TWI628046B - Method for processing plate-shaped body, method for manufacturing electronic device, and laminated body - Google Patents

Abstract

The present invention relates to a method for processing a plate-shaped body, the method comprising the steps of: grinding a grinding portion of at least a portion of a periphery of the plate-shaped body by a grinding stone comprising a metal bonding agent or a ceramic bonding agent, and a chamfering step of chamfering the portion of the plate-like body polished by the grindstone by an elastic grindstone, and the grindstone is in the shape of a cylinder or a truncated cone, and has a grinding grain surface of the plate-like body on the outer circumference There is no grinding groove on the surface of the abrasive grain.

Description

Method for processing plate-shaped body, method for manufacturing electronic device, and laminated body

The present invention relates to a method of processing a plate-shaped body, a method of manufacturing the electronic device, and a laminate.

In the processing of the outer peripheral portion of the plate-shaped body, for example, a grindstone containing a metal binder can be used (for example, refer to Patent Document 1). The grindstone has a cylindrical shape and has an abrasive grain surface on which the plate-like body is ground on the outer circumference. The center axis of the grindstone is set to be perpendicular to the main surface of the plate-shaped body. The grindstone rotates around the central axis and relatively moves along the outer circumference of the plate-like body, and at least a part of the outer periphery of the plate-shaped body is ground. The grinding stone has a V-shaped grinding groove on the surface of the grinding grain, and the plate-shaped body is ground by grinding the wall surface of the groove. Here, the grinding groove having a V-shaped cross section includes not only the bottom of the grinding groove but also a flat or rounded one.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2001-9689

When the plate-shaped body is ground on the wall surface of the grinding groove, cracks are likely to occur at the boundary portion between the main surface and the side surface of the plate-shaped body. This crack may cause the strength of the plate to decrease.

The present invention has been made in view of the above problems, and a main object thereof is to provide a method for processing a plate-like body which improves the strength of a plate-shaped body.

In order to solve the above problems, according to an aspect of the present invention, a method for processing a plate-like body is provided, which comprises the steps of: at least a periphery of a plate-shaped body by a grindstone comprising a metal binder or a ceramic binder; a grinding step of performing a grinding and a chamfering step of chamfering the portion of the plate-like body polished by the grindstone by an elastic grindstone, wherein the grindstone has a cylindrical shape or a truncated cone shape, and has an outer circumference The abrasive grain of the plate-like body is ground, and there is no grinding groove on the surface of the abrasive grain.

According to an aspect of the present invention, a method of processing a plate-like body for improving the strength of a plate-like body is provided.

10, 10A, 10B, 110A, 110B‧‧ ‧ laminated body

11, 11A, 11B, 111A, 111B‧‧‧ glass substrate

12, 12A, 12B, 112A, 111B‧‧‧ reinforcing plate

13, 13A, 13B, 113A, 113B‧‧‧ organic film

14, 14A, 14B, 114A, 114B‧‧‧ Support Board

15A, 16A, 18A, 19A, 115A, 116A, 118A, 119A‧‧

15B, 16B, 18B, 19B, 115B, 116B, 118B, 119B‧‧‧ chamfered parts

20, 120‧‧‧ Millstone

30, 130‧‧‧Elastic grindstone

30a-1, 30a-2, 30a-3‧‧‧ abrasive grains

41‧‧‧film transistor

42‧‧‧TFT substrate

43‧‧‧Color filters

44‧‧‧CF substrate

45‧‧‧Liquid crystal materials

51‧‧‧Organic EL components

52‧‧‧ opposite substrate

61‧‧‧Solar battery components

Fig. 1 is a side view showing a laminated body before processing according to a first embodiment of the present invention.

Fig. 2 is a view showing a grinding step of grinding the laminated body of Fig. 1 by a grindstone.

Fig. 3 is a view showing a chamfering step of chamfering the laminated body of Fig. 2 by an elastic grindstone.

Fig. 4 is a view showing a step of fabricating a TFT (Thin Film Transistor) substrate using the laminate of Fig. 3;

Fig. 5 is a view showing a step of fabricating a CF (Color Filter) substrate using the laminate of Fig. 3.

Fig. 6 is a view showing an assembly procedure of the TFT substrate of Fig. 4 and the CF substrate of Fig. 5.

Fig. 7 is a view showing a peeling step performed after the step of Fig. 4 or after the step of Fig. 5.

Fig. 8 is a view showing a step of forming an organic EL (Electro Luminescence) element using the laminate of Fig. 3 .

Fig. 9 is a view showing a bonding step performed after the step of Fig. 8.

Fig. 10 is a view showing a peeling step performed after the step of Fig. 8.

Fig. 11 is a view showing a step of forming a solar cell element using the laminated body of Fig. 3.

Fig. 12 is a view showing a peeling step performed after the step of Fig. 11.

Fig. 13 is a view showing a grinding step in the second embodiment of the present invention.

Fig. 14 is a view showing a chamfering step in the second embodiment of the present invention.

Figure 15 is a partial enlarged view of Figure 3.

Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the drawings, the same or corresponding reference numerals are given to the same or corresponding components, and the description is omitted. Further, the plate-like body of the present embodiment is a laminated body composed of a plurality of layers, but may be a single plate composed of one layer. Further, the laminated system of the present embodiment may be formed by peeling off specific layers among the plurality of layers constituting the laminated body, but may be difficult to peel off, and may be, for example, a liquid crystal display.

