other. By moving the lenses 924 and 930, the image of the beam on the substrate is scanned over a portion of the substrate. By simultaneously moving the substrate on the substrate table 902 under the optical column, the portion of the substrate that is the object of the image of the self-emitting contrast device 906 is also moved. Also, by switching on and off the self-emission contrast device 906 at high speed under the control of a controller that controls the rotation of the optical column or a portion of the two and controls the speed of the substrate, the required pattern can be imaged onto the resist layer on the substrate .

34 is a schematic plan view of the lithographic apparatus of FIG. 33 with self-emission contrast device 906. FIG. 33, the lithographic apparatus 900 includes a substrate table 902 for holding a substrate 928, and a position for moving the substrate table 902 to a degree of freedom of 6 or less And a setting mechanism 904. In one embodiment, the lithographic apparatus may be arranged to determine alignment between the individually addressable element 906 and the substrate 928 and to determine alignment of the substrate 928 with respect to the projection of the self- / Level sensor 932 as shown in FIG. As shown, the substrate 928 has a rectangular shape, but additionally or alternatively, a round shaped substrate may also be processed.

The self-emitting contrast device 906 is arranged on a frame 926. The self-emitting contrast device 906 is a radiation emitting diode, for example a laser diode, such as a violet laser diode. As shown in FIG. 34, the self-emitting contrast device 906 may be arranged in an array 934 extending in the X-Y plane.

This array 934 may be an elongated line. In one embodiment, such an array 934 can be a one-dimensional array of one or more individually addressable contrast devices 906. In one embodiment, such an array 934 may be a two-dimensional array of one or more individually addressable contrast devices 906.

A rotatable frame 912 capable of rotating in a direction indicated by an arrow can be provided. The rotatable frame may be provided with lenses 924 and 930 (see FIG. 33) to provide an image of each individually addressable contrast device 906.

The apparatus may be provided with an actuator for rotating an optical column including a frame 912 and lenses 924 and 930 with respect to the substrate. Movement of the optical column or a portion thereof can cause turbulence around the lens. This movement can cause a density change in the medium surrounding the optical column. This change in density can cause optical effects, referred to as Schlieren, which degrade the imaging of the beam on the substrate 928. [

35 and 36 schematically illustrate the lithographic apparatus of FIG. 33, which is configured to reduce the optical effect of the density variation of the medium around the moving part of the optical column relative to the beam. The compartment 936 may substantially surround the rotatable frame 912 and the space within the compartment 936 may be evacuated by the pump 944 to reduce the pressure. One or more openings may be provided to deliver the reduced pressure across the compartment 936. By reducing these pressures, the effect of the schlieren can be reduced. The pressure in the compartment can be reduced to less than 1 bar, less than 100 mbar, less than 20 mbar, or less than 10 mbar.

In the compartment 936, a specific medium, such as helium, may be provided from the gas reservoir 946 to reduce the schlieren effect. The advantage of using helium is that it has better cooling characteristics than conventional air. The movement of the optical column or a portion thereof can heat a portion of the lithographic apparatus. The improved cooling capacity of helium can reduce this heating. The provision of helium may be combined with a reduction in space and / or pressure between the compartment 936 and the lenses 924, 930, or may be used as a separate solution. Certain gases, such as reduced pressure and helium, can be combined with lower rotational speeds to further reduce the schlieren effect.

The beam 938 emitted by the self-emitting contrast device 906 passes through window 940 in the compartment to the substrate 928 on the substrate table. Movement of the frame 912 may cause turbulence in the medium in which the frame 912 is moving. The window 940 can be moved by this turbulence. This movement of the window 940 can also cause the beam to move, which would be detrimental to projecting the beam onto the target portion of the substrate.

Additionally or alternatively, movement of the window 940 may be caused by reducing the pressure in the compartment 936. The compartment may have a limited stiffness and lowering the pressure may cause the top plate 956 and / or the bottom plate 954 to move, thus moving the window 940, thereby also moving the beam 938 . The pressure in the compartment can be controlled to less than 1 bar, less than 100 mbar, less than 30 mbar and / or less than 10 mbar.

Fig. 36 schematically depicts the lithographic apparatus of Fig. 33, which is configured to reduce the optical effect of the density variation of the medium around the moving part of the optical column relative to the beam. The compartment 936 may substantially surround the rotatable frame 912 and the space in the compartment 936 may be vented by the pump 944 to reduce the pressure. One or more openings 942 may be provided to deliver the reduced pressure through the entire compartment 936. [ By reducing these pressures, the effect of the schlieren can be reduced. The pressure in the compartment can be reduced to less than 1 bar, less than 100 mbar, less than 20 mbar, or less than 10 mbar.

In the compartment 936, a specific medium, such as helium, may be provided from the gas reservoir 946 to reduce the schlieren effect. The advantage of using helium is that it has better cooling characteristics than conventional air. The movement of the optical column or a portion thereof can heat a portion of the lithographic apparatus. The improved cooling capacity of helium can reduce this heating. The provision of helium may be combined with a reduction in space and / or pressure between the compartment 936 and the lenses 924, 930, or may be used as a separate solution. Certain gases, such as reduced pressure and helium, can be combined with lower rotational speeds to further reduce the schlieren effect. Movement of the window 940 may be caused by reducing the pressure in the compartment 936. The compartment may have limited rigidity and the lower plate 954 and / or the upper plate 956 of the compartment may be rotated by reducing the pressure, thus moving the window 940, thereby also moving the beam 938 . The pressure in the compartment can be controlled to less than 1 bar, less than 100 mbar, less than 30 mbar and / or less than 10 mbar.

Figure 37 is a lithographic apparatus configured to reduce the optical effect of density changes of the medium around the moving part of the optical column relative to the beam. A self-emitting contrast device 906 emits a beam of radiation through rotating lenses 924, 930 and fixed lens 920 that are connected to a rotatable frame 912. The compartment 936 provides a substantially closed environment for the rotatable lenses 924,930. The enclosed environment may have a reduced pressure, and / or helium may be provided as described above. Movement of the frame 912 may cause turbulence in the medium in which the frame 912 moves. The window 940 can be moved by this turbulence. This movement of the window 940 can also cause the beam to move, which would be detrimental to projecting the beam onto the target portion of the substrate.

Movement of the window can be caused by reducing the pressure in the compartment 936. The compartment 936 may have a limited stiffness and by lowering the pressure the upper plate 956 and / or the lower plate 954 of the compartment 936 may be rotated, thus moving the window in the upper and / Thereby also moving the beam. The pressure in the compartment can be controlled to less than 1 bar, less than 100 mbar, less than 30 mbar and / or less than 10 mbar.

Figures 38A-C schematically illustrate a lithographic apparatus. 38A discloses a rotatable frame 912 (partially shown) having a rotatable portion 950 that partially closes the space between the lenses 924 and 930, Is partially open. Such a rotatable frame will be more similar to the rotating drum in this embodiment. The turbulence between the lenses 924 and 930 can be minimized in this way. The lithographic apparatus is also provided with a fixed cover 952, which partially encloses the space between the lenses 920, 924 leaving a space open for the beam to pass through. A window 940 may be provided below the stationary cover 952 to prevent gas from entering the open space within the stationary cover 952. [ Below the lens 930, a plate 948 with a window 940 is provided to reduce or minimize turbulence. The window 940 can also protect the lens 930 from foreign objects coming from the substrate.

Fig. 38B discloses an embodiment in which a plate 948 is provided in the vicinity of movable lenses 924 and 930. Fig. The plate 948 may be provided with a transparent portion, i.e., a window 940. Plate 948 can reduce turbulence and reduce the effect of shrinkage around the moveable lens.

Figure 38c discloses an embodiment in which a fixed covering 952 is provided around the beam. The fixed cover 952 is provided with a transparent window 940 near the open space in the covering 952 through which the beam passes. This reduces the sensitivity of the beam to turbulence caused by the movement of the lenses 924 and 930. Movement of the lenses 924 and 930 may cause turbulence in the medium through which the frame 912 moves. The window 940 can be moved by this turbulence. This movement of the window 940 can also cause the beam to move, which would be detrimental to projecting the beam onto the target portion of the substrate.

