WO2013133321A1 - Mask, mask unit, exposure device, substrate treatment apparatus and method for manufacturing device - Google Patents

Abstract

A mask comprises a pattern (Pm) on the outer circumferential surface formed in a prescribed axis (J) circumference, the outer circumferential surface includes a partial spherical surface (Ma) which forms part of a spherical surface the central point of which is provided on said axis, and the pattern is provided on the partial spherical surface.

Description

Mask, mask unit, exposure apparatus, substrate processing apparatus, and device manufacturing method

The present invention relates to a mask, a mask unit, an exposure apparatus, a substrate processing apparatus, and a device manufacturing method.
This application claims priority based on Japanese Patent Application No. 2012-50664 for which it applied on March 7, 2012, and uses the content here.

As display elements constituting display devices such as display devices, for example, liquid crystal display elements, organic electroluminescence (organic EL) elements, electrophoretic elements used for electronic paper, and the like are known.
At present, as these display elements, switching elements (thin film transistors: TFTs) called thin film transistors are formed on the substrate surface, and active elements (active devices) for forming the respective display devices thereon have become mainstream. Yes.

In recent years, a technique for forming a display element on a sheet-like substrate (for example, a film member) has been proposed. As such a technique, for example, a technique called a roll-to-roll system (hereinafter simply referred to as “roll system”) is known (see, for example, Patent Document 1).
In the roll method, a single sheet-like substrate (for example, a belt-like film member) wound around a substrate supply-side supply roller is sent out, and the sent-out substrate is wound up with a recovery roller on the substrate recovery side. Transport.

A gate electrode, a gate oxide film, a semiconductor film, a source / drain electrode, and the like constituting the TFT are formed by a plurality of processing apparatuses from when the substrate is sent out until it is wound. Thereafter, other components of the display element are sequentially formed on the substrate. For example, when an organic EL element is formed on a substrate, a light emitting layer, an anode, a cathode, an electric circuit, and the like are sequentially formed on the substrate.
These components may be formed using, for example, a photolithography method using an exposure apparatus that exposes the substrate with exposure light through a mask, for example.

As an example of a mask for an exposure apparatus, for example, a cylindrical mask is known. Such a cylindrical mask has a rotating body having a pattern. The rotating body is formed in, for example, a cylindrical shape or a columnar shape, and a pattern is formed on the cylindrical surface.
By using a cylindrical mask, it is not necessary to reciprocate the stage or to use a plurality of stages for holding the mask, and the cost can be reduced. Moreover, since the pattern can be transferred to a plurality of locations on the object to be exposed by moving the object to be exposed in one direction, the number of times of acceleration / deceleration of the stage can be reduced. As a result, the exposure accuracy can be improved.

International Publication No. 2006/100868

However, in order to project the pattern image on the cylindrical surface onto the flat substrate in the above exposure processing, an optical design for correcting the image surface is required, which causes a problem that the structure becomes complicated.

An object of an aspect of the present invention is to provide a mask, a mask unit, an exposure apparatus, a substrate processing apparatus, and a device manufacturing method that can prevent the structure from becoming complicated.

According to the first aspect of the present invention, there is provided a mask having a pattern on an outer peripheral surface formed around a predetermined axis, wherein the outer peripheral surface is a part of a spherical surface provided with a center point on the axis. There is provided a mask including a partial spherical surface formed, wherein the pattern is provided on the partial spherical surface.

According to the second aspect of the present invention, there is provided a mask unit comprising a plurality of masks according to the first aspect of the present invention, wherein the plurality of masks are arranged with the axes parallel to each other.

According to the third aspect of the present invention, there is provided an exposure apparatus for transferring a pattern to a substrate, which supports the mask of the first aspect of the present invention having the pattern on an outer peripheral surface formed around a predetermined axis. And a projection optical system that projects an image of the pattern of the mask supported by the support device onto the substrate, the projection optical system corresponding to a radius of curvature of the partial spherical surface of the mask. An exposure apparatus having a negative Petzval sum of magnitude is provided.

According to a fourth aspect of the present invention, there is provided an exposure apparatus for transferring a pattern to a substrate, comprising a plurality of masks having the pattern on an outer peripheral surface formed around a predetermined axis. A support device that supports a mask unit; and a plurality of projection optical systems that are provided corresponding to each of the plurality of masks supported by the support device and that project an image of the pattern onto the substrate, An exposure apparatus is provided in which the projection optical system has a negative Petzval sum having a magnitude corresponding to the radius of curvature of the partial spherical surface of the mask.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus for processing a strip-shaped substrate, wherein the substrate transport unit transports the substrate in the longitudinal direction of the substrate, and the substrate transport path by the substrate transport unit. And a substrate processing unit that performs processing on the substrate transported along the transport path, wherein the substrate processing unit transfers a pattern to the substrate. A substrate processing apparatus including the exposure apparatus of the aspect is provided.

According to a sixth aspect of the present invention, there is provided a device manufacturing method for processing a substrate to manufacture a device, wherein the pattern is transferred to the substrate using the exposure apparatus according to the fourth aspect of the present invention. And processing the substrate on which the pattern is transferred based on the pattern.

In the embodiment of the present invention, a mask that can prevent the structure from becoming complicated can be provided.