[First Embodiment]

Fig. 1 is a side view showing a laminated body before processing according to a first embodiment of the present invention. For example, as shown in FIG. 1, the laminated body 10 before processing has the glass substrate 11, and the reinforcement board 12 which is detachably bonded to the glass substrate 11. The laminated body 10 is used for manufacturing a product after being processed by the following processing method. A plurality of laminates 10 can also be used in the manufacture of a product. Examples of the product include electronic devices such as an image display device, a solar cell, and a thin film secondary battery. Examples of the image display device include a liquid crystal display, a plasma display, and an organic EL display.

The glass substrate 11 is a part of the product, and a functional film corresponding to the type of the product is formed on the glass substrate 11 in the manufacturing step of the product. The functional film may be composed of one of a layer and a plurality of layers.

Examples of the glass of the glass substrate 11 include alkali-free glass, borosilicate glass, soda lime glass, high cerium oxide glass, and other oxide-based glass containing cerium oxide as a main component. Glass and so on. The oxide-based glass is preferably a glass having a content of cerium oxide in terms of oxide of 40% by mass to 90% by mass. The glass of the glass substrate 11 is selected according to the kind of product. For example, in the case of a liquid crystal display, a glass (alkali-free glass) substantially free of an alkali metal component can be used.

The thickness of the glass substrate 11 is, for example, 0.3 mm or less, more preferably 0.1 mm or less, still more preferably 0.05 mm or less. Moreover, the thickness of the glass substrate 11 is preferably 0.01 mm or more from the viewpoint of moldability.

The reinforcing plate 12 is bonded to the glass substrate 11 to reinforce the glass substrate 11 before the peeling operation of the reinforcing plate 12 and the glass substrate 11. The thickness of the reinforcing plate 12 may be thicker than the thickness of the glass substrate 11. The reinforcing plate 12 is peeled off from the glass substrate 11 in the middle of the manufacturing process of the product, and is not part of the product.

As for the reinforcing plate 12, in order to prevent warping or peeling due to heat treatment, it is preferable that the difference in thermal expansion from the glass substrate 11 is small. Therefore, the reinforcing plate 12 preferably includes a glass plate. Preferably, the glass of the glass substrate 11 and the glass of the reinforcing plate 12 are the same type of glass.

The reinforcing plate 12 includes, for example, an organic film 13 as an intermediate film that is detachably bonded to the glass substrate 11, and a support plate 14 that supports the glass substrate 11 via the organic film 13. The organic film 13 and the glass substrate 11 are bonded in a peelable manner by a van der Waals force or the like acting therebetween.

The organic film 13 prevents the positional displacement of the glass substrate 11 before performing the peeling operation of the organic film 13 and the glass substrate 11. The organic film 13 is easily peeled off from the glass substrate 11 by a peeling operation. The damage of the glass substrate 11 caused by the peeling operation can be prevented.

The organic film 13 is formed in such a manner that the bonding force with the support plate 14 is relatively higher than the bonding force with the glass substrate 11. The peeling of the unintentional organic film 13 and the support sheet 14 can be prevented at the time of the peeling operation.

The organic film 13 is formed, for example, of an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxymethylene resin, or a polyimide polyimide resin. From the viewpoint of heat resistance or peelability, a polyoxymethylene resin or a polyamidene polyoxymethylene resin is preferred.

The polyoxymethylene resin is preferably disclosed in Japanese Laid-Open Patent Publication No. 2011-46174. Specifically, the polyoxyxene resin is preferably a cured product of a curable polyoxyxylene resin composition comprising the linear organopolyoxane (a) and the linear organopolyoxane (b) described below.

The linear organopolyoxane (a) has at least 2 alkenyl groups per molecule.

The linear organopolyoxane (b) has at least 3 hydrogen atoms bonded to a halogen atom per molecule, and has at least one hydrogen atom bonded to a halogen atom at the molecular terminal.

The molar ratio (hydrogen atom/alkenyl group) of all the hydrogen atoms bonded to the halogen atom to all the alkenyl groups in the curable polyoxynoxy resin composition is preferably from 0.7 to 1.05.

The curable polyoxyxene resin composition may further contain an additive such as a catalyst that promotes a reaction between a hydrogen atom bonded to a hydrazine element and an alkenyl group. Examples of the catalyst include a platinum system, a palladium system, and a ruthenium system.

The organic film 13 may be formed so that the bonding force with the support plate 14 is relatively higher than the bonding force with the glass substrate 11. As a method of forming the organic film 13, there are the following methods (1) to (3).

(1) After the resin composition applied on the support sheet 14 is cured to form the organic film 13, the glass substrate 11 and the support sheet 14 are pressure-bonded via the organic film 13. The bonding force of the support plate 14 and the organic film 13 is easily higher than the bonding force between the glass substrate 11 and the organic film 13.

(2) After the resin composition applied to a specific substrate is cured to form the organic film 13, the organic film 13 is peeled off from the specific substrate, and the glass substrate 11 and the support plate 14 are interposed via the organic film 13. Crimp. In order to impart a difference to the bonding force, the surface of at least one of the glass substrate 11 and the support plate 14 may be surface-treated in advance.

