TWI612864B - Washing device and washing method - Google Patents

Washing device and washing method Download PDF

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Publication number
TWI612864B
TWI612864B TW103137183A TW103137183A TWI612864B TW I612864 B TWI612864 B TW I612864B TW 103137183 A TW103137183 A TW 103137183A TW 103137183 A TW103137183 A TW 103137183A TW I612864 B TWI612864 B TW I612864B
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TW
Taiwan
Prior art keywords
cleaning
suction port
detergent
cleaning device
chamber
Prior art date
Application number
TW103137183A
Other languages
Chinese (zh)
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TW201526736A (en
Inventor
Masayuki Kitajima
Tetsuji Ishikawa
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Fujitsu Ltd
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Publication of TW201526736A publication Critical patent/TW201526736A/en
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Publication of TWI612864B publication Critical patent/TWI612864B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/003Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00Abrasive blasting machines or devices; Plants
    • B24C3/02Abrasive blasting machines or devices; Plants characterised by the arrangement of the component assemblies with respect to each other
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C7/00Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C9/00Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Abstract

一種洗淨裝置,包含有:噴射口構件,從噴射口將洗淨劑對具有貫通孔的洗淨對象物噴射;及吸引口構件,對前述洗淨對象物以設於和前述噴射口為相反側的吸引口吸引前述洗淨劑。 A cleaning device includes: a spray port member that sprays a cleaning agent from a spray port to a cleaning object having a through hole; and a suction port member that is opposite to the spray port from the cleaning object The side suction port sucks the aforementioned detergent.

Description

洗淨裝置及洗淨方法 Washing device and washing method 發明領域 Field of invention

本發明是有關於一種洗淨裝置及洗淨方法。 The present invention relates to a cleaning device and a cleaning method.

發明背景 Background of the invention

已知有從製冰器噴嘴對樹脂基板噴射包含凍結粒子的洗淨媒體,以進行樹脂基板的去毛邊洗淨的去毛邊洗淨裝置及去毛邊洗淨方法。 A deburring device and a deburring method are known in which a cleaning medium containing frozen particles is sprayed from a nozzle of an ice maker onto a resin substrate to clean the resin substrate.

先前技術文獻 Prior art literature

專利文獻1 日本特開2008-307624號公報 Patent Document 1 Japanese Patent Application Publication No. 2008-307624

在形成有貫通孔的洗淨對象中會有在貫通孔內也附著有附著物的情況。 In a cleaning object having a through-hole formed there may be an adhered substance in the through-hole.

發明概要 Summary of invention

一方面,本發明是以提高對形成有貫通孔的洗淨對象的附著物除去能力為目的。 In one aspect, the present invention aims to improve the ability to remove adherents to a cleaning target having a through-hole formed therein.

在一個態樣中,從噴射口對具有貫通孔的洗淨對象物噴射洗淨劑,利用對洗淨對象物設在與噴射口為相反側之吸引口吸引洗淨劑。 In one aspect, the cleaning agent is sprayed from the spray port to the cleaning object having the through hole, and the cleaning agent is sucked by the suction port provided to the cleaning object on the side opposite to the spray port.

12‧‧‧洗淨裝置 12‧‧‧washing device

14‧‧‧腔室 14‧‧‧ chamber

14A‧‧‧上部空間 14A‧‧‧Upper space

14B‧‧‧下部空間 14B‧‧‧Lower Space

14C‧‧‧側壁 14C‧‧‧Sidewall

14D‧‧‧上壁 14D‧‧‧Upper Wall

14E‧‧‧下壁 14E‧‧‧ lower wall

16‧‧‧金屬遮罩 16‧‧‧ metal mask

16A‧‧‧遮罩本體 16A‧‧‧Mask body

16B‧‧‧補強構件 16B‧‧‧ Reinforcing member

18‧‧‧貫通孔 18‧‧‧through hole

18S‧‧‧內面 18S‧‧‧ inside

20‧‧‧焊糊 20‧‧‧Solder Paste

20A‧‧‧助熔劑 20A‧‧‧Flux

20B‧‧‧焊料粒子 20B‧‧‧Solder particles

22‧‧‧保持構件 22‧‧‧ holding member

24‧‧‧洗淨劑噴嘴 24‧‧‧ Detergent nozzle

26‧‧‧噴射口 26‧‧‧jet port

28‧‧‧吸引噴嘴 28‧‧‧ suction nozzle

30‧‧‧吸引口 30‧‧‧ Attraction

32‧‧‧殼體 32‧‧‧shell

34‧‧‧氣體噴射噴嘴 34‧‧‧Gas jet nozzle

34A‧‧‧第1姿勢 34A‧‧‧first pose

34B‧‧‧第2姿勢 34B‧‧‧ 2nd posture

36‧‧‧軸桿 36‧‧‧ shaft

38‧‧‧控制裝置 38‧‧‧control device

40‧‧‧洗淨劑供給裝置 40‧‧‧ detergent supply device

42‧‧‧氣體供給裝置 42‧‧‧Gas supply device

44‧‧‧返回構件 44‧‧‧Return to component

46‧‧‧供給口 46‧‧‧ supply port

48‧‧‧第1泵 48‧‧‧The first pump

50‧‧‧緩衝槽 50‧‧‧ buffer tank

52‧‧‧第2泵 52‧‧‧Pump 2

54‧‧‧粒狀體生成裝置 54‧‧‧ Granular body generating device

56‧‧‧第3泵 56‧‧‧3rd pump

58‧‧‧過濾器 58‧‧‧Filter

60‧‧‧儲留槽 60‧‧‧Storage tank

62‧‧‧第1閥 62‧‧‧The first valve

64A‧‧‧第1配管 64A‧‧‧The first piping

64A1‧‧‧第1配管(分歧部分) 64A1‧‧‧The first piping (divergent part)

64B‧‧‧第2配管 64B‧‧‧ 2nd piping

66‧‧‧回收裝置 66‧‧‧ Recovery device

68‧‧‧回收裝置 68‧‧‧ Recovery device

70‧‧‧排出配管 70‧‧‧ discharge pipe

72‧‧‧第2閥 72‧‧‧ 2nd valve

74‧‧‧噴霧器 74‧‧‧ sprayer

76‧‧‧冷卻機 76‧‧‧Cooler

78‧‧‧凝固點感測器 78‧‧‧ Freezing point sensor

80‧‧‧排出配管 80‧‧‧ discharge piping

82‧‧‧相反側吸引噴嘴 82‧‧‧ opposite side suction nozzle

84‧‧‧相反側吸引口 84‧‧‧ opposite side suction mouth

86‧‧‧排出配管 86‧‧‧Exhaust piping

88‧‧‧第4泵 88‧‧‧4th pump

90‧‧‧沉澱槽 90‧‧‧ settling tank

92‧‧‧過濾器 92‧‧‧ Filter

94‧‧‧第3閥 94‧‧‧3rd valve

96‧‧‧反射構件 96‧‧‧Reflecting member

98‧‧‧傾斜面 98‧‧‧ inclined surface

102‧‧‧附著物 102‧‧‧ Attachments

104‧‧‧洗淨劑 104‧‧‧ Detergent

106‧‧‧渦流 106‧‧‧ Vortex

108‧‧‧渦流 108‧‧‧ Vortex

M1‧‧‧移動方向 M1‧‧‧moving direction

M2‧‧‧移動方向 M2‧‧‧ direction of movement

P‧‧‧箭頭 P‧‧‧ Arrow

P1‧‧‧箭頭 P1‧‧‧arrow

θ1‧‧‧角度 θ1‧‧‧ angle

θ2‧‧‧角度 θ2‧‧‧ angle

圖1是顯示第1實施形態之洗淨裝置的前視圖。 Fig. 1 is a front view showing a cleaning apparatus according to a first embodiment.

圖2是顯示第1實施形態之洗淨裝置的放大前視圖。 Fig. 2 is an enlarged front view showing a cleaning apparatus according to the first embodiment.

圖3是顯示第1實施形態之洗淨裝置的放大前視圖。 Fig. 3 is an enlarged front view showing a cleaning apparatus according to the first embodiment.

圖4是顯示第1實施形態之洗淨裝置的放大前視圖。 Fig. 4 is an enlarged front view showing a cleaning device according to the first embodiment.

圖5是顯示第1實施形態之洗淨裝置的吸引噴嘴的俯視圖。 Fig. 5 is a plan view showing a suction nozzle of the cleaning device of the first embodiment.

