TWI624892B - 接合方法、程式、電腦記錄媒體、接合裝置及接合系統 - Google Patents

接合方法、程式、電腦記錄媒體、接合裝置及接合系統 Download PDF

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Publication number
TWI624892B
TWI624892B TW104138363A TW104138363A TWI624892B TW I624892 B TWI624892 B TW I624892B TW 104138363 A TW104138363 A TW 104138363A TW 104138363 A TW104138363 A TW 104138363A TW I624892 B TWI624892 B TW I624892B
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TW
Taiwan
Prior art keywords
substrate
bonding
wafer
load
holding
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TW104138363A
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English (en)
Chinese (zh)
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TW201633424A (zh
Inventor
三村勇之
菅川賢治
松本宗兵
增永隆宏
月嶋慎
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東京威力科創股份有限公司
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Publication of TW201633424A publication Critical patent/TW201633424A/zh
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Publication of TWI624892B publication Critical patent/TWI624892B/zh

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW104138363A 2014-11-25 2015-11-20 接合方法、程式、電腦記錄媒體、接合裝置及接合系統 TWI624892B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-238237 2014-11-25
JP2014238237 2014-11-25
JP2015189332A JP6596288B2 (ja) 2014-11-25 2015-09-28 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
JP2015-189332 2015-09-28

Publications (2)

Publication Number Publication Date
TW201633424A TW201633424A (zh) 2016-09-16
TWI624892B true TWI624892B (zh) 2018-05-21

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TW104138363A TWI624892B (zh) 2014-11-25 2015-11-20 接合方法、程式、電腦記錄媒體、接合裝置及接合系統

Country Status (3)

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JP (1) JP6596288B2 (ja)
KR (1) KR102434123B1 (ja)
TW (1) TWI624892B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018010925A (ja) * 2016-07-12 2018-01-18 東京エレクトロン株式会社 接合装置
CN109923640B (zh) * 2016-11-09 2023-06-27 东京毅力科创株式会社 接合装置、接合系统、接合方法和计算机存储介质
KR102395194B1 (ko) 2017-06-21 2022-05-06 삼성전자주식회사 웨이퍼 본딩 장치 및 그 장치를 포함한 웨이퍼 본딩 시스템
KR102619624B1 (ko) * 2018-11-13 2023-12-29 삼성전자주식회사 기판합착 장치 및 방법
JP7203918B2 (ja) * 2020-09-18 2023-01-13 東京エレクトロン株式会社 接合装置、接合システム、接合方法及びコンピュータ記憶媒体
KR102610837B1 (ko) * 2020-12-29 2023-12-06 세메스 주식회사 기판과 기판을 접합하기 위한 기판 접합 설비에서의 기판 보관 및 정렬 장치
WO2024075566A1 (ja) * 2022-10-04 2024-04-11 東京エレクトロン株式会社 接合装置、接合システム及び接合方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200937569A (en) * 2007-10-30 2009-09-01 Nikon Corp Substrate holding member, substrate bonding apparatus, apparatus for manufacturing multilayer substrate, substrate bonding method, method for manufacturing multilayer substrate, and method for manufacturing multilayer semiconductor device
TW201250900A (en) * 2011-03-04 2012-12-16 Tokyo Electron Ltd Bonding apparatus, bonding system, bonding method, program, and computer storage medium
US20130327463A1 (en) * 2011-03-04 2013-12-12 Tokyo Electron Limited Joining method, joining device and joining system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004207436A (ja) 2002-12-25 2004-07-22 Ayumi Kogyo Kk ウエハのプリアライメント方法とその装置ならびにウエハの貼り合わせ方法とその装置
WO2009084536A1 (ja) * 2007-12-28 2009-07-09 Nikon Corporation 半導体基板貼り合わせ装置及び半導体基板貼り合わせ方法
JP5421825B2 (ja) 2010-03-09 2014-02-19 東京エレクトロン株式会社 接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP2012175043A (ja) * 2011-02-24 2012-09-10 Tokyo Electron Ltd 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200937569A (en) * 2007-10-30 2009-09-01 Nikon Corp Substrate holding member, substrate bonding apparatus, apparatus for manufacturing multilayer substrate, substrate bonding method, method for manufacturing multilayer substrate, and method for manufacturing multilayer semiconductor device
TW201250900A (en) * 2011-03-04 2012-12-16 Tokyo Electron Ltd Bonding apparatus, bonding system, bonding method, program, and computer storage medium
US20130327463A1 (en) * 2011-03-04 2013-12-12 Tokyo Electron Limited Joining method, joining device and joining system

Also Published As

Publication number Publication date
TW201633424A (zh) 2016-09-16
JP2016105458A (ja) 2016-06-09
JP6596288B2 (ja) 2019-10-23
KR20160062712A (ko) 2016-06-02
KR102434123B1 (ko) 2022-08-19

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