TWI638993B - 具有包括可重複使用之子結構的半導體裝置模型之度量衡系統 - Google Patents

具有包括可重複使用之子結構的半導體裝置模型之度量衡系統 Download PDF

Info

Publication number
TWI638993B
TWI638993B TW104101371A TW104101371A TWI638993B TW I638993 B TWI638993 B TW I638993B TW 104101371 A TW104101371 A TW 104101371A TW 104101371 A TW104101371 A TW 104101371A TW I638993 B TWI638993 B TW I638993B
Authority
TW
Taiwan
Prior art keywords
model
reusable
code
causing
computer
Prior art date
Application number
TW104101371A
Other languages
English (en)
Chinese (zh)
Other versions
TW201531694A (zh
Inventor
強納森 伊羅瑞塔
馬修Ａ 拉芬
李奧尼多 波斯拉夫斯基
托斯頓 凱克
寬 趙
列泉 李
Original Assignee
美商克萊譚克公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商克萊譚克公司 filed Critical 美商克萊譚克公司
Publication of TW201531694A publication Critical patent/TW201531694A/zh
Application granted granted Critical
Publication of TWI638993B publication Critical patent/TWI638993B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G01N21/211—Ellipsometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G01N21/211—Ellipsometry
    • G01N2021/213—Spectrometric ellipsometry

Landscapes

  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
TW104101371A 2014-01-15 2015-01-15 具有包括可重複使用之子結構的半導體裝置模型之度量衡系統 TWI638993B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201461927832P 2014-01-15 2014-01-15
US61/927,832 2014-01-15
US14/594,917 2015-01-12
US14/594,917 US9553033B2 (en) 2014-01-15 2015-01-12 Semiconductor device models including re-usable sub-structures

Publications (2)

Publication Number Publication Date
TW201531694A TW201531694A (zh) 2015-08-16
TWI638993B true TWI638993B (zh) 2018-10-21

Family

ID=53521602

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104101371A TWI638993B (zh) 2014-01-15 2015-01-15 具有包括可重複使用之子結構的半導體裝置模型之度量衡系統

Country Status (7)

Country Link
US (1) US9553033B2 (https=)
JP (1) JP6379206B2 (https=)
KR (1) KR102142178B1 (https=)
CN (1) CN105917454B (https=)
IL (1) IL246566B (https=)
TW (1) TWI638993B (https=)
WO (1) WO2015109035A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130245985A1 (en) * 2012-03-14 2013-09-19 Kla-Tencor Corporation Calibration Of An Optical Metrology System For Critical Dimension Application Matching
US10340165B2 (en) * 2016-03-29 2019-07-02 Kla-Tencor Corporation Systems and methods for automated multi-zone detection and modeling
US10775323B2 (en) * 2016-10-18 2020-09-15 Kla-Tencor Corporation Full beam metrology for X-ray scatterometry systems
US10817999B2 (en) * 2017-07-18 2020-10-27 Kla Corporation Image-based overlay metrology and monitoring using through-focus imaging
WO2019173170A1 (en) * 2018-03-05 2019-09-12 Kla-Tencor Corporation Visualization of three-dimensional semiconductor structures
US10794839B2 (en) 2019-02-22 2020-10-06 Kla Corporation Visualization of three-dimensional semiconductor structures
US11036898B2 (en) * 2018-03-15 2021-06-15 Kla-Tencor Corporation Measurement models of nanowire semiconductor structures based on re-useable sub-structures
US11060846B2 (en) 2018-12-19 2021-07-13 Kla Corporation Scatterometry based methods and systems for measurement of strain in semiconductor structures
US11060982B2 (en) 2019-03-17 2021-07-13 Kla Corporation Multi-dimensional model of optical dispersion
US11460418B2 (en) 2019-08-26 2022-10-04 Kla Corporation Methods and systems for semiconductor metrology based on wavelength resolved soft X-ray reflectometry
US11698251B2 (en) 2020-01-07 2023-07-11 Kla Corporation Methods and systems for overlay measurement based on soft X-ray Scatterometry
US12013355B2 (en) 2020-12-17 2024-06-18 Kla Corporation Methods and systems for compact, small spot size soft x-ray scatterometry
US11868689B2 (en) * 2021-10-11 2024-01-09 KLA Corp. Systems and methods for setting up a physics-based model

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200802630A (en) 2006-05-15 2008-01-01 Rudolph Technologies Inc Structure model description and use for scattermetry-based semiconductor manufacturing process metrology

