TWI613716B - 晶圓加工用膠帶 - Google Patents

晶圓加工用膠帶 Download PDF

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Publication number
TWI613716B
TWI613716B TW104140170A TW104140170A TWI613716B TW I613716 B TWI613716 B TW I613716B TW 104140170 A TW104140170 A TW 104140170A TW 104140170 A TW104140170 A TW 104140170A TW I613716 B TWI613716 B TW I613716B
Authority
TW
Taiwan
Prior art keywords
film
adhesive
adhesive layer
release film
support member
Prior art date
Application number
TW104140170A
Other languages
English (en)
Chinese (zh)
Other versions
TW201633387A (zh
Inventor
青山真沙美
大田郷史
木村和寛
佐久間登
杉山二朗
Original Assignee
古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 古河電氣工業股份有限公司 filed Critical 古河電氣工業股份有限公司
Publication of TW201633387A publication Critical patent/TW201633387A/zh
Application granted granted Critical
Publication of TWI613716B publication Critical patent/TWI613716B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • C09J2461/006—Presence of condensation polymers of aldehydes or ketones in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C09J2463/006—Presence of epoxy resin in the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW104140170A 2014-12-04 2015-12-01 晶圓加工用膠帶 TWI613716B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014246308A JP6382088B2 (ja) 2014-12-04 2014-12-04 ウェハ加工用テープ
JP2014-246308 2014-12-04

Publications (2)

Publication Number Publication Date
TW201633387A TW201633387A (zh) 2016-09-16
TWI613716B true TWI613716B (zh) 2018-02-01

Family

ID=56124797

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104140170A TWI613716B (zh) 2014-12-04 2015-12-01 晶圓加工用膠帶

Country Status (4)

Country Link
JP (1) JP6382088B2 (ko)
KR (1) KR101828135B1 (ko)
CN (1) CN105694748B (ko)
TW (1) TWI613716B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102238757B1 (ko) * 2019-02-26 2021-04-09 구자규 반도체 웨이퍼의 보호필름 제조방법 및 이에 따라 제조된 보호필름

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120100325A1 (en) * 2007-09-14 2012-04-26 Hiromitsu Maruyama Wafer processing tape

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04360653A (ja) 1991-06-06 1992-12-14 Tochigi Pref Gov 麻の実の多価不飽和脂肪酸高含有鶏卵の生産方法
JP4360653B2 (ja) * 2007-09-14 2009-11-11 古河電気工業株式会社 ウエハ加工用テープ
JP5276063B2 (ja) 2010-07-16 2013-08-28 古河電気工業株式会社 半導体ウエハのダイシング及びダイボンディング加工用シート
JP4976532B2 (ja) * 2010-09-06 2012-07-18 日東電工株式会社 半導体装置用フィルム
JP4991921B2 (ja) * 2010-09-06 2012-08-08 日東電工株式会社 半導体装置用フィルム、及び、半導体装置
JP2012082285A (ja) * 2010-10-08 2012-04-26 Hitachi Chemical Co Ltd 接着シート

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120100325A1 (en) * 2007-09-14 2012-04-26 Hiromitsu Maruyama Wafer processing tape

Also Published As

Publication number Publication date
JP2016111157A (ja) 2016-06-20
CN105694748A (zh) 2016-06-22
CN105694748B (zh) 2019-07-30
KR101828135B1 (ko) 2018-02-09
KR20160067754A (ko) 2016-06-14
JP6382088B2 (ja) 2018-08-29
TW201633387A (zh) 2016-09-16

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