TWI594864B - Molding temperature control system - Google Patents

Molding temperature control system Download PDF

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Publication number
TWI594864B
TWI594864B TW101142813A TW101142813A TWI594864B TW I594864 B TWI594864 B TW I594864B TW 101142813 A TW101142813 A TW 101142813A TW 101142813 A TW101142813 A TW 101142813A TW I594864 B TWI594864 B TW I594864B
Authority
TW
Taiwan
Prior art keywords
cooling
temperature
flow path
tank
coolant
Prior art date
Application number
TW101142813A
Other languages
English (en)
Chinese (zh)
Other versions
TW201343353A (zh
Inventor
Noboru Chiba
Hideo Yoshidome
Akihiro Yoshimura
Original Assignee
Nax Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nax Co Ltd filed Critical Nax Co Ltd
Publication of TW201343353A publication Critical patent/TW201343353A/zh
Application granted granted Critical
Publication of TWI594864B publication Critical patent/TWI594864B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/007—Tempering units for temperature control of moulds or cores, e.g. comprising heat exchangers, controlled valves, temperature-controlled circuits for fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW101142813A 2011-11-17 2012-11-16 Molding temperature control system TWI594864B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011251797 2011-11-17

Publications (2)

Publication Number Publication Date
TW201343353A TW201343353A (zh) 2013-11-01
TWI594864B true TWI594864B (zh) 2017-08-11

Family

ID=48429340

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101142813A TWI594864B (zh) 2011-11-17 2012-11-16 Molding temperature control system

Country Status (4)

Country Link
JP (1) JP5706969B2 (ja)
KR (1) KR101606893B1 (ja)
TW (1) TWI594864B (ja)
WO (1) WO2013073266A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6127099B2 (ja) * 2015-08-28 2017-05-10 株式会社サーモテック 温度調節システム
CN107289654B (zh) * 2016-04-11 2019-08-02 青月村燊股份有限公司 具有储备冷冻能力的冷冻机
JP6698013B2 (ja) * 2016-12-28 2020-05-27 パーパス株式会社 給水サーバー
CN108407242B (zh) * 2018-05-11 2023-10-27 珠海格力精密模具有限公司 模具
CN108859103B (zh) * 2018-06-25 2023-11-03 共享智能装备有限公司 一种控制fdm打印体成型温度的装置
TWI696541B (zh) * 2019-04-11 2020-06-21 均賀科技股份有限公司 塑膠射出模具之調溫裝置
JP6787609B1 (ja) * 2019-10-04 2020-11-18 Ｎｅｃプラットフォームズ株式会社 多重成形用金型及び成形機
JP6845955B2 (ja) * 2020-04-24 2021-03-24 パーパス株式会社 給水サーバーの制御方法、制御装置、プログラムおよび記録媒体
CN114322442B (zh) * 2021-07-06 2023-08-15 青岛海尔电冰箱有限公司 用于冰箱的制冰控制方法与冰箱
CN114602566B (zh) * 2022-03-23 2023-04-14 电子科技大学 一种研究姆潘巴效应的实验设备及其实验方法
CN115195063B (zh) * 2022-07-08 2023-06-23 广东文穗智能装备股份有限公司 注塑辅助集成系统用制冷系统
CN118359371B (zh) * 2024-05-10 2024-10-11 上海强华实业股份有限公司 一种冷却液可调的石英加工模具

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3748866A (en) * 1971-04-23 1973-07-31 Owens Illinois Inc Method and apparatus for chilling mold elements
US4680001A (en) * 1984-11-28 1987-07-14 Application Engineering Corporation Passive mold cooling and heating system
JPS6414006A (en) * 1987-07-09 1989-01-18 Canon Kk Temperature control instrument of mold
JP2001147066A (ja) * 1999-11-18 2001-05-29 Okazaki Mfg Co Ltd 冷却水供給装置
TW200526393A (en) * 2004-02-12 2005-08-16 Mitsubishi Heavy Ind Ltd Apparatus and method for mold temperature adjustment, and mold temperature control unit
JP2010099844A (ja) * 2008-10-21 2010-05-06 Nax Co Ltd 成形用金型の温度調整システム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1165681A (ja) * 1997-08-21 1999-03-09 Fujikura Rubber Ltd 自動温度調整システム
KR100627185B1 (ko) * 2005-04-19 2006-09-25 이평기 사출시스템의 냉각수 온도를 제어하기 위한 장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3748866A (en) * 1971-04-23 1973-07-31 Owens Illinois Inc Method and apparatus for chilling mold elements
US4680001A (en) * 1984-11-28 1987-07-14 Application Engineering Corporation Passive mold cooling and heating system
JPS6414006A (en) * 1987-07-09 1989-01-18 Canon Kk Temperature control instrument of mold
JP2001147066A (ja) * 1999-11-18 2001-05-29 Okazaki Mfg Co Ltd 冷却水供給装置
TW200526393A (en) * 2004-02-12 2005-08-16 Mitsubishi Heavy Ind Ltd Apparatus and method for mold temperature adjustment, and mold temperature control unit
JP2010099844A (ja) * 2008-10-21 2010-05-06 Nax Co Ltd 成形用金型の温度調整システム

Also Published As

Publication number Publication date
KR101606893B1 (ko) 2016-03-28
KR20140064998A (ko) 2014-05-28
WO2013073266A1 (ja) 2013-05-23
JPWO2013073266A1 (ja) 2015-04-02
JP5706969B2 (ja) 2015-04-22
TW201343353A (zh) 2013-11-01

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MM4A Annulment or lapse of patent due to non-payment of fees