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608526A (en) 1995-01-19 1997-03-04 Tencor Instruments Focused beam spectroscopic ellipsometry method and system
US5859424A (en) 1997-04-08 1999-01-12 Kla-Tencor Corporation Apodizing filter system useful for reducing spot size in optical measurements and other applications
US6429943B1 (en) 2000-03-29 2002-08-06 Therma-Wave, Inc. Critical dimension analysis with simultaneous multiple angle of incidence measurements
US7478019B2 (en) 2005-01-26 2009-01-13 Kla-Tencor Corporation Multiple tool and structure analysis
US7355728B2 (en) 2005-06-16 2008-04-08 Timbre Technologies, Inc. Optical metrology model optimization for repetitive structures
US7567351B2 (en) 2006-02-02 2009-07-28 Kla-Tencor Corporation High resolution monitoring of CD variations
US7484198B2 (en) * 2006-02-27 2009-01-27 Synopsys, Inc. Managing integrated circuit stress using dummy diffusion regions
US7518740B2 (en) * 2006-07-10 2009-04-14 Tokyo Electron Limited Evaluating a profile model to characterize a structure to be examined using optical metrology
WO2008077100A2 (en) * 2006-12-19 2008-06-26 Kla-Tencor Corporation Systems and methods for creating inspection recipes
WO2008137544A1 (en) 2007-05-02 2008-11-13 Mks Instruments, Inc. Automated model building and model updating
US7895548B2 (en) * 2007-10-26 2011-02-22 Synopsys, Inc. Filler cells for design optimization in a place-and-route system
GB0818308D0 (en) * 2008-10-07 2008-11-12 Helic S A Expert system-based integrated inductor synthesis and optimization
US8214771B2 (en) 2009-01-08 2012-07-03 Kla-Tencor Corporation Scatterometry metrology target design optimization
US8381140B2 (en) * 2011-02-11 2013-02-19 Tokyo Electron Limited Wide process range library for metrology
US8468471B2 (en) * 2011-09-23 2013-06-18 Kla-Tencor Corp. Process aware metrology
US20130110477A1 (en) 2011-10-31 2013-05-02 Stilian Pandev Process variation-based model optimization for metrology
US8879073B2 (en) 2012-02-24 2014-11-04 Kla-Tencor Corporation Optical metrology using targets with field enhancement elements
JP5969915B2 (ja) * 2012-05-28 2016-08-17 株式会社日立ハイテクノロジーズ 微細パターンの断面形状測定方法及びその装置
US9581430B2 (en) 2012-10-19 2017-02-28 Kla-Tencor Corporation Phase characterization of targets
US10769320B2 (en) 2012-12-18 2020-09-08 Kla-Tencor Corporation Integrated use of model-based metrology and a process model
US9291554B2 (en) 2013-02-05 2016-03-22 Kla-Tencor Corporation Method of electromagnetic modeling of finite structures and finite illumination for metrology and inspection

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200802630A (en) 2006-05-15 2008-01-01 Rudolph Technologies Inc Structure model description and use for scattermetry-based semiconductor manufacturing process metrology

Also Published As

Publication number Publication date
IL246566B (en) 2019-03-31
TW201531694A (zh) 2015-08-16
US20150199463A1 (en) 2015-07-16
CN105917454B (zh) 2018-08-24
KR20160108365A (ko) 2016-09-19
KR102142178B1 (ko) 2020-08-06
JP2017507479A (ja) 2017-03-16
JP6379206B2 (ja) 2018-08-22
US9553033B2 (en) 2017-01-24
CN105917454A (zh) 2016-08-31
WO2015109035A1 (en) 2015-07-23

Similar Documents

Publication Publication Date Title
TWI638993B (zh) 具有包括可重複使用之子結構的半導體裝置模型之度量衡系統
JP6783298B2 (ja) モデルベースのホットスポットモニタリング
KR102415145B1 (ko) 다중 패턴화 파라미터의 측정
TWI703653B (zh) 基於模型之單一參數量測
KR102013483B1 (ko) 파라미터 추적을 위한 계측 시스템 최적화
US10215559B2 (en) Metrology of multiple patterning processes
CN104995562B (zh) 基于模型的度量及过程模型的经整合使用
CN107429995A (zh) 在计量系统中计量数据的前向馈送
US10732520B1 (en) Measurement library optimization in semiconductor metrology
TW201448081A (zh) 以統計模型爲基礎的計量學
US10345095B1 (en) Model based measurement systems with improved electromagnetic solver performance
JP7303868B2 (ja) 位相解明光学及びｘ線半導体計量
CN121488157A (zh) 用于半导体结构的基于模型的测量的灵活测量模型