KR101911582B1 - 에지 보호된 배리어 조립체 - Google Patents

에지 보호된 배리어 조립체 Download PDF

Info

Publication number
KR101911582B1
KR101911582B1 KR1020147005193A KR20147005193A KR101911582B1 KR 101911582 B1 KR101911582 B1 KR 101911582B1 KR 1020147005193 A KR1020147005193 A KR 1020147005193A KR 20147005193 A KR20147005193 A KR 20147005193A KR 101911582 B1 KR101911582 B1 KR 101911582B1
Authority
KR
South Korea
Prior art keywords
delete delete
barrier
assembly
layer
barrier stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020147005193A
Other languages
English (en)
Korean (ko)
Other versions
KR20140051989A (ko
Inventor
마크 디 위겔
샬린 엠 슈벨트
트레이시 제이 버니어드
마이클 디 델모어
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20140051989A publication Critical patent/KR20140051989A/ko
Application granted granted Critical
Publication of KR101911582B1 publication Critical patent/KR101911582B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H10F19/85—Protective back sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Photovoltaic Devices (AREA)
KR1020147005193A 2011-08-04 2012-07-24 에지 보호된 배리어 조립체 Expired - Fee Related KR101911582B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161515073P 2011-08-04 2011-08-04
US61/515,073 2011-08-04
US201261605525P 2012-03-01 2012-03-01
US61/605,525 2012-03-01
PCT/US2012/047912 WO2013019463A1 (en) 2011-08-04 2012-07-24 Edge protected barrier assemblies

Publications (2)

Publication Number Publication Date
KR20140051989A KR20140051989A (ko) 2014-05-02
KR101911582B1 true KR101911582B1 (ko) 2018-10-24

Family

ID=47629591

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147005193A Expired - Fee Related KR101911582B1 (ko) 2011-08-04 2012-07-24 에지 보호된 배리어 조립체

Country Status (8)

Country Link
US (1) US20150027533A1 (enExample)
EP (1) EP2740328A4 (enExample)
JP (1) JP6228116B2 (enExample)
KR (1) KR101911582B1 (enExample)
CN (1) CN103733724B (enExample)
SG (1) SG2014007900A (enExample)
TW (1) TWI603842B (enExample)
WO (1) WO2013019463A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6139525B2 (ja) 2011-08-04 2017-05-31 スリーエム イノベイティブ プロパティズ カンパニー 縁部保護バリアアセンブリ
US9804305B2 (en) 2012-01-31 2017-10-31 3M Innovative Properties Company Methods for sealing the edges of multi-layer articles
JP6702720B2 (ja) 2012-05-03 2020-06-03 スリーエム イノベイティブ プロパティズ カンパニー 耐久性ソーラーミラーフィルム
CN104684727B (zh) 2012-08-08 2017-05-17 3M创新有限公司 阻隔膜构造及其制造方法
WO2019201417A1 (en) * 2018-04-16 2019-10-24 CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement Layer assembly for a photovoltaic module
CN111440585B (zh) * 2019-12-24 2022-06-07 宁波激智科技股份有限公司 一种uv固化粘合胶、一种太阳能反光条及太阳能反光条无缝接膜生产工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001076871A (ja) * 1999-06-29 2001-03-23 Nitto Denko Corp 有機エレクトロルミネセンス素子およびその製造方法
WO2010150759A1 (ja) * 2009-06-24 2010-12-29 三菱化学株式会社 有機電子デバイス及びその製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6340403B1 (en) * 1994-04-20 2002-01-22 The Regents Of The University Of California Solar cell module lamination process
JP3740251B2 (ja) * 1997-06-09 2006-02-01 キヤノン株式会社 太陽電池モジュールの製造方法
US6268695B1 (en) * 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
EA200200879A1 (ru) * 2000-03-09 2003-02-27 Изовольта Ёстеррайхише Изолирштоффверке Акциенгезельшафт Способ получения фотогальванического тонкопленочного элемента
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US20050156176A1 (en) * 2004-01-16 2005-07-21 Rahul Gupta Method for printing organic devices
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
CN101371367B (zh) * 2005-12-22 2010-12-08 壳牌可再生能源有限公司 光伏器件和封装的方法
US20090090412A1 (en) * 2005-12-22 2009-04-09 Hermann Calwer Photovoltaic device and method for encapsulating
FR2904508B1 (fr) * 2006-07-28 2014-08-22 Saint Gobain Dispositif electroluminescent encapsule
US8339700B2 (en) * 2007-10-25 2012-12-25 Techno Polymer Co., Ltd Infrared reflective laminate
WO2009126115A1 (en) * 2008-04-09 2009-10-15 Agency For Science, Technology And Research Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices
US20110223419A1 (en) * 2008-07-11 2011-09-15 Mitsubishi Plastics, Inc. Solar cell backsheet
KR20100071650A (ko) * 2008-12-19 2010-06-29 삼성전자주식회사 가스차단성박막, 이를 포함하는 전자소자 및 이의 제조방법
JP2011003657A (ja) * 2009-06-17 2011-01-06 Fuji Electric Systems Co Ltd 太陽電池モジュール積層体とその製造方法
JP2013502745A (ja) * 2009-08-24 2013-01-24 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 薄膜太陽電池用バリア膜
TW201130944A (en) * 2009-11-18 2011-09-16 3M Innovative Properties Co Flexible assembly and method of making and using the same
JP2011129850A (ja) * 2009-12-17 2011-06-30 Dengiken:Kk 太陽電池用バックシート及びそれを用いた太陽電池モジュール
CN201616442U (zh) * 2010-01-27 2010-10-27 上海海优威电子技术有限公司 一种太阳能电池背板
US9254506B2 (en) * 2010-07-02 2016-02-09 3M Innovative Properties Company Moisture resistant coating for barrier films
DE102010038292A1 (de) * 2010-07-22 2012-01-26 Evonik Röhm Gmbh Witterungsbeständige Rückseitenfolien

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001076871A (ja) * 1999-06-29 2001-03-23 Nitto Denko Corp 有機エレクトロルミネセンス素子およびその製造方法
WO2010150759A1 (ja) * 2009-06-24 2010-12-29 三菱化学株式会社 有機電子デバイス及びその製造方法

Also Published As

Publication number Publication date
US20150027533A1 (en) 2015-01-29
JP2014529881A (ja) 2014-11-13
WO2013019463A1 (en) 2013-02-07
TWI603842B (zh) 2017-11-01
SG2014007900A (en) 2014-03-28
CN103733724A (zh) 2014-04-16
TW201318848A (zh) 2013-05-16
EP2740328A1 (en) 2014-06-11
EP2740328A4 (en) 2015-05-06
KR20140051989A (ko) 2014-05-02
JP6228116B2 (ja) 2017-11-08
CN103733724B (zh) 2017-05-17

Similar Documents

Publication Publication Date Title
KR101911581B1 (ko) 에지 보호된 배리어 조립체
JP6139524B2 (ja) バリアアセンブリ
KR101985983B1 (ko) 탈층 저항성 조립체의 제조 방법
KR101883030B1 (ko) 연속적 에지 보호된 배리어 조립체
KR101911582B1 (ko) 에지 보호된 배리어 조립체
KR20140051988A (ko) 에지 보호된 배리어 조립체
KR20140051990A (ko) 에지 보호된 배리어 조립체

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20211019

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20211019

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000