TWI612080B - 封裝材料用透明樹脂以及包含該樹脂之封裝材料與電子元件 - Google Patents

封裝材料用透明樹脂以及包含該樹脂之封裝材料與電子元件 Download PDF

Info

Publication number
TWI612080B
TWI612080B TW100149817A TW100149817A TWI612080B TW I612080 B TWI612080 B TW I612080B TW 100149817 A TW100149817 A TW 100149817A TW 100149817 A TW100149817 A TW 100149817A TW I612080 B TWI612080 B TW I612080B
Authority
TW
Taiwan
Prior art keywords
unsubstituted
substituted
polyoxyalkylene
transparent resin
group
Prior art date
Application number
TW100149817A
Other languages
English (en)
Chinese (zh)
Other versions
TW201231507A (en
Inventor
車承桓
高尚蘭
金龍國
金佑翰
金哈娜
安治垣
Original Assignee
第一毛織股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 第一毛織股份有限公司 filed Critical 第一毛織股份有限公司
Publication of TW201231507A publication Critical patent/TW201231507A/zh
Application granted granted Critical
Publication of TWI612080B publication Critical patent/TWI612080B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW100149817A 2010-12-31 2011-12-30 封裝材料用透明樹脂以及包含該樹脂之封裝材料與電子元件 TWI612080B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20100140560 2010-12-31
??10-2010-0140560 2010-12-31
KR1020110142972A KR101466273B1 (ko) 2010-12-31 2011-12-27 봉지재용 투광성 수지, 상기 투광성 수지를 포함하는 봉지재 및 전자 소자
??11-2011-0142972 2011-12-27

Publications (2)

Publication Number Publication Date
TW201231507A TW201231507A (en) 2012-08-01
TWI612080B true TWI612080B (zh) 2018-01-21

Family

ID=46711916

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100149817A TWI612080B (zh) 2010-12-31 2011-12-30 封裝材料用透明樹脂以及包含該樹脂之封裝材料與電子元件

Country Status (2)

Country Link
KR (1) KR101466273B1 (ko)
TW (1) TWI612080B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104981517B (zh) 2012-12-07 2017-09-15 第一毛织株式会社 用于光学仪器的可固化的聚硅氧烷组合物、封装材料及光学器件
KR101466149B1 (ko) * 2012-12-26 2014-11-27 제일모직주식회사 광학기기용 경화형 폴리실록산 조성물, 봉지재 및 광학기기
KR101497139B1 (ko) * 2012-12-26 2015-02-27 제일모직 주식회사 봉지재 조성물, 봉지재 및 전자 소자
WO2014104719A1 (ko) 2012-12-26 2014-07-03 제일모직 주식회사 광학기기용 경화형 폴리실록산 조성물, 봉지재 및 광학기기
KR101556274B1 (ko) 2012-12-28 2015-09-30 제일모직 주식회사 봉지재 조성물, 봉지재 및 전자 소자
KR101739824B1 (ko) * 2014-06-30 2017-05-25 제일모직 주식회사 경화형 폴리오르가노실록산 조성물, 봉지재, 및 광학기기
WO2016006773A1 (ko) * 2014-07-10 2016-01-14 삼성에스디아이 주식회사 경화형 폴리오르가노실록산 조성물, 봉지재, 및 광학기기
KR101641430B1 (ko) * 2014-10-31 2016-07-20 희성금속 주식회사 실록산 중합체 및 이를 포함하는 수지 조성물

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060047097A1 (en) * 2004-08-25 2006-03-02 Shin-Etsu Chemical Co., Ltd. One part organopolysiloxane gel composition
CN101389695A (zh) * 2006-02-24 2009-03-18 陶氏康宁公司 用硅氧烷包封的发光器件和用于制备该硅氧烷的可固化的硅氧烷组合物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2401846C2 (ru) * 2006-04-25 2010-10-20 Учреждение Российской академии наук Институт синтетических полимерных материалов им. Н.С. Ениколопова РАН (ИСПМ РАН) Функциональные полиорганосилоксаны и композиция, способная к отверждению на их основе

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060047097A1 (en) * 2004-08-25 2006-03-02 Shin-Etsu Chemical Co., Ltd. One part organopolysiloxane gel composition
CN101389695A (zh) * 2006-02-24 2009-03-18 陶氏康宁公司 用硅氧烷包封的发光器件和用于制备该硅氧烷的可固化的硅氧烷组合物

Also Published As

Publication number Publication date
TW201231507A (en) 2012-08-01
KR101466273B1 (ko) 2014-11-28
KR20120078614A (ko) 2012-07-10

Similar Documents

Publication Publication Date Title
TWI612080B (zh) 封裝材料用透明樹脂以及包含該樹脂之封裝材料與電子元件
KR101560062B1 (ko) 발광 다이오드
US9147626B2 (en) Resin for transparent encapsulation material, and associated encapsulation material and electronic device
US8877877B2 (en) Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material
US9006374B2 (en) Curable composition
KR20090055500A (ko) 폴리알루미노실록산을 함유하는 광반도체-소자 밀봉용 수지및 이를 이용하여 얻어지는 광반도체 디바이스
TWI644986B (zh) 硬化性樹脂組成物
TWI558769B (zh) 固化產物
KR101566529B1 (ko) 광학기기용 경화형 폴리실록산 조성물, 봉지재 및 광학기기
EP2784129A1 (en) Curable composition
US9172011B2 (en) Composition for encapsulant, encapsulant, and electronic device
KR101486566B1 (ko) 봉지재 조성물, 봉지재 및 전자 소자
KR101497139B1 (ko) 봉지재 조성물, 봉지재 및 전자 소자
TWI510554B (zh) 可固化組成物
TW201527503A (zh) 密封劑組成物及密封劑和電子元件
TWI488919B (zh) 樹脂組合物及使用該樹脂組合物所形成的透明包封材料，以及包含該包封材料的電子裝置
KR101486569B1 (ko) 봉지재 조성물, 봉지재 및 전자 소자
KR20120078300A (ko) 봉지재 및 상기 봉지재를 포함하는 전자 소자
KR20160016417A (ko) 화합물, 투광성 수지 조성물 및 봉지재