TWI594809B - Thin film formation method and thin film formation apparatus - Google Patents

Description

Film forming method and film forming device

The present invention relates to a film forming method and a film forming apparatus for forming a film by applying a liquid film material to a substrate and then curing the film material.

A technique of forming a film by ejecting a liquid film material from a head (jet head) and curing the film material applied to the substrate is known (for example, Patent Document 1). The film forming technique is, for example, formation of a solder resist applied to a printed substrate, formation of an interlayer insulating film of a laminated substrate, and the like.

The film material is a photocurable resin (for example, an ultraviolet curable resin). When the film material is dropletized and applied to the substrate, the film material spreads in the in-plane direction. In order to enhance the sharpness of the film pattern formed on the substrate, it is preferable to quickly harden the film material after the film material is bounced. However, when the film material is applied to the entire region, after the film material is elasticized, the film material is quickly hardened, and irregularities are formed on the surface of the film corresponding to the respective droplets.

A film forming method capable of reducing surface unevenness of a film is disclosed It is shown in patent document 2. The method is to first form an edge pattern along the edge of the area where the film should be formed. A liquid film material is applied to the inner side of the edge pattern, and the film formation region is covered with a liquid film material. After the surface of the liquid film material is flat, the film material is hardened to form a film. Thereby, a film having a flat surface can be formed.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 3544543

[Patent Document 2] International Publication No. 2013/011775

In a conventional method of forming a film having a flat surface, first, it is necessary to sequentially perform a step of forming an edge pattern, a step of coating a film formation region on the inner side of the edge pattern with a liquid film material, and a liquid film. The step of hardening the material. Therefore, the time required for forming a film becomes long.

The present invention provides a film forming method and a film forming apparatus which can suppress an increase in time required for film formation and can form a film having reduced surface unevenness.

According to one aspect of the present invention, a film formation is provided The method comprises the steps of: forming a first film portion after the elastic film material is bounced on the substrate, and then curing the film material after the filming to the first curing degree; a step of forming a second film portion by buffing the film material in a liquid state, and re-hardening the film material after the filming to the second hardness; and the first film After the boundary between the portion and the second film portion is indistinguishable, the first film portion and the second film portion are cured to be higher than one of the first curing degree and the second curing degree. The steps up to the third degree of hardening.

According to another aspect of the present invention, a film forming apparatus comprising: a stage holding a substrate; and at least two heads provided opposite to the substrate held on the stage, facing the substrate, and being photocurable a plurality of nozzle holes that are discharged after the film material is dropletized; at least three light sources for curing are opposed to the substrate, and the film material adhering to the substrate is irradiated with light for curing; a moving mechanism for the head and the hardening The light source is used to relatively move the substrate, and the control device controls the light source for curing to cause the liquid film material adhering to the substrate to pass through the plurality of hardening light sources. Light from the light source obtains the above film The control device controls the head, the curing light source, and the moving mechanism to move the substrate in the scanning direction while discharging the film material from the nozzle hole to adhere the film material to the substrate. When the light-receiving light-forming film is used to control the head, the light-receiving light source, and the moving mechanism, the liquid-like film material is bounced from the nozzle hole on the substrate held by the stage, and then the film is bounced. The film material is irradiated with light from at least one of the curing light sources, thereby curing to a first curing degree, and forming a first film portion so that a portion overlaps with the first film portion from the above After the liquid film material of the nozzle hole is bounced, the film material is again irradiated with light from at least one of the curing light source, thereby curing to the second hardness to form the second film portion. After the boundary between the first film portion and the second film portion is indistinguishable, the first film portion and the second thin portion are And irradiating light to at least one of the light source for curing, wherein the first film portion and the second film portion are hardened to be harder than one of the first curing degree and the second curing degree High third degree of hardening.

After the boundary between the first film portion and the second film portion is indistinguishable, the film is cured until the third curing degree, whereby the film is formed, so that unevenness on the surface of the film can be reduced. And no need to form edge graphics in advance Etc. Therefore, an increase in the time required for forming a film can be prevented.