(3) The resin composition sandwiched between the glass substrate 11 and the support plate 14 is cured to form the organic film 13. In order to impart a difference to the bonding force, the surface of at least one of the glass substrate 11 and the support plate 14 may be surface-treated in advance.

The crimping in the methods (1) and (2) above can also be carried out in an environment with a high degree of cleanliness. The pressure at the periphery of the crimping may be atmospheric pressure, but in order to suppress the incorporation of air, a negative pressure lower than atmospheric pressure is preferred. As a method of crimping, there are a roll type, a press type, and the like. The crimping temperature may be a temperature higher than room temperature, but may be room temperature in order to prevent deterioration of the organic film.

The resin composition may be cured by any one of a condensation reaction type, an addition reaction type, an ultraviolet curing type, and an electron beam curing type. The addition reaction type resin composition is easily cured, and is excellent in peelability and high in heat resistance.

Further, the resin composition may be in the form of a solvent type, a latex type or a solventless type, and is preferably a solventless type from the viewpoint of productivity and environmental characteristics. Further, the solvent-free resin composition does not contain a solvent which may be foamed when it is cured, so that the organic film 13 having less defects can be obtained.

Examples of the coating method of the resin composition include a spray coating method, a die coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, a screen printing method, and a gravure coating method. These coating methods are appropriately selected depending on the kind of the resin composition.

The thickness of the organic film 13 is preferably 100 μm or less. When the thickness of the organic film 13 exceeds 100 μm, the material cost of the organic film 13 is high, and cracks are likely to occur in the organic film 13. Examples of the cause of cracking include (1) drying shrinkage of the resin composition, (2) curing shrinkage of the resin composition, and (3) difference in thermal expansion between the glass and the resin. (1) It is produced when the resin composition contains a solvent. When the solvent is evaporated and the resin composition shrinks, the shrinkage thereof is hindered by the substrate supporting the resin composition, and stress is generated to cause cracking. In the case of (2), products such as water generated by the hardening reaction are removed, thereby causing cracks. In the case of (3), the heat shrinkage of the resin after drying and cooling is significantly greater than the heat shrinkage of the glass, so that cracks are generated. The thickness of the organic film 13 is more preferably 50 μm or less, and still more preferably 30 μm or less.

Further, the thickness of the organic film 13 is preferably 1 μm or more. Foreign matter can be buried in the organic film 13. Since the resin composition before fluidification has fluidity, the foreign matter is buried in the resin composition in. When the foreign matter enters between the organic film 13 and the glass substrate 11 after the hardening or the lamination, the organic film 13 is elastically deformed, whereby the foreign matter is buried in the organic film 13.

Regarding the outer shape of the organic film 13, in order to allow the organic film 13 to support the entire glass substrate 11, it is preferably the same as the outer shape of the glass substrate 11 as shown in FIG. 1, or larger than the outer shape of the glass substrate 11. When the shape of the organic film 13 is larger than the shape of the glass substrate 11, the portion of the organic film 13 that protrudes from the glass substrate 11 is bent and deformed, and the peeling of the reinforcing plate 12 from the glass substrate 11 is progressed smoothly, thereby smoothly peeling off.

Further, the organic film 13 of the present embodiment includes one organic film, but may also include a plurality of organic films. In this case, the "thickness of the interlayer film" means the total thickness of all the organic films.

The support plate 14 supports the glass substrate 11 via the organic film 13. The support plate 14 is preferably a glass plate having a small difference in thermal expansion from the glass substrate 11.

The thickness of the glass plate as the support plate 14 is preferably 0.7 mm or less. Moreover, in order to reinforce the glass substrate 11, the thickness of the glass plate as the support plate 14 is preferably 0.4 mm or more.

Regarding the outer shape of the support plate 14, in order to allow the support plate 14 to support the entire organic film 13, it is preferably the same as the outer shape of the organic film 13 as shown in Fig. 1, or larger than the outer shape of the organic film 13.

Further, the support plate 14 of the present embodiment is a single plate including only a glass plate, and may be a composite plate including a glass plate and a resin film.

Fig. 2 is a view showing a grinding step of grinding the laminated body of Fig. 1 by a grindstone. Fig. 3 is a view showing a chamfering step of chamfering the laminated body of Fig. 2 by an elastic grindstone. Figure 15 is a partial enlarged view of Figure 3.

The processing method of the laminated body 10 includes a grinding step (refer to FIG. 2) and a chamfering step (refer to FIGS. 3 and 15). The grinding step is a step of adjusting the laminated body to a desired size and making the side faces of the glass substrate, the side faces of the organic film, and the side faces of the support plates the same plane. The chamfering step is a step of chamfering the layered body obtained by the grinding step.

In the grinding step, at least a part of the outer circumference of the laminated body 10 is ground by the grindstone 20 to obtain a laminated body 10A. The laminated body 10A shown in FIG. 2 is obtained by grinding the laminated body 10 shown in FIG. 1 by the grindstone 20.

