TWI654325B - Evaporation source device - Google Patents

Evaporation source device

Info

Publication number
TWI654325B
TWI654325B TW103108655A TW103108655A TWI654325B TW I654325 B TWI654325 B TW I654325B TW 103108655 A TW103108655 A TW 103108655A TW 103108655 A TW103108655 A TW 103108655A TW I654325 B TWI654325 B TW I654325B
Authority
TW
Taiwan
Prior art keywords
crucible
auxiliary heater
source device
evaporation source
heater
Prior art date
Application number
TW103108655A
Other languages
English (en)
Chinese (zh)
Other versions
TW201510252A (zh
Inventor
近藤喜成
渡邊一弘
小林義仁
三澤啓太
牧修治
山田尙人
山将大
松本栄一
Original Assignee
日商佳能特機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商佳能特機股份有限公司 filed Critical 日商佳能特機股份有限公司
Publication of TW201510252A publication Critical patent/TW201510252A/zh
Application granted granted Critical
Publication of TWI654325B publication Critical patent/TWI654325B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Control Of Resistance Heating (AREA)
TW103108655A 2013-03-26 2014-03-12 Evaporation source device TWI654325B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013063941A JP2014189807A (ja) 2013-03-26 2013-03-26 蒸発源装置
JP2013-063941 2013-03-26

Publications (2)

Publication Number Publication Date
TW201510252A TW201510252A (zh) 2015-03-16
TWI654325B true TWI654325B (zh) 2019-03-21

Family

ID=51623731

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103108655A TWI654325B (zh) 2013-03-26 2014-03-12 Evaporation source device

Country Status (4)

Country Link
JP (1) JP2014189807A (ja)
KR (3) KR20150133183A (ja)
TW (1) TWI654325B (ja)
WO (1) WO2014156750A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10300634B2 (en) * 2015-11-16 2019-05-28 The Boeing Company Advanced multiple grid heat sources to achieve optimized cure structure and method of making the same
CN205443432U (zh) * 2016-04-07 2016-08-10 鄂尔多斯市源盛光电有限责任公司 一种线性蒸发源、蒸发源系统及蒸镀装置
EP3559306B1 (en) * 2016-12-22 2022-10-05 Flisom AG Linear source for vapor deposition with at least three electrical heating elements
KR102381054B1 (ko) * 2017-07-11 2022-03-31 엘지전자 주식회사 증착 장치
CN112853271B (zh) * 2019-11-27 2023-11-14 合肥欣奕华智能机器股份有限公司 一种线型蒸发源

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3054168B2 (ja) * 1990-05-22 2000-06-19 アイシン精機株式会社 自動縫製装置
US5532102A (en) * 1995-03-30 1996-07-02 Xerox Corporation Apparatus and process for preparation of migration imaging members
US20030168013A1 (en) * 2002-03-08 2003-09-11 Eastman Kodak Company Elongated thermal physical vapor deposition source with plural apertures for making an organic light-emitting device
JP4026449B2 (ja) * 2002-08-30 2007-12-26 ソニー株式会社 有機電界発光素子の製造装置
US6893939B1 (en) * 2004-02-25 2005-05-17 Eastman Kodak Company Thermal physical vapor deposition source with minimized internal condensation effects
KR20060060994A (ko) * 2004-12-01 2006-06-07 삼성에스디아이 주식회사 증착 소스 및 이를 구비한 증착 장치
CN101962750B (zh) * 2009-07-24 2013-07-03 株式会社日立高新技术 真空蒸镀方法及其装置

Also Published As

Publication number Publication date
KR20220123757A (ko) 2022-09-08
TW201510252A (zh) 2015-03-16
KR20150133183A (ko) 2015-11-27
KR20210049951A (ko) 2021-05-06
KR102646510B1 (ko) 2024-03-11
JP2014189807A (ja) 2014-10-06
WO2014156750A1 (ja) 2014-10-02

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