The figure which shows the structure of the substrate processing apparatus which concerns on this embodiment. The figure which shows schematic structure of exposure apparatus. The front view which looked at the mask from the -X side. The figure which shows the value of the item of a projection optical system. The figure which shows the aspherical surface data for every surface number formed in an aspherical surface. The figure which shows schematic structure of the exposure apparatus which concerns on 2nd Embodiment. The figure which shows the value of the item of the projection optical system which concerns on 2nd Embodiment. The figure which shows the aspherical surface data for every surface number formed in the aspherical surface which concerns on 2nd Embodiment. The figure which shows schematic structure of the exposure apparatus which concerns on 3rd Embodiment. The figure which shows the value of the item of the projection optical system which concerns on 3rd Embodiment. The figure which shows the aspherical surface data for every surface number formed in the aspherical surface which concerns on 3rd Embodiment. The figure which shows schematic structure of the exposure apparatus which has a mask unit. The flowchart for demonstrating an example of the manufacturing process of a microdevice. The figure explaining an example of the method of producing the mask which concerns on this embodiment.

Embodiments of a mask, a mask unit, an exposure apparatus, a substrate processing apparatus, and a device manufacturing method according to the present invention will be described below with reference to FIGS.

(First embodiment)
FIG. 1 is a diagram showing a configuration of a substrate processing apparatus FPA according to the first embodiment of the present invention.
As shown in FIG. 1, the substrate processing apparatus FPA performs processing on a substrate supply unit SU that supplies a sheet substrate (for example, a strip-shaped film member) FB, and a surface (surface to be processed) of the sheet substrate FB. It includes a part PR, a substrate recovery part CL for recovering the sheet substrate FB, and a control part CONT for controlling these parts. The substrate processing apparatus FPA is installed in a factory, for example.

Hereinafter, in the description of the substrate processing apparatus FPA, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system.
In the XYZ orthogonal coordinate system, the conveyance direction of the sheet substrate FB (longitudinal direction of the sheet substrate FB) is the X-axis direction, and the direction orthogonal to the conveyance direction of the sheet substrate FB (the short direction of the sheet substrate FB or the sheet substrate FB) The width direction is defined as the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction is defined as the Z-axis direction.

The substrate processing apparatus FPA is a roll toe that performs various processes on the surface of the sheet substrate FB from when the sheet substrate FB is sent out from the substrate supply unit SU to when the sheet substrate FB is recovered by the substrate recovery unit CL. A device of a roll method (hereinafter simply referred to as “roll method”).
The substrate processing apparatus FPA can be used when forming a display element (electronic device) such as an organic EL element or a liquid crystal display element on the sheet substrate FB. Of course, when forming elements other than these elements, the substrate processing apparatus FPA may be used.

As the sheet substrate FB to be processed in the substrate processing apparatus FPA, for example, a foil such as a resin film or stainless steel can be used.
For example, the resin film is made of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, etc. Can be used.

The dimension of the sheet substrate FB in the Y direction (short direction) is, for example, about 1 m to 2 m, and the dimension in the X direction (long direction) is, for example, 10 m or more.
Of course, this dimension is only an example and is not limited thereto. For example, the dimension of the sheet substrate FB in the Y direction may be 1 m or 50 cm or less, or 2 m or more. Moreover, the dimension of the X direction of the sheet | seat board | substrate FB may be 10 m or less.

The sheet substrate FB is formed to have flexibility, for example. Here, the term “flexibility” refers to the property that the substrate can be bent without breaking or breaking even when a predetermined force of at least its own weight is applied to the substrate. Further, for example, the property of bending by the predetermined force is also included in the flexibility. The flexibility varies depending on the material, size, thickness, or environment such as temperature of the substrate.
In addition, as the sheet | seat board | substrate FB, you may use the sheet | seat-like board | substrate of 1 sheet, However, It is good also as a structure formed by connecting a some unit board | substrate and forming in a strip | belt shape.

The sheet substrate FB can have a small coefficient of thermal expansion so that the dimensions do not substantially change even when it receives heat at a relatively high temperature (for example, about 200 ° C.) (thermal deformation is small). For example, an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.

The substrate supply unit SU sends out the sheet substrate FB wound in a roll shape to the substrate processing unit PR, for example. The substrate supply unit SU is provided with, for example, a shaft around which the sheet substrate FB is wound, a rotation drive source that rotates the shaft, and the like. In addition, for example, a configuration in which a cover portion that covers the sheet substrate FB wound in a roll shape or the like may be provided.

The substrate collection unit CL collects the sheet substrate FB from the substrate processing unit PR in a roll shape, for example. Similarly to the substrate supply unit SU, the substrate recovery unit CL is provided with a shaft for winding the sheet substrate FB, a rotational drive source for rotating the shaft, a cover for covering the recovered sheet substrate FB, and the like. ing.
In addition, when the sheet substrate FB is cut into a panel shape in the substrate processing unit PR, for example, the sheet substrate FB is collected in a stacked state, and the sheet substrate FB is in a state different from the rolled state. It may be configured to collect the.

The substrate processing unit PR transports the sheet substrate FB supplied from the substrate supply unit SU to the substrate recovery unit CL, and processes the surface Fp to be processed of the sheet substrate FB in the course of transport. The substrate processing unit PR includes, for example, a processing device 60, a transfer device 70, an alignment device 80, and the like.

