TWI603842B - 邊緣經保護之阻隔組件 - Google Patents

邊緣經保護之阻隔組件 Download PDF

Info

Publication number
TWI603842B
TWI603842B TW101128116A TW101128116A TWI603842B TW I603842 B TWI603842 B TW I603842B TW 101128116 A TW101128116 A TW 101128116A TW 101128116 A TW101128116 A TW 101128116A TW I603842 B TWI603842 B TW I603842B
Authority
TW
Taiwan
Prior art keywords
component
barrier stack
electronic device
layer
barrier
Prior art date
Application number
TW101128116A
Other languages
English (en)
Chinese (zh)
Other versions
TW201318848A (zh
Inventor
馬克 大衛 威葛爾
查林 馬雷 史古柏特
翠斯 喬 伯尼阿德
麥可 丹尼爾 戴摩爾
Original Assignee
3M新設資產公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M新設資產公司 filed Critical 3M新設資產公司
Publication of TW201318848A publication Critical patent/TW201318848A/zh
Application granted granted Critical
Publication of TWI603842B publication Critical patent/TWI603842B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/564Details not otherwise provided for, e.g. protection against moisture
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H10F19/85Protective back sheets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Photovoltaic Devices (AREA)
TW101128116A 2011-08-04 2012-08-03 邊緣經保護之阻隔組件 TWI603842B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161515073P 2011-08-04 2011-08-04
US201261605525P 2012-03-01 2012-03-01

Publications (2)

Publication Number Publication Date
TW201318848A TW201318848A (zh) 2013-05-16
TWI603842B true TWI603842B (zh) 2017-11-01

Family

ID=47629591

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101128116A TWI603842B (zh) 2011-08-04 2012-08-03 邊緣經保護之阻隔組件

Country Status (8)

Country Link
US (1) US20150027533A1 (enExample)
EP (1) EP2740328A4 (enExample)
JP (1) JP6228116B2 (enExample)
KR (1) KR101911582B1 (enExample)
CN (1) CN103733724B (enExample)
SG (1) SG2014007900A (enExample)
TW (1) TWI603842B (enExample)
WO (1) WO2013019463A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6139525B2 (ja) 2011-08-04 2017-05-31 スリーエム イノベイティブ プロパティズ カンパニー 縁部保護バリアアセンブリ
US9804305B2 (en) 2012-01-31 2017-10-31 3M Innovative Properties Company Methods for sealing the edges of multi-layer articles
JP6702720B2 (ja) 2012-05-03 2020-06-03 スリーエム イノベイティブ プロパティズ カンパニー 耐久性ソーラーミラーフィルム
CN104684727B (zh) 2012-08-08 2017-05-17 3M创新有限公司 阻隔膜构造及其制造方法
WO2019201417A1 (en) * 2018-04-16 2019-10-24 CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement Layer assembly for a photovoltaic module
CN111440585B (zh) * 2019-12-24 2022-06-07 宁波激智科技股份有限公司 一种uv固化粘合胶、一种太阳能反光条及太阳能反光条无缝接膜生产工艺

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6340403B1 (en) * 1994-04-20 2002-01-22 The Regents Of The University Of California Solar cell module lamination process
JP3740251B2 (ja) * 1997-06-09 2006-02-01 キヤノン株式会社 太陽電池モジュールの製造方法
US6268695B1 (en) * 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
JP2001076871A (ja) * 1999-06-29 2001-03-23 Nitto Denko Corp 有機エレクトロルミネセンス素子およびその製造方法
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
EA200200879A1 (ru) * 2000-03-09 2003-02-27 Изовольта Ёстеррайхише Изолирштоффверке Акциенгезельшафт Способ получения фотогальванического тонкопленочного элемента
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US20050156176A1 (en) * 2004-01-16 2005-07-21 Rahul Gupta Method for printing organic devices
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
CN101371367B (zh) * 2005-12-22 2010-12-08 壳牌可再生能源有限公司 光伏器件和封装的方法
US20090090412A1 (en) * 2005-12-22 2009-04-09 Hermann Calwer Photovoltaic device and method for encapsulating
FR2904508B1 (fr) * 2006-07-28 2014-08-22 Saint Gobain Dispositif electroluminescent encapsule
US8339700B2 (en) * 2007-10-25 2012-12-25 Techno Polymer Co., Ltd Infrared reflective laminate
WO2009126115A1 (en) * 2008-04-09 2009-10-15 Agency For Science, Technology And Research Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices
US20110223419A1 (en) * 2008-07-11 2011-09-15 Mitsubishi Plastics, Inc. Solar cell backsheet
KR20100071650A (ko) * 2008-12-19 2010-06-29 삼성전자주식회사 가스차단성박막, 이를 포함하는 전자소자 및 이의 제조방법
JP2011003657A (ja) * 2009-06-17 2011-01-06 Fuji Electric Systems Co Ltd 太陽電池モジュール積層体とその製造方法
EP2448032B1 (en) * 2009-06-24 2014-09-17 Mitsubishi Chemical Corporation Organic electronic device and method for producing the same
JP2013502745A (ja) * 2009-08-24 2013-01-24 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 薄膜太陽電池用バリア膜
TW201130944A (en) * 2009-11-18 2011-09-16 3M Innovative Properties Co Flexible assembly and method of making and using the same
JP2011129850A (ja) * 2009-12-17 2011-06-30 Dengiken:Kk 太陽電池用バックシート及びそれを用いた太陽電池モジュール
CN201616442U (zh) * 2010-01-27 2010-10-27 上海海优威电子技术有限公司 一种太阳能电池背板
US9254506B2 (en) * 2010-07-02 2016-02-09 3M Innovative Properties Company Moisture resistant coating for barrier films
DE102010038292A1 (de) * 2010-07-22 2012-01-26 Evonik Röhm Gmbh Witterungsbeständige Rückseitenfolien

Also Published As

Publication number Publication date
KR101911582B1 (ko) 2018-10-24
US20150027533A1 (en) 2015-01-29
JP2014529881A (ja) 2014-11-13
WO2013019463A1 (en) 2013-02-07
SG2014007900A (en) 2014-03-28
CN103733724A (zh) 2014-04-16
TW201318848A (zh) 2013-05-16
EP2740328A1 (en) 2014-06-11
EP2740328A4 (en) 2015-05-06
KR20140051989A (ko) 2014-05-02
JP6228116B2 (ja) 2017-11-08
CN103733724B (zh) 2017-05-17

Similar Documents

Publication Publication Date Title
TWI581445B (zh) 阻隔組件
US10038112B2 (en) Edge protected barrier assemblies
TWI581446B (zh) 製造抗分層組件之方法
TWI583556B (zh) 連續邊緣經保護之阻隔組件
TWI603842B (zh) 邊緣經保護之阻隔組件
TW201315603A (zh) 邊緣保護的阻障總成
TWI583557B (zh) 邊緣經保護之阻障總成

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees