TWI623640B - 氣體封閉組件及系統 - Google Patents
氣體封閉組件及系統 Download PDFInfo
- Publication number
- TWI623640B TWI623640B TW105142240A TW105142240A TWI623640B TW I623640 B TWI623640 B TW I623640B TW 105142240 A TW105142240 A TW 105142240A TW 105142240 A TW105142240 A TW 105142240A TW I623640 B TWI623640 B TW I623640B
- Authority
- TW
- Taiwan
- Prior art keywords
- gas
- specific examples
- assembly
- frame
- panel
- Prior art date
Links
- 239000011261 inert gas Substances 0.000 claims abstract description 140
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 22
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 22
- 229910052760 oxygen Inorganic materials 0.000 claims description 22
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- 239000002808 molecular sieve Substances 0.000 description 16
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- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 16
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
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- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- -1 but not limited to Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
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- 238000007641 inkjet printing Methods 0.000 description 5
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003463 adsorbent Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
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- 229910000831 Steel Inorganic materials 0.000 description 2
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- 229910052756 noble gas Inorganic materials 0.000 description 2
- 150000002835 noble gases Chemical class 0.000 description 2
- 229920001084 poly(chloroprene) Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000001172 regenerating effect Effects 0.000 description 2
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- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
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- 238000003466 welding Methods 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
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- 239000003086 colorant Substances 0.000 description 1
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- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
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- 238000002360 preparation method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/811—Controlling the atmosphere during processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/12—Guards, shields or dust excluders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/377—Cooling or ventilating arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161579233P | 2011-12-22 | 2011-12-22 | |
| US61/579,233 | 2011-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201716616A TW201716616A (zh) | 2017-05-16 |
| TWI623640B true TWI623640B (zh) | 2018-05-11 |
Family
ID=48669466
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105142240A TWI623640B (zh) | 2011-12-22 | 2012-12-21 | 氣體封閉組件及系統 |
| TW101148932A TWI568874B (zh) | 2011-12-22 | 2012-12-21 | 氣體封閉組件及系統 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101148932A TWI568874B (zh) | 2011-12-22 | 2012-12-21 | 氣體封閉組件及系統 |
Country Status (4)
| Country | Link |
|---|---|
| JP (4) | JP6153539B2 (ko) |
| KR (7) | KR20190090064A (ko) |
| TW (2) | TWI623640B (ko) |
| WO (1) | WO2013096503A1 (ko) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
| US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
| US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
| KR101970449B1 (ko) | 2013-12-26 | 2019-04-18 | 카티바, 인크. | 전자 장치의 열 처리를 위한 장치 및 기술 |
| KR101813828B1 (ko) * | 2014-01-21 | 2017-12-29 | 카티바, 인크. | 전자 장치 인캡슐레이션을 위한 기기 및 기술 |
| JP6461195B2 (ja) * | 2014-04-30 | 2019-01-30 | カティーバ， インコーポレイテッド | 基板コーティングのためのガスクッション装置および技法 |
| JP2017531049A (ja) * | 2014-07-25 | 2017-10-19 | カティーバ， インコーポレイテッド | 有機薄膜インク組成物および方法 |
| US9753463B2 (en) * | 2014-09-12 | 2017-09-05 | Applied Materials, Inc. | Increasing the gas efficiency for an electrostatic chuck |
| CN107075767B (zh) * | 2014-11-26 | 2021-09-03 | 科迪华公司 | 环境受控的涂层系统 |
| CN107848309B (zh) * | 2015-07-31 | 2020-05-19 | 科迪华公司 | 墨输送系统和方法 |
| KR102539338B1 (ko) | 2017-09-14 | 2023-06-02 | 가부시키가이샤 세이부 기켄 | 가스 치환용 드라이룸 |
| JP7306683B2 (ja) * | 2019-05-29 | 2023-07-11 | 株式会社西部技研 | ガス置換用ドライルーム |
| JP7344450B2 (ja) * | 2020-03-05 | 2023-09-14 | トヨタ自動車株式会社 | 電池作製設備および電極スタックの作製空間形成方法 |
| KR102473786B1 (ko) | 2021-01-07 | 2022-12-06 | (주)유니젯 | 인클로저 시스템 |
| KR102279864B1 (ko) * | 2021-02-16 | 2021-07-22 | (주)삼백테크놀로지 | 이중확산 자연대류 순환형 냉각장치 및 이를 이용한 대용량 엘이디 등기구 |