Figure 39 schematically illustrates a portion of a lithographic apparatus according to an embodiment of the present invention, from a side view and from above. The compartment 936 (only partially shown) is provided with a lower plate 954 with a window 940. The window 940 is mechanically mounted to the device with high rigidity. The lower plate 954 and the window 940 can be flexibly connected with relatively low stiffness such that movement of the bottom plate does not cause movement of the window 940. [ For example, the window 940 can be connected to the bottom plate 954 with a glue, a membrane, a flexible adhesive or rubber. The window 940 may be provided with a rubber O-ring for mounting it on the lower plate 954. [ In this way, the lower plate 954 can move inward without exerting pressure on the window 940. [ The window 940 may be rigidly mounted to the compartment 936 of the device or base frame. Because the window 940 is smaller than the entire bottom plate 954, the force on the window 940 is much smaller. Therefore, it is easier to mount the window 940 so as to remain optically flat and / or in the correct position without movement.

A leaky seal 958 may be provided between the window 940 and the bottom plate. The leak seal is a very small opening, e. G., Less than 200 micrometers, less than 50 micrometers, or less than 10 micrometers, which mechanically isolates the window from the bottom plate 954. This small opening restricts the inflow of gas through the leak seal 958 to the interior of the compartment.

Embodiments are also presented below with the following numbered items:

1. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to expose an exposure area of the substrate to a plurality of beams modulated according to a required pattern; And

A projection system configured to project a modulated beam onto a substrate, the projection system comprising a lens array for receiving a plurality of beams,

Wherein the projection system is configured to move the lens array relative to the modulator during exposure of the exposure area.

2. In the first embodiment,

Each lens comprising at least two lenses arranged along a beam path of at least one of the plurality of beams from the modulator to the substrate.

3. In the second embodiment,

Wherein the first of the at least two lenses comprises a field lens and the second of the at least two lenses comprises an imaging lens.

4. In the third embodiment,

Wherein the focal plane of the field lens coincides with the inverse focal plane of the imaging lens.

5. In the third embodiment or the fourth embodiment,

Wherein the imaging lens comprises a double aspherical lens.

6. In any one of the third to fifth embodiments,

Wherein the focal length of the field lens is such that the field size for the imaging lens is a half angle smaller than two to three degrees.

7. In any one of the third to sixth embodiments,

Wherein the focal length of the imaging lens is such that the imaging lens is not larger than the diameter of the field lens when NA is 0.2 on the substrate.

8. In the seventh embodiment,

Wherein the focal length of the imaging lens is equal to the diameter of the field lens.

9. In any one of the third to eighth embodiments,

Wherein a plurality of beams are imaged in a single combination of a field lens and an imaging lens.

10. In any one of the third to ninth embodiments,

Further comprising a focus control device arranged along a beam path of at least one of the plurality of beams from the modulator to the field lens.

11. The method of embodiment 10,

Wherein the focus control device comprises a folding mirror and a movable roof top.

12. In a third embodiment,

And a lens for collimating the beam from the first lens to the second lens.

13. The twelfth embodiment,

Wherein the lens on the path for collimating the beam is substantially fixed to the modulator.

14. In the third embodiment, the twelfth embodiment or the thirteenth embodiment,

Further comprising a lens in a path between the modulator and the first lens for focusing at least one of the plurality of beams toward the first lens.

15. The process of embodiment 14,

Wherein the lens on the path for focusing the beam is substantially fixed to the modulator.

16. In any one of the third or twelfth to fifteenth embodiments,

Wherein the optical axis of the field lens coincides with the optical axis of the imaging lens.

17. In a second embodiment,

Wherein the first of the at least two lenses comprises at least two sub-lenses and at least one of the plurality of beams is focused in the middle of the two sub-lenses.

18. The process of embodiment 17,

Each of the at least two sub-lenses having substantially the same focal length.

19. In any one of the second, seventeenth, or eighteenth embodiment,

Wherein the first lens is configured to output a collimated beam towards the second of the at least two lenses.

20. In any one of the second embodiment, or the seventeenth through nineteenth embodiments,

Wherein the first lens of the at least two lenses is configured to move at a different speed than the second one of the at least two lenses.

21. The twentieth embodiment,

The speed of the second lens being twice the speed of the first lens.

22. In a first embodiment,

Each lens comprising a 4f telecentric in / telecentric out imaging system.

23. The process of embodiment 22,

4f. A lithographic apparatus comprising a telecentric in / telecentric out imaging system comprising at least six lenses.

24. In a first embodiment,

Further comprising a derotator between the modulator and the lens array.

25. The process of embodiment 24,

Wherein the di rotator comprises a Pechan prism.

26. The twenty-fourth embodiment or the twenty-fifth embodiment,

Wherein the divertor is configured to move to a half of the speed of the lens array.

27. In any one of the twenty-fourth to twenty-sixth embodiments,

Further comprising a parabolic curved mirror for reducing the size of the beam between the modulator and the de-rotator.

28. In any one of the twenty-fourth to twenty-seventh embodiments,

Further comprising a parabolic curved mirror for increasing the size of the beam between the di rotator and the lens array.

29. In any one of the first through twenty-eighth embodiments,

Wherein the lens array is rotated relative to the modulator.

30. In any one of the first through twenty-ninth embodiments,

Wherein the modulator comprises a plurality of individually controllable radiation sources for emitting electromagnetic radiation.

31. In any one of the first through twenty-ninth embodiments,

Wherein the modulator comprises a micromirror array.

32. In any one of the first to twenty-ninth embodiments,

Wherein the modulator comprises a radiation source and an acousto-optic modulator.

33. A device manufacturing method comprising:

Providing a plurality of beams modulated according to a required pattern; And

Projecting a plurality of beams onto a substrate using a lens array that receives a plurality of beams; And

Moving the lens array relative to the beam during projection

≪ / RTI >

34. The method of embodiment 33,

Each lens comprising at least two lenses arranged along a beam path of at least one of the plurality of beams from the source of the at least one beam to the substrate.

35. The method of embodiment 34,

Wherein the first of the at least two lenses comprises a field lens and the second of the at least two lenses comprises an imaging lens.

36. The method of embodiment 35,

Wherein the focal plane of the field lens coincides with the inverse focal plane of the imaging lens.

37. The 35th embodiment or the 36th embodiment,

Wherein the imaging lens comprises a double aspherical lens.

38. In any one of the 35th to 37th embodiments,

Wherein the focal length of the field lens is such that the field size for the imaging lens is a half angle smaller than two to three degrees.

39. The method according to any one of < RTI ID = 0.0 > 35th < / RTI &

Wherein the focal length of the imaging lens is such that the imaging lens is not larger than the diameter of the field lens when NA is 0.2 at the substrate.

40. The process of embodiment 39,

Wherein the focal length of the imaging lens is equal to the diameter of the field lens.

41. In any one of the 35th to 40th embodiments,

Wherein the plurality of beams is imaged in a single combination of a field lens and an imaging lens.

42. In any one of the 35th to 41nd embodiments,

Using a focus control device between a source of at least one of the plurality of beams and a field lens.

43. The process of embodiment 42 wherein < RTI ID = 0.0 >

Wherein the focus control device comprises a folding mirror and a movable roof top.

44. The process of embodiment 35 wherein,

Further comprising the step of collimating at least one beam between the first lens and the second lens using a lens.

45. The process of embodiment 44,

Wherein the lens for collimating at least one beam is substantially fixed with respect to at least one beam.

46. The method as in any one of the 35th, 44th, or 45th embodiments,

Further comprising the step of focusing at least one of the plurality of beams toward the first lens using a lens in a path between the source of the at least one beam and the first lens.

47. The process of embodiment 46 wherein < RTI ID = 0.0 >

Wherein the lens for focusing at least one beam is substantially fixed with respect to at least one beam.

48. The method according to any one of the thirty-fifth to 44th embodiments,

Wherein the optical axis of the field lens coincides with the optical axis of the corresponding imaging lens.

49. The process of embodiment 34,

Wherein the first of the at least two lenses comprises at least two sub-lenses, and at least one of the plurality of beams is focused in the middle of the two sub-lenses.

50. The process of embodiment 49,

Each of the at least two sub-lenses having substantially the same focal length.

