TWI606224B - 流體熱交換系統 - Google Patents
流體熱交換系統 Download PDFInfo
- Publication number
- TWI606224B TWI606224B TW101110072A TW101110072A TWI606224B TW I606224 B TWI606224 B TW I606224B TW 101110072 A TW101110072 A TW 101110072A TW 101110072 A TW101110072 A TW 101110072A TW I606224 B TWI606224 B TW I606224B
- Authority
- TW
- Taiwan
- Prior art keywords
- recess
- heat
- inlet
- heat exchange
- defines
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161512379P | 2011-07-27 | 2011-07-27 | |
US13/401,618 US9453691B2 (en) | 2007-08-09 | 2012-02-21 | Fluid heat exchange systems |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201305522A TW201305522A (zh) | 2013-02-01 |
TWI606224B true TWI606224B (zh) | 2017-11-21 |
Family
ID=46705693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101110072A TWI606224B (zh) | 2011-07-27 | 2012-03-23 | 流體熱交換系統 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3179086U (de) |
DE (1) | DE202012002974U1 (de) |
TW (1) | TWI606224B (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11395443B2 (en) | 2020-05-11 | 2022-07-19 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014141162A1 (en) | 2013-03-15 | 2014-09-18 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
JP6124742B2 (ja) | 2013-09-05 | 2017-05-10 | 三菱電機株式会社 | 半導体装置 |
US9445526B2 (en) * | 2014-12-22 | 2016-09-13 | Toyota Motor Engineering & Manufacturing North America, Inc. | Modular jet impingement assemblies with passive and active flow control for electronics cooling |
US11452243B2 (en) | 2017-10-12 | 2022-09-20 | Coolit Systems, Inc. | Cooling system, controllers and methods |
DE102018125375A1 (de) * | 2018-10-14 | 2020-04-16 | Han Xu Hardware Plastic Technological Co., Ltd. | Wassergekühlte hocheffizienz-wärmeableitungsvorrichtung |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
DE102020207966A1 (de) * | 2019-11-25 | 2021-05-27 | Volkswagen Aktiengesellschaft | Kühlanordnung für elektronische Komponenten eines Kraftfahrzeugs |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4561040A (en) * | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
JPH10173114A (ja) * | 1996-12-13 | 1998-06-26 | Hitachi Ltd | マルチチップモジュールの冷却構造 |
JP4141613B2 (ja) * | 2000-03-09 | 2008-08-27 | 富士通株式会社 | 密閉サイクル冷凍装置および密閉サイクル冷凍装置用乾式蒸発器 |
JP2003243581A (ja) * | 2002-02-15 | 2003-08-29 | Fujikura Ltd | ヒートシンク |
JP2007531991A (ja) * | 2004-03-31 | 2007-11-08 | ハイドロクール ピーティーワイ リミテッド | 熱交換器 |
JP2005351600A (ja) * | 2004-06-14 | 2005-12-22 | Nikkei Nekko Kk | アルミ製熱交換器及びそのスケール付着防止方法 |
JP2007180505A (ja) * | 2005-12-02 | 2007-07-12 | Matsushita Electric Ind Co Ltd | 電子部品の冷却装置 |
US7331378B2 (en) * | 2006-01-17 | 2008-02-19 | Delphi Technologies, Inc. | Microchannel heat sink |
KR20080108545A (ko) * | 2006-03-16 | 2008-12-15 | 베헤르 게엠베하 운트 콤파니 카게 | 자동차용 열교환기 |
JP4797954B2 (ja) * | 2006-11-30 | 2011-10-19 | アイコム株式会社 | 放熱フィンの冷却構造 |
US7762314B2 (en) * | 2007-04-24 | 2010-07-27 | International Business Machines Corporation | Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways |
JP2011114206A (ja) * | 2009-11-27 | 2011-06-09 | Ryosan Co Ltd | フィン一体型ヒートシンク |
-
2012
- 2012-03-22 DE DE202012002974U patent/DE202012002974U1/de not_active Expired - Lifetime
- 2012-03-23 TW TW101110072A patent/TWI606224B/zh active
- 2012-04-11 JP JP2012002117U patent/JP3179086U/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11395443B2 (en) | 2020-05-11 | 2022-07-19 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
Also Published As
Publication number | Publication date |
---|---|
JP3179086U (ja) | 2012-10-18 |
DE202012002974U1 (de) | 2012-07-23 |
TW201305522A (zh) | 2013-02-01 |
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