The grindstone 20 has a cylindrical shape (including a disk shape), and has an abrasive grain surface on which the laminated body 10 is ground on the outer circumference. The whole or a part of the abrasive grain surface may also have a slightly curved shape. The center axis of the grindstone 20 is set to be perpendicular to the main surface of the laminated body 10, for example, and a rotating shaft is disposed on the central axis of the grindstone 20. The grindstone 20 rotates around the central axis and relatively moves along the outer periphery of the laminated body 10, and at least a part of the outer periphery of the laminated body 10 is ground. When the grindstone 20 and the laminated body 10 are relatively moved, either of them can be moved or both can be moved.

The cement of the grindstone 20 contains metal or ceramic. Examples of the grindstone containing a metal binder include a metal binder grindstone and an electroplated grindstone. The metal cement grindstone is obtained by sintering metal powder and abrasive grains. The electroplating grindstone is a method in which the abrasive grains are fixed on the plating layer. When the binder of the grindstone 20 contains a metal, for example, it contains at least one selected from the group consisting of copper, iron, tungsten, tin, and nickel. As the grindstone containing a ceramic binder, a vitrified bond grindstone can be cited. If a grindstone 20 comprising a metal binder or a ceramic binder is used, the grinding efficiency is better, and the time required to adjust the laminate to the desired size is shorter.

The abrasive grains of the grindstone 20 include, for example, at least one selected from the group consisting of diamond, CBN (Cubic boron nitride), tantalum carbide, alumina, garnet, and natural stone (for example, pumice).

The laminated body 10A obtained by the grinding step has the glass substrate 11A and the reinforcing plate 12A similarly to the laminated body 10 before processing. Similarly to the reinforcing plate 12 before processing, the reinforcing plate 12A has an organic film 13A and a supporting plate 14A.

The side surface of the glass substrate 11A, the side surface of the organic film 13A, and the side surface of the support plate 14A are set to the same plane by the grindstone 20, and the side surface of the laminated body 10A is opposed to the laminated layer. The main surface of the body 10A is set to be vertical.

In the grinding step, cracks are likely to occur at the boundary portions 15A and 16A between the main surface and the side surface of the laminated body 10A.

In the chamfering step, the portion of the laminated body 10A which has been ground by the grindstone 20 is chamfered by the elastic grindstone 30 to obtain the laminated body 10B. The laminated body 10B shown in FIG. 3 is obtained by chamfering the laminated body 10A shown in FIG. 2 by the elastic grindstone 30.

The elastic grindstone 30 has a cylindrical shape and has an abrasive grain surface on which the laminated body 10A is ground on the outer circumference. The whole or a part of the abrasive grain surface may also have a slightly curved shape. The elastic grindstone 30 may also have a recess into which the laminated body 10A is inserted on the abrasive grain surface. The central axis of the elastic grindstone 30 is set to be perpendicular to the main surface of the laminated body 10A, and a rotating shaft is disposed on the central axis of the elastic grindstone 30. The elastic grindstone 30 is rotated about the central axis and relatively moved along the outer circumference of the laminated body 10A, and the portion of the laminated body 10A that has been ground by the grindstone 20 is ground. When the elastic grindstone 30 and the laminated body 10A are relatively moved, either of them can be moved or both can be moved.

The elastic grindstone 30 is elastically deformed so as to be pressed against the laminated body 10A in a direction perpendicular to the main surface of the laminated body 10A and in surface contact with the side surface of the laminated body 10A. The adhesive of the elastic grindstone 30 contains a material having elasticity, for example, at least one selected from the group consisting of phenol, epoxy resin, polyimine, polyoxymethylene, polyurethane, butyl rubber, and natural rubber. The abrasive grains of the elastic grindstone 30 include, for example, at least one selected from the group consisting of diamond, CBN (Cubic boron nitride), tantalum carbide, alumina, garnet, and natural stone (for example, pumice).

The elastic grindstone 30 grinds the boundary portions 15A and 16A of the main surface and the side surface of the laminated body 10A shown in Fig. 2, and the chamfered portions 15B and 16B shown in Fig. 3 are produced. The chamfered portions 15B, 16B may also be curved surfaces.

Further, in the present embodiment, the grindstone 20 used in the grinding step does not have a grinding groove on the abrasive grain surface. There are no irregularities on the surface of the abrasive grains. So, as before In the case where the grindstone has a V-shaped grinding groove, the side surface of the laminated body 10A obtained by the grinding step is perpendicular to the main surface of the laminated body 10A, and there is no side and main body compared to the laminated body 10A. The interface portions 15A and 16A of the surface protrude more outward. Therefore, stress is easily concentrated on the boundary portions 15A and 16A in the chamfering step, and the boundary portions 15A and 16A are easily cut by the elastic grindstone 30 in a concentrated manner. The crack formed in the boundary portions 15A and 16A by the grinding step can be efficiently removed, and the strength of the laminated body 10B obtained by the chamfering step is improved.

Further, since the grindstone 20 does not have a grinding groove, other effects can be obtained. For example, according to the present embodiment, in the grinding step, the glass substrate and the support sheet are less likely to be damaged in the vicinity of the organic film, and the damage of the metal cement grindstone caused by the debris can be restricted. When the grooving groove having a V-shaped cross section is present as described above, at least one of the glass substrate and the support plate is sharpened in the grinding step, and is easily damaged in the vicinity of the organic film having different materials. Moreover, the grindstone is easily damaged by the debris. Moreover, according to the present embodiment, since the grinding groove is not present, the manufacturing cost of the grindstone can be reduced.