51. The method as in any of the 34th, 49th, or 50th embodiments,

Wherein the first lens is configured to output a collimated beam toward the second one of the at least two lenses.

52. The method according to any one of the thirty-fourth to fifty-first embodiments, or forty-eighth to fifty-first embodiments,

Moving a first one of the at least two lenses at a different speed than a second one of the at least two lenses.

53. The process of embodiment 52 wherein < RTI ID = 0.0 >

Wherein the speed of the second lens is twice the speed of the first lens.

54. The method of embodiment 33,

Wherein each lens comprises a 4f telecentric in / telecentric out imaging system.

55. The process of embodiment 54,

4f. A method of manufacturing a device, wherein the telecentric in / telecentric out imaging system comprises at least six lenses.

56. The method of embodiment 33,

Further comprising derotating the beam between the source of the beam and the lens array using a di rotator.

57. The method of embodiment 56,

Wherein the di rotator comprises a Pechan prism.

58. The process cartridge of embodiment 56 or claim 57,

And moving the di rotator to one half the speed of the lens array.

59. In any one of embodiments 56 to 58,

Further comprising using a parabolic curved mirror to reduce the size of the beam between the source of the beam and the detonator.

60. In any one of the 56th to 59th embodiments,

Further comprising increasing the size of the beam between the source of the beam and the detonator using a parabolic curved mirror.

61. In any one of embodiments 33 to 60,

And rotating the lens array relative to the beam.

62. The method according to any one of the thirty-third to sixty-first embodiments,

Each of the plurality of individually controllable radiation sources emitting each of the plurality of beams.

63. In any one of the 33nd to 61nd embodiments,

Wherein the micromirror array emits a plurality of beams.

64. In any one of embodiments 33 to 61,

Wherein the radiation source and the acousto-optic modulator generate a plurality of beams.

65. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator comprising a plurality of individually controllable radiation sources for emitting electromagnetic radiation and configured to expose an exposure area of the substrate to a plurality of beams modulated according to a required pattern; And

A projection system configured to project a modulated beam onto a substrate, the projection system comprising a lens array for receiving a plurality of beams,

/ RTI >

Wherein the projection system is configured to move the lens array relative to an individually controllable radiation source during exposure of the exposure region.

66. A device manufacturing method comprising:

Providing a plurality of beams modulated according to a required pattern using a plurality of individually controllable radiation sources;

Projecting a plurality of beams onto a substrate using a lens array that receives a plurality of beams; And

Moving the lens array relative to the individually controllable radiation source during projection

≪ / RTI >

67. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to expose an exposure area of the substrate to a plurality of beams modulated according to a required pattern; And

A projection system configured to project a modulated beam onto a substrate, the projection system comprising a plurality of lens arrays for receiving a plurality of beams,

/ RTI >

Each lens array being arranged separately along a beam path of the plurality of beams.

68. The process of embodiment 67 wherein < RTI ID = 0.0 >

Wherein the projection system is configured to move the lens array relative to the modulator during exposure of the exposure area.

69. The 67th embodiment or the 68th embodiment,

Wherein the lenses of each array are arranged in a single body.

70. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A plurality of individually controllable radiation sources for emitting electromagnetic radiation and configured to expose an exposure area of the substrate to a plurality of beams modulated according to a required pattern, wherein less than a few radiation sources, A modulator configured to move a plurality of radiation sources relative to the exposure area during exposure of the exposure area so that the exposure area can be exposed at any time; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

71. A lithographic apparatus comprising:

A plurality of individually controllable radiation sources configured to provide a plurality of beams modulated in accordance with a required pattern, wherein at least one of the plurality of radiation sources is movable between a position emitting radiation and a position not emitting radiation, A plurality of individually controllable radiation sources;

A substrate holder configured to hold a substrate; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

72. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A plurality of individually controllable radiation sources for emitting electromagnetic radiation and configured to expose an exposure area of the substrate to a plurality of beams modulated according to a desired pattern, wherein at least one of the plurality of radiation sources A modulator configured to move at least one radiation source of the plurality of radiation sources relative to the exposure area during exposure of the exposure area such that the radiation is adjacent or overlapping with radiation from at least another of the plurality of radiation sources; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

73. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A plurality of individually controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure area of the substrate, wherein at least one of the plurality of radiation sources has a position capable of emitting radiation to the exposure area A plurality of individually controllable radiation sources movable between a position where the radiation is not able to emit radiation to the exposure area and a position where radiation can not be emitted; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

74. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A plurality of individually controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate, the plurality of beams being configured to move a plurality of radiation sources relative to an exposure region during exposure of the exposure region The modulator having a plurality of beam outputs to an exposure region, the beam output having a region smaller than an output region of a plurality of radiation sources; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

75. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A plurality of arrays of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to each of the exposure areas of the substrate, wherein each array is moved relative to each exposure area, Wherein each of the plurality of arrays in the array is configured to move a plurality of beams from each of the plurality of arrays during movement of the array and a plurality of beams for each of the plurality of arrays, A modulator adjacent or superimposed on each exposure area of the other array; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

76. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate, wherein each of the plurality of radiation sources is moved relative to the exposure region, A modulator configured to move a plurality of beams or to move both a plurality of respective radiation sources and a plurality of beams with respect to an exposure area, wherein each radiation source in use operates at an oblique portion of each power / A modulator; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

77. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate, wherein each of the plurality of radiation sources is moved relative to the exposure region, A modulator configured to move a plurality of beams or to move both a plurality of respective radiation sources and a plurality of beams with respect to an exposure area, wherein each of the individually controllable radiation sources comprises a blue-violet laser diode; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

78. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the modulator configured to move each of the plurality of radiation sources relative to the exposure region, Wherein the radiation source of the radiation source is arranged in at least two concentric circular arrays; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

79. The method of embodiment 78,

Wherein at least one circular array of circular arrays is arranged in a staggered manner with at least one other circular array of circular arrays.

80. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the modulator configured to move each of the plurality of radiation sources relative to the exposure region, Wherein the radiation source of the radiation source is arranged around a center of the structure and the structure has an opening extending through the structure inside the plurality of radiation sources; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

81. The process of embodiment 80,

Further comprising a support for holding the substrate structure at or outside the radiation source.

82. The process of embodiment 81 wherein < RTI ID = 0.0 >

Wherein the support includes a bearing that allows movement of the structure.

83. The 81st embodiment or the 82nd embodiment,

Wherein the support comprises a motor for moving the structure.

84. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the modulator configured to move each of the plurality of radiation sources relative to the exposure region, Wherein the radiation source of the radiation source is arranged around a center of the structure;

A support for holding a structure to or from a radiation source, the support configured to rotate the structure or allow rotation of the structure; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

85. The process of embodiment 84 wherein < RTI ID = 0.0 >

Wherein the support includes a bearing that allows rotation of the structure.

86. The process of embodiment 84 or 85 wherein < RTI ID = 0.0 >

Wherein the support comprises a motor for rotating the structure.

87. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the modulator configured to move each of the plurality of radiation sources relative to the exposure region, Wherein the radiation source of the radiation source is arranged on a movable structure and the movable structure is arranged on a movable plate; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

88. The process as set forth in claim 87,

Wherein the movable structure is rotatable.

89. The process as set forth in embodiment 87 or 88,

Wherein the movable plate is rotatable.

90. The process as claimed in claim 89,

Wherein the center of rotation of the movable plate is inconsistent with the center of rotation of the movable structure.

91. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the modulator configured to move each of the plurality of radiation sources relative to the exposure region, Wherein the radiation source of the radiation source is arranged within the movable structure or on the movable structure;

A fluid channel arranged in the movable structure to provide a temperature control fluid adjacent at least a plurality of radiation sources; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

92. The process of embodiment 91 wherein < RTI ID = 0.0 >

Further comprising a sensor located within the movable structure or on the movable structure.

93. The process of embodiment 91 or 92, wherein < RTI ID = 0.0 >

Further comprising a sensor disposed at a location adjacent to the at least one radiation source of the plurality of radiation sources, but not disposed within or within the movable structure.

94. The process as in any one of embodiments 92 through 93,

Wherein the sensor comprises a temperature sensor.

95. In any one of the embodiments 92 to 94,

Wherein the sensor comprises a sensor configured to measure the rate of expansion and / or shrinkage of the structure.

96. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the modulator configured to move each of the plurality of radiation sources relative to the exposure region, Wherein the radiation source of the radiation source is arranged within the movable structure or on the movable structure;

A fin arranged in the movable structure or on the movable structure to provide temperature control of the structure; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

97. The process of embodiment 96,

Further comprising a retaining pin cooperating with the pin within the moveable structure or on the moveable structure.

98. The process of embodiment 97,

Wherein the at least two fins in the movable structure or at least one of the at least two fins on the movable structure are movable in or on the movable structure, And at least one of the at least two fins on the substrate.

99. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure area of the substrate, the modulator configured to move each of the plurality of radiation sources relative to the exposure area, Wherein the radiation source of the radiation source is arranged in the movable structure or on the movable structure;

A fluid supply device configured to supply fluid to the outer surface of the structure to control the temperature of the structure; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

100. The process of embodiment 99 wherein < RTI ID = 0.0 >

Wherein the fluid supply device is configured to supply gas.

101. The process of embodiment 99 wherein < RTI ID = 0.0 >

Wherein the fluid supply device is configured to supply liquid.

102. The process as claimed in claim 101,

Further comprising a fluid confinement structure configured to hold the liquid in contact with the structure.

[0073] 103. The process of embodiment 102,

Wherein the fluid confinement structure is configured to maintain a seal between the structure and the fluid confinement structure.

104. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the plurality of radiation sources being movable relative to the exposure region; And

A plurality of radiation sources, each of the plurality of radiation sources being attached to or in proximity to a respective radiation source,

And a lithographic apparatus.

105. The process of embodiment 104,

Further comprising an actuator configured to displace the lens relative to each radiation source.

106. The process cartridge of embodiment 104 or 105 wherein:

Further comprising an actuator configured to displace the lens and each radiation source relative to the lens and the structure supporting each radiation source.

107. The process of embodiment 105 or 106 above,

Wherein the actuator is configured to move the lens at a degree of freedom of 3 or less.

108. In any one of embodiments 104-107,

Further comprising an aperture structure downstream from at least one of the plurality of radiation sources.

109. The reader as in any one of embodiments 104-107,

Wherein the lens supports the lens and each radiation source and is attached to a structure having a high thermal conductivity.

110. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the plurality of radiation sources being movable relative to the exposure region;

A spatial coherence decay device configured to scramble the radiation from at least one of the plurality of radiation sources; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

111. The process of embodiment 110 wherein < RTI ID = 0.0 >

Wherein the spatial coherence decay device comprises a fixed plate and the at least one radiation source is movable relative to the plate.

112. The process of embodiment 110,

Wherein the spatial coherence decay device comprises at least one selected from: a phase modulator, a rotatable plate, or a vibratory plate.

113. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the plurality of radiation sources being movable relative to the exposure region;

A sensor configured to measure a focus associated with at least one of the plurality of radiation sources, wherein at least some of the sensors are within the at least one radiation source or on the at least one radiation source; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

114. The process of embodiment 113 wherein < RTI ID = 0.0 >

Wherein the sensor is configured to individually measure a focus associated with each radiation source.

115. The process of embodiment 113 or claim 114,

Wherein the sensor is a knife edge focus detector.

116. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the plurality of radiation sources being movable relative to the exposure region;

A transmitter configured to wirelessly transmit signals and / or power to a plurality of radiation sources to control a plurality of radiation sources, respectively, and / or to power a plurality of radiation sources; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

117. The process of embodiment 116 wherein < RTI ID = 0.0 >

Wherein the signal comprises a plurality of signals and wherein the lithographic apparatus further comprises a demultiplexer for transmitting each of the plurality of signals toward each radiation source.

118. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the modulator configured to move each of the plurality of radiation sources relative to the exposure region, Wherein the radiation source of the radiation source is arranged within the movable structure or on the movable structure;

A single line configured to couple a controller to a moveable structure, to control a plurality of radiation sources, and / or to transmit a plurality of signals and / or power to a plurality of radiation sources to supply power to the plurality of radiation sources; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

119. The process of embodiment 118 wherein < RTI ID = 0.0 >

Wherein the signal comprises a plurality of signals and wherein the lithographic apparatus further comprises a demultiplexer for transmitting each of the plurality of signals toward each radiation source.

120. The process of embodiment 118 or 119, wherein < RTI ID = 0.0 >

Wherein the line comprises an optical line.

121. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the plurality of radiation sources being movable relative to the exposure region;

A sensor for measuring a characteristic of radiation to be transmitted or transmitted towards the substrate by at least one radiation source of the plurality of radiation sources; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

122. The process of embodiment 121,

Wherein at least a portion of the sensors are located in or on the substrate holder.

123. The process of embodiment 122 wherein,

Wherein at least some of the sensors are located in or on the substrate holder at an external location of a region where the substrate is supported on the substrate holder.

124. The method as in any one of the embodiments 121-123,

Wherein at least some of the sensors are located at the substrate side which, in use, extends substantially in the scanning direction of the substrate.

125. The method as in any one of the embodiments 121-124,

Wherein at least some of the sensors are mounted on or in a frame for supporting a movable structure.

126. The method as in any one of embodiments 121-125,

Wherein the sensor is configured to measure radiation from at least one radiation source outside the exposure area.

127. The method as in any one of embodiments 121-126,

Wherein at least a portion of the sensor is movable.

128. The method as in any one of embodiments 121-123,

And a controller configured to calibrate the at least one radiation source based on the sensor results.

129. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the modulator configured to move each of the plurality of radiation sources relative to the exposure region, Wherein the radiation source of the radiation source is arranged within the movable structure or on the movable structure;

A sensor for measuring the position of the movable structure; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

130. The process of embodiment 129,

Wherein at least some of the sensors are mounted on or in a frame that supports a movable structure.

131. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a desired pattern to an exposure area of the substrate, the modulator configured to move each of the plurality of radiation sources relative to the exposure area, A plurality of radiation sources of the modulator, the modulator having or providing an identification;

A sensor configured to detect the identifier; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

132. The process of embodiment 131,

Wherein at least some of the sensors are mounted on or in a frame that supports a plurality of radiation sources.

133. The process of embodiment 131 or 132 above,

Wherein the identifier comprises a frequency of radiation from each radiation source.

134. The method as in any one of embodiments 131-133,

Wherein the identifier comprises at least one of: a bar code, a radio frequency identifier, or a mark.

135. A lithographic apparatus comprising:

A substrate holder configured to hold a substrate;

A modulator configured to include a plurality of individually controllable radiation sources and configured to provide a plurality of beams modulated according to a required pattern to an exposure region of the substrate, the plurality of radiation sources being movable relative to the exposure region;

A sensor configured to detect radiation from at least one radiation source of the plurality of radiation sources, redirected by the substrate; And

A projection system configured to project a modulated beam onto a substrate

/ RTI >

136. The process of embodiment 135,

Wherein the sensor is configured to determine a position of a radiation spot from at least one radiation source incident on the substrate from the redirected radiation.

137. In any one of embodiments 70-136,

Wherein the modulator is configured to rotate at least one radiation source about an axis substantially parallel to the direction of propagation of the plurality of beams.

138. The method as in any one of embodiments 70-137,

Wherein the modulator is configured to translate at least one radiation source in a direction transverse to the direction of propagation of the plurality of beams.

[0072] 139. The method as in any one of embodiments 70-138,

The modulator comprising a beam deflector configured to move a plurality of beams.

140. The process of embodiment 139,

Wherein the beam deflector is selected from the group consisting of a mirror, a prism, or an acousto-optic modulator.

141. The process of embodiment 139,

Wherein the beam deflector comprises a polygon.

142. The process of embodiment 139,

Wherein the beam deflector is configured to vibrate.

143. The process of embodiment 139,

Wherein the beam deflector is configured to rotate.

144. The method as in any one of embodiments 70-143,

Wherein the substrate holder is configured to move the substrate in a direction in which a plurality of beams are provided.

145. The process of embodiment 144,

Wherein movement of the substrate is rotation.

146. The method as in any one of embodiments 70-145,

Wherein the plurality of radiation sources are movable together.

147. In any one of embodiments 70-146,

Wherein the plurality of radiation sources are arranged in a circular shape.