The processing apparatus 60 has various apparatuses for forming, for example, an organic EL element on the processing surface Fp of the sheet substrate FB. As such an apparatus, for example, a partition forming apparatus for forming a partition on the processing surface Fp, an electrode forming apparatus for forming an electrode for driving an organic EL element, and light emission for forming a light emitting layer Examples thereof include a layer forming apparatus.
More specifically, film forming apparatuses such as a droplet coating apparatus (for example, an ink jet type coating apparatus, a spin coating type coating apparatus, etc.), a vapor deposition apparatus, a sputtering apparatus, an atmospheric pressure CVD apparatus, a mist deposition apparatus, and an electroless plating apparatus. And an exposure apparatus, a development apparatus, a surface modification apparatus, and a cleaning apparatus. Each of these apparatuses is appropriately provided, for example, on the conveyance path of the sheet substrate FB.
In the present embodiment, the exposure apparatus will be mainly described among various apparatuses constituting the processing apparatus 60.

The transport device 70 includes a roller device R that transports, for example, the sheet substrate FB to the substrate recovery unit CL in the substrate processing unit PR. For example, a plurality of roller devices R are provided along the conveyance path of the sheet substrate FB. A drive mechanism (not shown) is attached to at least some of the plurality of roller devices R.
By rotating such a roller device R, the sheet substrate FB is conveyed in the X-axis direction. For example, a part of the plurality of roller devices R may be configured to be movable in a direction orthogonal to the transport direction.

Alignment device 80 performs an alignment operation on sheet substrate FB. The alignment apparatus 80 includes an alignment camera 81 that detects the position state of the sheet substrate FB, and the sheet substrate FB in the X direction, Y direction, Z direction, θX direction, θY direction, and θZ direction based on the detection result of the alignment camera 81. And an adjusting device 82 for fine adjustment.

The alignment camera 81 detects, for example, an alignment mark formed on the sheet substrate FB and transmits the detection result to the control unit CONT. The control unit CONT obtains the position information of the sheet substrate based on the detection result, and controls the adjustment amount by the adjusting device 82 based on the position information.

FIG. 2 is a view showing a schematic configuration of an exposure apparatus EX used as the processing apparatus 60.
As shown in FIG. 2, the exposure apparatus EX is an apparatus that projects an image of the pattern Pm formed on the mask M onto the sheet substrate FB. The exposure apparatus EX includes an illumination optical system IU that illuminates exposure light on the mask M, a support apparatus MST that rotatably supports the mask M around a rotation axis (shaft portion) MJ, and a pattern Pm formed on the mask M. A projection optical system PU for projecting an image.

FIG. 3 is a front view of the mask M viewed from the −X side.
As shown in FIGS. 2 and 3, the mask M in the present embodiment is formed in a substantially disk shape centered on a central axis (predetermined axis) J parallel to the Y axis. The outer peripheral surface of the mask M includes a partial spherical surface Ma that forms a part of a spherical surface having a central point on the central axis J. The center point of the spherical surface is located at the substantial center of the partial spherical surface Ma with respect to the direction along the central axis J.
The pattern Pm is formed in the pattern area PA of the partial spherical surface Ma excluding the non-pattern area PN in the circumferential direction. As the pattern Pm, a configuration directly formed on the spherical surface Ma, a configuration in which a sheet on which the pattern Pm is formed is pasted on the spherical surface Ma, or the like can be adopted.
The pattern Pm formed in the pattern area PA is patterned by a material that reflects illumination light for exposure and a material that absorbs the illumination light. The pattern Pm is, for example, a circuit pattern for forming a pixel electrode, TFT, wiring, or the like of a display panel unit using liquid crystal or organic EL, or a circuit pattern for forming a display panel unit and a peripheral circuit unit for a mobile terminal device. And so on.

The partial spherical surface Ma is formed in a belt shape around the central axis line J, intersects with an axis intersecting line passing through the center point of the spherical surface and orthogonal to the central axis line J, and the axis intersecting line and the partial spherical surface Ma. Is formed so that the tangent plane that includes the intersection with the partial spherical surface Ma is substantially parallel to the central axis J.

The rotation axis MJ is provided on both sides of the mask M in the Y direction so that the center axis J and the axis coincide with each other (as the axis center). Further, the rotation shaft MJ is rotatably held together with the outer peripheral surface of the mask M by the support device MST, and is connected to a rotation drive device (rotation device) RD to be rotated. The driving of the rotation driving device RD (that is, the rotation driving of the mask M) is controlled by the control unit CONT.

The illumination optical system IU illuminates the exposure light EL on the mask M. The illumination optical system IU includes a light source unit 20, a plane reflecting mirror M1, an optical element (first partial optical system) L11 and an optical element L12 that constitute a part of the projection optical system PU, a concave mirror L13, and a plane reflecting mirror M2. ing.
The light source unit 20 may have a configuration in which a light source device such as a mercury lamp or a laser generator is installed, or a configuration in which an element that forms a secondary light source such as a fly-eye optical element is installed.

The projection optical system PU projects an image of the pattern Pm formed on the mask M onto the sheet substrate FB. The projection optical system PU is arranged in order along the traveling direction of the exposure light EL, the optical elements L11 and L12, the concave mirror L13, the plane reflecting mirror M2, the optical element L14, the aperture stop (optical path limiting member) AS, and the optical element. Elements L15 to L19 and an optical element (second partial optical system) L20 are included.
The aperture stop AS defines the numerical aperture of the projection optical system PU. The aperture stop AS is disposed at a position on the pupil plane that is a plane conjugate with the exit pupil (or entrance pupil) of the projection optical system PU. The reflecting surface of the concave mirror L13 is also arranged at the position of the pupil plane in the projection optical system PU.

