TWI644072B - Chamber for heat treatment device and heat treatment device - Google Patents

Chamber for heat treatment device and heat treatment device Download PDF

Info

Publication number
TWI644072B
TWI644072B TW106132267A TW106132267A TWI644072B TW I644072 B TWI644072 B TW I644072B TW 106132267 A TW106132267 A TW 106132267A TW 106132267 A TW106132267 A TW 106132267A TW I644072 B TWI644072 B TW I644072B
Authority
TW
Taiwan
Prior art keywords
chamber
heat treatment
flat plate
members
side wall
Prior art date
Application number
TW106132267A
Other languages
English (en)
Chinese (zh)
Other versions
TW201802423A (zh
Inventor
笠次克尚
西村圭介
浦崎義彥
森川清彥
中西裕也
Original Assignee
光洋熱系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 光洋熱系統股份有限公司 filed Critical 光洋熱系統股份有限公司
Publication of TW201802423A publication Critical patent/TW201802423A/zh
Application granted granted Critical
Publication of TWI644072B publication Critical patent/TWI644072B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Furnace Details (AREA)
  • Tunnel Furnaces (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
TW106132267A 2013-07-26 2014-06-25 Chamber for heat treatment device and heat treatment device TWI644072B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013155916A JP2015025623A (ja) 2013-07-26 2013-07-26 熱処理装置用のチャンバ、および、熱処理装置
JP2013-155916 2013-07-26

Publications (2)

Publication Number Publication Date
TW201802423A TW201802423A (zh) 2018-01-16
TWI644072B true TWI644072B (zh) 2018-12-11

Family

ID=52488932

Family Applications (3)

Application Number Title Priority Date Filing Date
TW106132266A TWI644071B (zh) 2013-07-26 2014-06-25 Chamber for heat treatment device and heat treatment device
TW103121853A TWI616633B (zh) 2013-07-26 2014-06-25 Chamber for heat treatment device and heat treatment device
TW106132267A TWI644072B (zh) 2013-07-26 2014-06-25 Chamber for heat treatment device and heat treatment device

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW106132266A TWI644071B (zh) 2013-07-26 2014-06-25 Chamber for heat treatment device and heat treatment device
TW103121853A TWI616633B (zh) 2013-07-26 2014-06-25 Chamber for heat treatment device and heat treatment device

Country Status (4)

Country Link
JP (1) JP2015025623A (ko)
KR (2) KR101612614B1 (ko)
CN (2) CN107611066B (ko)
TW (3) TWI644071B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11041836B2 (en) 2016-11-08 2021-06-22 O.I. Corporation Catalyst guard
JP6960845B2 (ja) * 2017-12-21 2021-11-05 株式会社Ｃｆｃデザイン 炭素／炭素複合材料製の円筒炉用マッフル構造
TWM581661U (zh) * 2019-03-07 2019-08-01 群翌能源股份有限公司 Combined protection bucket for high temperature process protected by inert atmosphere

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01289254A (ja) * 1988-05-17 1989-11-21 Tel Sagami Ltd 熱処理装置
JP2009524243A (ja) * 2006-01-21 2009-06-25 インテグレイティッド マテリアルズ インク キー溝インターロックで接着しているステーブにより形成された管状部材または他の部材

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4559631A (en) * 1984-09-14 1985-12-17 Abar Ipsen Industries Heat treating furnace with graphite heating elements
US4897140A (en) * 1986-05-19 1990-01-30 Peter Opsvik Method for making a pipe-shaped body of wood
JPH01184387A (ja) * 1988-01-20 1989-07-24 Kureha Chem Ind Co Ltd 高温電気炉用マッフル
US6021155A (en) * 1998-02-23 2000-02-01 Jones; William R. Heat treating furnace having improved hot zone
JP2000000147A (ja) * 1998-06-17 2000-01-07 Takeguchi Shinichi ガラス構造体及びその構造材
JP4060112B2 (ja) * 2001-04-10 2008-03-12 アイセル株式会社 薄板パネル
US20020170487A1 (en) * 2001-05-18 2002-11-21 Raanan Zehavi Pre-coated silicon fixtures used in a high temperature process
JP4384518B2 (ja) 2004-02-18 2009-12-16 光洋サーモシステム株式会社 熱処理装置の炉口構造
US20100009489A1 (en) * 2008-07-08 2010-01-14 Chan Albert Tu Method and system for producing a solar cell using atmospheric pressure plasma chemical vapor deposition
JP5501916B2 (ja) * 2010-09-27 2014-05-28 東レエンジニアリング株式会社 基板処理システム
CN202393209U (zh) * 2011-08-24 2012-08-22 徐玉继 罩式圆形大工件专用拼装炉窑装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01289254A (ja) * 1988-05-17 1989-11-21 Tel Sagami Ltd 熱処理装置
JP2009524243A (ja) * 2006-01-21 2009-06-25 インテグレイティッド マテリアルズ インク キー溝インターロックで接着しているステーブにより形成された管状部材または他の部材

Also Published As

Publication number Publication date
KR20150013027A (ko) 2015-02-04
CN104347454A (zh) 2015-02-11
JP2015025623A (ja) 2015-02-05
KR101612614B1 (ko) 2016-04-14
KR101562768B1 (ko) 2015-10-22
CN107611066B (zh) 2021-05-07
TW201516366A (zh) 2015-05-01
KR20150101442A (ko) 2015-09-03
CN107611066A (zh) 2018-01-19
TWI644071B (zh) 2018-12-11
CN104347454B (zh) 2017-10-13
TW201802423A (zh) 2018-01-16
TWI616633B (zh) 2018-03-01
TW201809570A (zh) 2018-03-16

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