圖6是顯示金屬遮罩的立體圖。 FIG. 6 is a perspective view showing a metal mask.

圖7是第1實施形態之洗淨裝置的塊狀圖。 Fig. 7 is a block diagram of a cleaning device according to the first embodiment.

圖8A是將金屬遮罩之貫通孔的附近放大並加以顯示的縱斷面圖。 FIG. 8A is a longitudinal sectional view showing an enlarged vicinity of a through hole of a metal mask. FIG.

圖8B是將金屬遮罩之貫通孔的附近放大並加以顯示的橫斷面圖。 FIG. 8B is a cross-sectional view enlarging and displaying the vicinity of the through hole of the metal mask.

圖9是顯示第1實施形態洗淨裝置之洗淨步驟的一例的時序圖。 Fig. 9 is a timing chart showing an example of a cleaning procedure of the cleaning device according to the first embodiment.

圖10是將氣體噴射噴嘴設於腔室內之洗淨裝置的前視圖。 Fig. 10 is a front view of a cleaning device in which a gas injection nozzle is provided in a chamber.

較佳實施例之詳細說明 Detailed description of the preferred embodiment

就有關第1實施形態,基於圖面詳細進行說明。 The first embodiment will be described in detail based on the drawings.

在圖1中,顯示了第1實施形態之洗淨裝置12。 FIG. 1 shows a cleaning device 12 according to the first embodiment.

洗淨裝置12具有腔室14。也如圖2~圖4所示, 腔室14是密閉的容器。在腔室14的內部收納並保持有金屬遮罩16。 The cleaning device 12 includes a chamber 14. As shown in Figure 2 ~ 4, The chamber 14 is a closed container. A metal shield 16 is housed and held inside the chamber 14.

金屬遮罩16是例如在印刷電路基板的基材上印刷塗布焊糊20(參照圖6)時作為遮罩使用的板狀構件。如圖1~圖4所示的例子中,金屬遮罩16具有板狀的遮罩本體16A、安裝於遮罩本體16A周圍的框狀補強構件16B。 The metal mask 16 is, for example, a plate-like member used as a mask when the solder paste 20 (see FIG. 6) is printed on the base material of a printed circuit board. In the examples shown in FIGS. 1 to 4, the metal mask 16 includes a plate-shaped mask body 16A and a frame-shaped reinforcing member 16B attached to the periphery of the mask body 16A.

在金屬遮罩16上,也如圖6所示,形成有複數個貫通孔18。為了於印刷電路基板的基材上印刷塗布焊糊20,使用之後的金屬遮罩16會有焊糊20的一部分作為附著物102而附著在貫通孔18內的情況。焊糊20是例如在助熔劑20A和焊料粒子20B以預定的體積比混合後的狀態。亦即,焊糊20是焊料粒子20B分散在助熔劑20A中,而會有該焊糊20在金屬遮罩16使用後殘留於貫通孔18內的情況。在本實施形態中,金屬遮罩16是洗淨對象物的一個例子,焊糊20是附著物的一個例子。 A plurality of through holes 18 are also formed in the metal mask 16 as shown in FIG. 6. In order to print and apply the solder paste 20 on the base material of the printed circuit board, a part of the solder paste 20 may be attached to the through-hole 18 as an attachment 102 after the metal mask 16 is used. The solder paste 20 is, for example, a state where the flux 20A and the solder particles 20B are mixed at a predetermined volume ratio. That is, the solder paste 20 has the solder particles 20B dispersed in the flux 20A, and the solder paste 20 may remain in the through hole 18 after the metal mask 16 is used. In this embodiment, the metal mask 16 is an example of an object to be cleaned, and the solder paste 20 is an example of an attachment.

如詳細地顯示於圖2~圖4般,在腔室14內設有用以保持金屬遮罩16的保持構件22。保持構件22在本實施形態中,是從外側保持遮罩本體16A及補強構件16B,並設置於腔室14內的預定位置。保持構件22是設置部的一個例子。 As shown in detail in FIGS. 2 to 4, a holding member 22 for holding the metal shield 16 is provided in the chamber 14. In this embodiment, the holding member 22 holds the mask body 16A and the reinforcing member 16B from the outside, and is provided at a predetermined position in the chamber 14. The holding member 22 is an example of the installation portion.

又,保持構件22雖是在腔室14內保持金屬遮罩16,但不塞住金屬遮罩16的貫通孔18。而且,在腔室14內,於金屬遮罩16的下方產生下部空間14B,於金屬遮罩16的上方產生上部空間14A。 The holding member 22 holds the metal shield 16 in the cavity 14, but does not block the through hole 18 of the metal shield 16. In the chamber 14, a lower space 14B is generated below the metal shield 16, and an upper space 14A is generated above the metal shield 16.

在腔室14的側壁14C安裝有1個或複數個(在圖2~圖4所示的例子中於左右的側壁14C各有兩個,合計4個)洗淨劑噴嘴24。洗淨劑噴嘴24是噴射口構件的一例。洗淨劑噴嘴24如圖3所示,是將從洗淨劑供給裝置40(如圖1所示)所供給的洗淨劑104由噴射口26朝腔室14內噴射。 One or a plurality of detergent nozzles 24 are installed on the side wall 14C of the chamber 14 (two in each of the left and right side walls 14C in the example shown in FIGS. 2 to 4, a total of four). The detergent nozzle 24 is an example of an injection port member. As shown in FIG. 3, the detergent nozzle 24 sprays the detergent 104 supplied from the detergent supply device 40 (shown in FIG. 1) into the chamber 14 through the injection port 26.

在腔室14的上壁14D安裝有1個或複數個(在圖2~圖4所示的例子中,於上壁14D的中央有1個)吸引噴嘴28。吸引噴嘴28是吸引口構件的一例,吸引噴嘴28的內部是吸引口30。吸引噴嘴28具有複數個隨著從腔室14離開而階段性地直徑擴大的圓筒狀殼體32。在圖2~圖4所示之吸引噴嘴28中,具有4個隨著朝上方而階段性地直徑擴大的殼體32。 One or a plurality of suction nozzles 28 are attached to the upper wall 14D of the chamber 14 (in the example shown in FIGS. 2 to 4, there is one in the center of the upper wall 14D). The suction nozzle 28 is an example of a suction port member, and the inside of the suction nozzle 28 is a suction port 30. The suction nozzle 28 includes a plurality of cylindrical casings 32 that gradually increase in diameter as they leave the chamber 14. The suction nozzle 28 shown in FIG. 2 to FIG. 4 includes four housings 32 that gradually increase in diameter as they go upward.

如詳細地顯示於圖5般,於吸引口30的內部,亦即於殼體32的每一個安裝有1個或複數個(在圖5的例子中,每一個殼體32有4個)氣體噴射噴嘴34。氣體噴射噴嘴34的每一個藉由軸桿36而可旋轉地安裝在殼體32。 As shown in detail in FIG. 5, one or a plurality of gas (in the example of FIG. 5, there are 4 each) are installed inside the suction port 30, that is, each of the casings 32. Spray nozzle 34. Each of the gas injection nozzles 34 is rotatably mounted to the housing 32 by a shaft 36.

氣體噴射噴嘴34的每一個藉由以軸桿36為中心而旋轉,在圖5以實線所示的第1姿勢34A、及以二點鏈線所示的第2姿勢34B間進行姿勢變化。氣體噴射噴嘴34在第1姿勢34A,相對於朝向殼體32之中心的方向,以一定的角度θ1傾斜,在第2姿勢34B則朝著第1姿勢34A的相反側以一定的角度θ2傾斜。角度θ1和角度θ2也可以是相等,也可以是相異。氣體噴射噴嘴34的姿勢如圖7所示,是藉由控制裝置38加以控制。 Each of the gas injection nozzles 34 rotates with the shaft 36 as the center, and changes its posture between the first posture 34A shown by a solid line in FIG. 5 and the second posture 34B shown by a two-dot chain line. The gas injection nozzle 34 is inclined at a certain angle θ1 with respect to the direction toward the center of the housing 32 in the first posture 34A, and is inclined with a certain angle θ2 toward the opposite side of the first posture 34A in the second posture 34B. The angle θ1 and the angle θ2 may be equal or different. As shown in FIG. 7, the attitude of the gas injection nozzle 34 is controlled by the control device 38.