The exposure light EL from the light source unit 20 is sequentially reflected by the plane reflecting mirror M1 and the concave mirror L13, and then sequentially passes through the optical elements L12 and L11 to illuminate the pattern Pm formed on the partial spherical surface Ma of the mask M.
The exposure light EL reflected by the mask M (partial spherical surface Ma) is received (transmitted) by the optical element L11, then passes through the optical element L12 and is reflected by the concave mirror L13 and the plane reflecting mirror M2. The exposure light EL reflected by the plane reflecting mirror M2 is sequentially transmitted through the optical elements L14 to L19, and then projected onto the sheet substrate FB by the optical element L20.

FIG. 4 shows values of specifications of the projection optical system PU.
In FIG. 4, at the left end, each optical surface on which exposure light EL sequentially enters or exits at the optical elements L11 and L12, the concave mirror L13, the plane reflecting mirror M2, the optical element L14, the aperture stop AS, and the optical elements L15 to L20. The face number is shown.
R represents the radius of curvature of each optical surface, and d represents the surface spacing between the optical surfaces. The r column shows the paraxial radius of curvature of each optical surface, and the d column shows the surface spacing.

FIG. 5 shows aspherical data for each surface number formed on the aspherical surface.
In FIG. 5, K is a conic coefficient, and A to F are fourth, sixth, eighth,... Aspheric coefficients.
In FIGS. 4 and 5, the sign of the paraxial radius of curvature r is positive when convex toward the object plane side (pattern Pm plane side), and the plane spacing d is reversed before and after the optical surface. Shall.

The projection optical system PU has, for example, a wavelength (exposure wavelength) of 365 nm, a reduction ratio of 1 (equal magnification), an object-side numerical aperture NA of 0.055, the optical elements L11 and L12, the concave mirror L13, the plane It has a negative Petzval sum set by the reflecting mirror M2, the optical element L14, the aperture stop AS, and the optical elements L15 to L20.
Here, in an optical system composed of a plurality of optical elements, if the focal length of the i-th optical surface is fi and the refractive indices before and after the optical surface are ni and ni ′, the Petzval sum Psum is expressed by the following equation. Is done.

At this time, if the curvature radius of the image plane is R0, the Petzval sum Psum is as follows.
Psum = -1 / R0
For example, in the case of the concave mirror L13, it has positive power and the Petzval sum is a negative value. As shown in FIG. 4, the focal length fi of the concave mirror L13 having a negative curvature radius ri is expressed by the following equation.

Also, the Petzval sum Psum of the concave mirror L13 is expressed by the following equation.

In this embodiment, the magnitude of the Petzval sum in the projection optical system PU is set substantially equal to the reciprocal of the radius of curvature (that is, the curvature) of the partial spherical surface Ma on which the pattern Pm is formed. Specifically, as shown in FIG. 4, when the radius of curvature of the partial spherical surface Ma is 500 mm, the Petzval sum in the projection optical system PU is −0.00199 (≈−1 / 500). It has become.
Thereby, the image of the pattern Pm formed on the partial spherical surface Ma is projected onto the processing surface Fp of the sheet substrate FB in a substantially planar shape.

The substrate processing apparatus FPA configured as described above produces, for example, the display substrate 1 by the so-called roll-to-roll method (hereinafter referred to as a roll method) under the control of the control unit CONT. Hereinafter, a process of manufacturing the display substrate 1 using the substrate processing apparatus FPA having the above configuration will be described.

First, the belt-shaped sheet substrate FB is wound around a roller provided in the substrate supply unit SU. The control unit CONT causes the sheet substrate FB to be sent out from the substrate supply unit SU from this state, and the sheet substrate FB that has been sent out is taken up by the roller of the substrate recovery unit CL to transport the sheet substrate FB.

The control unit CONT displays the display by the processing device 60 while appropriately transporting the sheet substrate FB in the substrate processing unit PR by the transport device 70 of the substrate processing unit PR from when the sheet substrate FB is sent out to when it is wound up. The components of the substrate 1 are sequentially formed on the sheet substrate FB.
When the processing by the processing device 60 is performed, the control unit CONT causes the alignment device 80 to align the sheet substrate FB.

The control unit CONT performs exposure in the processing apparatus 60 while appropriately transporting the sheet substrate FB in the substrate processing unit PR by the transporting device 70 of the substrate processing unit PR from when the sheet substrate FB is sent out to when it is wound up. The apparatus EX is caused to project the pattern Pm of the mask M onto the processing surface Fp of the sheet substrate FB.

At this time, the control unit CONT controls the rotation of the rotation driving device RD and the driving of the roller device R to synchronously drive the rotation of the mask M around the rotation axis MJ and the sheet substrate FB.
More specifically, the control unit CONT determines that the ratio of the moving speed (conveying speed) of the sheet substrate FB to the moving speed around the rotation axis MJ of the partial spherical surface Ma included in the mask M is the projection magnification of the projection optical system PU. In the embodiment, the drive control is performed so as to be equal to 1 ×.