Further, since the grindstone 20 does not have the grinding groove, the direction in which the grindstone 20 and the laminated body 10 are perpendicular to the main surface of the laminated body 10 can be changed according to the relative cumulative moving distance between the grindstone 20 and the laminated body 10. The relative position (in the up and down direction in Fig. 2). This change is performed in a grinding step of grinding one or more laminated bodies 10. For example, this change is performed each time a specific number of blocks 10 are processed. After the change, the shape of the obtained laminated body 10A does not change. The reason for this is that there is no grinding groove on the grindstone 20. By this change, the contact position of the grindstone 20 with the laminated body 10 can be changed, and the partial wear of the grindstone 20 can be prevented.

Further, in the present embodiment, the relative position of the grindstone 20 and the laminated body 10 is changed after the processing of one laminated body 10 and before the processing of the other laminated body 10, but it may be applied to one laminated body 10 The processing is carried out in the middle. The starting time of the relative cumulative moving distance between the grindstone 20 and the laminated body 10 may be when the use of the grindstone 20 is started, or when the user specifies point.

The laminated body 10B obtained by the chamfering step has the glass substrate 11B and the reinforcing plate 12B similarly to the laminated body 10 before processing. Similarly to the reinforcing plate 12 before processing, the reinforcing plate 12B has an organic film 13B and a supporting plate 14B.

In the present embodiment, the elastic grindstone 30 used in the chamfering step selectively grinds the organic film 13B. The organic film 13B is softer than the glass substrate 11B and the support plate 14B, and can be selectively ground. As shown in Fig. 15, the abrasive grains 30a-1 for grinding the glass substrate 11B and the abrasive grains 30a-2 for grinding the support plate 14B are pushed back, whereas the abrasive grains 30a for grinding the organic film 13B are 3 enters into the organic film 13B. This can be achieved by elastic deformation of the elastic grindstone 30. Thus, by the elastic deformation of the elastic grindstone 30, the abrasive grains 30a-3 of the elastic grindstone 30 enter between the glass substrate 11B and the support plate 14B. As a result, a chamfered portion 18B is formed at a boundary portion between the main surface and the side surface on the side of the organic film 13B in the glass substrate 11B, and a chamfered portion is formed at a boundary portion between the main surface and the side surface on the side of the organic film 13B in the support plate 14B. 19B. The chamfered portions 18B, 19B may also be curved surfaces.

The gap between the chamfered portions 18B and 19B spreads outward. Therefore, in the peeling step described below, the cutting edge is easily inserted from the outside to the chamfered portions 18B, 19B. By inserting the blade edge, the glass substrate 11B is separated from the support plate 14B, and a peeling origin is formed between the glass substrate 11B having a low bonding force and the organic film 13B.

Since the chamfered portions 18B and 19B are formed, it is possible to remove cracks or breakage which may occur at the boundary portion 19A of the interface portion 18A of the glass substrate 11A and the support plate 14A in the grinding step in the chamfering step. Thereby, the end face strength of the glass substrate 11B obtained by the chamfering step or the end face strength of the support plate 14B is improved, and the damage of the glass substrate 11B or the damage of the support plate 14B can be suppressed during the peeling operation.

Next, a method of manufacturing an electronic device using the layered body 10B obtained by the above-described processing method will be described. The manufacturing method of the electronic device includes the steps of forming a functional film on the glass substrate 11B of the laminated body 10B, and the glass forming the functional film The step of peeling off the substrate 11B from the reinforcing plate 12B. Hereinafter, a specific example will be described.

The manufacturing method of the liquid crystal display includes, for example, a TFT substrate fabrication step (see FIG. 4), a CF substrate fabrication step (see FIG. 5), an assembly step (see FIG. 6), and a peeling step (see FIG. 7).

In the TFT substrate manufacturing step, as shown in FIG. 4, a thin film transistor (TFT) 41 or the like is formed on the glass substrate 11B of the laminated body 10B to fabricate the TFT substrate 42. The TFT substrate 42 includes a glass substrate 11B, a thin film transistor 41, and the like. Since the manufacturing method of the TFT substrate 42 is normal, description is abbreviate|omitted.

In the CF substrate manufacturing step, as shown in FIG. 5, the color filter 43 is formed on the glass substrate 11B of the other laminated body 10B or the like to form the CF substrate 44. The CF substrate 44 includes a glass substrate 11B, a color filter 43, and the like. Since the manufacturing method of the CF substrate 44 is normal, description is abbreviate|omitted.

As shown in FIG. 6, the assembly step includes the step of sealing the liquid crystal material 45 between the TFT substrate 42 and the CF substrate 44. The method of injecting the liquid crystal material 45 between the TFT substrate 42 and the CF substrate 44 may be any one of a reduced pressure injection method and a dropping injection method.

In the peeling step, as shown in FIG. 7, the glass substrate 11B and the reinforcing plate 12B are peeled off. The glass substrate 11B is a part of the liquid crystal display, and the reinforcing plate 12B is not part of the liquid crystal display. In the present embodiment, the peeling step is performed after the assembly step, but it may be performed after the TFT substrate fabrication step and the CF substrate fabrication step, or before the assembly step or during the assembly step.

