JPH11262848A - Device for chamfering and polishing hard board for electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve workability, reduce the incidence of defectives and lessen the exchange frequency of a grinding wheel when chamfering and polishing the angular edge of a hard board, including a glass board, for a liquid crystal display element with the rotationally driven grinding wheel. SOLUTION: The outer periphery of a grinding wheel 2 is thrust against at least one angular edge A1 of the angular edges of a hard board A, when transferred, in the condition that the axis 2a of the grinding wheel 2 is properly inclined at an angle θ to one angular edge A1 in view from the extending direction of one angular edge A1 and at a right angle to the extending direction of one angular edge A1 in view from a direction at the right angle to the extending direction of one angular edge A1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hard substrate for electronic parts such as a glass substrate in a liquid crystal display element or a ceramic substrate in a thermal print head. The present invention relates to an apparatus for polishing a chamfered edge.

[0002]

2. Description of the Related Art In general, a glass substrate in a liquid crystal display element or a ceramic substrate in a thermal print head is manufactured by breaking a wide material substrate to an appropriate size. The edge of the substrate has a sharp blade shape.

Therefore, conventionally, a process for chamfering a corner edge of the hard substrate is performed in the course of manufacturing the liquid crystal display element or the thermal print head, and the conventional chamfering process is shown in FIG. As described above, the outer peripheral surface of a cylindrical grinding wheel B formed by solidifying abrasive particles including diamond particles rotated at an appropriate speed by a motor or the like with respect to one corner A1 of the hard substrate A is attached to the grinding wheel. After the axis of B is in contact with the direction in which the edge A1 extends, the grinding wheel B and the hard substrate A are relatively moved in the direction in which the edge A1 extends.
1 is chamfered by polishing, or as shown in FIG.
After contacting the outer peripheral surface of the conical grinding wheel C rotated at an appropriate speed by a motor or the like with the axis of the grinding wheel C perpendicular to the direction in which the corner A1 extends, the grinding wheel C and the hard substrate By moving A relatively in the direction in which the corner A1 extends, the corner A1 is chamfered by polishing.

[0004]

However, in the chamfering polishing by the former method, since the direction of polishing by the grinding wheel B is perpendicular to the direction in which the corner A1 extends, chipping and cracking of the corner A1 occur. There is a problem that not only is it easy to occur and the occurrence rate of defective products is high, but also that the grinding wheel B wears out considerably quickly.

Polishing by the latter method is performed by a grinding wheel C
The direction in which the edge A1 is polished is the direction in which the edge A1 extends. Therefore, although the rate at which the edge A1 is chipped and cracked is smaller than that of the former, the grinding wheel C having a special shape called a cone is used. In addition to the necessity, the conical grinding wheel C has a problem that the cost required for chamfering and polishing is considerably increased because chipping and cracking occur frequently.

An object of the present invention is to provide a chamfering polishing apparatus which can solve these problems at once.

[0007]

In order to achieve this technical object, the present invention provides a method of forming a plurality of rectangular rigid substrates such that at least one of the rectangular edges of each of the rectangular rigid substrates is substantially aligned. In the transport path to be arranged and transferred in a line, at least one cylindrical grinding wheel that is rotationally driven by a motor or the like is disposed, and the outer peripheral surface of the grinding wheel is positioned with respect to one corner edge of the hard substrate. Thus, the axis of the grinding wheel is inclined obliquely with respect to one corner when viewed from the direction in which the one edge extends, and one axis when viewed in a direction perpendicular to the direction in which the one edge extends. Pressing contact is made at right angles to the direction in which the corner edge extends. "

[0008]

Operation and effect of the present invention
A cylindrical grinding wheel that is rotationally driven is obliquely viewed from a direction in which the one edge extends, with respect to one of the edges of each hard substrate transferred along the transport path. Since the one edge is moved in the extending direction in this state, one edge of each hard substrate is sequentially chamfered and polished during the transfer of each hard substrate. You can do it, and
Since the direction of polishing with the grinding wheel is the direction in which one corner edge extends, chipping and cracking rarely occur in the one corner edge.

As described above, according to the present invention, the corners of the hard substrate are continuously formed by using the cylindrical grinding wheel, and the corners are hardly chipped or cracked. By being able to bevel-polish, workability is high, and the occurrence rate of defective products is low. Moreover, since the grinding wheel has a very general cylindrical shape, the grinding wheel is worn out. In addition, the occurrence of chipping and cracking is small, in other words, the life is long, the frequency of replacement can be reduced, and it can be obtained at a low cost, so that the cost required for chamfering and polishing can be greatly reduced.

[0010] In particular, by reciprocating the cylindrical grinding wheel in the axial direction by a reciprocating mechanism, the entire outer peripheral surface of the grinding wheel is uniformly worn. Therefore, there is an advantage that the life of the grinding wheel can be further increased.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In this figure,
Reference numeral 1 denotes a transport path for the rigid substrate A formed in a rectangular shape, and the transport path 1 includes a plurality of hard substrates A, each of which has at least one edge A1 of each of the edges. It is configured to be transported in a line so as to be aligned in a straight line.

