TWI642337B - Electronic component mounting device - Google Patents

Electronic component mounting device Download PDF

Info

Publication number
TWI642337B
TWI642337B TW106126808A TW106126808A TWI642337B TW I642337 B TWI642337 B TW I642337B TW 106126808 A TW106126808 A TW 106126808A TW 106126808 A TW106126808 A TW 106126808A TW I642337 B TWI642337 B TW I642337B
Authority
TW
Taiwan
Prior art keywords
substrate
electronic component
crimping
component mounting
mounting device
Prior art date
Application number
TW106126808A
Other languages
English (en)
Chinese (zh)
Other versions
TW201808084A (zh
Inventor
神戸寛久
Original Assignee
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of TW201808084A publication Critical patent/TW201808084A/zh
Application granted granted Critical
Publication of TWI642337B publication Critical patent/TWI642337B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
TW106126808A 2016-08-16 2017-08-09 Electronic component mounting device TWI642337B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016159645 2016-08-16
JP2016-159645 2016-08-16

Publications (2)

Publication Number Publication Date
TW201808084A TW201808084A (zh) 2018-03-01
TWI642337B true TWI642337B (zh) 2018-11-21

Family

ID=61249130

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106126808A TWI642337B (zh) 2016-08-16 2017-08-09 Electronic component mounting device

Country Status (4)

Country Link
JP (1) JP6675356B2 (ja)
KR (1) KR102004606B1 (ja)
CN (1) CN107770970B (ja)
TW (1) TWI642337B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112566485B (zh) * 2019-09-25 2022-05-13 芝浦机械电子装置株式会社 电子零件的安装装置
KR20210116725A (ko) 2020-03-12 2021-09-28 삼성디스플레이 주식회사 본딩 장치
WO2021243545A1 (zh) * 2020-06-02 2021-12-09 南京溧水高新创业投资管理有限公司 一种电子零件安装装置
KR102510422B1 (ko) * 2021-01-18 2023-03-15 주식회사 제이스텍 표시장치를 제조하는 장치 및 이를 이용한 표시장치의 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273688A (ja) * 2003-03-07 2004-09-30 Seiko Epson Corp 圧着方法、圧着装置、電気光学装置の製造方法及び製造装置
TWI311792B (ja) * 2005-08-24 2009-07-01 Shibaura Mechatronics Corporatio
TWI439775B (zh) * 2007-01-10 2014-06-01 Shibaura Mechatronics Corp Installation device and installation method of electronic parts

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2971180B2 (ja) 1991-05-30 1999-11-02 株式会社東芝 アウタリードボンディング装置
JP3909816B2 (ja) * 2001-10-31 2007-04-25 オプトレックス株式会社 液晶表示パネルへの回路部品接続装置
JP2008084952A (ja) * 2006-09-26 2008-04-10 Fujifilm Corp 配線板接続方法
JP5008476B2 (ja) * 2007-06-27 2012-08-22 パナソニック株式会社 電極接合ユニット及び電極接合方法
JP2009272457A (ja) * 2008-05-08 2009-11-19 Sharp Corp 基板実装構造及び液晶表示装置、並びに基板実装構造の製造方法
JP2011047984A (ja) * 2009-08-25 2011-03-10 Hitachi High-Technologies Corp Ｆｐｄモジュール実装装置およびその実装方法
JP2011054815A (ja) * 2009-09-03 2011-03-17 Hitachi High-Technologies Corp 実装処理作業装置及び実装処理作業方法並びに表示基板モジュール組立ライン

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273688A (ja) * 2003-03-07 2004-09-30 Seiko Epson Corp 圧着方法、圧着装置、電気光学装置の製造方法及び製造装置
TWI311792B (ja) * 2005-08-24 2009-07-01 Shibaura Mechatronics Corporatio
TWI439775B (zh) * 2007-01-10 2014-06-01 Shibaura Mechatronics Corp Installation device and installation method of electronic parts

Also Published As

Publication number Publication date
KR102004606B1 (ko) 2019-07-26
JP2018029171A (ja) 2018-02-22
TW201808084A (zh) 2018-03-01
CN107770970A (zh) 2018-03-06
KR20180019480A (ko) 2018-02-26
CN107770970B (zh) 2020-06-30
JP6675356B2 (ja) 2020-04-01

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