20‧‧‧Abutment

21‧‧‧Mobile agencies

22‧‧‧

30‧‧‧Nozzle unit

31‧‧‧floor

32‧‧‧ sprinkler

33‧‧‧Nozzle hole

40‧‧‧1st hardening light source

41‧‧‧2nd hardening light source

50‧‧‧Control device

60‧‧‧Substrate

61‧‧‧ Film formation area

62‧‧‧ openings

64‧‧‧1st assumed line

65‧‧‧2nd hypothetical line

70‧‧‧ film

71‧‧‧Liquid film material

72‧‧‧1st film part

72a‧‧‧ film

73‧‧‧Liquid film material

74‧‧‧2nd film part

74a‧‧‧ film

76‧‧‧Liquid film material

77‧‧‧1st film section

78‧‧‧Liquid film material

79‧‧‧2nd film section

80‧‧‧Liquid film

81‧‧‧film

85‧‧‧3rd film section

85a‧‧ ‧ film

86‧‧‧4th film part

86a‧‧ ‧ film

87‧‧‧film

88‧‧‧ film part

89‧‧‧film

90‧‧‧ film part

91, 92‧‧‧ film

Fig. 1 is a schematic front view of a film forming apparatus according to an embodiment.

Fig. 2A is a perspective view of the nozzle unit, and Fig. 2B is a bottom view of the nozzle unit.

Figure 3 is a top view of the stage, substrate and nozzle unit.

Fig. 4 is a top view showing an example of the shape of the upper surface of the film to be formed on the substrate.

Fig. 5A is a side view of the substrate and the nozzle unit, and Fig. 5B is a top view of the film material after being bounced on the substrate.

6A to 6E are cross-sectional views of the substrate in the middle of the film forming method of the embodiment, and FIG. 6F is a cross-sectional view of the substrate on which the thin film is formed.

7A is a side view of the substrate, the head, the first curing light source, and the second curing light source when the thin film forming method of Comparative Example 1 is used, and FIGS. 7B to 7D are the film of Comparative Example 1. A cross-sectional view of the substrate in the middle of the formation method, and FIG. 7E is a cross-sectional view of the substrate on which the thin film is formed by the thin film formation method of Comparative Example 1.

8A is a side view of the substrate, the head, the first curing light source, and the second curing light source when the thin film forming method of Comparative Example 2 is formed, and FIGS. 8B to 8D are the film of Comparative Example 2. A cross-sectional view of the substrate in the middle of the formation method, and FIG. 8E is a film shape of Comparative Example 2. A cross-sectional view of a substrate into which a film is formed.

9A to 9C are cross-sectional views of the substrate in the middle of the film forming method of the other embodiment.

9D to 9E are cross-sectional views of the substrate in the middle of the film forming method of the other embodiment.

10A to 10F are sectional views of the substrate in the middle of the thin film forming method of the embodiment, and FIG. 9F is a 9A to 9E drawing showing the thin film forming method by the embodiment. A cross-sectional view of a substrate on which a film is formed.

Fig. 1 is a schematic front view showing a film forming apparatus according to an embodiment. The stage 22 is supported by the moving mechanism 21 on the base 20 . The xyz orthogonal coordinate system is defined such that the x-axis and the y-axis are oriented in the horizontal direction and the Z-axis is oriented vertically upward. The moving mechanism 21 is controlled by the control device 50 to move the stage 22 in the x direction and the y direction. Further, the moving mechanism 21 may have a function of changing the posture in the rotation direction of the stage 22 with the direction parallel to the z-axis as the center of rotation.

On the upper surface (holding surface) of the stage 22, the substrate 60 on which the thin film is to be formed is held. The substrate 60 is fixed to the stage 22 by, for example, a vacuum chuck. The nozzle unit 30 is supported by the upper and lower sides of the stage 22 so as to be freely movable. The nozzle unit 30 includes a plurality of nozzles. The showerhead has a plurality of nozzle apertures opposite the substrate 60. The film material is dropletized from the nozzle holes toward the surface of the substrate 60, and then discharged. The discharge of the film material is controlled by the control device 50 system. The liquid film material is a photocurable resin (for example, an ultraviolet curable resin).