氣體噴射噴嘴34是將從氣體供給裝置42(如圖1所示)所供給的氣體朝殼體32內噴射的噴嘴,是氣體噴射構件的一例。再者,氣體噴射噴嘴34是使在腔室14內的洗淨劑104的移動方向相對貫通孔18的貫通方向傾斜的傾斜構件的一例。 The gas injection nozzle 34 is a nozzle that injects a gas supplied from a gas supply device 42 (shown in FIG. 1) into the housing 32, and is an example of a gas injection member. The gas injection nozzle 34 is an example of an inclined member that inclines the moving direction of the detergent 104 in the chamber 14 with respect to the penetrating direction of the through hole 18.

在氣體噴射噴嘴34的每一個以上述之預定角度θ1或θ2傾斜的狀態下,於殼體32內及腔室14內發生渦流106。而且,在本實施形態中,方便上,使氣體噴射噴嘴34位在第1姿勢34A(角度θ1)時在腔室14內所產生的渦流的方向為右向(圖5所示的方向)。因此,位在第2姿勢34B(角度θ2)時在腔室14內所產生之渦流的方向為左向(與圖5所示之方向為相反方向)。 In a state where each of the gas injection nozzles 34 is inclined at the predetermined angle θ1 or θ2 described above, a vortex 106 is generated in the housing 32 and the chamber 14. Further, in this embodiment, for convenience, the direction of the vortex generated in the chamber 14 when the gas injection nozzle 34 is positioned at the first posture 34A (angle θ1) is the right direction (the direction shown in FIG. 5). Therefore, the direction of the eddy current generated in the chamber 14 when the second posture 34B (angle θ2) is in the left direction (the direction opposite to the direction shown in FIG. 5).

藉由在腔室14內產生的渦流106,而使腔室14內之洗淨劑104的移動方向變化。特別是,如圖8A所示,洗淨劑104之移動方向M1相對於金屬遮罩16的貫通孔18的貫通方向(金屬遮罩16的法線方向)傾斜。 The moving direction of the cleaning agent 104 in the chamber 14 is changed by the eddy current 106 generated in the chamber 14. In particular, as shown in FIG. 8A, the moving direction M1 of the cleaning agent 104 is inclined with respect to the penetration direction of the through-hole 18 of the metal mask 16 (the normal direction of the metal mask 16).

又,如圖8B所示,在平面視金屬遮罩16時,在貫通孔18的內部也產生渦流108。藉由該渦流108,貫通孔18的內部的洗淨劑104的移動方向M2可採取各種方向。 As shown in FIG. 8B, when the metal mask 16 is viewed in plan, a vortex 108 is also generated inside the through hole 18. By this eddy current 108, the moving direction M2 of the cleaning agent 104 inside the through-hole 18 can take various directions.

如圖1所示,洗淨裝置12具有洗淨劑供給裝置40及回收裝置66。洗淨劑供給裝置40具有從供給口46經由第1泵48及緩衝槽50在第2泵52分歧而至洗淨劑噴射噴嘴24的第1配管64A。於第1配管64A分歧之分歧部分64A1設有粒狀體生成裝置54。第1配管64A是供給配管的一例。 As shown in FIG. 1, the cleaning device 12 includes a detergent supply device 40 and a recovery device 66. The detergent supply device 40 includes a first pipe 64A branched from the supply port 46 through the first pump 48 and the buffer tank 50 at the second pump 52 to the detergent injection nozzle 24. A granular body generating device 54 is provided at the branch portion 64A1 where the first pipe 64A branches. The first piping 64A is an example of a supply piping.

相對於此,回收裝置66具有返回構件44。返回構件44具有從吸引噴嘴28經由第3泵56、過濾器58及儲留槽60、第1閥62而至緩衝槽50的第2配管64B。第1配管64A、64A1中,從緩衝槽50到洗淨劑噴射噴嘴24的部分、和第2配管64B是返回構件44。亦即,第1配管64A、64A1中,從緩衝槽50到洗淨劑噴射噴嘴24的部分是兼作供給配管和返回配管。 In contrast, the recovery device 66 includes a return member 44. The return member 44 includes a second pipe 64B from the suction nozzle 28 to the buffer tank 50 through the third pump 56, the filter 58, the storage tank 60, and the first valve 62. Among the first pipes 64A and 64A1, the portion from the buffer tank 50 to the detergent injection nozzle 24 and the second pipe 64B are return members 44. That is, in the first piping 64A, 64A1, the portion from the buffer tank 50 to the detergent injection nozzle 24 serves as both a supply piping and a return piping.

回收裝置66可藉由第3泵56的驅動透過第2配管64B回收腔室14內的洗淨劑104而送至儲留槽60。 The recovery device 66 can be driven by the third pump 56 to the cleaning agent 104 in the recovery chamber 14 through the second pipe 64B and sent to the storage tank 60.

儲留槽60連接有藉由第2閥72而開閉的排出配管70。 The storage tank 60 is connected to a discharge pipe 70 opened and closed by a second valve 72.

洗淨媒體(在本實施形態的例子是水)從第1配管64A一端的供給口46供給並一時地儲留在緩衝槽50。緩衝槽50內的洗淨媒體在第2泵52驅動時被送至粒狀體生成裝置54。 The cleaning medium (water in the example of this embodiment) is supplied from the supply port 46 at one end of the first pipe 64A and is temporarily stored in the buffer tank 50. The cleaning medium in the buffer tank 50 is sent to the granular material generating device 54 when the second pump 52 is driven.

在本實施形態中,粒狀體生成裝置54具有設於第1配管64A1的噴霧器74及冷卻機76。液狀的洗淨媒體經過以噴霧器74進行霧化和以冷卻機76進行冷卻而送至洗淨劑噴射噴嘴24。液狀水的一部分或全部藉由霧化及冷卻而固化,成為冰粒子。然後,如圖3所示,冰粒子作為洗淨劑104,從洗淨劑噴嘴24朝腔室14內噴射。冰粒子是粒狀體的一例。 In the present embodiment, the granular material generating device 54 includes a sprayer 74 and a cooler 76 provided in the first pipe 64A1. The liquid cleaning medium is sent to the cleaning agent spray nozzle 24 after being atomized by the atomizer 74 and cooled by the cooler 76. Part or all of the liquid water is solidified by atomization and cooling, and becomes ice particles. Then, as shown in FIG. 3, the ice particles are sprayed into the chamber 14 from the detergent nozzle 24 as the detergent 104. Ice particles are an example of granular bodies.

在冷卻機76中也可將氧以外的氣體(例如二氧化碳或氮)混合於霧狀水。將氧以外的氣體送至腔室14內, 藉以減少腔室14內的氧量。利用減少腔室14內的氧量,而抑制包含於焊糊20之助焊劑20A氧化而使黏度上升。 In the cooler 76, a gas other than oxygen (for example, carbon dioxide or nitrogen) may be mixed with the mist water. Sending gas other than oxygen into the chamber 14, Thereby, the amount of oxygen in the chamber 14 is reduced. By reducing the amount of oxygen in the chamber 14, the flux 20A contained in the solder paste 20 is inhibited from being oxidized to increase the viscosity.

腔室14內的洗淨劑104的一部分藉由設於第2配管64B之第3泵56的驅動而以吸引噴嘴28吸引。以吸引噴嘴28吸引的洗淨劑104經過過濾器58而送至儲留槽60。 A part of the cleaning agent 104 in the chamber 14 is sucked by the suction nozzle 28 by driving the third pump 56 provided in the second pipe 64B. The detergent 104 sucked by the suction nozzle 28 passes through the filter 58 and is sent to the storage tank 60.

過濾器58從洗淨劑104分離包含於洗淨劑104的附著物(從金屬遮罩16除去的焊糊20等)的一部分。分離了附著物的洗淨劑104一時地儲留在儲留槽60。 The filter 58 separates a part of the adhered matter (the solder paste 20 and the like removed from the metal mask 16) contained in the detergent 104 from the detergent 104. The cleaning agent 104 separated from the deposits is temporarily stored in the storage tank 60.

儲留槽60設有凝固點感測器78。洗淨劑104中殘留很多附著物時,洗淨劑104的凝固點會變低。亦即,藉由凝固點感測器78來測定洗淨劑104的凝固點,藉以可判斷洗淨劑104是否含有很多附著物。如圖7所示,利用凝固點感測器78測定的測定資料送至控制裝置38。 The storage tank 60 is provided with a freezing point sensor 78. When a lot of deposits remain in the detergent 104, the freezing point of the detergent 104 becomes low. That is, the freezing point of the detergent 104 is measured by the freezing point sensor 78, and thereby it can be judged whether the detergent 104 contains many attachments. As shown in FIG. 7, the measurement data measured by the freezing point sensor 78 is sent to the control device 38.

