TWI607094B - 用於無線通訊塔的經微球塡充之金屬組件 - Google Patents
用於無線通訊塔的經微球塡充之金屬組件 Download PDFInfo
- Publication number
- TWI607094B TWI607094B TW102135133A TW102135133A TWI607094B TW I607094 B TWI607094 B TW I607094B TW 102135133 A TW102135133 A TW 102135133A TW 102135133 A TW102135133 A TW 102135133A TW I607094 B TWI607094 B TW I607094B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- microspheres
- microsphere
- filled
- filled metal
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/08—Alloys with open or closed pores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1103—Making porous workpieces or articles with particular physical characteristics
- B22F3/1112—Making porous workpieces or articles with particular physical characteristics comprising hollow spheres or hollow fibres
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C23/00—Alloys based on magnesium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1103—Making porous workpieces or articles with particular physical characteristics
- B22F2003/1106—Product comprising closed porosity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1103—Making porous workpieces or articles with particular physical characteristics
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/08—Access point devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Casings For Electric Apparatus (AREA)
- Powder Metallurgy (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261707085P | 2012-09-28 | 2012-09-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201413002A TW201413002A (zh) | 2014-04-01 |
TWI607094B true TWI607094B (zh) | 2017-12-01 |
Family
ID=49230874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102135133A TWI607094B (zh) | 2012-09-28 | 2013-09-27 | 用於無線通訊塔的經微球塡充之金屬組件 |
Country Status (10)
Country | Link |
---|---|
US (1) | US20150225815A1 (ja) |
EP (1) | EP2900838A1 (ja) |
JP (1) | JP2016518694A (ja) |
KR (1) | KR20150060728A (ja) |
CN (1) | CN104662184B (ja) |
BR (1) | BR112015006630A2 (ja) |
CA (1) | CA2881164A1 (ja) |
MX (1) | MX2015004107A (ja) |
TW (1) | TWI607094B (ja) |
WO (1) | WO2014052020A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2894268C (en) * | 2012-12-20 | 2021-01-05 | Dow Global Technologies Llc | Polymer composite components for wireless-communication towers |
CA3037556A1 (en) * | 2016-11-30 | 2018-06-07 | Continental Structural Plastics, Inc. | Two piece bonded vehicle components formed by sheet molding compound-resin transfer molding assemblies |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102612459A (zh) * | 2009-09-15 | 2012-07-25 | 泽菲罗斯公司 | 腔填充的改进或相关 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5910980B2 (ja) * | 1975-03-31 | 1984-03-13 | 工業技術院長 | 多孔質アルミニウム合金複合材の製造方法 |
JPS62170440A (ja) * | 1986-01-22 | 1987-07-27 | Inahata Kenkyusho:Kk | 複合軽金属材料 |
JPH065751A (ja) * | 1992-03-05 | 1994-01-14 | Texas Instr Inc <Ti> | 金属フォーム放熱器 |
JPH11302765A (ja) * | 1998-04-20 | 1999-11-02 | Shinko Kosen Kogyo Kk | 衝撃吸収性に優れた発泡金属 |
JPH11340640A (ja) * | 1998-05-26 | 1999-12-10 | Furukawa Electric Co Ltd:The | 電子機器筐体 |
KR20010076991A (ko) * | 2000-01-29 | 2001-08-17 | 박호군 | 발포금속 방열기 |