In Fig. 1, it is shown that the nozzle unit 30 is stationary on the base station. 20, an example in which the substrate 60 is moved, but conversely, the substrate 60 may be stationary on the base 20 to move the nozzle unit 30. As described above, the substrate 60 and the nozzle unit 30 may be relatively moved relative to each other.

Figure 2A shows a perspective view of the nozzle unit 30, in the bottom plate On the 31st, a plurality of, for example, two heads 32 are arranged in the y direction. The heads 32 each have a plurality of nozzle holes 33 arranged in the x direction. The first hardened light source 40 is attached to each other between the two heads 32 adjacent to the y direction and the outside of the heads 32 at both ends. The second curing light source 41 is attached to the outer side of the outermost first curing light source 40. The first curing light source 40 and the second curing light source 41 are light (for example, ultraviolet light) that is used to cure the film material adhering to the substrate 60 ( FIG. 1 ).

The surface of the substrate 60 is from the second curing light source 41. The power density of the emitted light is higher than the power density of the light emitted from the first curing light source 40. When the liquid film material applied to the substrate 60 (Fig. 1) is irradiated with light emitted from the first curing light source 40, only the extremely thin surface layer portion is cured to form a film, but the inside is substantially not cured. The phenomenon in which only the surface layer portion of the film material is hardened is referred to as "false hardening". On the film material on which the film is formed, once the film material having a droplet shape is bounced, the film is broken to mix the applied liquid film material with the freshly applied liquid film material.

For the film material forming the film, the irradiation is from the second hardening When the light emitted by the light source 41 is used, the degree of hardening of the film material is increased. For example, it hardens to the inside of the film material. Therefore, even if a new liquid droplet-shaped film material is bounced on the film material irradiated with the light emitted from the second curing light source 41, the two are not mixed.

FIG. 2B is a bottom view of the nozzle unit 30. Two nozzles 32 are arranged in the y direction. The first curing light source 40 is disposed between the two heads 32 and outside the outermost head 32. The second curing light source 41 is disposed outside the first curing light source 40.

Each nozzle hole 33 of the head 32 is serrated in the x direction Arranged in a shape. When one head 32 is focused on, one example is that the nozzle hole 33 is disposed at a pitch equivalent to 300 dpi in the x direction. One of the heads 32 is disposed in the x direction with respect to the other of the heads 32, with only a half of the pitch corresponding to 300 dpi. Therefore, the nozzle holes 33 of the two heads 32 as a whole are arranged in the x direction at a pitch corresponding to 600 dpi (hereinafter, referred to as a nozzle pitch).

3 shows the stage 22, the substrate 60, and the nozzle unit 30. Upper view. The substrate 60 is held on the holding surface of the stage 22. The nozzle unit 30 is supported above the substrate 60. The head 32, the first curing light source 40, and the second curing light source 41 are mounted on the bottom plate 31. The moving mechanism 21 moves the stage 22 in the x direction and the y direction by control from the control device 50. The control device 50 controls the timing at which the film material is discharged from the head 32.

Moving the substrate 60 from the nozzle hole while moving the substrate 60 in the y direction 33 (Fig. 2B) The film material was dropletized and discharged, whereby the film material was bounced on the substrate 60 in the x direction at a sharpness (600 dpi) corresponding to the nozzle pitch. The film material that has been bounced on the substrate 60 (after smearing) is pseudo-hardened by light emitted from the first curing light source 40 located on the downstream side in the moving direction of the substrate 60.

