JPS6414006A - Temperature control instrument of mold - Google Patents
Temperature control instrument of moldInfo
- Publication number
- JPS6414006A JPS6414006A JP16986387A JP16986387A JPS6414006A JP S6414006 A JPS6414006 A JP S6414006A JP 16986387 A JP16986387 A JP 16986387A JP 16986387 A JP16986387 A JP 16986387A JP S6414006 A JPS6414006 A JP S6414006A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- circuit
- discharge
- medium
- released
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/0288—Controlling heating or curing of polymers during moulding, e.g. by measuring temperatures or properties of the polymer and regulating the process
- B29C35/0294—Controlling heating or curing of polymers during moulding, e.g. by measuring temperatures or properties of the polymer and regulating the process using tempering units for temperature control of moulds or cores
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE:To prevent a medium from spouting out or leaking by detecting immediately that pressure within a circuit is lowered suddenly, by a method wherein the pressure within the circuit is detected by a pressure gauge provided in the circuit, a discharge pump is suspended at the time when the pressure becomes lower than an established lower limit pressure and residual pressure within a tank or the circuit is released into a reserve tank. CONSTITUTION:When the pressure of a pressurizing source is either too low or too high while pressurizing the medium water 11 in a tank 23 up to, for example, 3-5kg/cm<2>, the pressure value is detected by a discharge pressure gauge 6, an alarm is emitted through a discharge back pressure monitoring device 19, a solenoid valve 21 is closed and a discharge pump 5 and heating heater 12 are suspended. When the pressure detected by a pressure monitoring device 8 for a leakage becomes a predetermined pressure or less by reducing the pressure within a medium pipe 24 suddenly, in the case where the medium water 11 is leaked due to the damage of the pipe 24, the alarm is emitted, simultaneously with the suspension of the discharge pump 5 and a heater 12 due to a command of the discharge back pressure monitoring device 19 the solenoid valve 9 for the leakage is released and residual pressure in the medium pipe 24 is released into a reserve tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16986387A JPS6414006A (en) | 1987-07-09 | 1987-07-09 | Temperature control instrument of mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16986387A JPS6414006A (en) | 1987-07-09 | 1987-07-09 | Temperature control instrument of mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6414006A true JPS6414006A (en) | 1989-01-18 |
Family
ID=15894343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16986387A Pending JPS6414006A (en) | 1987-07-09 | 1987-07-09 | Temperature control instrument of mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6414006A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH058363A (en) * | 1991-07-03 | 1993-01-19 | Lonseal Corp | Tile made of synthetic resin excellent in design properties |
| JPH07290459A (en) * | 1994-04-22 | 1995-11-07 | Nissei Plastics Ind Co | Mold temperature control device |
| WO2013073266A1 (en) * | 2011-11-17 | 2013-05-23 | ナックス株式会社 | System for adjusting temperature of molding die |
-
1987
- 1987-07-09 JP JP16986387A patent/JPS6414006A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH058363A (en) * | 1991-07-03 | 1993-01-19 | Lonseal Corp | Tile made of synthetic resin excellent in design properties |
| JPH07290459A (en) * | 1994-04-22 | 1995-11-07 | Nissei Plastics Ind Co | Mold temperature control device |
| WO2013073266A1 (en) * | 2011-11-17 | 2013-05-23 | ナックス株式会社 | System for adjusting temperature of molding die |
| JPWO2013073266A1 (en) * | 2011-11-17 | 2015-04-02 | ナックス株式会社 | Mold temperature control system |
| TWI594864B (en) * | 2011-11-17 | 2017-08-11 | Nax Co Ltd | Molding temperature control system |
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