148. The method according to any one of embodiments 70-147,

Wherein the plurality of radiation sources are arranged spaced apart from one another on the plate.

149. The method as in any one of embodiments 70-148,

Wherein the projection system comprises a lens array.

150. In any one of the 70th to 149th embodiments,

Wherein the projection system consists essentially of a lens array.

151. The process of embodiment 149 or claim 150,

The lens of the lens array has a high numerical aperture and the lithographic apparatus allows the substrate to be out of focus of the radiation associated with the lens in order to effectively lower the numerical aperture of the lens.

152. The method as in any one of embodiments 70-115,

Each radiation source comprising a laser diode.

153. The 152nd embodiment,

Wherein each laser diode is configured to emit radiation having a wavelength of about 405 nm.

154. In any one of embodiments 70-139,

Further comprising a temperature controller configured to maintain the plurality of radiation sources at a substantially constant temperature during exposure.

155. The process of embodiment 154,

The temperature controller is configured to heat the plurality of radiation sources to a substantially constant temperature or near a substantially constant temperature prior to exposure.

156. The method as in any one of embodiments 70-155,

Wherein each array comprises a plurality of radiation sources. ≪ RTI ID = 0.0 > 31. < / RTI >

157. The method as in any one of embodiments 70 to 156,

Wherein the plurality of radiation sources comprise at least about 1,200 radiation sources.

[0352] 158. The method as in any one of embodiments 70-139,

Further comprising an alignment sensor for determining alignment between at least one of the plurality of radiation sources and the substrate.

159. The method according to any one of embodiments 70-138,

Further comprising a level sensor for determining the position of the substrate relative to the focal point of at least one of the plurality of beams.

160. The controller of embodiment 158 or 159,

Further comprising a controller configured to change the pattern based on the alignment sensor result and / or the level sensor result.

161. In any one of embodiments 70-160,

Further comprising a controller configured to change a pattern based on a temperature measurement of at least one of the plurality of radiation sources or a measurement associated with the at least one radiation source.

162. In any one of embodiments 70-161,

Further comprising a sensor for measuring a characteristic of radiation to be transmitted or transmitted towards the substrate by at least one radiation source of the plurality of radiation sources.

163. A lithographic apparatus comprising:

A plurality of individually controllable radiation sources configured to provide a plurality of beams modulated according to a required pattern;

A lens array including a plurality of small lenses; And

A substrate holder configured to hold a substrate

Lt; / RTI >

Wherein during use, there is no optical device other than the lens array between the plurality of radiation sources and the substrate.

164. A programmable patterning device,

A substrate having an array of radiation emitting diodes spaced apart in at least one direction; And

The lens array on the downstream side of the radiation of the radiation-

The programmable patterning device.

165. The process of embodiment 164 wherein < RTI ID = 0.0 >

The lens array includes a microlens array having a plurality of microlenses, wherein the plurality of microlenses correspond to the plurality of radiation emitting diodes, and are arranged to focus the radiation selectively transmitted by each of the radiation emitting diodes to an array of microspots A programmable patterning device.

166. The process of any one of embodiments 164-116,

Wherein the radiation-emitting diodes are spaced apart in at least two orthogonal directions.

167. The method as in any one of embodiments 164-166,

A radiation-emitting diode is embedded in a material having a low thermal conductivity.

168. A device manufacturing method comprising:

Providing a plurality of beams modulated according to a required pattern toward an exposure area of the substrate using a plurality of individually controllable radiation sources;

Moving at least one radiation source of the plurality of radiation sources while providing a plurality of beams such that less than a plurality of radiation sources can expose an exposure area at any time; And

Projecting a plurality of beams onto a substrate

≪ / RTI >

169. A device manufacturing method comprising:

Providing a plurality of beams modulated according to a required pattern using a plurality of individually controllable radiation sources;

Moving at least one radiation source of the plurality of radiation sources between a position at which radiation is emitted and a position at which radiation is not emitted; And

Projecting a plurality of beams onto a substrate

≪ / RTI >

170. A device manufacturing method comprising:

Providing a modulated beam according to a required pattern using a plurality of individually controllable radiation sources and projecting the modulated beam from the plurality of individually controllable radiation sources onto the substrate using only the lens array. / RTI >

171. A method for manufacturing a device,

Providing a plurality of modulated electromagnetic radiation beams using a plurality of individually controllable radiation sources;

At least one radiation source of the plurality of radiation sources relative to the exposure area during exposure of the exposure area so that radiation from at least one radiation source of the plurality of radiation sources simultaneously adjoins or overlaps radiation from at least the other radiation source Moving; And

Projecting a plurality of beams onto a substrate

≪ / RTI >

172. The method as in any one of embodiments 168-171,

Wherein the moving step comprises rotating at least one radiation source about an axis substantially parallel to the propagation direction of the plurality of beams.

173. In any one of the 168th through 172th embodiments,

Wherein the moving step comprises translating at least one radiation source in a direction transverse to the direction of propagation of the plurality of beams.

[0073] 174. In any one of embodiments 168-173,

And moving the plurality of beams by using a beam deflector.

175. The process of embodiment 174 wherein < RTI ID = 0.0 >

Wherein the beam deflector is selected from the group consisting of a mirror, a prism, or an acousto-optic modulator.

176. The process of embodiment 174 wherein < RTI ID = 0.0 >

Wherein the beam deflector comprises a polygon.

177. The process of embodiment 174 wherein < RTI ID = 0.0 >

Wherein the beam deflector is configured to vibrate.

178. The process of embodiment 174 wherein < RTI ID = 0.0 >

Wherein the beam deflector is configured to rotate.

179. The method as in any one of embodiments 168-178,

And moving the substrate in a direction in which a plurality of beams are provided.

180. The process of embodiment 179 wherein < RTI ID = 0.0 >

Wherein movement of the substrate is rotation.

181. In any one of embodiments 168-180,

And moving the plurality of radiation sources together.

182. The method as in any one of embodiments 168-181,

Wherein the plurality of radiation sources are arranged in a circular shape.

183. In any one of the 168th through 182nd embodiments,

Wherein the plurality of radiation sources are arranged on the plate spaced apart from each other.

[0072] 184. The method according to any one of embodiments 168-183,

Wherein projecting comprises forming an image of each beam onto a substrate using a lens array.

185. The method as in any one of embodiments 168-184,

Wherein projecting comprises forming an image of each beam onto the substrate using substantially only the lens array.

186. The process of any one of embodiments 168-185,

Wherein each radiation source comprises a laser diode.

187. The process of embodiment 186 wherein < RTI ID = 0.0 >

Wherein each laser diode is configured to emit radiation having a wavelength of about 405 nm.

188. A flat panel display produced according to the method of any one of embodiments 168-187.

189. An integrated circuit device manufactured in accordance with the method of any one of embodiments 168-187.

190. A radiation system,

A plurality of moveable radiation arrays, each radiation array comprising a plurality of individually controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern; And

A motor configured to move each radiation array

.

191. The process of embodiment 190 wherein < RTI ID = 0.0 >

Wherein the motor is configured to rotate each radiation array about an axis substantially parallel to the direction of propagation of the plurality of beams.

192. The 190th embodiment or 191nd embodiment,

Wherein the motor is configured to translate each radiation array in a direction transverse to the direction of propagation of the plurality of beams.

193. In any one of the 190th through 192th embodiments,

≪ / RTI > further comprising a beam deflector configured to move a plurality of beams.

194. The 193 < th > embodiment,

Wherein the beam deflector is selected from the group consisting of a mirror, a prism, or an acousto-optic modulator.

195. The process of embodiment 193 wherein < RTI ID = 0.0 >

Wherein the beam deflector comprises a polygon.

196. The process of embodiment 193 wherein < RTI ID = 0.0 >

Wherein the beam deflector is configured to vibrate.

197. The process of embodiment 193 wherein < RTI ID = 0.0 >

Wherein the beam deflector is configured to rotate.

198. The method as in any one of embodiments 190-197,

Wherein a plurality of radiation sources of each radiation array are movable together.

199. In any one of embodiments 190-198,

Wherein a plurality of radiation sources of each radiation array are arranged in a circular shape.