Further, in the present embodiment, the thin film transistor 41 and the color filter 43 are formed on the glass substrate 11B of the other laminated body 10B, respectively, and either one of the single-plate glass substrates may be formed.

The manufacturing method of an organic EL display (OLED, Organic Light Emitting Display) includes, for example, an organic EL element forming step (see FIG. 8), a bonding step (see FIG. 9), and a peeling step (see FIG. 10).

In the organic EL element forming step, as shown in FIG. 8, the organic EL element 51 is formed on the glass substrate 11B of the laminated body 10B. The organic EL element 51 includes, for example, a transparent electrode layer, a hole transport layer, a light-emitting layer, an electron transport layer, and the like. The method of forming the organic EL element 51 is a usual method, and thus the description thereof will be omitted.

In the bonding step, as shown in FIG. 9, the glass substrate 11B on which the organic EL element 51 is formed is bonded to the counter substrate 52.

In the peeling step, as shown in FIG. 10, the glass substrate 11B and the reinforcing plate 12B are peeled off. The glass substrate 11B is a part of the organic EL display, and the reinforcing plate 12B is not part of the organic EL display. In the present embodiment, the peeling step is performed after the bonding step, but it may be performed after the organic EL element forming step, or may be performed before the bonding step or during the bonding step.

A method of manufacturing a solar cell includes a solar cell element forming step (see FIG. 11) and a peeling step (see FIG. 12).

In the solar cell element forming step, as shown in FIG. 11, the solar cell element 61 is formed on the glass substrate 11B of the laminated body 10B. The solar cell element 61 includes, for example, a transparent electrode layer, a semiconductor layer, or the like. Since the method of forming the solar cell element 61 is a usual method, the description is omitted.

In the peeling step, as shown in FIG. 12, the glass substrate 11B and the reinforcing plate 12B are peeled off. The glass substrate 11B is a part of the solar cell, and the reinforcing plate 12B is not part of the solar cell. The stripping step can be performed after the solar cell element forming step.

[Second Embodiment]

The method for processing a laminated body according to the second embodiment differs from the method for processing a laminated body according to the first embodiment described above in that the grinding stone has a truncated cone shape. Hereinafter, the description will be centered on differences.

The processing method of the laminated body 10 includes a grinding step (refer to FIG. 13) and a chamfering step (refer to FIG. 14).

In the grinding step, at least a part of the outer circumference of the laminated body 10 is ground by the grindstone 120 to obtain a laminated body 110A. The laminated body 110A shown in FIG. 13 is obtained by grinding the laminated body 10 shown in FIG. 1 by the grindstone 120.

The grindstone 120 has a truncated cone shape and has a polished grain surface on which the laminated body 10 is ground on the outer circumference. The center axis of the grindstone 120 is set to be perpendicular to the main surface of the laminated body 10, for example, and a rotating shaft is disposed on the central axis of the grindstone 120. The grindstone 120 rotates around the central axis thereof and relatively moves along the outer circumference of the laminated body 10, and at least a part of the outer periphery of the laminated body 10 is ground.

The laminated body 110A obtained by the grinding step has a glass substrate 111A and a reinforcing plate 112A in the same manner as the laminated body 10 before processing. Similarly to the reinforcing plate 12 before processing, the reinforcing plate 112A has an organic film 113A and a supporting plate 114A.

The side surface of the glass substrate 111A, the side surface of the organic film 113A, and the side surface of the support plate 114A are set to the same plane by the grindstone 120, and the side surface of the laminated body 110A is set to be inclined with respect to the main surface of the laminated body 110A. The support plate 114A protrudes outward more than the glass substrate 111A to protect the side surface of the glass substrate 111A. When an object such as a positioning pin perpendicular to the main surface of the laminated body 110A comes into contact with the side surface of the laminated body 110A, the object comes into contact with the side surface of the support plate 114A, and the object does not come into contact with the side surface of the glass substrate 111A. Therefore, it is possible to prevent breakage of the glass substrate 111A which is a part of the product.

In the grinding step, cracks are likely to occur at the boundary portions 115A and 116A between the main surface and the side surface of the laminated body 110A. Among the boundary portions 115A and 116A, cracks are more likely to occur at the sharpened boundary portion. In the present embodiment, the boundary portion 116A between the main surface and the side surface of the support plate 114A is sharpened, and cracks are more likely to occur at the boundary portion 116A.

In the chamfering step, the portion of the layered body 110A that has been ground by the grindstone 120 is chamfered by the elastic grindstone 130 to obtain a layered body 110B. The laminated body 110B shown in FIG. 14 is obtained by chamfering the laminated body 110A shown in FIG. 13 by the elastic grindstone 130.

Regarding the elastic grindstone 130, in addition to the shape of the truncated cone, the system and the diagram The elastic grindstone 30 shown in Fig. 3 is constructed in the same manner. Furthermore, the elastic grindstone 130 can also be cylindrical. The elastic grindstone 130 is elastically deformed so as to be pressed against the laminated body 110A in a direction perpendicular to the main surface of the laminated body 110A and in contact with the side surface of the laminated body 110A.

The elastic grindstone 130 grinds the boundary portions 115A and 116A of the main surface and the side surface of the laminated body 110A shown in Fig. 13 to produce chamfered portions 115B and 116B shown in Fig. 14 . The chamfered portions 115B, 116B may also be curved surfaces.