JP2002077969A (ja) * | 2000-09-05 | 2002-03-15 | Hitachi Kokusai Electric Inc | 固定局装置の設置・保守支援装置 |
JP2002100998A (ja) * | 2000-09-22 | 2002-04-05 | Hitachi Kokusai Electric Inc | ケーブルロスに対するアンプゲイン調整方法 |
CN1463039A (zh) * | 2002-05-29 | 2003-12-24 | 富骅企业股份有限公司 | 高热传导的散热片结构及其制造方法 |
JP2004282504A (ja) * | 2003-03-17 | 2004-10-07 | Hitachi Metals Ltd | 携帯用電子機器用筐体及びその製造方法 |
JP4913605B2 (ja) * | 2005-01-20 | 2012-04-11 | 株式会社アライドマテリアル | 半導体装置用部材の製造方法 |
JP4694988B2 (ja) * | 2006-02-22 | 2011-06-08 | 株式会社神戸製鋼所 | アルミニウム合金発泡体およびその製造方法 |
US20070223866A1 (en) * | 2006-03-22 | 2007-09-27 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Controllable electromagnetically responsive assembly of self resonant bodies |
EP2092593B1 (en) * | 2006-11-13 | 2012-11-28 | KMW Inc. | Radio frequency filter |
CN101627503A (zh) * | 2006-11-13 | 2010-01-13 | Kmw株式会社 | 射频滤波器 |
JP2008283108A (ja) * | 2007-05-14 | 2008-11-20 | Naigai Technos:Kk | 複合材料および複合体 |
JP2009029653A (ja) * | 2007-07-26 | 2009-02-12 | Konoshima Chemical Co Ltd | 発泡剤及び発泡金属材料ならびにその製造方法 |
JP5111230B2 (ja) * | 2008-05-14 | 2013-01-09 | 三菱電機株式会社 | 空洞共振器及び高周波フィルタ |
JP5252380B2 (ja) * | 2008-07-14 | 2013-07-31 | Toto株式会社 | 複合構造物及びその作製方法 |
US20120015245A1 (en) * | 2010-07-15 | 2012-01-19 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of electrode of power storage device, electrode of power storage device, and power storage device |
US8969132B2 (en) * | 2010-09-20 | 2015-03-03 | Nuvotronics, Llc | Device package and methods for the fabrication thereof |
US9293800B2 (en) * | 2010-12-10 | 2016-03-22 | Northrop Grumman Systems Corporation | RF transmission line disposed within a conductively plated cavity located in a low mass foam housing |
CN102501357B (zh) * | 2011-12-09 | 2013-12-11 | 长沙理工大学 | 聚合物/泡沫铝复合材料及其生产方法 |
-
2013
- 2013-09-12 EP EP13766201.1A patent/EP2900838A1/en not_active Withdrawn
- 2013-09-12 CA CA2881164A patent/CA2881164A1/en not_active Abandoned
- 2013-09-12 JP JP2015534530A patent/JP2016518694A/ja not_active Withdrawn
- 2013-09-12 BR BR112015006630A patent/BR112015006630A2/pt not_active IP Right Cessation
- 2013-09-12 KR KR1020157007629A patent/KR20150060728A/ko not_active Application Discontinuation
- 2013-09-12 US US14/419,696 patent/US20150225815A1/en not_active Abandoned
- 2013-09-12 WO PCT/US2013/059390 patent/WO2014052020A1/en active Application Filing
- 2013-09-12 CN CN201380050435.0A patent/CN104662184B/zh not_active Expired - Fee Related
- 2013-09-12 MX MX2015004107A patent/MX2015004107A/es unknown
- 2013-09-27 TW TW102135133A patent/TWI607094B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102612459A (zh) * | 2009-09-15 | 2012-07-25 | 泽菲罗斯公司 | 腔填充的改进或相关 |
Also Published As
Publication number | Publication date |
---|---|
EP2900838A1 (en) | 2015-08-05 |
CN104662184B (zh) | 2018-03-02 |
KR20150060728A (ko) | 2015-06-03 |
BR112015006630A2 (pt) | 2017-07-04 |
TW201413002A (zh) | 2014-04-01 |
CA2881164A1 (en) | 2014-04-03 |
WO2014052020A1 (en) | 2014-04-03 |
US20150225815A1 (en) | 2015-08-13 |
MX2015004107A (es) | 2015-07-06 |
CN104662184A (zh) | 2015-05-27 |
JP2016518694A (ja) | 2016-06-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |