TWI650293B - 刻劃工具 - Google Patents

刻劃工具 Download PDF

Info

Publication number
TWI650293B
TWI650293B TW104107539A TW104107539A TWI650293B TW I650293 B TWI650293 B TW I650293B TW 104107539 A TW104107539 A TW 104107539A TW 104107539 A TW104107539 A TW 104107539A TW I650293 B TWI650293 B TW I650293B
Authority
TW
Taiwan
Prior art keywords
scribing
scoring
groove
rollers
pair
Prior art date
Application number
TW104107539A
Other languages
English (en)
Chinese (zh)
Other versions
TW201605751A (zh
Inventor
江島谷彰
高松生芳
森亮
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201605751A publication Critical patent/TW201605751A/zh
Application granted granted Critical
Publication of TWI650293B publication Critical patent/TWI650293B/zh

Links

Landscapes

  • Physics & Mathematics (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
TW104107539A 2014-08-07 2015-03-10 刻劃工具 TWI650293B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2014-161252 2014-08-07
JP2014161252A JP6435698B2 (ja) 2014-08-07 2014-08-07 スクライブ装置

Publications (2)

Publication Number Publication Date
TW201605751A TW201605751A (zh) 2016-02-16
TWI650293B true TWI650293B (zh) 2019-02-11

Family

ID=55369641

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104107539A TWI650293B (zh) 2014-08-07 2015-03-10 刻劃工具

Country Status (4)

Country Link
JP (1) JP6435698B2 (ru)
KR (1) KR20160018330A (ru)
CN (1) CN105366932B (ru)
TW (1) TWI650293B (ru)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101727543B1 (ko) * 2016-02-22 2017-04-17 한국미쯔보시다이아몬드공업(주) 기판절단용 스크라이브헤드 회전장치
CN108623141A (zh) * 2018-07-18 2018-10-09 安徽锐利玻璃机械有限公司 一种玻璃切割机

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012240902A (ja) * 2011-05-24 2012-12-10 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4226153A (en) * 1979-05-17 1980-10-07 The Fletcher-Terry Company Compensating glass scoring head
JPH07138039A (ja) * 1993-11-12 1995-05-30 Fuji Xerox Co Ltd スクライブ装置
JP3810127B2 (ja) * 1996-04-25 2006-08-16 京セラ株式会社 ガラス基板分断方法
JP2003313036A (ja) * 2002-04-17 2003-11-06 Sharp Corp ガラス分断方法とその装置
JP2006137641A (ja) 2004-11-12 2006-06-01 Sanyo Electric Co Ltd ガラス基板の切断方法
JP2008156151A (ja) * 2006-12-22 2008-07-10 Sharp Corp 分断刃ユニット、それを備えた液晶表示パネル製造装置、及び液晶表示パネルの製造方法
JPWO2015137161A1 (ja) * 2014-03-12 2017-04-06 旭硝子株式会社 カッター装置および切線形成方法並びに脆性板の切断方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012240902A (ja) * 2011-05-24 2012-12-10 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置

Also Published As

Publication number Publication date
JP2016037414A (ja) 2016-03-22
JP6435698B2 (ja) 2018-12-12
CN105366932A (zh) 2016-03-02
CN105366932B (zh) 2019-12-17
KR20160018330A (ko) 2016-02-17
TW201605751A (zh) 2016-02-16

Similar Documents

Publication Publication Date Title
TWI406821B (zh) Cutter wheel and its manufacturing method, manual scribing tool and scribing device
TWI393682B (zh) A scribing method for brittle materials and a method of manufacturing the same, using the scribing method of the scribing wheel and the scribing device, and the scribing tool
TWI466838B (zh) Cutter wheel and the use of its brittle material substrate scribing method and segmentation method
TWI650291B (zh) 刻劃方法及刻劃裝置
TWI530466B (zh) 玻璃面板刻線裝置及刻線方法
TWI511939B (zh) A scribing line, a scribing device, a scribing method, a manufacturing method for a display panel, and a display panel
TW201632479A (zh) 基板分斷方法及劃線裝置
TWI650293B (zh) 刻劃工具
JP6384264B2 (ja) スクライブ方法およびスクライブ装置
JP6493512B2 (ja) 分断方法および分断装置
JP2016047787A (ja) スクライビングツールおよびスクライブ装置
JP2016121037A (ja) スクライブ装置
JP2016108167A (ja) スクライビングツールおよびスクライブ装置
TWI672279B (zh) 劃線方法及劃線裝置
JP2016108169A (ja) スクライビングツールおよびスクライブ装置
TW201922645A (zh) 劃線方法和切割方法
KR20190049441A (ko) 스크라이브 방법 및 분단방법
JP2016060684A (ja) 基板分断方法及びスクライブ装置