因殘留於洗淨劑104的附著物很多等理由,而不將洗淨劑104再利用時,控制裝置38便使排出配管70的第2閥72開閥。而可從排出配管80將儲留槽60內的洗淨劑104排出。 When there is a lot of adhered matter remaining in the detergent 104 and the like, when the detergent 104 is not reused, the control device 38 opens the second valve 72 of the discharge pipe 70. The detergent 104 in the storage tank 60 can be discharged from the discharge pipe 80.

相對於此,因殘留於洗淨劑104的附著物少等理由而再利用洗淨劑104時,控制裝置38便將第1閥62開閥,而可使儲留槽60內的洗淨劑104移動至緩衝槽50。回到緩衝槽50之洗淨劑104被再利用於腔室14內之金屬遮罩16的洗淨。 On the other hand, when the cleaning agent 104 is reused for reasons such as a small amount of deposits remaining on the cleaning agent 104, the control device 38 opens the first valve 62 to allow the cleaning agent in the storage tank 60 to be opened. 104 moves to the buffer tank 50. The cleaning agent 104 returned to the buffer tank 50 is reused for cleaning the metal mask 16 in the chamber 14.

而且,在第2配管64B之儲留槽60和緩衝槽50之間的部分也可設置過濾器,而可從洗淨劑104進一步將附 著物分離。 In addition, a filter may be provided at a portion between the storage tank 60 and the buffer tank 50 of the second pipe 64B, and the cleaning agent 104 may further be used to attach the filter. The objects are separated.

如圖1~圖4所示,腔室14的下壁14E安裝有一個或複數個(在圖1~圖4所示的例子中於下壁14E的中央安裝一個)相反側吸引噴嘴82。相反側吸引噴嘴82形成圓筒狀,相反側吸引噴嘴82的內部是相反側吸引口84。相反側吸引噴嘴82相對金屬遮罩16是和吸引噴嘴28位在相反側。而且,相反側吸引口84相對金屬遮罩16亦是位於和吸引口30為相反側的位置。 As shown in FIGS. 1 to 4, the lower wall 14E of the chamber 14 is provided with one or a plurality of suction nozzles 82 (opposite to the center of the lower wall 14E in the example shown in FIGS. 1 to 4). The opposite-side suction nozzle 82 is formed in a cylindrical shape, and the inside of the opposite-side suction nozzle 82 is an opposite-side suction port 84. The suction nozzle 82 on the opposite side is located on the opposite side from the suction nozzle 28 with respect to the metal mask 16. In addition, the opposite-side suction port 84 is also located on the side opposite to the suction port 30 with respect to the metal shield 16.

相反側吸引噴嘴82設有回收裝置68。回收裝置68具有連接於相反側吸引噴嘴82的排出配管86。 The opposite side suction nozzle 82 is provided with a recovery device 68. The recovery device 68 includes a discharge pipe 86 connected to the suction nozzle 82 on the opposite side.

在排出配管86設有第4泵88、沉澱槽90、過濾器92及第3閥94。回收裝置68可藉由第4泵88的驅動透過排出配管86回收腔室14內的洗淨劑104,並送至沉澱槽90。 The discharge pipe 86 is provided with a fourth pump 88, a sedimentation tank 90, a filter 92, and a third valve 94. The recovery device 68 can drive the fourth pump 88 to recover the cleaning agent 104 in the chamber 14 through the discharge pipe 86 and send it to the sedimentation tank 90.

在沉澱槽90中,沉澱洗淨劑104內之附著物102。積存在沉澱槽90內的附著物(沉澱物)可在預定條件(例如定期地)從沉澱槽90廢棄。而且,控制裝置38可利用將第3閥94開閥,從排出配管86的排出口將沉澱槽90內之洗淨劑104的上部澄清部分排出。 In the sedimentation tank 90, the deposits 102 in the detergent 104 are precipitated. The deposits (precipitates) accumulated in the sedimentation tank 90 can be discarded from the sedimentation tank 90 under predetermined conditions (for example, periodically). In addition, the control device 38 can open the third valve 94 and discharge the clarified part of the cleaning agent 104 in the sedimentation tank 90 from the discharge port of the discharge pipe 86.

如圖1~圖4所示,腔室14的上壁14D的下面形成有複數個反射構件96。反射構件96是傾斜構件的一例。 As shown in FIGS. 1 to 4, a plurality of reflecting members 96 are formed under the upper wall 14D of the chamber 14. The reflecting member 96 is an example of an inclined member.

反射構件96的每一個具有相對收容於腔室14內的金屬遮罩的貫通方向(箭頭P1方向)傾斜的一個或複數個(圖1~圖4的例子中是2個)傾斜面98。圖1~圖4所示的例子中,相鄰接的傾斜面98相互朝相反方向傾斜。碰到傾斜面 98的洗淨劑104會以和對上壁14D的入射角相異的反射角反射。 Each of the reflecting members 96 has one or a plurality of inclined surfaces 98 (two in the example of FIGS. 1 to 4) inclined with respect to the penetrating direction (the direction of the arrow P1) of the metal shield housed in the chamber 14. In the examples shown in FIGS. 1 to 4, the adjacent inclined surfaces 98 are inclined in opposite directions to each other. Hit the inclined surface The cleaning agent 104 of 98 reflects at a reflection angle different from the incident angle to the upper wall 14D.

反射構件96的形狀並未限定,例如,可舉圓錐狀或是角錐狀的形狀(底面成為上方的朝向)。在複數個反射構件96間也可隔著間隙,然而如圖1~圖4所示,無間隙地形成複數個反射構件96時,每預定面積可形成的反射構件96的數量變多。 The shape of the reflecting member 96 is not limited, and for example, a conical shape or a pyramidal shape may be mentioned (the bottom surface faces upward). There may be gaps between the plurality of reflection members 96. However, as shown in FIGS. 1 to 4, when the plurality of reflection members 96 are formed without a gap, the number of reflection members 96 that can be formed per predetermined area increases.

在本實施形態中,傾斜面98形成為腔室14內面的一部分。亦即,在腔室14內反射構件96和腔室14一體化。 In this embodiment, the inclined surface 98 is formed as a part of the inner surface of the chamber 14. That is, the reflection member 96 and the cavity 14 are integrated in the cavity 14.

如圖7所示,凝固點感測器78之測定資料會送至控制裝置38。在控制裝置38控制第1~第4泵48、52、56、88、第1~第3閥62、72、94及氣體噴射噴嘴34。控制裝置38也可是控制第1~第4泵48、52、56、88、第1~第3閥62、72、94及氣體噴射噴嘴34驅動的電腦,也可是進行順序控制的控制裝置。 As shown in FIG. 7, the measurement data of the freezing point sensor 78 is sent to the control device 38. The control device 38 controls the first to fourth pumps 48, 52, 56, 88, the first to third valves 62, 72, and 94, and the gas injection nozzle 34. The control device 38 may be a computer that controls the driving of the first to fourth pumps 48, 52, 56, 88, the first to third valves 62, 72, 94, and the gas injection nozzle 34, or a control device that performs sequence control.

其次,說明本實施形態之作用及洗淨方法。 Next, the function and cleaning method of this embodiment will be described.

為了以洗淨裝置12洗淨金屬遮罩16,如圖2所示,在腔室14內使金屬遮罩16保持於保持構件22。藉此,在預定位置保持的狀態下設置金屬遮罩16,所以可抑制洗淨時金屬遮罩16的位置偏移。 In order to wash the metal mask 16 with the cleaning device 12, as shown in FIG. 2, the metal mask 16 is held on the holding member 22 in the chamber 14. Thereby, since the metal mask 16 is provided in the state hold | maintained at a predetermined position, the position shift of the metal mask 16 at the time of washing can be suppressed.

而且,因應需要,使用泵等使腔室14內減壓。此時使用的泵,例如,可使用腔室14內減壓用所設置的泵。 If necessary, the inside of the chamber 14 is decompressed using a pump or the like. As the pump used at this time, for example, a pump provided for decompression in the chamber 14 can be used.