200. The method according to any one of embodiments 190-199,

Wherein a plurality of radiation sources of each radiation array are arranged spaced apart from one another on the plate.

201. The system as in any one of embodiments 190-100,

Further comprising a lens array associated with each radiation array.

202. The process of embodiment 201 wherein < RTI ID = 0.0 >

Each of the plurality of radiation sources of each radiation array being associated with a lens of a lens array associated with the radiation array.

203. The reader as in any one of embodiments 190 to 202,

Wherein each of the plurality of radiation sources of each radiation array comprises a laser diode.

204. The process of embodiment 203,

Wherein each laser diode is configured to emit radiation having a wavelength of about 405 nm.

205. A lithographic apparatus for exposing a substrate to radiation,

A programmable patterning device having 100 to 25,000 individually addressable self-luminous elements.

206. The process of embodiment 205 wherein,

And at least 400 individually addressable self-luminous elements.

207. The process of embodiment 205 wherein,

And at least 1,000 individually addressable self-emitting elements.

208. The method as in any one of embodiments 205-207,

And less than 10,000 individually addressable self-emitting elements.

209. The method as in any one of embodiments 205-207,

And less than 5,000 individually addressable self-emitting elements.

210. The method as in any one of embodiments 205-209,

Wherein the individually addressable self-emitting element is a laser diode.

211. The method as in any one of embodiments 205 to 209,

Wherein the individually addressable self-emissive element is configured to have a spot size on a selected substrate in the range of 0.1 to 3 microns.

212. The method as in any one of embodiments 205 through 209,

Wherein the individually addressable self-emitting element is configured to have a spot size on a substrate of about 1 micron.

213. A lithographic apparatus for exposing a substrate to radiation,

And a programmable patterning device having 100 to 25,000 individually addressable self-luminous elements when standardized with an exposure field length of 10 cm.

214. The process of embodiment 213,

And at least 400 individually addressable self-luminous elements.

215. The process of embodiment 213,

And at least 1,000 individually addressable self-emitting elements.

216. The method as in any one of embodiments 213-215,

And less than 10,000 individually addressable self-emitting elements.

217. The method as in any one of embodiments 213-215,

And less than 5,000 individually addressable self-emitting elements.

218. The method as in any one of embodiments 213-27,

Wherein the individually addressable self-emitting element is a laser diode.

219. The method as in any one of the embodiments 213-27,

Wherein the individually addressable self-emissive element is configured to have a spot size on a selected substrate in the range of 0.1 to 3 microns.

220. The method as in any one of the embodiments 213-217,

Wherein the individually addressable self-emitting element is configured to have a spot size on a substrate of about 1 micron.

221. A programmable patterning device comprising a rotatable disk,

Wherein the disk has from 100 to 25,000 individually addressable self-emitting elements.

222. The process of embodiment 221,

Wherein the disk comprises at least 400 individually addressable self-emitting elements.

223. The process as in the embodiment 221,

Wherein the disk comprises at least 1,000 individually addressable self-emitting elements.

224. In any one of embodiments 221-23,

Wherein the disk comprises less than 10,000 individually addressable self-emitting elements.

225. The method as in any one of the embodiments 221-23,

Wherein the disk comprises less than 5,000 individually addressable self-emitting elements.

226. The method as in any one of embodiments 221-255,

Wherein the individually addressable self-emitting element is a laser diode.

227. Use of one or more of the present invention in the manufacture of a flat panel display.

228. Use of one or more of the present invention in integrated circuit packaging.

229. A lithographic method comprising exposing a substrate to radiation using a programmable patterning device having a self-

Wherein during power-on, the power consumption of the programmable patterning device for operating the self-emitting element is less than 10 kW.

230. The process of embodiment 229 wherein < RTI ID = 0.0 >

Wherein the power consumption is less than 5 kW.

231. The method as in 229 or 230,

Wherein the power consumption is at least 100 mW.

232. In any one of embodiments 229 to 231,

Wherein the self-emitting element is a laser diode.

[0323] 233. The process as in embodiment 232,

Wherein the laser diode is a blue-violet laser diode.

234. A lithographic method comprising exposing a substrate to radiation using a programmable patterning device having a self-

In use, the light output per light emitting element is at least 1 mW.

235. The process of embodiment 234 wherein < RTI ID = 0.0 >

Wherein the light output is at least 10 mW.

236. The process of embodiment 234 wherein < RTI ID = 0.0 >

Wherein the light output is at least 50 mW.

237. The method as in any one of embodiments 234 to 236,

Wherein the light output is less than 200 mW.

238. The method as in any one of the 234th to 237th embodiments,

Wherein the self-emitting element is a laser diode.

239. The process of embodiment 238 wherein < RTI ID = 0.0 >

Wherein the laser diode is a blue-violet laser diode.

240. The process of embodiment 234 wherein < RTI ID = 0.0 >

Wherein the light output is greater than 5 mW but not greater than 20 mW.

241. The process of embodiment 234 wherein < RTI ID = 0.0 >

Wherein the light output is greater than 5 mW but not greater than 30 mW.

242. The process of embodiment 234 wherein < RTI ID = 0.0 >

Wherein the light output is greater than 5 mW but not greater than 40 mW.

243. In any one of embodiments 234 to 242,

Wherein the self-emitting element operates in a single mode.

244. A lithographic apparatus comprising:

A programmable patterning device having a self-luminous element; And

A rotatable frame having an optical element for receiving radiation from the self-

Wherein the optical element is a refractive optical element.

245. A lithographic apparatus comprising:

A programmable patterning device having a self-luminous element; And

A rotatable frame having an optical element for receiving radiation from the self-

/ RTI >

Wherein the rotatable frame has no reflective optical element for receiving radiation from any or all of the self-emitting elements.

246. A lithographic apparatus comprising:

A programmable patterning device; And

A rotatable frame comprising a plate with optical elements

/ RTI >

The plate surface with optical elements is flat.

247. Use of one or more of the present invention in the manufacture of a flat panel display.

248. Use of one or more of the present invention in integrated circuit packaging.

249. A flat panel display produced according to any of the above methods.

250. An integrated circuit device manufactured according to any of the above methods.

251. A lithographic apparatus comprising:

An optical column for projecting a beam onto a target portion of a substrate, the optical column including a projection system configured to project the beam onto the target portion;

An actuator for moving the optical column or at least a portion thereof relative to the substrate; And

A window between the moving part of the optical column and the target part of the substrate and / or between the moving part of the optical column and the fixed part of the optical column

Lt; / RTI >

Wherein the window is constructed and arranged in the lithographic apparatus to reduce or minimize movement of the window.

252. The process of embodiment 251 wherein < RTI ID = 0.0 >

Further comprising a substantially closed compartment substantially surrounding the moving portion of the optical column.

253. The process of embodiment 252 wherein < RTI ID = 0.0 >

Further comprising a pump for controlling the pressure in the compartment to less than 1 bar, less than 100 mbar, less than 30 mbar, or less than 10 mbar.

254. The process of embodiment 252 or 253,

Further comprising a medium supply for providing a medium other than air to the compartment.

255. The method of embodiment 254,

Wherein the medium is helium.

256. In any one of embodiments 252 to 255,

Wherein the window is provided in the compartment and a portion of the compartment other than the window is flexibly connected to the window.

257. The method of any one of embodiments 252-264,

Wherein a portion of the compartment other than the window is movable relative to the window.

258. The process of embodiment 257 wherein < RTI ID = 0.0 >

Wherein the window is mounted as an O-ring or as a glue in a portion other than the window of the compartment.

259. The method according to any one of < RTI ID = 0.0 > 252 < / RTI &

Wherein the compartment is provided with a substantially circular bottom plate and the window is mounted to the substantially circular bottom plate radially outwardly from the center of the substantially circular bottom plate.

260. The method according to any one of < RTI ID = 0.0 > 251 < / RTI >

Wherein the moving part of the optical column comprises a lens, the beam passes through the lens and the window, and the distance between the lens and the window is less than 2 cm, less than 1 cm, less than 5 mm or less than 2 mm.

261. The method as in any one of operations 251 to 260,

Wherein said movement is rotational movement in excess of 500 RPM, above 1000 RPM, above 2000 RPM or above 4000 RPM.

