TWI609950B - 硏磨用組成物 - Google Patents

硏磨用組成物 Download PDF

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Publication number
TWI609950B
TWI609950B TW103107046A TW103107046A TWI609950B TW I609950 B TWI609950 B TW I609950B TW 103107046 A TW103107046 A TW 103107046A TW 103107046 A TW103107046 A TW 103107046A TW I609950 B TWI609950 B TW I609950B
Authority
TW
Taiwan
Prior art keywords
acid
polishing
metal
polishing composition
indole
Prior art date
Application number
TW103107046A
Other languages
English (en)
Chinese (zh)
Other versions
TW201437350A (zh
Inventor
井澤由裕
佐藤剛樹
Original Assignee
福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 福吉米股份有限公司 filed Critical 福吉米股份有限公司
Publication of TW201437350A publication Critical patent/TW201437350A/zh
Application granted granted Critical
Publication of TWI609950B publication Critical patent/TWI609950B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1436Composite particles, e.g. coated particles
    • C09K3/1445Composite particles, e.g. coated particles the coating consisting exclusively of metals
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/32115Planarisation
    • H01L21/3212Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW103107046A 2013-03-26 2014-03-03 硏磨用組成物 TWI609950B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013063821 2013-03-26

Publications (2)

Publication Number Publication Date
TW201437350A TW201437350A (zh) 2014-10-01
TWI609950B true TWI609950B (zh) 2018-01-01

Family

ID=51623382

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103107046A TWI609950B (zh) 2013-03-26 2014-03-03 硏磨用組成物

Country Status (3)

Country Link
JP (1) JP6103659B2 (ja)
TW (1) TWI609950B (ja)
WO (1) WO2014156381A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1031574A (zh) * 1987-06-19 1989-03-08 北京航空学院 铝及铝合金碱性化学抛光溶液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3982925B2 (ja) * 1998-10-12 2007-09-26 花王株式会社 研磨液組成物
JP2001127017A (ja) * 1999-10-27 2001-05-11 Hitachi Chem Co Ltd 金属研磨方法
JP2004189894A (ja) * 2002-12-11 2004-07-08 Asahi Kasei Chemicals Corp 金属用研磨組成物
US8541310B2 (en) * 2007-05-04 2013-09-24 Cabot Microelectronics Corporation CMP compositions containing a soluble peroxometalate complex and methods of use thereof
JP5658443B2 (ja) * 2009-05-15 2015-01-28 山口精研工業株式会社 炭化ケイ素基板用研磨剤組成物
JP5035387B2 (ja) * 2010-05-10 2012-09-26 住友電気工業株式会社 研磨剤、化合物半導体の製造方法および半導体デバイスの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1031574A (zh) * 1987-06-19 1989-03-08 北京航空学院 铝及铝合金碱性化学抛光溶液

Also Published As

Publication number Publication date
JP6103659B2 (ja) 2017-03-29
WO2014156381A1 (ja) 2014-10-02
JPWO2014156381A1 (ja) 2017-02-16
TW201437350A (zh) 2014-10-01

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