圖9中,顯示了第2泵52的驅動、停止、第3泵56的驅動、停止、氣體噴射噴嘴34之姿勢變化、及第4泵88的驅動、停止的時序的一例。而且,圖9中所示之各時序(T1~T10)是用以方便說明的一例。例如,在圖9中T1~T10間的各時間間隔雖為一定,然而該等之時間間隔也可不是一定。 FIG. 9 shows an example of the timing of driving and stopping the second pump 52, driving and stopping the third pump 56, changing the posture of the gas injection nozzle 34, and driving and stopping the fourth pump 88. The timings (T1 to T10) shown in FIG. 9 are examples for convenience of explanation. For example, although the time intervals between T1 and T10 in FIG. 9 are constant, the time intervals between them may not be constant.

在將設置於腔室14內的金屬遮罩16洗淨時,驅動第2泵52以將洗淨劑104供給到腔室14內(T1~T2)。藉此,如圖3所示,從洗淨劑噴射噴嘴24朝金屬遮罩16噴射洗淨劑104。此時,第3泵56也驅動,一面使渦流106發生在腔室14內,一面以吸引口30吸引腔室14內。再者,從氣體噴射噴嘴34(位在第1姿勢34A)噴射氣體。藉此,渦流106發生在腔室14內。而且,此時,由於第4泵88停止,所以不從相反側吸引口84吸引洗淨劑104。 When the metal mask 16 provided in the chamber 14 is cleaned, the second pump 52 is driven to supply the detergent 104 into the chamber 14 (T1 to T2). As a result, as shown in FIG. 3, the detergent 104 is sprayed from the detergent spray nozzle 24 toward the metal mask 16. At this time, the third pump 56 is also driven, and while the vortex 106 is generated in the chamber 14, the suction port 30 is sucked into the chamber 14. In addition, the gas is ejected from the gas injection nozzle 34 (located in the first posture 34A). Thereby, the eddy current 106 occurs in the chamber 14. At this time, since the fourth pump 88 is stopped, the detergent 104 is not sucked from the suction port 84 on the opposite side.

而且,洗淨劑104在通過貫通孔18時,與焊糊20衝撞而從金屬遮罩16除去焊糊20。 When the detergent 104 passes through the through hole 18, it collides with the solder paste 20 to remove the solder paste 20 from the metal mask 16.

在本實施形態中,噴射口26和吸引口30對金屬遮罩16是互相位在相反側的位置。因此,相較於沒有吸引口30的構造、或吸引口30相對金屬遮罩16位在與噴射口26同側的構造,從噴射口26噴射的洗淨劑104易於從下部空間14B穿越金屬遮罩16的貫通孔18。因此,除去貫通孔18內之附著物102的能力高。 In the present embodiment, the ejection port 26 and the suction port 30 are positioned opposite to each other on the metal mask 16. Therefore, the cleaning agent 104 sprayed from the spray port 26 is easier to pass through the metal cover from the lower space 14B than the structure without the suction port 30 or the structure in which the suction port 30 is located on the same side as the spray port 26 relative to the metal mask 16. Through hole 18 of the cover 16. Therefore, the ability to remove the adherend 102 in the through-hole 18 is high.

特別是,如圖6所示,雖會有貫通孔18內殘存焊糊20,然而在本實施形態之洗淨裝置12中,除去該焊糊20 的能力高。而且,金屬遮罩16中,即使是貫通孔18以外的地方,也會因洗淨劑104被吸引口30吸引而強烈碰觸。利用洗淨劑104強烈碰觸,即使是貫通孔18以外的地方,在本實施形態之洗淨裝置12中,洗淨能力也高。 In particular, as shown in FIG. 6, although the solder paste 20 remains in the through hole 18, in the cleaning device 12 of this embodiment, the solder paste 20 is removed. High capacity. In addition, even in the metal mask 16 other than the through hole 18, the cleaning agent 104 is strongly touched by being attracted by the suction port 30. The cleaning agent 104 is strongly touched, and even in a place other than the through hole 18, the cleaning device 12 of this embodiment has a high cleaning ability.

在本實施形態中,於吸引口30,利用從氣體噴射噴嘴34噴射氣體,而使在腔室14內發生渦流106。而且,在該狀態下,氣體噴射噴嘴34是位在第1姿勢34A,所以渦流106是向右旋轉。 In this embodiment, a vortex 106 is generated in the chamber 14 by injecting gas from the gas injection nozzle 34 into the suction port 30. In this state, since the gas injection nozzle 34 is in the first posture 34A, the vortex 106 is rotated to the right.

藉由該渦流106,如圖8A中箭頭M1所示,洗淨劑104相對金屬遮罩16的貫通孔18的內面18S傾斜而除去附著物102。又,洗淨劑104如圖8B中箭頭M2所示,在貫通孔18內旋轉,相對貫通孔18的內面18S,是以和箭頭M2相異的方向傾斜而除去附著物102。因此,相較於腔室14內不使渦流106發生的構造,對金屬遮罩16的洗淨效果高。 By this eddy current 106, as shown by an arrow M1 in FIG. 8A, the cleaning agent 104 is inclined with respect to the inner surface 18S of the through-hole 18 of the metal shield 16 to remove the attached matter 102. Further, as shown by an arrow M2 in FIG. 8B, the detergent 104 rotates in the through hole 18 and is inclined with respect to the inner surface 18S of the through hole 18 in a direction different from the arrow M2 to remove the adhered matter 102. Therefore, compared with the structure which does not generate | occur | produce the eddy current 106 in the chamber 14, the cleaning effect on the metal mask 16 is high.

而且,氣體噴射噴嘴34為了使渦流106發生在腔室14內,也可是設在腔室14內。如圖1~圖4所示,將氣體噴射噴嘴34設在吸引口30內部時,不需要用以將多數個氣體噴射噴嘴34設於腔室14內的空間,可謀求腔室14的小型化。 The gas injection nozzle 34 may be provided in the chamber 14 in order to generate the vortex 106 in the chamber 14. As shown in FIGS. 1 to 4, when the gas injection nozzle 34 is provided inside the suction port 30, a space for providing a plurality of gas injection nozzles 34 in the chamber 14 is not required, and the size of the chamber 14 can be reduced. .

相對於此,如圖10所示,也可是使氣體噴射噴嘴34設在腔室14內的構造。在圖10所示的構造中,雖然難以設置多數個氣體噴射噴嘴34,然而可在接近金屬遮罩16的位置使渦流發生。 In contrast, as shown in FIG. 10, a structure in which the gas injection nozzle 34 is provided in the chamber 14 may be adopted. In the structure shown in FIG. 10, although it is difficult to provide a plurality of gas injection nozzles 34, a vortex can be generated at a position close to the metal shield 16.

在腔室14內從下部空間14B通過貫通孔18朝上 部空間14A上升的洗淨劑104碰到傾斜面98而反射。而且,如圖4所示,再次通過貫通孔18。傾斜面98相對貫通孔18的貫通方向傾斜,反射後的洗淨劑104會以和上升時相異的角度下降。亦即,洗淨劑104下降時以和上升時相異的角度通過貫通孔18的可能性高。因此,相較於沒有傾斜面98的構造,對金屬遮罩16的洗淨能力高。 From the lower space 14B in the chamber 14 through the through hole 18 upward The detergent 104 rising in the partial space 14A hits the inclined surface 98 and is reflected. Then, as shown in FIG. 4, the through hole 18 is passed again. The inclined surface 98 is inclined with respect to the penetrating direction of the through-hole 18, and the reflected detergent 104 is lowered at an angle different from that when it is raised. That is, there is a high possibility that the detergent 104 passes through the through-hole 18 at an angle different from that when the detergent 104 is raised. Therefore, compared with the structure without the inclined surface 98, the cleaning ability with respect to the metal mask 16 is high.

而且,在本實施形態中,在鄰接之傾斜面98,傾斜方向是互相相異。因此,相較於全部的傾斜面98的角度為相同的構造,可使洗淨劑104隨機地反射。亦即,洗淨劑104對金屬遮罩16以種種的角度碰觸的可能性高,所以對金屬遮罩16的洗淨能力高。 Furthermore, in this embodiment, the adjacent inclined surfaces 98 have different directions of inclination. Therefore, the angles of all the inclined surfaces 98 are the same, and the detergent 104 can be reflected randomly. That is, since the cleaning agent 104 is highly likely to touch the metal mask 16 at various angles, the cleaning ability of the metal mask 16 is high.

而且,在圖1~圖4所示的例子中,雖是舉出顯現在各個反射構件96兩側的對稱形狀的傾斜面98,然而傾斜面98的角度也可以是隨機的。 Further, in the examples shown in FIGS. 1 to 4, although the inclined surfaces 98 having symmetrical shapes appearing on both sides of each reflection member 96 are listed, the angles of the inclined surfaces 98 may be random.