262. The method according to any one of < RTI ID = 0.0 > 251 < / RTI >

Wherein the window comprises quartz.

263. In any one of embodiments 251 to 262,

Wherein the optical column comprises a self-emitting contrast device.

264. The process of embodiment 263 wherein < RTI ID = 0.0 >

Wherein the self-emission contrast device comprises a laser diode.

265. The method of any one of embodiments 251 to 264,

Wherein the window is flexibly connected to a portion of the lithographic apparatus and is fixedly connected to another portion of the lithographic apparatus.

266. A device manufacturing method comprising projecting a patterned radiation beam onto a substrate,

Projecting a beam onto a substrate using a projection system of an optical column to generate a pattern on a target portion of the substrate using the optical column;

Causing the beam to pass through a window; And

Moving the optical column or at least a portion thereof relative to the substrate while reducing or minimizing movement of the window

≪ / RTI >

267. The process of embodiment 266 wherein < RTI ID = 0.0 >

Wherein the optical column or at least a portion thereof is in a compartment containing the window and wherein reducing or minimizing movement by the window includes allowing movement between the window and a portion of the compartment other than the window. Gt;

Although specific reference may be made in this text to the use of lithographic apparatus in the manufacture of specific devices or structures (e.g., integrated circuits or flat panel displays), it should be understood that the lithographic apparatus and lithographic methods described herein may have other applications I have to understand. Such applications include but are not limited to integrated circuits, integrated optical systems, guidance and detection patterns for magnetic domain memories, flat panel displays, liquid crystal displays (LCDs), OLED displays, thin film magnetic heads, microelectromechanical systems (MEMS) , DNA chips, packaging (e.g., flip chips, rewiring, etc.), flexible displays or electronic devices (such as paper rewindable, bendable, defect-free, consistent, robust, And / or lightweight displays or electronics, such as flexible plastic displays), and the like. Also for example in flat panel displays, the present apparatus and method can be used to contribute to the creation of various layers, such as thin film transistor layers and / or color filter layers. As used herein, the term "wafer" or "die" is used interchangeably with the more general terms "substrate" or "target portion", respectively, As will be understood by those skilled in the art. The substrate referred to herein may be processed in a test track, typically a track (typically a device that applies a layer of resist to a substrate and develops the exposed resist), a metrology tool, and / or an inspection tool. To the extent applicable, the teachings of the present disclosure may be applied to the substrate processing apparatus and other substrate processing apparatuses. Also, for example, the substrate may be processed multiple times to create a multi-layer IC, so that the term substrate used herein may refer to a substrate that already contains multiple processed layers.

The flat panel display substrate may have a rectangular shape. A lithographic apparatus designed to expose a substrate of this type can cover the entire width of a rectangular substrate or provide an exposure area covering a portion of the width (e.g., 1/2 of the width). While the substrate is scanned below the exposure area, the patterning device may be scanned simultaneously through the patterned beam, or the patterning device may provide a variable pattern. In this way, all or a portion of the desired pattern is transferred to the substrate. If the exposure area covers the entire width of the substrate, the exposure can be completed in a single scan. If the exposure area covers, for example, one-half the substrate width, then the substrate may be moved laterally after the first scan to perform additional scanning to expose the remainder of the substrate.

The term "patterning device " as used herein should be broadly interpreted as referring to any device that can be used to modulate a cross section of a radiation beam, such as to create a pattern on (part of) a substrate. It should be noted that the pattern imparted to the radiation beam may not exactly correspond to the desired pattern in the target portion of the substrate, for example if the pattern comprises a phase-reversal feature or so-called assist feature. Likewise, the pattern ultimately generated on the substrate may not correspond to the pattern formed at any one moment on the array of individually controllable elements. This may be the case in a configuration in which a final pattern formed on each part of the substrate is formed over a given period or a given number of exposures, such that during a given period of time or a given number of exposures the pattern on the array of individually controllable elements and / As shown in FIG. Generally, a pattern created on a target portion of a substrate may be formed in a device, such as an integrated circuit or a specific functional layer of a flat panel display (e.g., a color filter layer of a flat panel display or a thin film transistor layer of a flat panel display) ). Examples of such patterning devices include, for example, reticles, programmable mirror arrays, laser diode arrays, light emitting diode arrays, grating light valves, and LCD arrays. An electronic device (e.g., a computer), including an electronically programmable patterning device having a plurality of programmable elements that impart a pattern to a radiation beam by modulating the phase of the portion of the radiation beam relative to an adjacent portion of the radiation beam (E.g., a patterning device that includes a plurality of programmable elements, each capable of modulating the intensity of a portion of a radiation beam, such as all of the features referred to in the preceding sentence except for the reticle, Devices) are collectively referred to herein as "contrast devices ". In one embodiment, the patterning device includes at least 10 programmable elements, such as at least 100, at least 1,000, at least 10,000, at least 100,000, at least 1,000,000, or at least 10,000,000 programmable elements. Embodiments of some of these devices are discussed in more detail below.

- Programmable mirror array. The programmable mirror array may include a matrix-addressable surface having a viscoelastic control layer and a reflective surface. According to the basic principle of this device, for example, the addressed area of the reflective surface reflects the incoming radiation as diffracted radiation, while the unaddressed area reflects the incoming radiation as undiffracted radiation. With a suitable spatial filter, the undiffracted radiation can be filtered out of the reflected beam, leaving only the diffracted radiation to reach the substrate. In this way, the beam is patterned according to the addressing pattern of the matrix-addressable surface. Alternatively, the filter may filter the diffracted radiation, leaving un-diffracted radiation to reach the substrate. An array of diffractive optical MEMS devices may also be used in a corresponding manner. The diffractive optical MEMS device may include a plurality of reflective ribbons that may be deformed relative to one another to form a grating that reflects the incoming radiation to the diffracted radiation. A further embodiment of a programmable mirror array utilizes a matrix array of miniature mirrors, each of which can be individually tilted about an axis by applying a suitable local electric field or using piezoelectric actuation means. The degree of tilt defines the state of each mirror. Such a mirror is controllable by an appropriate control signal from the controller if the element is free of defects. Each defect-free element is controllable so that the state of either of a series of states can be employed to adjust the intensity of the corresponding pixel in the projected radiation pattern. Once again, the mirrors are matrix-addressable so that the addressed mirrors reflect the incident radiation beam in a direction different from the unaddressed mirror; In this way, the reflected beam can be patterned according to the addressing pattern of the matrix-addressable mirror. The required matrix addressing can be performed using suitable electronic means. More information regarding the mirror arrays referred to herein can be found, for example, in U.S. Pat. Nos. 5,296,891 and 5,523,193, and PCT patent applications WO 98/38597 and WO 98/33096, Which is incorporated herein by reference in its entirety.

- Programmable LCD array. An example of such a configuration is provided in U.S. Patent No. 5,229,872, which is incorporated herein by reference in its entirety.

The lithographic apparatus may include one or more patterning devices, e.g., one or more contrasting devices. For example, such devices may have a plurality of arrays of individually controllable elements that are each independently controlled relative to one another. In such an arrangement, some or all of the arrays of individually controllable elements may share a common illumination system (or part of an illumination system), a common support structure for an array of individually controllable elements, and / A portion of the projection system).

If pre-biasing of features, optical proximity effect correction features, phase shift techniques and / or multiple exposure techniques are used, for example, a pattern "displayed" on an array of individually controllable elements It should be appreciated that the pattern may be substantially different from the pattern eventually transferred to or onto the substrate. Likewise, a pattern ultimately generated on a substrate may not correspond to a pattern formed at any one moment on an array of individually controllable elements. In a configuration in which a final pattern formed on each portion of the substrate is formed over a given period or a given number of exposures and during such a given period or number of exposures the pattern on the array of individually controllable elements and / This is because the position is changed.

The projection system and / or illumination system may include various types of optical components for guiding, shaping, or controlling the beam of radiation, such as refractive, reflective, magnetic, electromagnetic, electrostatic or other types Or any combination thereof. ≪ / RTI >

The lithographic apparatus may be of a type having two (e.g., dual stage) or more substrate tables (and / or two or more patterning device tables). In such "multiple stage" devices it is possible to use additional tables in parallel, or to use one or more other tables for exposure while performing a preliminary process on one or more tables.