| US11892382B2 (en) | 2021-08-27 | 2024-02-06 | Taiwan Semiconductor Manufacturing Company Ltd. | Method for detecting environmental parameter in semiconductor fabrication facility |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4581478A (en) * | 1982-04-07 | 1986-04-08 | Pugh Paul F | Gas pressurized cable and conduit system |
| US5029518A (en) * | 1989-10-16 | 1991-07-09 | Clean Air Technology, Inc. | Modular clean room structure |
| US6089282A (en) * | 1998-05-08 | 2000-07-18 | Aeronex, Inc. | Method for recovery and reuse of gas |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3216858A (en) * | 1963-04-26 | 1965-11-09 | Cons Edison Co New York Inc | Method of purging gas-conduit tubing in gas-filled electric cables |
| US3498343A (en) * | 1966-12-13 | 1970-03-03 | Lawrence R Sperberg | Apparatus for inflating pneumatic tires with an inert gas |
| US3885362A (en) * | 1973-04-19 | 1975-05-27 | Gordon J Pollock | Modular noise abatement enclosure and joint seal |
| JPH037588Y2 (ko) * | 1985-12-13 | 1991-02-25 | ||
| JP2559617B2 (ja) * | 1988-03-24 | 1996-12-04 | キヤノン株式会社 | 基板処理装置 |
| US5156894A (en) * | 1989-08-02 | 1992-10-20 | Southwall Technologies, Inc. | High performance, thermally insulating multipane glazing structure |
| US5314377A (en) * | 1992-10-05 | 1994-05-24 | Airo Clean Inc. | Clean air isolation enclosure |
| US5344365A (en) * | 1993-09-14 | 1994-09-06 | Sematech, Inc. | Integrated building and conveying structure for manufacturing under ultraclean conditions |
| JPH09327646A (ja) * | 1996-04-10 | 1997-12-22 | Sony Corp | 粘性体滴下装置 |
| US6049167A (en) * | 1997-02-17 | 2000-04-11 | Tdk Corporation | Organic electroluminescent display device, and method and system for making the same |
| JPH10246201A (ja) * | 1997-03-03 | 1998-09-14 | Tokyo Seimitsu Sokki Kk | 空気圧供給システム |
| JPH11312640A (ja) * | 1998-02-25 | 1999-11-09 | Canon Inc | 処理装置および該処理装置を用いたデバイス製造方法 |
| US6023899A (en) * | 1998-11-03 | 2000-02-15 | Climatecraft Technologies, Inc. | Wall panel assembly with airtight joint |
| JP4303811B2 (ja) * | 1998-11-11 | 2009-07-29 | 大陽日酸株式会社 | 減圧設備における不活性ガスの循環供給方法及び装置 |
| JP4868269B2 (ja) * | 2000-03-09 | 2012-02-01 | 東レ株式会社 | 塗布方法およびカラーフィルターの製造方法 |
| JP3939101B2 (ja) * | 2000-12-04 | 2007-07-04 | 株式会社荏原製作所 | 基板搬送方法および基板搬送容器 |
| US6646284B2 (en) * | 2000-12-12 | 2003-11-11 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and method of manufacturing the same |
| JP3868280B2 (ja) * | 2001-12-04 | 2007-01-17 | 株式会社美和製作所 | 有機電界発光素子の製造装置 |
| JP3925257B2 (ja) * | 2002-03-15 | 2007-06-06 | セイコーエプソン株式会社 | 気密チャンバにおける接続ラインの貫通構造およびこれを備えた吐出装置、並びに液晶表示装置の製造方法、有機ｅｌ装置の製造方法、電子放出装置の製造方法、ｐｄｐ装置の製造方法、電気泳動表示装置の製造方法、カラーフィルタの製造方法、有機ｅｌの製造方法、スペーサ形成方法、金属配線形成方法、レンズ形成方法、レジスト形成方法および光拡散体形成方法 |
| JP3985559B2 (ja) * | 2002-03-19 | 2007-10-03 | セイコーエプソン株式会社 | 吐出装置、並びに液晶表示装置の製造方法、有機ｅｌ装置の製造方法、電子放出装置の製造方法、ｐｄｐ装置の製造方法、電気泳動表示装置の製造方法、カラーフィルタの製造方法、有機ｅｌの製造方法、スペーサ形成方法、金属配線形成方法、レンズ形成方法、レジスト形成方法および光拡散体形成方法 |
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2012
- 2012-12-19 KR KR1020197021637A patent/KR20190090064A/ko active Application Filing
- 2012-12-19 KR KR1020217041139A patent/KR102530263B1/ko active IP Right Grant
- 2012-12-19 KR KR1020247007913A patent/KR20240036145A/ko active Application Filing
- 2012-12-19 KR KR1020147020478A patent/KR101869134B1/ko active IP Right Grant
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- 2012-12-19 KR KR1020207032729A patent/KR102341544B1/ko active IP Right Grant
- 2012-12-19 KR KR1020237015116A patent/KR20230069251A/ko not_active Application Discontinuation
- 2012-12-19 JP JP2014548852A patent/JP6153539B2/ja active Active
- 2012-12-19 KR KR1020187016567A patent/KR102005688B1/ko active IP Right Grant
- 2012-12-21 TW TW105142240A patent/TWI623640B/zh active
- 2012-12-21 TW TW101148932A patent/TWI568874B/zh active
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2017
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2018
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- 2019-08-01 JP JP2019142132A patent/JP2019220472A/ja active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI568874B (zh) | 2017-02-01 |
| KR102530263B1 (ko) | 2023-05-08 |
| JP2015510254A (ja) | 2015-04-02 |
| KR20190090064A (ko) | 2019-07-31 |
| JP6379255B2 (ja) | 2018-08-22 |
| KR20140110967A (ko) | 2014-09-17 |
| WO2013096503A1 (en) | 2013-06-27 |
| JP6153539B2 (ja) | 2017-06-28 |
| KR102005688B1 (ko) | 2019-10-01 |
| JP2018200887A (ja) | 2018-12-20 |
| KR20230069251A (ko) | 2023-05-18 |
| JP2017228770A (ja) | 2017-12-28 |
| TW201716616A (zh) | 2017-05-16 |
| JP2019220472A (ja) | 2019-12-26 |
| KR102341544B1 (ko) | 2021-12-21 |
| KR20210156856A (ko) | 2021-12-27 |
| JP6605089B2 (ja) | 2019-11-13 |
| KR20180069096A (ko) | 2018-06-22 |
| KR20240036145A (ko) | 2024-03-19 |
| TW201343948A (zh) | 2013-11-01 |
| KR101869134B1 (ko) | 2018-06-19 |
| KR20200130757A (ko) | 2020-11-19 |
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