Thereby, the image of the pattern Pm of the rotating mask M illuminated by the illumination optical system IU is sequentially projected onto the sheet substrate FB with a size corresponding to the projection magnification via the projection optical system PU.

As described above, in the present embodiment, since the mask M in which the pattern Pm is formed on the partial spherical surface forming a part of the spherical surface is used, an optical design for correcting the image surface becomes unnecessary, and the structure is prevented from becoming complicated. it can.
In particular, in this embodiment, the projection optical system PU having a negative Petzval sum can be easily realized by using the concave mirror L13, and the image of the pattern Pm can be easily projected on the sheet substrate FB with a simple structure. It is possible.

(Second Embodiment)
Next, a second embodiment of the exposure apparatus EX will be described with reference to FIGS.
In the second embodiment, the configurations of the illumination optical system IU and the projection optical system PU are different from those of the first embodiment. For this reason, the illumination optical system IU and the projection optical system PU will be described below.
In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and the description thereof is omitted or simplified.

As shown in FIG. 6, the illumination optical system IU in this embodiment includes a light source unit 20, a beam splitter BS, optical elements L25 and L24, an aperture stop AS, and an optical element L23 that are sequentially arranged along the optical path of the exposure light EL. , L22, L21. These beam splitter BS, optical elements L25 and L24, aperture stop AS, and optical elements L23, L22, and L21 constitute a part of the projection optical system PU as will be described later.

The projection optical system PU includes the optical element (first partial optical system) L21, the optical elements L22 to L23, the aperture stop AS, the optical elements L24 and L25, and the beam splitter BS, which are sequentially arranged along the optical path of the exposure light EL. , A concave mirror L26, a plane reflecting mirror M21, optical elements L27 to L29, and an optical element (second partial optical system) L30. The concave mirror L26 is disposed at the position of the pupil plane in the projection optical system PU.

The exposure light EL from the light source unit 20 is incident and reflected by the beam splitter BS as the illumination optical system IU, and then passes through the optical elements L25 and L24, the aperture stop AS, the optical elements L23, L22, and L21, and the mask M. The pattern Pm formed on the partial spherical surface Ma is illuminated.
The exposure light EL reflected by the mask M (partial spherical surface Ma) is incident on the beam splitter BS via optical elements L21 to L23 serving as a projection optical system PU, an aperture stop AS, and optical elements L24 and L25.
The exposure light EL that has entered the beam splitter BS passes through the beam splitter BS, is reflected by the concave mirror L26, and again passes through the beam splitter BS and the optical elements L25 and L24 in order, and then is reflected by the planar reflecting mirror M21.
The exposure light EL reflected by the plane reflecting mirror M21 is sequentially transmitted through the optical elements L27 to L30 to project an image of the pattern Pm of the mask M onto the sheet substrate FB.

FIG. 7 shows values of specifications of the projection optical system PU in the present embodiment.
In FIG. 7, at the left end, each optical surface on which exposure light EL sequentially enters or exits the optical elements L21 to L23, aperture stop AS, optical elements L24 and L25, beam splitter BS, concave mirror L26, and optical elements L27 to L30. The face number is shown.
R represents the radius of curvature of each optical surface, and d represents the surface spacing between the optical surfaces. The r column shows the paraxial radius of curvature of each optical surface, and the d column shows the surface spacing.

FIG. 8 shows aspherical data for each surface number formed on the aspherical surface.
In FIG. 8, K is a conic coefficient, and A to F are 4th, 6th, 8th,... Aspherical coefficients.
7 and 8, the sign of the paraxial radius of curvature r is positive when it is convex toward the object plane side (pattern Pm plane side), and the plane spacing d is reversed before and after the optical surface. It is supposed to be.

The projection optical system PU has, for example, a wavelength (exposure wavelength) of 365 nm, a projection magnification of 2 (enlargement), and an object-side numerical aperture NA of 0.054. The Petzval sum set by the optical elements L21 to L23, aperture stop AS, optical elements L24 and L25, beam splitter BS, concave mirror L26, and optical elements L27 to L30 is −0.00200 (−1/500 ).

Therefore, also in this embodiment, the use of the mask M in which the pattern Pm is formed on the partial spherical surface forming a part of the spherical surface and the projection optical system PU having the negative Petzval sum can prevent the structure from being complicated. On the other hand, it is possible to project with good optical performance from the partial spherical surface Ma to the plane (surface Fp of the sheet substrate FB).
Furthermore, according to the present embodiment, since the optical element is shared between the illumination optical system IU and the projection optical system PU, the apparatus can be reduced in size.

(Third embodiment)
Next, a third embodiment of the exposure apparatus EX will be described with reference to FIGS.
In the third embodiment, the configurations of the illumination optical system IU and the projection optical system PU are different from those of the first embodiment. For this reason, the illumination optical system IU and the projection optical system PU will be described below.
In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and the description thereof is omitted or simplified.

As shown in FIG. 9, the illumination optical system IU in the present embodiment includes a convex mirror L34, optical elements L33 and L32, a concave mirror L31, and a plane reflecting mirror M31 that are sequentially arranged along the optical path of the exposure light EL. The convex mirror L34, the optical elements L33 and L32, the concave mirror L31, and the plane reflecting mirror M31 constitute a part of the projection optical system PU as will be described later.