The lithographic apparatus may also be of the type in which at least a portion of the substrate has a "liquid immersion ", e.g. a space between the projection system and the substrate, which has a relatively high refractive index, is covered with water. The immersion liquid may also be added to another space within the lithographic apparatus, for example, a space between the patterning device and the projection system. The immersion technique is used to increase the NA of the projection system. The term "immersion" as used herein means that the structure, e.g. the substrate, is meant to be immersed in the liquid, rather than the liquid being positioned between the projection system and the substrate during exposure.

The apparatus also includes a fluid treatment cell (e.g., to selectively adhere the chemical to the substrate or selectively modify the surface structure of the substrate) to allow interaction between the fluid and the irradiated portion of the substrate .

In one embodiment, the substrate may have a substantially circular shape and may optionally have a notched and / or planarized edge along a portion of the periphery. In one embodiment, the substrate has a polygonal shape, e.g., a rectangular shape. Embodiments in which the substrate has a substantially circular shape include those having a diameter of at least 25 mm, such as at least 50 mm, at least 75 mm, at least 100 mm, at least 125 mm, at least 150 mm, at least 175 mm, at least 200 mm, at least 250 mm, ≪ / RTI > In one embodiment, the diameter of the substrate is less than 500 mm, less than 400 mm, less than 350 mm, less than 300 mm, less than 250 mm, less than 200 mm, less than 150 mm, less than 100 mm, or less than 75 mm. Embodiments in which the substrate is polygonal, e.g., rectangular, include at least one side, e.g., at least two sides, or at least three sides, at least three sides of at least 5 cm, such as at least 25 cm, at least 50 cm, at least 100 cm, At least 200 cm, or at least 250 cm. In one embodiment, the length of at least one side of the substrate is no greater than 1,000 cm, such as no greater than 750 cm, no greater than 500 cm, no greater than 350 cm, no greater than 250 cm, no greater than 150 cm, or no greater than 75 cm. In one embodiment, the substrate is a rectangular substrate having a length of about 250-350 cm and a width of about 250-300 cm. The thickness of the substrate may vary and may depend, for example, to some extent on the substrate material and / or substrate dimensions. In one embodiment, the thickness is at least 50 microns, such as at least 100 microns, at least 200 microns, at least 300 microns, at least 400 microns, at least 500 microns, or at least 600 microns. In one embodiment, the thickness of the substrate is not more than 5,000 mu m, such as not more than 3,500 mu m, not more than 2,500 mu m, not more than 1,750 mu m, not more than 1,250 mu m, not more than 1,000 mu m, Or 300 mu m or less. The substrate referred to herein can be processed in a track, typically a device that applies a layer of resist to a substrate and develops the exposed resist, before and after exposure. The properties of the substrate can be measured before and after exposure, for example with metrology tools and / or inspection tools.

In one embodiment, a resist layer is provided on the substrate. In one embodiment, the substrate is a wafer, for example a semiconductor wafer. In one embodiment, the wafer material is selected from the group consisting of Si, SiGe, SiGeC, SiC, Ge, GaAs, InP and InAs. In one embodiment, the wafer is a III / V compound semiconductor wafer. In one embodiment, the wafer is a silicon wafer. In one embodiment, the substrate is a ceramic substrate. In one embodiment, the substrate is a glass substrate. Glass substrates may be useful, for example, in the manufacture of flat panel displays and liquid crystal display panels. In one embodiment, the substrate is a plastic substrate. In one embodiment, the substrate is transparent (with respect to the naked eye). In one embodiment, the substrate is colored. In one embodiment, the substrate is colorless.

In one embodiment, the patterning device 104 is described and / or shown as being on the substrate 114, but alternatively or additionally may be located below the substrate 114. Also, in one embodiment, the patterning device 104 and the substrate 114 may be positioned side by side, e.g., the patterning device 104 and the substrate 114 extend vertically, and the pattern is projected horizontally. In one embodiment, the patterning device 104 is provided for exposing at least two opposite surfaces of the substrate 114. For example, to expose such a surface, at least two patterning devices 104 may be provided, at least on opposite sides of the substrate 114. In one embodiment, a single patterning device 104 for projecting one side of the substrate 114 and a suitable optical device (e.g., a single patterning device 104) for projecting the pattern from the single patterning device 104 onto the other side of the substrate 114 For example, a beam guiding mirror) may be provided.

While specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described. For example, an embodiment of the present invention may be implemented as a computer program containing one or more sequences of machine-readable instructions describing a method as disclosed above, or a data storage medium (e.g., Semiconductor memory, magnetic or optical disk).

Furthermore, although the present invention has been disclosed in the context of specific embodiments and examples, it will be apparent to those of ordinary skill in the art that the present invention extends beyond the specifically disclosed embodiments to other alternative embodiments and / or uses of the invention and obvious modifications and equivalents As shown in FIG. Additionally, although numerous modifications and variations of the present invention have been shown and described in detail, other modifications that are within the scope of this invention based on this disclosure will be apparent to those skilled in the art. For example, it is contemplated that various combinations or subcombinations of specific features and aspects of the embodiments are within the scope of the invention. It is therefore to be understood that the various features and aspects of the disclosed embodiments may be combined or substituted with one another to form the various modes of the disclosed invention. For example, in one embodiment, the movable individually controllable elements of FIG. 5 may be combined with non-movable arrays of individually controllable elements, for example to provide or have a backup system.

Thus, while various embodiments of the invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. Accordingly, the scope of the present invention should not be limited by any of the above-described exemplary embodiments, but should be determined only in accordance with the appended claims and their equivalents.

Claims (17)

A lithographic apparatus comprising:
An optical column for projecting a beam onto a target portion of a substrate, the optical column including a projection device configured to project the beam onto the target portion;
An actuator for rotationally moving the optical column or at least a portion thereof with respect to the substrate; And
A window between a moving part of the optical column and a target portion of the substrate and / or between a moving part of the optical column and a non-moving part of the optical column
Lt; / RTI >
Wherein the window is constructed and arranged in the lithographic apparatus to reduce or minimize movement of the window. The method according to claim 1,
Further comprising a substantially closed compartment substantially surrounding the moving portion of the optical column. 3. The method of claim 2,
Further comprising a pump for controlling the pressure in the compartment to a level below 1 bar. The method according to claim 2 or 3,
Further comprising a medium supply for providing a medium other than air to the compartment. 5. The method of claim 4,
Wherein the medium is helium. The method according to claim 2 or 3,
Wherein the window is provided in the compartment and a portion of the compartment other than the window is flexibly connected to the window. The method according to claim 2 or 3,
Wherein a portion of the compartment other than the window is movable relative to the window. 8. The method of claim 7,
Wherein the window is mounted as an O-ring or as a glue in a portion other than the window of the compartment. The method according to claim 2 or 3,
Wherein the compartment is provided with a circular bottom plate and the window is mounted on the circular bottom plate radially outwardly from the center of the circular bottom plate. 4. The method according to any one of claims 1 to 3,
Wherein the moving part of the optical column includes a lens, the beam passes through the lens and the window, and the distance between the lens and the window is less than 2 cm. 4. The method according to any one of claims 1 to 3,
Wherein the rotational movement is a rotational movement in excess of 500 RPM. 4. The method according to any one of claims 1 to 3,
Wherein the window comprises quartz. 4. The method according to any one of claims 1 to 3,
Wherein the optical column comprises a self-emitting contrast device. 14. The method of claim 13,
Wherein the self-emission contrast device comprises a laser diode. 4. The method according to any one of claims 1 to 3,
Wherein the window is flexibly connected to a portion of the lithographic apparatus and is fixedly connected to another portion of the lithographic apparatus. A device manufacturing method comprising projecting a patterned radiation beam onto a substrate,
Projecting a beam onto a substrate using a projection apparatus of an optical column to generate a pattern on a target portion of the substrate using the optical column;
Causing the beam to pass through a window; And
Rotating or translating the optical column or at least a portion thereof relative to the substrate while reducing or minimizing movement of the window
≪ / RTI > 17. The method of claim 16,
Wherein the optical column or at least a portion thereof is in a compartment containing the window and wherein reducing or minimizing movement by the window includes allowing movement between the window and a portion of the compartment other than the window. Gt;

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