具有傾斜面98的反射構件96在上述實施形態中是形成於腔室14的內面。具有傾斜面98的反射構件96也可是和腔室14為不同物體,然而如上述般形成於腔室14的內面時,由於傾斜面98和腔室14一體化,所以零件數少。又,也不需要用以將傾斜面(反射構件)安裝在腔室14的構件。 The reflecting member 96 having the inclined surface 98 is formed on the inner surface of the cavity 14 in the above-mentioned embodiment. The reflecting member 96 having the inclined surface 98 may be a different object from the cavity 14. However, when the reflecting member 96 is formed on the inner surface of the cavity 14 as described above, the inclined surface 98 and the cavity 14 are integrated, so the number of parts is small. Moreover, a member for attaching the inclined surface (reflection member) to the chamber 14 is also unnecessary.

如圖9所示,第2泵52及第3泵56在一定時間驅動後停止(T2)。氣體噴射噴嘴34也停止。 As shown in FIG. 9, the second pump 52 and the third pump 56 are stopped after being driven for a certain time (T2). The gas injection nozzle 34 is also stopped.

接著,控制裝置38驅動第4泵88(T2~T3)。藉此,腔室14內的洗淨劑104會被吸引到相反側吸引口84。 亦即,利用傾斜面98造成的反射,或是除了作用在洗淨劑104的重力並以相反側吸引口84進行吸引,而可積極地使洗淨劑104朝下方移動,並通過貫通孔18。 Next, the control device 38 drives the fourth pump 88 (T2 to T3). As a result, the detergent 104 in the chamber 14 is attracted to the suction port 84 on the opposite side. That is, by using the reflection caused by the inclined surface 98, or in addition to the gravity acting on the detergent 104 and attracting it with the suction port 84 on the opposite side, the detergent 104 can be actively moved downward and passed through the through hole 18 .

而且,由於在吸引口30的吸引時序和在相反側吸引口84的吸引時序不同,所以可有效率地使腔室14內之洗淨劑104的上下運動交互地進行。 Furthermore, since the suction timing at the suction port 30 and the suction timing at the opposite side suction port 84 are different, the up and down movements of the detergent 104 in the chamber 14 can be performed interactively.

在一定時間驅動第4泵88後,控制裝置38便使氣體噴射噴嘴34呈第2姿勢34B(T3)。然後,驅動第2泵52及第3泵56(T3~T4)。藉此,在腔室14內洗淨劑104上升,通過金屬遮罩16的貫通孔18。此時,由於氣體噴射噴嘴34是第2姿勢34B,所以在腔室14內發生向左的渦流。亦即,在時間T1~T2和時間T3~T4於腔室14內發生不同朝向的渦流。因此,相較於僅在一個方向發生渦流的構造,由於在貫通孔18內以相異的角度使洗淨劑104通過,所以對金屬遮罩16的洗淨效果高。 After the fourth pump 88 is driven for a certain period of time, the control device 38 sets the gas injection nozzle 34 in the second posture 34B (T3). Then, the second pump 52 and the third pump 56 are driven (T3 to T4). As a result, the cleaning agent 104 rises in the chamber 14 and passes through the through hole 18 of the metal mask 16. At this time, since the gas injection nozzle 34 is in the second posture 34B, a leftward vortex occurs in the chamber 14. That is, eddy currents of different orientations occur in the chamber 14 at times T1 to T2 and times T3 to T4. Therefore, compared with a structure in which eddy currents are generated in only one direction, the cleaning agent 104 is passed through the through-holes 18 at different angles, and thus the cleaning effect on the metal mask 16 is high.

之後,控制裝置38會交互進行藉第2泵52的驅動來吸引來自腔室14內之洗淨劑104(來自上方的吸引)、及藉第3泵56的驅動來吸引來自腔室14內之洗淨劑104(來自下方的吸引)(T5~T9)。在圖9所示的例子中,在時間T1~T9是反覆進行4次第2泵52的驅動和第3泵56的驅動。藉此,可在腔室14內,使洗淨劑104之朝上方移動和朝下方移動交互發生,並使洗淨劑104通過貫通孔18複數次。 After that, the control device 38 will alternately drive the detergent 104 (suction from above) in the chamber 14 by the driving of the second pump 52 and the third pump 56 to attract the cleaning agent 104 in the chamber 14. Detergent 104 (suction from below) (T5 to T9). In the example shown in FIG. 9, the driving of the second pump 52 and the driving of the third pump 56 are repeated four times at times T1 to T9. Thereby, the upward movement and the downward movement of the cleaning agent 104 can occur alternately in the chamber 14, and the cleaning agent 104 can pass through the through-hole 18 multiple times.

又,控制裝置38於每次驅動第2泵52,便使氣體噴射噴嘴34的姿勢交互地切換成第1姿勢34A(T1~T2、T5 ~T6)和第2姿勢34B(T3~T4、T7~T8)。藉此,在腔室14內,交互地產生向右的渦流和向左的渦流,洗淨劑104以各種角度碰觸金屬遮罩16。 In addition, each time the control device 38 drives the second pump 52, the posture of the gas injection nozzle 34 is alternately switched to the first posture 34A (T1 to T2, T5). ~ T6) and the second posture 34B (T3 ~ T4, T7 ~ T8). Thereby, a rightward vortex and a leftward vortex are alternately generated in the chamber 14, and the detergent 104 touches the metal shield 16 at various angles.

控制裝置38在進行了驅動第2泵52和反覆驅動第3泵56預定次數後,便一起驅動第2泵52及第3泵56(T9~T10)。藉由驅動第2泵52,新的洗淨劑104從噴射口26噴射到腔室14內。特別是,從相反側噴射口84吸引洗淨劑104進行複數次後,腔室14內的洗淨劑雖會減少,但是藉由第2泵52的驅動將洗淨劑104供給到腔室14內,而可維持對金屬遮罩16的洗淨能力。而且,腔室14內的洗淨劑104藉由第2泵52的驅動而通過吸引口30朝上方吸引。 After the control device 38 has driven the second pump 52 and the third pump 56 repeatedly for a predetermined number of times, the control device 38 drives the second pump 52 and the third pump 56 together (T9 to T10). When the second pump 52 is driven, a new detergent 104 is injected into the chamber 14 from the injection port 26. In particular, after the detergent 104 is sucked from the injection port 84 on the opposite side for a plurality of times, the detergent in the chamber 14 is reduced, but the detergent 104 is supplied to the chamber 14 by the drive of the second pump 52 Inside, the cleaning ability of the metal mask 16 can be maintained. Then, the detergent 104 in the chamber 14 is sucked upward by the suction port 30 by being driven by the second pump 52.

使如上述,在腔室14內進行洗淨金屬遮罩16的動作時,腔室14內的洗淨劑104的一部分會進入到吸引口30或是相反側吸引口84內。 As described above, when the cleaning operation of the metal mask 16 is performed in the chamber 14, a part of the detergent 104 in the chamber 14 enters the suction port 30 or the suction port 84 on the opposite side.

如此,在本實施形態中,由於可從相反側吸引口84及吸引口30雙方回收腔室14內的洗淨劑104,所以可抑制附著了焊糊20的洗淨劑104滯留在腔室14內。 As described above, in this embodiment, since the cleaning agent 104 in the chamber 14 can be recovered from both the suction port 84 and the suction port 30 on the opposite sides, it is possible to prevent the cleaning agent 104 to which the solder paste 20 adheres from staying in the chamber 14. Inside.

回收來自腔室14內的洗淨劑104也可以是僅從相反側吸引口84和吸引口30的其中之一進行。特別是,附著了很多焊糊的洗淨劑104比重大,所以相較於吸引口30較易於進入相反側吸引口84。換言之,由於相反側吸引口84是比吸引口30位在下方,所以附著了很多焊糊且不適合再利用的洗淨劑104相較位在金屬遮罩16上方的吸引口30是易於進入到相反側吸引口84。 Recovery of the detergent 104 from the inside of the chamber 14 may be performed from only one of the suction port 84 and the suction port 30 on the opposite side. In particular, since the cleaning agent 104 to which a large amount of solder paste is attached has a large specific gravity, it is easier to enter the suction port 84 on the opposite side than the suction port 30. In other words, the suction port 84 on the opposite side is lower than the suction port 30, so the cleaning agent 104 with a lot of solder paste and unsuitable for reuse is easier to enter than the suction port 30 located above the metal shield 16. Side suction port 84.