The convex mirror L34 is semi-transmissive, and emits the exposure light EL incident from the surface opposite to the surface facing the optical element L33 toward the optical element L33.
The exposure light EL incident on the optical element L33 is transmitted through the optical elements L33 and L32, then reflected by the concave mirror 31 and the plane reflecting mirror M31, travels toward the central axis J of the mask M, and reaches the partial spherical surface Ma of the mask M. The formed pattern Pm is illuminated.

The projection optical system PU includes a concave mirror L35, in addition to the above-described plane reflecting mirror (first partial optical system) M31, concave mirror L31, optical elements L32 and L33, and convex mirror L34, which are sequentially arranged along the optical path of the exposure light EL. A plane reflecting mirror M32, an aperture stop AS, and an optical element (second partial optical system) L36 are provided.
The concave mirrors L31 and L35 are disposed at the position of the pupil plane in the projection optical system PU. The concave mirror L35 is disposed in the vicinity of the aperture stop AS.

The exposure light EL reflected by the mask M (partial spherical surface Ma) is reflected by the plane reflecting mirror M31 and the concave mirror L31 as the projection optical system PU, and then sequentially passes through the optical elements L32 and L33 and is reflected by the convex mirror L34.
The exposure light EL reflected by the convex mirror L34 again passes through the optical elements L33 and L32 again, and then is reflected by the concave mirror L35 and the plane reflecting mirror M32.
The exposure light EL reflected by the plane reflecting mirror M32 passes through the optical element L36 and projects an image of the pattern Pm of the mask M onto the sheet substrate FB.

FIG. 10 shows values of specifications of the projection optical system PU in this embodiment.
In FIG. 10, at the left end, the surface number of each optical surface on which the exposure light EL sequentially enters or exits at the concave mirror L31, the optical elements L32 and L33, the convex mirror L34, the concave mirror L35, the aperture stop AS, and the optical element L36 is shown. ing.
R represents the radius of curvature of each optical surface, and d represents the surface spacing between the optical surfaces. The r column shows the paraxial radius of curvature of each optical surface, and the d column shows the surface spacing.

FIG. 11 shows aspherical data for each surface number formed on the aspherical surface.
In FIG. 11, K is a conic coefficient, and A to F are 4th, 6th, 8th,... Aspherical coefficients.
10 and 11, the sign of the paraxial radius of curvature r is positive when it is convex toward the object plane side (pattern Pm plane side), and the plane spacing d is reversed before and after the optical surface. It is supposed to be.

The projection optical system PU has, for example, a wavelength (exposure wavelength) of 365 nm, a projection magnification of 1.25 times (enlargement), an object-side numerical aperture NA of 0.055, the concave mirror L31, the optical elements L32, L33, The Petzval sum set by the convex mirror L34, the concave mirror L35, the aperture stop AS, and the optical element L36 is −0.00175 (≈−1 / 560).

Therefore, also in this embodiment, the use of the mask M in which the pattern Pm is formed on the partial spherical surface forming a part of the spherical surface and the projection optical system PU having the negative Petzval sum can prevent the structure from being complicated. On the other hand, it is possible to project with good optical performance from the partial spherical surface Ma to the plane (surface Fp of the sheet substrate FB).

(Fourth embodiment)
Next, a fourth embodiment of the exposure apparatus EX will be described with reference to FIG.
In the exposure apparatus EX according to the fourth embodiment, a mask unit in which a plurality of masks M described above are arranged with their axes parallel to each other is provided, and a projection optical system is provided corresponding to each mask.
In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and the description thereof is omitted or simplified.

As shown in FIG. 12, the exposure apparatus EX in the present embodiment includes a mask unit MU provided with a plurality (three in this case) of masks M1 to M3 each having the above-described partial spherical surface Ma. The masks M1 to M3 are arranged at intervals in the Y direction.
The central axis J in each of the masks M1 to M3 extends in the Y-axis direction and is arranged in parallel to each other. In the present embodiment, the masks M1 to M3 are provided with a common rotation axis MJ ′ that extends in the Y-axis direction, has a common spherical axis as a center along with the partial spherical surface Ma, and can rotate around the common axis. The central axis J in each of the masks M1 to M3 is arranged coaxially with the common axis of the common rotation axis MJ ′.

Corresponding to each of the masks M1 to M3, each of the masks M1 to M3 has the same configuration as the projection optical system PU in the above-described embodiment that projects the images of the patterns Pm1 to Pm3 on the sheet substrate FB. Projection optical systems PU1 to PU3 having negative Petzval sums corresponding to the radii of curvature of the partial spherical surfaces Ma of M3 to M3 are provided.
Projection areas PA1 to PA3 projected by the projection optical systems PU1 to PU3 on the sheet substrate FB according to the projection magnification are adjacently arranged along the Y direction. The adjacent arrangement is a concept including not only a configuration in which the edges of adjacent projection areas are in contact with each other but also a part of edges of adjacent projection areas overlapping each other.

In the exposure apparatus EX configured as described above, the partial spherical surfaces Ma of the masks M1 to M3 are integrally rotated in accordance with the rotation of the common rotation axis MJ ′, and the patterns Pm1 to Pm3 of the masks M1 to M3 illuminated with the exposure light EL. The images are projected onto the projection areas PA1 to PA3 via the projection optical systems PU1 to PU3, respectively.