The film material liquid is moved while moving the substrate 60 in the y direction. The process of discharging from the nozzle hole 33 (Fig. 2B) after the dropping is "scanned". The substrate 60 is scanned four times with respect to the 1/4 of the nozzle pitch toward the x direction, whereby the film material can be bounced in the x direction corresponding to the sharpness of the nozzle pitch by 4 times (2400 dpi). On the substrate 60. In the four scans, the substrate 60 can be moved in only one direction or can be moved back and forth.

Set the area where the film material can be applied four times. A path (pathway). When the width of one path in the x direction is narrower than the dimension of the substrate 60 in the x direction, the surface of the substrate 60 is divided into a plurality of paths, and a film is formed on each path, whereby a film can be formed over the entire area of the substrate 60.

When the required resolution of the film is 600 dpi, One scan completes the processing of one path. Further, when the resolution required for the film is 2400 dpi, when the nozzle unit 30 having a nozzle pitch of 2400 dpi is used, the processing of one path can be completed in one scan.

Figure 4 shows the shape of the film which should be formed on the substrate 60. An example of a shape. A region (film formation region) 61 where a film should be formed is drawn in the surface region of the substrate 60. In Fig. 4, hatching is given to the film formation region 61. As in the example shown in Fig. 4, a film forming region 61 includes a circular or rectangular opening 62 therein. The other film forming regions 61 are circular or square. The video data of the bit map format defining the pattern of the thin film formation region 61 is stored in the control device 50 (Fig. 1). In one example, the substrate 60 is a core substrate corresponding to a laminated substrate, and the thin film corresponds to an interlayer insulating film.

FIG. 5A shows a side view of the substrate 60 and the nozzle unit 30 Figure. The second curing light source 41, the first curing light source 40, the head 32, the first curing light source 40, the head 32, the first curing light source 40, and the second curing light source 41 are arranged in the y direction in this order. The substrate 60 is moved toward the positive direction of the y-axis (the right direction in FIG. 5a), and the film material is dropletized from the two heads 32, and then discharged.

The lighting is arranged on each downstream side of the two heads 32 (y-axis The first hardening light source 40 of the positive side and the second curing light source 41 disposed at the downstream end. The second curing light source 41 at the upstream end and the first curing light source 40 on the most upstream side are extinguished and are not used.

Figure 5B shows the film material after being played on the substrate 60. Top view. In Fig. 5B, the film material in the form of a droplet at the time of the bombing is indicated by a circle. The film material discharged from the head 32 on the upstream side is parallel to each other, and the first hypothetical straight line 64 arranged at equal intervals moves the projecting position while being bounced. The film material discharged from the head 32 on the downstream side is between the first hypothetical straight lines 64 adjacent to each other, and is flat along the first assumption. The second hypothetical line 65 arranged in the row moves the projecting position while moving. The film material that is struck along the second hypothetical line 65 is partially overlapped with the film material that is struck along the first hypothetical line 64 on either side thereof.

Referring to FIGS. 6A to 6F, the film by the embodiment is illustrated. Forming method. 6A to 6F are cross-sectional views showing the substrate 60 and the film material at the positions of the one-dot chain lines 6A to 6F in the fifth and fifth panels, respectively.

As shown in Fig. 6A, the film material is discharged from the head 32 (Fig. 5A) on the upstream side. Thereby, a film material is applied to the substrate 60. As shown in FIG. 6B, when the liquid film material 71 (Fig. 6A) passes under the first curing light source 40 (Fig. 5A), it is irradiated with light emitted from the first curing light source 40. Thereby, the film material 71 is cured to the first degree of curing, and the first film portion 72 is formed.

The first film portion 72 has a structure in which a liquid film 72a having a thin film material is coated. The light emitted from the first curing light source 40 is thinned and hardened to the surface layer portion of the film material 71 (Fig. 6A), but has a power density that cannot be hardened to the inside.

The degree of hardening of bridging all monomers into a polymer state is defined as 100%. The degree of hardening can be evaluated, for example, by Fourier transform infrared Raman spectroscopy. Since the first film portion 72 includes an unbridged polymer in the liquid film material inside, the first degree of hardening is a value which is much lower than 100%.

