TWI647276B - 一種ｌｅｄ光源薄板封裝材料 - Google Patents
一種ｌｅｄ光源薄板封裝材料 Download PDFInfo
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- TWI647276B TWI647276B TW105128133A TW105128133A TWI647276B TW I647276 B TWI647276 B TW I647276B TW 105128133 A TW105128133 A TW 105128133A TW 105128133 A TW105128133 A TW 105128133A TW I647276 B TWI647276 B TW I647276B
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- 239000005022 packaging material Substances 0.000 title claims abstract description 32
- 239000004593 Epoxy Substances 0.000 claims abstract description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 10
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- 229920002050 silicone resin Polymers 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 18
- 229920000647 polyepoxide Polymers 0.000 abstract description 18
- 239000000203 mixture Substances 0.000 abstract description 9
- 229920001296 polysiloxane Polymers 0.000 abstract description 6
- 150000008065 acid anhydrides Chemical class 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 125000000524 functional group Chemical group 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 2
- 238000009472 formulation Methods 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 239000010703 silicon Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 18
- 239000000843 powder Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000001802 infusion Methods 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- -1 methylhexaene Hydrogen anhydride Chemical class 0.000 description 3
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical group C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
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- 229920000877 Melamine resin Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000004645 aluminates Chemical class 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
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- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
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- 238000000034 method Methods 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