At this time, for example, if the patterns Pm1 to Pm3 formed on the masks M1 to M3 are the same, a plurality of the same patterns are formed on the sheet substrate FB, so that a so-called multi-piece manufacturing is possible. Become.
On the other hand, for example, when the patterns Pm1 to Pm3 formed on the masks M1 to M3 are combined to form one pattern, a large and large area pattern can be formed on the sheet substrate FB.

In the mask unit MU in the above embodiment, the three masks M1 to M3 are provided coaxially by the common shaft portion MJ ′, and the projection optical systems PU1 to PU3 are also arranged along the Y direction.
On the other hand, for example, when it is difficult to arrange the three projection optical systems PU1 to PU3 along the common axis due to space restrictions, the mask M2 and the projection optical system PU2 are combined with the masks M1 and M3 and the projection optical systems PU1 and PU3. It is good also as a structure arrange | positioned at what is called zigzag form spaced apart with respect to the X direction.

In addition, the number of masks M1 to M3 and the number of projection optical systems PU included in the mask unit MU shown in the above embodiment are examples, and the configuration includes two masks or the configuration including four or more masks. Also good.
Even in this case, for example, when it is difficult to arrange a plurality of projection optical systems along the common axis due to space restrictions, the mask and the projection optical system adjacent to each other in the direction (Y direction) orthogonal to the transport direction. May be arranged in a zigzag pattern separated in the transport direction (X direction).

The preferred embodiments according to the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. The
In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy.

The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Prior to the assembly process from the various subsystems to the exposure apparatus, there is an assembly process for each subsystem.
When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus can be manufactured in a clean room in which temperature, cleanliness, etc. are controlled.

As shown in FIG. 13, a microdevice such as a semiconductor device includes a step 201 for designing the function and performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate which is a substrate of the device. (Manufacturing the long sheet-like flexible substrate) Step 203, Exposing the substrate with exposure light using the mask pattern and developing the exposed substrate (photosensitive agent) according to the above-described embodiment The substrate is manufactured through a substrate processing step 204 including a substrate processing (exposure processing), a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.
In step 204, the photosensitive agent is developed to form an exposure pattern layer (developed photosensitive agent layer) corresponding to the mask pattern, and the substrate is processed through the exposure pattern layer. It is.

In recent years, an additive process that does not require development of a photosensitive agent has been desired as an ecological process.
In that case, the substrate processing step 204 is a step of applying a photosensitive SAM agent on the surface of the substrate that changes from a state showing high liquid repellency to a state showing lyophilicity by irradiation of ultraviolet exposure light, the above-described embodiment. The pattern Pm of the mask M is used to expose the substrate coated with the photosensitive SAM agent with exposure light, and the lyophilic portion on the substrate by the exposure is exposed to a printing method or an inkjet method. , A process of selectively applying a conductive ink or paste for wiring, a solution of a semiconductor material for TFT, or the like.

Furthermore, there are also known materials that exhibit plating reduction ability in the portions irradiated with exposure light. When such a material is used, a metal layer for wiring can be formed by immersing the exposed substrate as it is in an electroless plating solution (including ions such as palladium).

By the way, in step 202 for manufacturing the mask in FIG. 13, the projection reticle system PU described in each of the previous embodiments is used, and the pattern of the planar reticle serving as a master has a spherical outer peripheral surface serving as the mask M. It can be easily transferred onto a cylindrical body. Therefore, an example of producing a spherical cylindrical mask M using the projection optical system PU of the exposure apparatus shown in FIG. 6 will be described with reference to FIG.

The projection optical system PU shown in FIG. 14 is obtained by reversing the relationship between the object plane and the image plane of the projection optical system PU shown in FIG. 6, and in FIG. On the side, a planar reticle RT serving as an original plate is disposed, and in FIG. 6, a cylindrical body M ′ having a spherical surface serving as a mask M is disposed on the object side where the mask M is located.
Photoresist is uniformly applied to the spherical outer peripheral surface of the cylindrical body M ′, and exposed by a pattern Pm ′ projected from the planar reticle RT via the projection optical system PU. In the present embodiment, the best focus surface (pattern image surface) of the pattern Pm ′ is curved along each of the two directions of the Y axis and the Z axis in FIG. 14 along the spherical outer peripheral surface of the cylindrical body M ′. It becomes.

In FIG. 14, a stage RST that moves one-dimensionally at least in the X direction supports the reticle RT so that the pattern surface Mp of the reticle RT is parallel to the XY plane. Above the reticle RT, an illumination optical system ILU that irradiates slit-shaped (or rectangular) illumination light IB extending in the Y-axis direction toward the pattern surface Mp is provided.

Thus, in this embodiment, the spherical optical mask PU can be produced from the planar reticle RT by using the projection optical system PU described in FIG.
In FIG. 14, the example in which the projection optical system PU of FIG. 6 is used has been described. However, even if the projection optical system PU shown in FIGS. 2 and 9 is used, a spherical cylindrical mask is similarly formed from the planar reticle RT. M can be produced.

70: conveying device, AS ... aperture stop (optical path limiting member), CONT ... control unit, FPA ... substrate processing device, FB ... sheet substrate (substrate), J ... central axis (predetermined axis), L11, L21 ... optical element (First partial optical system), M31: plane reflecting mirror (first partial optical system), L13, L26, L31, L35 ... concave mirror, L20, L30, L36 ... optical element (second partial optical system), M ... mask , Ma: partial spherical surface, MJ: rotation axis (shaft), MST: support device, Pm: pattern, RD: rotation drive device (rotation device).