As shown in Fig. 6C, the film material is discharged from the head 32 (Fig. 5A) on the downstream side. Thereby, partially overlapping the first film portion 72 The liquid film material 73 is bounced on the substrate 60. The ejection of the liquid film material 73 causes a part of the film 72a to be broken. Further, the liquid film material inside the first film portion 72 and the liquid film material 73 after the new bomb can be mixed with each other.

As shown in Fig. 6D, the liquid film material 73 passes through In the lower side of the first curing light source 40 (Fig. 5A), the liquid film portion material 73 (Fig. 6C) is hardened to the second hardening by the light emitted from the first curing light source 40. So far. Thereby, the second thin film portion 74 is formed. Similarly to the first thin film portion 72, the second thin film portion 74 has a structure in which a liquid film 74a having a thin film material is coated.

The second degree of hardening is also a value far below 100% as in the first degree of hardening. When the power density of light when forming the first thin film portion 72 (Fig. 6B) is equal to the power density of light when the second thin film portion 74 is formed, the first hardening degree and the second hardening degree are substantially equal.

Figure 6E shows the state from the 6D picture after a certain time A cross-sectional view of the substrate 60 at a time point. Since the film 72a of the first film portion 72 and the film 74a of the second film portion 74 (Fig. 6D) are sufficiently thin, the first film portion 72 and the second film portion 74 can be borrowed (Fig. 6D). The surface tension of the liquid film material deforms the films 72a and 74a to flatten the surface. When the surface is flattened, the boundary between the first film portion 72 and the second film portion 74 becomes indistinguishable.

As shown in Fig. 6F, the first film portion 72 and the second thin film The film portion 74 is hardened to the third hard by irradiation of light from the second curing light source 41 (Fig. 5A) disposed at one end of the y-axis positive side. Until then. Here, the "third degree of hardening" means the hardness by which the film material is bounced without being deformed. The third degree of hardening is higher than any of the first curing degree and the second curing degree. The film 70 is formed by hardening to the third degree of hardening. At this point of time, the third degree of hardening does not have to reach the degree of hardening required for the film 70. When the third degree of hardening does not reach the degree of hardening required to form a film, after the substrate 60 is taken out from the stage 22 (Fig. 1), the film 70 is irradiated with strong light to be cured to a desired degree of hardening. That's it.

Next, while the film forming method of the above embodiment is The effects will be described in comparison with the film formation methods of Comparative Example 1 and Comparative Example 2.

Fig. 7A shows the formation of the film formation method of Comparative Example 1. A side view of the substrate 60, the head 32, the first curing light source 40, and the second curing light source 41 in the case of a film. In the comparative example 1, the second hardening light source 41 is extinguished. The power density of the surface of the substrate 60 of the light emitted from the first curing light source 40 is the power of the surface of the substrate 60 which is the light emitted from the second curing light source 41 of the film forming method of the fifth embodiment. The densities are roughly equal.

7B to 7E show a point chain of each of the 7A A cross-sectional view of the substrate 60 at the position of 7B to 7E. As shown in Fig. 7B, the film material is discharged from the head 32 (Fig. 7A) on the upstream side, whereby the film material 76 is applied to the substrate 60.

As shown in Fig. 7C, the liquid film material 76 (Fig. 7B) is hardened by the light from the first curing light source 40 on the downstream side. The first thin film portion 77 is formed by the third curing degree. In the embodiment, as shown in Fig. 6B, the first film portion 72 is in a state in which only the surface layer portion is cured. However, in the first embodiment, the first film portion 77 is cured to the inside.

As shown in Fig. 7D, the film material is discharged from the head 32 (Fig. 7A) on the downstream side, whereby the film material 78 is applied to the substrate 60. The film material 78 partially overlaps the first film portion 77. Since the first film portion 77 is hardened to the inside, the film material 78 is not fused with the first film portion 77.