In the present embodiment, as in the first embodiment, the grindstone 120 does not have a grinding groove on the abrasive grain surface. There are no irregularities on the surface of the abrasive grains. Therefore, unlike the case where the grinding stone has a V-shaped grinding groove as in the prior art, the side surface of the laminated body 110A obtained by the grinding step is inclined with respect to the main surface of the laminated body 110A. Therefore, there is no portion that protrudes further outward than one of the boundary portions 115A and 116A of the side surface of the laminated body 110A and the main surface (the boundary portion 116A in the present embodiment). Therefore, in the chamfering step, the stress is easily concentrated on the one boundary portion 116A, and the one boundary portion 116A is easily cut by the elastic grindstone 130 intensively. The crack formed in the boundary portion 116A by the grinding step can be efficiently removed, and the strength of the laminated body 110B obtained by the chamfering step is improved.

Further, since the grindstone 120 does not have a grinding groove, other effects can be obtained. For example, since there is no grinding groove, the manufacturing cost of the grindstone can be reduced. Further, similarly to the first embodiment, the direction in which the grindstone 120 and the laminated body 110 are perpendicular to the main surface of the laminated body 110 can be changed according to the relative cumulative moving distance between the grindstone 120 and the laminated body 110 (FIG. 13) The relative position in the middle and the up direction). As a result, the partial wear of the grindstone 120 can be prevented. Further, in the present embodiment, the grindstone 120 is in contact with the laminated body 110, and the grindstone in the direction perpendicular to the main surface of the laminated body 110 (the horizontal direction in FIG. 13) is simultaneously changed. The relative position of 120 to the laminate 110.

The laminated body 110B obtained by the chamfering step has the glass substrate 111B and the reinforcing plate 112B similarly to the laminated body 10 before processing. The reinforcing plate 112B and the reinforcing plate before processing 12 similarly has the organic film 113B and the support plate 114B. The support plate 114B protrudes outward more than the glass substrate 111B to protect the side surface of the glass substrate 111B. When an object such as a positioning pin perpendicular to the main surface of the laminated body 110B comes into contact with the side surface of the laminated body 110B, the object comes into contact with the side surface of the support plate 114B, and the object does not come into contact with the side surface of the glass substrate 111B. Therefore, it is possible to prevent breakage of the glass substrate 111B which is a part of the product.

Further, in the present embodiment, as in the first embodiment, the abrasive grains of the elastic grindstone 130 enter between the glass substrate 111B and the support plate 114B by the elastic deformation of the elastic grindstone 130. As a result, a chamfered portion 118B is formed at a boundary portion between the main surface and the side surface on the side of the organic film 113B in the glass substrate 111B, and a corner portion is formed at a boundary portion between the main surface and the side surface on the side of the organic film 113B in the support plate 114B. 119B. The chamfered portions 118B, 119B may also be curved surfaces.

The gap between the chamfered portions 118B and 119B is extended toward the outside. Therefore, in the peeling step, the cutting edge is easily inserted from the outside to the chamfered portions 118B, 119B. By the insertion of the blade edge, a peeling origin is formed between the glass substrate 111B having a low bonding force and the organic film 113B.

Since the chamfered portions 118B and 119B are formed, it is possible to remove cracks or breakage which may occur at the boundary portion 119A between the interface portion 118A of the glass substrate 111A and the support plate 114A in the grinding step in the chamfering step. Thereby, the end face strength of the glass substrate 111B obtained by the chamfering step or the end face strength of the support plate 114B is improved, and the breakage of the glass substrate 111B or the damage of the support plate 114B can be suppressed during the peeling operation.

The laminated body 110B obtained by the above-described processing method can be used for the manufacture of an electronic device similarly to the laminated body 10B shown in FIG.

In the above, the embodiment of the method for processing the laminated body has been described. However, the present invention is not limited to the above-described embodiment and the like, and various modifications and improvements can be made within the scope of the gist of the invention.

For example, in the above embodiment, as the intermediate film of the reinforcing plate, organic can be used. As the film, an inorganic film can also be used. The inorganic film contains, for example, at least one selected from the group consisting of metal halides, nitrides, carbides, and carbonitrides.

The metal halide includes, for example, at least one selected from the group consisting of W, Fe, Mn, Mg, Mo, Cr, Ru, Re, Co, Ni, Ta, Ti, Zr, and Ba, preferably tungsten telluride. .

The nitride includes, for example, at least one selected from the group consisting of Si, Hf, Zr, Ta, Ti, Nb, Na, Co, Al, Zn, Pb, Mg, Sn, In, B, Cr, Mo, and Ba. Preferably, it is aluminum nitride, titanium nitride, or tantalum nitride.

The carbide includes, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, preferably ruthenium carbide.

The carbonitrides include, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, preferably hafnium carbonitride.

Regarding metal tellurides, nitrides, carbides, and carbonitrides, the difference in the electrical properties between Si, N or C contained in the material and other elements contained in the material is small and the polarization is small. Therefore, the reactivity of the inorganic film with water is low, and it is difficult to generate a hydroxyl group on the surface of the inorganic film. Therefore, the release property of the inorganic film and the glass substrate can be favorably maintained.