Claims (23)

1. A mask having a pattern on an outer peripheral surface formed around a predetermined axis,
   The outer peripheral surface includes a partial spherical surface forming a part of a spherical surface provided with a center point on the axis.
   The pattern is a mask provided on the partial spherical surface.
2. 2. The mask according to claim 1, wherein the partial spherical surface intersects with an axis intersecting line orthogonal to the axis passing through the center point of the spherical surface.
3. 3. The mask according to claim 2, wherein a tangent plane including an intersection of the axis intersection line and the partial spherical surface and in contact with the partial spherical surface is substantially parallel to the axis line.
4. The mask according to any one of claims 1 to 3, wherein the partial spherical surface is formed in a band shape around the axis.
5. The mask according to claim 4, wherein the center point of the spherical surface is located at a substantially central portion of the belt-shaped partial spherical surface with respect to a direction along the axis.
6. The mask according to any one of claims 1 to 5, further comprising a shaft portion connected to the outer peripheral surface and rotatably provided around the axis along with the outer peripheral surface.
7. The mask according to claim 6, wherein the shaft portion is provided with the axis as an axis center.
8. A plurality of the masks according to any one of claims 1 to 7,
   A plurality of the masks are each a mask unit arranged with the axes parallel to each other.
9. The mask unit according to claim 8, wherein each of the plurality of masks is arranged with the axis coaxial with a predetermined common axis.
10. 10. The mask unit according to claim 9, further comprising a common shaft portion that is connected to the outer peripheral surface of the plurality of masks and is provided so as to be rotatable around the common axis along with the outer peripheral surface.
11. The mask unit according to claim 10, wherein the common shaft portion is provided with the common axis as an axis center.
12. An exposure apparatus for transferring a pattern to a substrate,
    A support device for supporting the mask according to any one of claims 1 to 7, which has the pattern on an outer peripheral surface formed around a predetermined axis;
    A projection optical system that projects an image of the pattern of the mask supported by the support device onto the substrate;
    The exposure apparatus according to claim 1, wherein the projection optical system has a negative Petzval sum having a magnitude corresponding to a radius of curvature of the partial spherical surface of the mask.
13. An exposure apparatus for transferring a pattern to a substrate,
    A supporting device for supporting the mask unit according to any one of claims 8 to 11, comprising a plurality of masks having the pattern on an outer peripheral surface formed around a predetermined axis.
    A plurality of projection optical systems provided corresponding to each of the plurality of masks supported by the support device, and projecting an image of the pattern onto the substrate;
    The exposure apparatus according to claim 1, wherein the projection optical system has a negative Petzval sum having a magnitude corresponding to a radius of curvature of the partial spherical surface of the mask.
14. The plurality of projection optical systems are arranged such that respective projection regions are adjacent to each other in a direction along the axis of the mask or a direction optically corresponding to a direction along the axis of the mask. The exposure apparatus according to claim 13.
15. The exposure apparatus according to any one of claims 12 to 14, wherein a magnitude of the Petzval sum of the projection optical system is substantially equal to a reciprocal of a radius of curvature of the partial spherical surface.
16. The projection optical system is
    A first partial optical system for receiving light emitted from the pattern;
    A second partial optical system that projects light through the first partial optical system onto the substrate;
    An optical path limiting member that is disposed in an optical path between the first partial optical system and the second partial optical system and defines a numerical aperture of the projection optical system;
    At least one concave mirror disposed in an optical path between the first partial optical system and the second partial optical system and reflecting light via the first partial optical system;
    The exposure apparatus according to any one of claims 12 to 15, further comprising:
17. The exposure apparatus according to claim 16, wherein the at least one concave mirror is disposed in the vicinity of the optical path limiting member.
18. The exposure apparatus according to any one of claims 12 to 15, wherein the projection optical system includes at least one concave mirror disposed in the vicinity of a pupil plane of the projection optical system.
19. The exposure apparatus according to any one of claims 12 to 18, wherein the projection optical system projects an image of the pattern in an enlarged manner.
20. A rotating device that rotates the mask supported by the supporting device around the axis;
    A transfer device for transferring the substrate along the surface of the substrate;
    A control unit that performs drive control to drive the rotating device and the transport device in synchronization;
    The exposure apparatus according to any one of claims 12 to 19, further comprising:
21. 21. The control unit performs the drive control so that a ratio of a conveyance speed of the substrate to a movement speed of the partial spherical surface of the mask around the axis is equal to a projection magnification of the projection optical system. The exposure apparatus described in 1.
22. A substrate processing apparatus for processing a band-shaped substrate,
    A substrate transfer section for transferring the substrate in the longitudinal direction of the substrate;
    A substrate processing unit that is provided along a transport path of the substrate by the substrate transport unit and that performs processing on the substrate transported along the transport path;
    The substrate processing apparatus including the exposure apparatus according to any one of claims 12 to 21, wherein the substrate processing unit transfers a pattern to the substrate.
23. A device manufacturing method for manufacturing a device by processing a substrate,
    Using the exposure apparatus according to any one of claims 12 to 21 to transfer a pattern to the substrate;
    Processing the substrate on which the pattern is transferred based on the pattern;
    A device manufacturing method including:

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