而且,利用將相反側吸引噴嘴82設於相反側吸引口84,而可有效率地回收相反側吸引噴嘴82吸引了的洗淨劑104。 Further, by providing the opposite-side suction nozzle 82 to the opposite-side suction port 84, the detergent 104 sucked by the opposite-side suction nozzle 82 can be efficiently recovered.

如此,進入到相反側吸引口84的洗淨劑104回收到沉澱槽90。 In this way, the detergent 104 that has entered the suction port 84 on the opposite side is recovered to the sedimentation tank 90.

在沉澱槽90,從洗淨劑104沉澱比重比洗淨劑104及助熔劑20A大的焊料粒子20B。而且,控制裝置38在預定的時序,或是於沉澱槽90焊料粒子積存了一定量時,便將第3閥94開閥。藉由第1閥62開閥而可將洗淨劑104之上部澄清成分從相反側吸引口84廢棄。 In the sedimentation tank 90, the solder particles 20B having a larger specific gravity than the detergent 104 and the flux 20A are precipitated from the detergent 104. Then, the control device 38 opens the third valve 94 at a predetermined timing or when a certain amount of solder particles are accumulated in the sedimentation tank 90. When the first valve 62 is opened, the clarified component in the upper portion of the detergent 104 can be discarded from the suction port 84 on the opposite side.

沉澱在沉澱槽90內的焊料粒子20B,例如作業者會定期回收。 The solder particles 20B deposited in the precipitation tank 90 are periodically collected by, for example, an operator.

相對於此,以吸引口30吸引了的洗淨劑104中,藉由過濾器58而可分離焊糊20的一部分。 In contrast, a part of the solder paste 20 can be separated from the cleaning agent 104 sucked by the suction port 30 by the filter 58.

再者,也可利用使吸引口30吸引了的洗淨劑104儲留在儲留槽60,而使洗淨劑104內的焊糊20的一部分沉澱而分離。 Furthermore, a part of the solder paste 20 in the detergent 104 may be deposited and separated by storing the cleaning agent 104 sucked by the suction port 30 in the storage tank 60.

吸引口30吸引了的洗淨劑104多是比重比相反側吸引口84吸引了的洗淨劑104小。吸引口30吸引了的洗淨劑104以儲留槽60回收。 Most of the detergent 104 attracted by the suction port 30 has a smaller specific gravity than the detergent 104 attracted by the suction port 84 on the opposite side. The cleaning agent 104 attracted by the suction port 30 is recovered by the storage tank 60.

而且,除去了焊糊20的一部分的洗淨劑104中,以凝固點感測器78的測定結果判斷出可再利用的洗淨劑104會經過第2配管64B藉由第1配管64A的一部分而回到緩衝槽50。亦即,洗淨劑104可再利用。 In the detergent 104 from which a part of the solder paste 20 has been removed, it is determined from the measurement result of the freezing point sensor 78 that the reusable detergent 104 passes through the second pipe 64B and passes through a part of the first pipe 64A. Return to the buffer tank 50. That is, the detergent 104 can be reused.

相對於此,洗淨劑104以凝固點感測器78之測定結果而判斷出可再利用時,控制裝置38便將第2閥72開閥。儲留槽60內的洗淨劑104通過排出配管70排出。 On the other hand, when the cleaning agent 104 determines that it can be reused based on the measurement result of the freezing point sensor 78, the control device 38 opens the second valve 72. The detergent 104 in the storage tank 60 is discharged through a discharge pipe 70.

本實施形態中,洗淨劑104包含粒狀體(冰粒子)。利用粒狀體碰觸洗淨對象物的附著物,而使從洗淨對象物削落的方式除去附著物。因此,相較於使用不包含粒狀體之洗淨劑的構造,洗淨對象物洗淨的效果高。 In the present embodiment, the detergent 104 includes granular bodies (ice particles). The granular body touches the adherend of the object to be washed, and the adherend is removed from the object to be washed off. Therefore, compared with the structure which used the detergent which does not contain a granular body, the washing | cleaning target object has a high cleaning effect.

而且,由於洗淨劑104包含冰粒子,所以易於將腔室14內維持在低溫。利用將腔室14內維持在低溫,由於焊糊20的黏著性降低,所以變得易於從金屬遮罩16除去。 Moreover, since the detergent 104 contains ice particles, it is easy to maintain the inside of the chamber 14 at a low temperature. By keeping the inside of the chamber 14 at a low temperature, the adhesiveness of the solder paste 20 is reduced, and therefore, it becomes easy to remove the metal mask 16.

又,本實施形態之洗淨裝置12於除去焊糊20(附著物)時使用冰粒子,而不使用揮發性的有機溶劑。相較於揮發性的有機溶劑,冰粒子(水)的處理及再利用容易,可以低成本將洗淨對象物洗淨。藉由將作為洗淨劑104的水再利用,也可減少洗淨劑的廢棄量。 In addition, the cleaning device 12 of this embodiment uses ice particles instead of a volatile organic solvent when removing the solder paste 20 (attachment). Compared with a volatile organic solvent, ice particles (water) are easier to handle and reuse, and the object to be cleaned can be washed at a lower cost. By reusing water as the cleaning agent 104, it is also possible to reduce the amount of waste of the cleaning agent.

而且,藉由不使用有機溶劑作為洗淨劑,對用以將遮罩本體16A和補強構件16B接著的接著劑等的影響也較小。 In addition, by not using an organic solvent as a cleaning agent, the influence on the adhesive or the like for bonding the mask body 16A and the reinforcing member 16B is small.

再者,使用冰粒子作為洗淨劑104時,冰粒子的形狀及粒子尺寸的自由度大。因此,可因應金屬遮罩16的尺寸或貫通孔18的尺寸、焊糊20的物性等,一面使洗淨時間較短,一面提高洗淨效果。 When ice particles are used as the cleaning agent 104, the degree of freedom of the shape and particle size of the ice particles is large. Therefore, according to the size of the metal mask 16, the size of the through-hole 18, and the physical properties of the solder paste 20, the cleaning effect can be improved while shortening the cleaning time.

本實施形態之洗淨對象物並不限定於上述金屬遮罩16。總之,只要是具有貫通孔的構件,便可提高洗淨 劑對貫通孔的通過性,並提高除去附著於洗淨對象物的附著物的能力。 The object to be cleaned in this embodiment is not limited to the metal mask 16 described above. In short, as long as it is a member with a through hole, it is possible to improve the cleaning The permeability of the agent to the through-holes improves the ability to remove the adhered matter attached to the object to be cleaned.

又,本實施形態之洗淨對象物不限於焊糊,可適用於從洗淨對象物除去導電性糊塗料或研磨用糊等的情況。例如,在導電性糊塗料中有和焊糊類似物性者。又,在研磨用糊中有含有硬質的研磨劑(鑽石粉等)者。在將如此之導電性糊塗料或研磨用糊等從洗淨對象物除去時,本實施形態之洗淨對象物從貫通孔除去附著物的能力高。 In addition, the object to be cleaned in this embodiment is not limited to a solder paste, and can be applied to a case where a conductive paste paint or a polishing paste is removed from the object to be cleaned. For example, conductive paste coatings have properties similar to solder paste. In addition, there are those containing a hard abrasive (such as diamond powder) in the polishing paste. When such a conductive paste paint, a polishing paste, or the like is removed from the object to be cleaned, the object to be cleaned in the present embodiment has a high ability to remove the adhered matter from the through hole.

以上,就有關本案所揭示的技術的實施形態進行說明,然而本案揭示的技術並不限定於上述者,當然在上述以外於不逸脫該主旨的範圍內也可進行種種變形來實施。 In the foregoing, the embodiments of the technology disclosed in this case have been described. However, the technology disclosed in this case is not limited to the above, and of course, various modifications can be implemented within the scope that does not escape the gist of the invention.

依據本案揭示的技術,對形成有貫通孔之洗淨對象物的附著物除去能力高。 According to the technology disclosed in this case, the removal ability of the adherend to the object to be cleaned having the through-holes formed is high.

記載於本說明書之全部的文獻、專利申請案及技術規格,藉由參照而取入各個文獻、專利申請案及技術規格的情況是和具體的或是各個記載的情況同程度地,藉由參照而取入於本說明書中。 All documents, patent applications, and technical specifications described in this specification are incorporated by reference, and each document, patent application, and technical specification is taken to the same extent as the specific or individual recorded case by reference Taken into this manual.