The inorganic film as the intermediate film is preferably softer than the glass substrate or the support sheet. In the chamfering step, the inorganic film is selectively cut, and a boundary portion between the main surface and the side surface on the inorganic film side in the glass substrate and a boundary portion between the main surface and the side surface on the inorganic film side in the support plate may be chamfered . Further, the same effect can be obtained when the inorganic film as the intermediate film is more fragile than the glass substrate or the support plate.

Further, the reinforcing plate of the above embodiment has an intermediate film and a support plate, but the intermediate film may not be present. For example, the reinforcing plate may be composed only of a glass plate, and the glass plate as the reinforcing plate is in direct contact with the glass substrate 11.

Further, in the above embodiment, a glass substrate may be used as the substrate, and a ceramic substrate, a resin substrate, a metal substrate or the like may be used. Similarly, in the above embodiment, The support plate can be a glass plate or a ceramic plate, a resin plate, a metal plate or the like.

Further, the laminated system provided in the chamfering step of the above embodiment may be formed by grinding a grinding stone without a grinding groove, or may be a grinding stone with a grinding groove, or may be cut by a cutter. Founder. In either case, in the chamfering step, the boundary portion between the main surface and the side surface on the intermediate film side in the substrate and the boundary portion between the main surface and the side surface on the intermediate film side in the support plate may be chamfered.

Further, the grinding step of the above embodiment is performed before the chamfering step, and may not be based on the chamfering step. As long as the relative position of the grindstone and the plate-like body in the direction perpendicular to the main surface of the plate-like body is changed according to the relative cumulative moving distance between the grindstone and the plate-shaped body in which the grinding groove is not present, the deviation of the grindstone can be suppressed. Wear.

Further, the center axis of the grindstone 20 shown in FIG. 2 is set to be perpendicular to the main surface of the laminated body 10, but may be set to be inclined. In this case, the same shape as the laminated body 110A shown in Fig. 13 can be obtained by the grinding step. Further, in this case, the relative position of the grindstone 20 and the laminated body 10 in the direction perpendicular to the main surface of the laminated body 10 may be changed depending on the relative cumulative moving distance between the grindstone 20 and the laminated body 10. The partial wear of the grindstone 20 can be prevented. In this case, in the same manner as in the second embodiment, the grindstone 20 is in contact with the laminated body 10, and the grindstone in the direction perpendicular to the main surface of the laminated body 10 is simultaneously changed. The relative position of 20 to the laminated body 10.

The present application is based on Japanese Patent Application No. 2013-164252, filed on Jan.

Claims (6)

A method for processing a plate-shaped body, comprising the steps of: grinding a grinding portion of at least a portion of a periphery of the plate-shaped body by a grindstone comprising a metal binder or a ceramic binder; and a chamfering step of chamfering the portion of the plate-shaped body that is ground by the grindstone; and the grindstone is in the shape of a column or a truncated cone, and has an abrasive grain surface of the plate-like body on the outer circumference, and the abrasive grain surface is There is no grinding groove; the plate-shaped system has a substrate and a laminate of a reinforcing plate bonded to the substrate in a peelable manner; the reinforcing plate has an intermediate film which is detachably coupled to the substrate, and is interposed therebetween The film supports the support plate of the substrate; in the chamfering step, by the elastic deformation of the elastic grindstone, the abrasive grains of the elastic grindstone enter between the substrate and the support plate, thereby being in the substrate The boundary portion between the main surface and the side surface on the intermediate film side and the boundary portion between the main surface and the side surface on the intermediate film side of the support plate are chamfered. A method for processing a plate-shaped body, comprising: chamfering a step of chamfering at least a portion of a periphery of the plate-shaped body by an elastic grindstone; and the plate-like system has a substrate and is detachable from the substrate a laminated body of the reinforcing plate; the reinforcing plate has an intermediate film that is detachably coupled to the substrate, and a supporting plate that supports the substrate via the intermediate film; and the elastic grinding stone in the chamfering step Elastic deformation, the abrasive grains of the elastic grindstone enter between the substrate and the support plate, thereby the boundary portion between the main surface and the side surface of the intermediate film side in the substrate, and the support plate The boundary portion between the main surface and the side surface on the intermediate film side is chamfered. The method for processing a plate-shaped body according to claim 2, which is before the chamfering step, further comprising a grinding step of the plate-like body by a grindstone comprising a metal binder or a ceramic binder At least a part of the outer circumference is ground; and the chamfering step is to chamfer the portion of the plate-shaped body that has been ground by the grindstone by the elastic grindstone; the grindstone is cylindrical or truncated, and The abrasive grain surface on which the above-mentioned plate-shaped body is ground is provided on the outer periphery, and the grinding grain surface does not have a grinding groove. The method of processing a plate-like body according to claim 3, wherein the grindstone is in the grinding step, and rotates around a rotation axis perpendicular or inclined with respect to a main surface of the plate-like body and along the plate-like body The outer circumference is relatively moved; and the relative position of the grindstone and the plate-like body in a direction perpendicular to the main surface of the plate-shaped body is changed according to the relative cumulative moving distance. A method of manufacturing an electronic device, comprising the steps of: forming a functional film on a substrate of a laminate processed by any one of claims 2 to 4; and forming the functional film described above The step of peeling off the substrate from the above reinforcing plate. The method of manufacturing an electronic device of claim 5, wherein the electronic device is an image display device.