TWI607518B - Resin molding apparatus, resin molding method, and fluid material spraying apparatus - Google Patents
Resin molding apparatus, resin molding method, and fluid material spraying apparatus Download PDFInfo
- Publication number
- TWI607518B TWI607518B TW106110037A TW106110037A TWI607518B TW I607518 B TWI607518 B TW I607518B TW 106110037 A TW106110037 A TW 106110037A TW 106110037 A TW106110037 A TW 106110037A TW I607518 B TWI607518 B TW I607518B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- rotating
- flow path
- rotating bodies
- resin molding
- Prior art date
Links
- 239000011347 resin Substances 0.000 title claims description 394
- 229920005989 resin Polymers 0.000 title claims description 394
- 238000000465 moulding Methods 0.000 title claims description 107
- 239000012530 fluid Substances 0.000 title claims description 34
- 239000000463 material Substances 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 14
- 238000005507 spraying Methods 0.000 title claims description 12
- 230000007246 mechanism Effects 0.000 claims description 83
- 238000002347 injection Methods 0.000 claims description 69
- 239000007924 injection Substances 0.000 claims description 69
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 description 150
- 239000000758 substrate Substances 0.000 description 61
- 235000012431 wafers Nutrition 0.000 description 21
- 239000004065 semiconductor Substances 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 9
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 239000012778 molding material Substances 0.000 description 7
- 238000000748 compression moulding Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 230000005484 gravity Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/0011—Combinations of extrusion moulding with other shaping operations combined with compression moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/30—Extrusion nozzles or dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/30—Extrusion nozzles or dies
- B29C48/345—Extrusion nozzles comprising two or more adjacently arranged ports, for simultaneously extruding multiple strands, e.g. for pelletising
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
- B29C48/395—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
- B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016066051A JP6541600B2 (ja) | 2016-03-29 | 2016-03-29 | 樹脂成形装置及び樹脂成形方法並びに流動性材料の吐出装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201735221A TW201735221A (zh) | 2017-10-01 |
| TWI607518B true TWI607518B (zh) | 2017-12-01 |
Family
ID=59983467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106110037A TWI607518B (zh) | 2016-03-29 | 2017-03-24 | Resin molding apparatus, resin molding method, and fluid material spraying apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6541600B2 (ko) |
| KR (1) | KR101930618B1 (ko) |
| CN (1) | CN107234769B (ko) |
| TW (1) | TWI607518B (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI787411B (zh) * | 2018-02-16 | 2022-12-21 | 日商山田尖端科技股份有限公司 | 樹脂模製裝置 |
| TW202413048A (zh) | 2022-06-07 | 2024-04-01 | 義大利商沙克米機械合作伊莫拉公司 | 用於從塑膠材料以連續循環來生產物體之設備及方法 |
| TW202413049A (zh) * | 2022-06-07 | 2024-04-01 | 義大利商沙克米機械合作伊莫拉公司 | 用於從塑膠材料以連續循環來生產物體之設備及方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5863333A (en) * | 1995-02-16 | 1999-01-26 | Toyoda Gosei Co., Ltd. | Surface modifying apparatus for resin moldings |
| CN102958660B (zh) * | 2010-07-16 | 2015-06-10 | 株式会社平和化学工业所 | 中空成型品的制造方法和装置 |
| JP2015123738A (ja) * | 2013-12-27 | 2015-07-06 | Ｔｏｗａ株式会社 | 樹脂成形装置及び樹脂成形方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4121740A (en) * | 1977-08-19 | 1978-10-24 | Chicago Rawhide Manufacturing Company | Injector head for injection molding machine |
| SU1316843A2 (ru) * | 1986-01-03 | 1987-06-15 | Украинский Научно-Исследовательский И Конструкторский Институт По Разработке Машин Для Переработки Пластмасс,Резины И Искусственной Кожи | Многоручьева экструзионна головка дл переработки пластмасс |
| SU1353628A1 (ru) * | 1986-01-20 | 1987-11-23 | Предприятие П/Я А-7408 | Многосопловой мундштук дл литьевых машин |
| JPH06114867A (ja) * | 1992-10-07 | 1994-04-26 | Matsushita Electric Works Ltd | 成形装置 |
| JP2000127227A (ja) | 1998-10-29 | 2000-05-09 | Teijin Ltd | フィルムの押出装置及び製造方法 |
| JP2010111050A (ja) | 2008-11-07 | 2010-05-20 | Mitsubishi Electric Corp | 樹脂成型用金型 |
| JP6021262B2 (ja) * | 2013-01-17 | 2016-11-09 | 株式会社名機製作所 | 繊維複合成形品の圧縮成形方法および繊維複合成形品の圧縮成形装置 |
| JP6218666B2 (ja) * | 2014-04-25 | 2017-10-25 | Ｔｏｗａ株式会社 | 樹脂成形装置及び樹脂成形方法 |
| CN204955330U (zh) * | 2015-09-09 | 2016-01-13 | 王开发 | 一种注塑机 |
-
2016
- 2016-03-29 JP JP2016066051A patent/JP6541600B2/ja active Active
-
2017
- 2017-01-23 KR KR1020170010283A patent/KR101930618B1/ko active IP Right Grant
- 2017-03-07 CN CN201710130581.4A patent/CN107234769B/zh active Active
- 2017-03-24 TW TW106110037A patent/TWI607518B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5863333A (en) * | 1995-02-16 | 1999-01-26 | Toyoda Gosei Co., Ltd. | Surface modifying apparatus for resin moldings |
| CN102958660B (zh) * | 2010-07-16 | 2015-06-10 | 株式会社平和化学工业所 | 中空成型品的制造方法和装置 |
| JP2015123738A (ja) * | 2013-12-27 | 2015-07-06 | Ｔｏｗａ株式会社 | 樹脂成形装置及び樹脂成形方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101930618B1 (ko) | 2018-12-18 |
| KR20170113021A (ko) | 2017-10-12 |
| JP2017177455A (ja) | 2017-10-05 |
| JP6541600B2 (ja) | 2019-07-10 |
| CN107234769B (zh) | 2019-08-16 |
| TW201735221A (zh) | 2017-10-01 |
| CN107234769A (zh) | 2017-10-10 |
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