12‧‧‧洗淨裝置 12‧‧‧washing device

14‧‧‧腔室 14‧‧‧ chamber

14D‧‧‧上壁 14D‧‧‧Upper Wall

14E‧‧‧下壁 14E‧‧‧ lower wall

16‧‧‧金屬遮罩 16‧‧‧ metal mask

16A‧‧‧遮罩本體 16A‧‧‧Mask body

16B‧‧‧補強構件 16B‧‧‧ Reinforcing member

18‧‧‧貫通孔 18‧‧‧through hole

24‧‧‧洗淨劑噴嘴 24‧‧‧ Detergent nozzle

26‧‧‧噴射口 26‧‧‧jet port

28‧‧‧吸引噴嘴 28‧‧‧ suction nozzle

30‧‧‧吸引口 30‧‧‧ Attraction

34‧‧‧氣體噴射噴嘴 34‧‧‧Gas jet nozzle

38‧‧‧控制裝置 38‧‧‧control device

40‧‧‧洗淨劑供給裝置 40‧‧‧ detergent supply device

42‧‧‧氣體供給裝置 42‧‧‧Gas supply device

44‧‧‧返回構件 44‧‧‧Return to component

46‧‧‧供給口 46‧‧‧ supply port

48‧‧‧第1泵 48‧‧‧The first pump

50‧‧‧緩衝槽 50‧‧‧ buffer tank

52‧‧‧第2泵 52‧‧‧Pump 2

54‧‧‧粒狀體生成裝置 54‧‧‧ Granular body generating device

56‧‧‧第3泵 56‧‧‧3rd pump

58‧‧‧過濾器 58‧‧‧Filter

60‧‧‧儲留槽 60‧‧‧Storage tank

62‧‧‧第1閥 62‧‧‧The first valve

64A‧‧‧第1配管 64A‧‧‧The first piping

64A1‧‧‧第1配管(分歧部分) 64A1‧‧‧The first piping (divergent part)

64B‧‧‧第2配管 64B‧‧‧ 2nd piping

66‧‧‧回收裝置 66‧‧‧ Recovery device

68‧‧‧回收裝置 68‧‧‧ Recovery device

70‧‧‧排出配管 70‧‧‧ discharge pipe

72‧‧‧第2閥 72‧‧‧ 2nd valve

74‧‧‧噴霧器 74‧‧‧ sprayer

76‧‧‧冷卻機 76‧‧‧Cooler

78‧‧‧凝固點感測器 78‧‧‧ Freezing point sensor

82‧‧‧相反側吸引噴嘴 82‧‧‧ opposite side suction nozzle

84‧‧‧相反側吸引口 84‧‧‧ opposite side suction mouth

86‧‧‧排出配管 86‧‧‧Exhaust piping

88‧‧‧第4泵 88‧‧‧4th pump

90‧‧‧沉澱槽 90‧‧‧ settling tank

92‧‧‧過濾器 92‧‧‧ Filter

94‧‧‧第3閥 94‧‧‧3rd valve

96‧‧‧反射構件 96‧‧‧Reflecting member

P‧‧‧箭頭 P‧‧‧ Arrow

Claims (16)

一種洗淨裝置,包含有:噴射口構件,從相對於具有貫通孔的洗淨對象物設於下側的噴射口噴射洗淨劑;吸引口構件,利用相對於前述洗淨對象物是在上側而設於和前述噴射口為相反側的吸引口吸引前述洗淨劑;及相反側吸引口構件,利用相對於前述洗淨對象物是在下側而設在和前述吸引口為相反側的相反側吸引口吸引前述洗淨劑。 A cleaning device includes a spray port member that sprays a cleaning agent from a spray port that is provided on a lower side with respect to a cleaning object having a through hole, and a suction port member that uses the spray port member to be on the upper side with respect to the cleaning object. The suction port provided on the side opposite to the spray port sucks the detergent; and the suction port member on the opposite side is provided on the opposite side to the suction port on the lower side with respect to the object to be cleaned. The suction port sucks the aforementioned detergent. 如請求項1之洗淨裝置,其中具有使前述洗淨劑含有粒狀體的粒狀體生成裝置。 The cleaning device according to claim 1, further comprising a granular body generating device for allowing the aforementioned detergent to contain granular bodies. 如請求項1或2之洗淨裝置,包含有可設置前述洗淨對象物的設置部且安裝有前述噴射口構件及前述吸引口構件的腔室。 The cleaning device according to claim 1 or 2 includes a chamber in which the cleaning object can be installed, and the injection port member and the suction port member are installed. 如請求項3之洗淨裝置,包含有使前述洗淨劑之移動方向相對前述貫通孔之貫通方向傾斜的傾斜構件。 The cleaning device according to claim 3 includes an inclined member that inclines the moving direction of the cleaning agent with respect to the penetrating direction of the through hole. 如請求項4之洗淨裝置,其中前述傾斜構件具有對前述洗淨劑噴射氣體而使渦流發生的氣體噴射構件。 The cleaning device according to claim 4, wherein the inclined member includes a gas injection member that injects a gas to the detergent to generate a vortex. 如請求項5之洗淨裝置,其中前述氣體噴射構件設於前述吸引口的內部。 The cleaning device according to claim 5, wherein the gas injection member is provided inside the suction port. 如請求項4之洗淨裝置,其中前述傾斜構件設於前述腔室內。 The cleaning device according to claim 4, wherein the inclined member is provided in the cavity. 如請求項4之洗淨裝置,其中傾斜構件具有對前述貫通孔之貫通方向傾斜的傾斜面。 The cleaning device according to claim 4, wherein the inclined member has an inclined surface that is inclined with respect to a penetration direction of the through-hole. 如請求項8之洗淨裝置,其中前述腔室的內面的一部分作為前述傾斜面。 The cleaning device according to claim 8, wherein a part of the inner surface of the chamber is used as the inclined surface. 如請求項8之洗淨裝置,其中前述傾斜面形成複數個,在鄰接的傾斜面傾斜方向相異。 According to the cleaning device of claim 8, wherein the aforementioned inclined surfaces are formed in plural, the inclined directions of the adjacent inclined surfaces are different. 如請求項1之洗淨裝置,其中在前述吸引口和前述相反側吸引口,吸引時序相異。 The cleaning device according to claim 1, wherein the suction timing is different between the suction port and the suction port on the opposite side. 如請求項1之洗淨裝置,包含有將從前述吸引口和前述相反側吸引口的至少一者吸引的前述洗淨劑回收的回收裝置。 The cleaning device according to claim 1, further comprising a recovery device for recovering the cleaning agent sucked from at least one of the suction port and the suction port on the opposite side. 如請求項1之洗淨裝置,其中前述回收裝置回收前述相反側吸引構件吸引了的前述洗淨劑。 The cleaning device according to claim 1, wherein the recovery device recovers the cleaning agent sucked by the suction member on the opposite side. 如請求項12或請求項13之洗淨裝置,包含有從前述回收裝置所回收的前述洗淨劑分離從前述洗淨對象物除去的附著物的至少一部分的分離構件。 The cleaning device according to claim 12 or claim 13 includes a separating member that separates at least a part of the attached matter removed from the object to be cleaned from the cleaning agent recovered by the recovery device. 如請求項14之洗淨裝置,包含有將在前述分離構件分離了前述附著物之至少一部分的前述洗淨劑返回到前述噴射口的返回構件。 The cleaning device according to claim 14, further comprising a returning means for returning the cleaning agent separated from the attachment member to at least a part of the attachment to the ejection port. 一種洗淨方法,從相對於具有貫通孔的洗淨對象物設於下側的噴射口噴射洗淨劑,利用相對於前述洗淨對象物是在上側而設於和前述噴射口為相反側的吸引口吸引前述洗淨劑,並利用相對於前述洗淨對象物是在下側而設在和前述吸引口為相反側的相反側吸引口吸引前述 洗淨劑。 A cleaning method in which a cleaning agent is sprayed from an injection port provided on a lower side with respect to a cleaning object having a through hole, and the cleaning agent is provided on an opposite side to the spray port from an upper side with respect to the cleaning object. The suction port sucks the cleaning agent, and sucks the cleaning agent by using a suction port provided on a side opposite to the suction port and opposite to the cleaning object. Detergent.
TW103137183A 2013-11-29 2014-10-28 Washing device and washing method TWI612864B (en)

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