Reference numeral 2 denotes a cylindrical grinding wheel arranged in the middle of the transport path 1 so that the outer peripheral surface thereof contacts one edge A1 of each hard substrate A being transferred. 2 is made of ceramic, the axis 2a of which is obliquely inclined at an appropriate angle θ with respect to one corner A1 as viewed from the direction in which the one corner A1 extends, and One corner A1 viewed from a direction perpendicular to the direction in which it extends
Are arranged at right angles to the direction in which

It is preferable that the angle θ is 45 degrees with respect to the upper surface of the hard substrate A. The cylindrical grinding wheel 2 is supported as described below, and
It is driven to rotate. That is, the base end of the bracket arm 4 that rotatably supports the shaft 3 of the grinding wheel 2 at the distal end is rotatably pivotally connected to the motor support base 6 on which the motor 5 is mounted via the intermediate shaft 7. Then, the grinding wheel 2 is attached to the motor support base 6 by the bracket arm 4.
While the bracket arm 4 is urged by a spring 8 provided between the bracket arm 4 and the motor support base 6 so as to rotate inward toward the hard substrate A. The grinding wheel 2 at the tip is configured to be pressed against one corner A1 of the hard substrate A with an appropriate pressure. The pressing force of the grinding wheel 2 against the corner A1 can be arbitrarily adjusted by a screw 9 provided on the spring 8. In addition, the motor support base 6 is adjustable for restricting the bracket arm 4 from turning inwardly and largely after the hard substrate A passes through the grinding wheel 2. A stopper 10 is provided.

A belt 13 is wound around a pulley 11 provided on the output shaft 5a of the motor 5 and a pulley 12 provided on the intermediate shaft 7, while the belt 13 is wound around the intermediate shaft 7 together with the pulley 12. Pulley 14 provided to rotate
A belt 16 is wound around a pulley 15 provided on the shaft 3 of the grinding wheel 2 to rotate the grinding wheel 2 at an appropriate speed by the motor 5.

The motor support 6 is supported by a plurality of guide shafts 18 with respect to the machine frame 17 so as to freely reciprocate in the same direction as the axis 2 a of the grinding wheel 2. A bracket 19 provided at the lower end of each guide shaft 18 is attached to an eccentric cam 20 for reciprocating motion by a spring 21.
The eccentric cam 20 is pressed and contacted by
, The motor support 6 and, consequently, the grinding wheel 2 reciprocate in the direction of its axis 2a. The stroke when the grinding wheel 2 reciprocates in this manner is within the range of the width of the grinding wheel 2 in the axial direction.

In this configuration, a cylindrical grinding wheel 2 that is rotationally driven is rotated with respect to one of the corner edges A1 of each of the hard substrates A transferred along the transport path 1.
However, the contact is made obliquely obliquely when viewed from the direction in which the one corner edge extends, and in this state, the one corner edge A1 moves in the extending direction. One edge A1 can be chamfered and polished sequentially during the transfer of each hard substrate A, and the direction of polishing by the grinding wheel 2 is one edge A1.
, The chipping and cracking are less likely to occur at the one corner edge A1.

Since the grinding wheel 2 is reciprocated in the direction of its axis 2a, the grinding wheel 2 is uniformly worn over the entire outer peripheral surface in the width direction. By the way, when the grinding wheel 2 is one in which abrasive particles are hardened similarly to a conventional grinding wheel, by constantly applying water to the polished portion, in other words,
Grinding while grinding with water is intended to reduce wear of the grinding wheel.

On the other hand, when the grinding wheel 2 is made of ceramic, it is hardly worn out and can be omitted from being sprayed with water, so that the structure of the apparatus can be made simpler and smaller. It was. In addition, the said grinding wheel 2
As shown by the two-dot chain line in FIG. 4, by providing a plurality of pieces along the transfer direction of the hard substrate A, the chamfering polishing can be performed at a plurality of locations, so that the moving speed of the hard substrate A is increased accordingly. Work ability. Further, by providing the grinding wheel 2 on both left and right sides of the hard substrate A as shown by a two-dot chain line in FIG.
Can be chamfered and polished simultaneously on both left and right side edges A1 and A1 '. Further, in addition to disposing the grinding wheel 2 on the upper surface side of the hard substrate A,
By disposing the grinding wheel 2 in the same manner, the hard substrate A
Can be simultaneously chamfered and polished on the lower surface side.

[Brief description of the drawings]

FIG. 1 is a perspective view showing conventional chamfering polishing.

FIG. 2 is a view showing another conventional chamfering polishing.

FIG. 3 is a longitudinal sectional front view showing an embodiment of the present invention, and FIG.
FIG. 2 is a sectional view taken along line II of FIG.

FIG. 4 is a plan view taken along line IV-IV of FIG. 3;

[Explanation of symbols]

 Reference Signs List A hard substrate A1, A1 'corner 1 transport path 2 grinding wheel 2a axis of grinding wheel 3 axis of grinding wheel 4 bracket arm 5 motor 6 motor support stand 13, 16 belt 18 guide shaft 19 body frame 20 eccentricity for reciprocating movement cam

Claims (2)

[Claims] A rotary drive by means of a motor or the like on a transport path for transferring a plurality of rectangular rigid substrates in a line so that at least one of the respective angular edges of each of the rectangular rigid substrates is aligned substantially in a straight line. Disposed at least one cylindrical grinding wheel, the outer peripheral surface of the grinding wheel, with respect to one edge of the hard substrate, the axis of the grinding wheel from the direction in which the one edge extends. Pressing and contacting obliquely with respect to one corner when viewed, and perpendicular to the direction in which one corner extends when viewed from the direction perpendicular to the direction in which the one corner extends. An apparatus for chamfering and polishing a hard substrate for electronic components. 2. The apparatus according to claim 1, further comprising a reciprocating mechanism for reciprocating the grinding wheel in the axial direction thereof.