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- 229920002635 polyurethane Polymers 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
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- 238000012360 testing method Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- NSFJVFJYLFBBTI-UHFFFAOYSA-N C(C1CO1)OCCCC(C)O[Si](OCC)(C)C Chemical compound C(C1CO1)OCCCC(C)O[Si](OCC)(C)C NSFJVFJYLFBBTI-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- DRRZZMBHJXLZRS-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]cyclohexanamine Chemical compound CO[Si](C)(OC)CCCNC1CCCCC1 DRRZZMBHJXLZRS-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K13/02—Organic and inorganic ingredients
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- C08K3/00—Use of inorganic substances as compounding ingredients
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Abstract
本發明公開了一種LED光源薄板封裝材料，該材料包含有以下組分：(a)具有環氧官能基的環氧樹脂；(b)相對於(a)的重量90%-110%的酸酐；(c)相對於(a)的重量0.1%-10%的矽氧烷化合物。本發明通過合理配方，克服了環氧樹脂封裝材料脆性大、耐衝擊性能差以及有機矽封裝材料價格高的技術問題，並且本發明的LED薄板封裝材料能夠成功達到亮度均大於150lm/W，光衰均小於30%，明顯高於市場上現有的LED封裝材料。
Description
本發明涉及LED封裝材料技術領域，尤其涉及一種LED光源薄板封裝材料，特別是指一種於硬化過程後能夠達到高亮度低光衰的封裝材料。
LED(發光二極體)封裝是指發光晶片的封裝，相比積體電路封裝有較大不同。LED的封裝不僅要求能夠保護燈芯，而且還要能夠透光。所以LED的封裝對封裝材料有特殊的要求。
目前常用的LED封裝主要有環氧樹脂、聚氨酯、有機矽等透明度高的材料。其中聚氨酯灌封膠表面過軟，易起泡，固化不充分，只能用於普通電器元件的灌封。目前使用最多的環氧樹脂脆性大、耐衝擊性能差，使用溫度一般不超過150℃。有機矽材料具有較好的耐熱性能和耐紫外線性能，同時與晶片的相容性好，是目前最理想的封裝材料，但是其價格昂貴，一般只在對封裝要求苛刻的大功率LED封裝中應用，同時現有的封裝材料還存在亮度低、光衰嚴重的缺陷，隨著大功率LED發光效率的提高，其在照片領域的應用逐漸擴大，對LED封裝材料的需求量也隨之增加，因此更需要開發一種價格便宜、高亮度低光衰的封裝材料。
本發明的目的是提供一種LED光源薄板封裝材料。
本發明採用如下技術方案：
本發明的LED光源薄板封裝材料包含有以下組分：(a)具有環氧官能基的環氧樹脂；(b)相對於(a)的重量90%-110%的酸酐；(c)相對於(a)的重量0.1%-10%的矽氧烷化合物。
所述的具有環氧官能基的環氧樹脂是雙酚A型環氧樹脂、雙酚F型環氧樹脂、酚醛型環氧樹脂、四溴雙酚環氧樹脂、以及橡膠改質環氧樹脂、脂環族環氧樹脂、脂肪族環氧樹脂或其共混和物。
所述的酸酐是甲基四氫苯酐、甲基六氫苯酐或其共混和物。酸酐最好使用甲基六氫酸酐(MHHPA)。當含量不足或過多重量份時，會有Tg過低、黃變與信賴性不佳的問題。
所述的矽氧烷化合物是3-縮水甘油醚氧基丙基三乙氧基矽烷、3-(2,3-環氧丙氧)丙基三甲氧基矽烷，3-縮水甘油醚氧基丙基甲基二乙氧基矽烷，3-[(2,3)-環氧丙氧]丙基甲基二甲氧基矽烷、2-(3,4-環氧環己烷)乙基三甲氧基矽烷、silicone alkoxy oligomer，其中silicone取代基包含甲基、乙基、氨類、環氧或聚甲基丙烯酸甲酯。
所述的材料中還含有促進劑，該促進劑是含磷型、含溴型、含氮型促進劑或共混物；促進劑的添加量是環氧樹脂重量的0.01%-10%。
所述的材料中還含有螢光材料，所述螢光材料是YAG螢光粉、TAG螢光粉、鋁酸鹽螢光材料、矽酸鹽螢光材料、氮化物以及氮氧化物螢光材料、氮氧化物螢光材料；螢光材料的添加量是環氧樹脂重量的0.01%-30%。
所述的材料中還含有功能性粉料，所述功能性粉料是矽樹脂、三聚氰胺、壓克力材料、二氧化矽、氧化鋁、氫氧化鋁、氮化硼或其共混物；功能性粉料的添加量是環氧樹脂重量的0.01%-5%。
所述的材料的加工方式包括模壓及灌注方式。
作為優選的技術方案之一，本發明的LED光源薄板封裝材料是由以下組份組成：(a)雙酚A型環氧樹脂；(b)相對於(a)的重量100%的甲基六氫酸酐；(c)相對於(a)的重量2%的磷系促進劑；(d)相對於(a)的重量20%的YAG螢光粉；(e)相對於(a)的重量1%的矽樹脂作為優選的技術方案之二，本發明的LED光源薄板封裝材料是由以下組份組成：(a)雙酚A型環氧樹脂；(b)相對於(a)的重量100%的甲基六氫酸酐；(c)相對於(a)的重量2%的環氧基矽氧烷低聚物(epoxy silcone alkoxy oligomer)；(d)相對於(a)的重量2%的磷系促進劑；(e)相對於(a)的重量20%的YAG螢光粉；(f)相對於(a)的重量1%的矽樹脂。
本發明的積極效果如下：
本發明通過合理配方，克服了環氧樹脂封裝材料脆性大、耐衝擊性能差以及有機矽封裝材料價格高的技術問題，並且本發明的LED薄板封裝材料
能夠成功達到亮度均大於150lm/W，光衰均小於30%，明顯高於市場上現有的LED封裝材料。
下面，進一步詳細說明本發明：
實施例1
本發明的LED光源薄板封裝材料是由以下組份組成：(a)脂環族環氧樹脂；(b)相對於(a)的重量100%的甲基六氫苯酐；(c)相對於(a)的重量5%的3-縮水甘油醚氧基丙基甲基二乙氧基矽烷。
所述的材料的加工方式是模壓。
實施例2
本發明的LED光源薄板封裝材料是由以下組份組成：(a)四溴雙酚環氧樹脂；(b)相對於(a)的重量110%的甲基六氫苯酐；(c)相對於(a)的重量0.1%的3-(2,3-環氧丙氧)丙基三甲氧基矽烷；
實施例2
本發明的LED光源薄板封裝材料是由以下組份組成：(a)四溴雙酚環氧樹脂；(b)相對於(a)的重量110%的甲基六氫苯酐；(c)相對於(a)的重量0.1%的3-(2,3-環氧丙氧)丙基三甲氧基矽烷；
(d)相對於(a)的重量10%的含氮型促進劑；(e)相對於(a)的重量0.01%的鋁酸鹽螢光粉；(f)相對於(a)的重量5%的三聚氰胺。
所述的材料的加工方式是灌注。
實施例3
本發明的LED光源薄板封裝材料是由以下組份組成：(a)雙酚F型環氧樹脂；(b)相對於(a)的重量90%的甲基四氫苯酐；(c)相對於(a)的重量10%的3-縮水甘油醚氧基丙基三乙氧基矽烷；(d)相對於(a)的重量0.01%的含溴型促進劑；(e)相對於(a)的重量30%的TAG螢光粉；(f)相對於(a)的重量0.01%的氧化鋁。
所述的材料的加工方式是模壓。
實施例4
本發明的LED光源薄板封裝材料是由以下組份組成：(a)雙酚A型環氧樹脂；(b)相對於(a)的重量100%的甲基六氫酸酐；(c)相對於(a)的重量2%的磷系促進劑；(d)相對於(a)的重量20%的YAG螢光粉；(e)相對於(a)的重量1%的矽樹脂。
所述的材料的加工方式是灌注。
實施例5
本發明的LED光源薄板封裝材料是由以下組份組成：(a)雙酚A型環氧樹脂；(b)相對於(a)的重量100%的甲基六氫酸酐；(c)相對於(a)的重量2%的環氧基矽氧烷低聚物(epoxy silcone alkoxy oligomer)；(d)相對於(a)的重量2%的磷系促進劑；(e)相對於(a)的重量20%的YAG螢光粉；(f)相對於(a)的重量1%的矽樹脂。
所述的材料的加工方式是模壓。
比較例1
使用雙酚A型環氧樹脂與脂環族族環氧樹脂與MHHPA酸酐硬化劑進行硬化反應所制得的成品(型號WG-5211A/B，臺灣勁合有限公司供售)。
比較例2
使用雙酚A型環氧樹脂與MHHPA酸酐硬化劑進行硬化反應所制得的成品(型號SK-5518A/B，臺灣勁合有限公司供售)。
LED封裝材料組成物光衰性評估
分別將比較例1至2以及實施例1-5封裝材料組成物混合並攪拌均勻後，以模壓或灌注方式製成發光薄板，其後，將前述薄板，進行常溫15mA@1000hrs點亮，利用LED亮度測試機測試亮度及記錄光衰資料(LED-BNTW-12-XY，宏綱股份有限公司)，測試結果顯示於下表1中。
從上表1、2可知，相對於比較例1和比較例2，本發明的LED發光源封裝材料組成物確實在經過成型後，可達到高亮度及光衰測試可小於30%，因此具有能夠長期使用且不會造成點亮後光衰嚴重的優勢。
儘管已經示出和描述了本發明的實施例，對於本領域的普通技術人員而言，可以理解在不脫離本發明的原理和精神的情況下可以對這些實施例進行多種變化、修改、替換和變型，本發明的範圍由所附請求項及其等同物限定。
Claims (1)
- 一種LED光源薄板封裝材料，其特徵在於：所述的LED光源薄板封裝材料是由以下組份組成：(a)雙酚A型環氧樹脂；(b)相對於(a)的重量100%的甲基六氫酸酐；(c)相對於(a)的重量2%的環氧基矽氧烷低聚物(epoxy silcone alkoxy oligomer)；(d)相對於(a)的重量2%的磷系促進劑；(e)相對於(a)的重量20%的YAG螢光粉；(f)相對於(a)的重量1%的矽樹脂。
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