As shown in Fig. 7E, the film material 78 (Fig. 7D) is formed by irradiating light from the first curing light source 40 and curing to the third curing degree, thereby forming the second film portion 79.

In Comparative Example 1, the first film material 77 and the second film portion 79 were not fused to each other. Therefore, irregularities remain on the surface of the formed film. According to the unevenness, fine streaks parallel to the scanning direction (y direction) can be visually observed.

8A is a side view showing the substrate 60, the head 32, the first curing light source 40, and the second curing light source 41 when the thin film is formed by the thin film forming method of Comparative Example 2. In Comparative Example 2, the first curing light source 40 was turned off. Moreover, the power density of the surface of the substrate 60 of the light emitted from the second curing light source 41 and the power density of the surface of the substrate 60 of the light emitted from the second curing light source 41 of the thin film forming method of the fifth embodiment are shown in FIG. Almost equal.

Fig. 8B to Fig. 8E are points showing Fig. 8A, respectively. A cross-sectional view of the substrate 60 at the position of the chain lines 8B to 8E. As shown in Fig. 8B, the film material is discharged from the head 32 (Fig. 8A) on the upstream side, whereby the film material 76 is applied to the substrate 60. As shown in Fig. 8C, the film material is discharged from the head 32 (Fig. 8A) on the downstream side, whereby the film material 78 is applied to the substrate 60. Since the film material 76 and the film material 78 are in a liquid state, they can be easily mixed.

As shown in Fig. 8D, after the film material 78 is bounced, the film material 76 and the film material 78 are mixed by the second curing light source 41 to form a liquid film 80 having a flat surface. Further, since the edge of the liquid film 80 is still in a liquid state, the film material 76 which is projected on the outermost periphery diffuses into the surface to cause penetration.

As shown in Fig. 8E, the light from the second curing light source 41 is irradiated onto the liquid film 80 (Fig. 8D) to be cured. Thereby, the film 81 is formed. In Comparative Example 2, although the surface of the film 81 was flattened, the edge was liable to permeate.

The first to sixth embodiments show the first curing light source on the downstream side of the head 32 after the film material 71 is ejected after the liquid film material 71 (Fig. 6A) is bounced on the substrate 60. 40, immediately hardened until the first degree of hardening. As shown in Fig. 8D, when the film material applied to the substrate 60 is still in a liquid state, the film material diffuses in the in-plane direction to cause penetration. In the embodiment, after the film material is bounced, it is hardened to the first degree of hardening in a short time, and then no penetration occurs. Therefore, the penetration of the edge of the film 70 (Fig. 6F) can be alleviated. Formed from the film material 73 (Fig. 6C) discharged from the head 32 (Fig. 5A) on the downstream side In the case of the film 70, the penetration can be similarly reduced.

After the film material is bounced on the substrate 60, it is hardened to the first The time until the degree of hardening is dependent on the distance from the impact point of the film material to the irradiation region of the first curing light source 40 (Fig. 5A) on the downstream side and the moving speed of the substrate 60. In order to obtain an effect of sufficiently reducing the penetration, it is preferable that the time from the film material being bounced on the substrate 60 to the time of curing to the first degree of hardening is less than 0.2 second. Similarly, it is preferable that the time from the film material being bounced on the substrate 60 to the second curing degree is less than 0.2 second.

The second film portion 74 (Fig. 6D) which is cured to the second degree of hardening is cured to the third degree of hardening and the time until the film 70 (Fig. 6F) is formed depends on the surface of the substrate 60. The distance from the irradiation region of the first curing light source 40 (Fig. 5A) on the most downstream side to the irradiation region of the second curing light source 41 disposed at the downstream end portion, and the moving speed of the substrate 60. In order to fuse the first film portion 72 and the second film portion 74 (Fig. 6D), the second film portion 74 is cured until the second curing degree is ensured by the time until the surface is flattened (Fig. 6D). The elapsed time until it is hardened to the third degree of hardening is preferably longer than 0.5 seconds.

In order to satisfy the above conditions, the distance from the irradiation region of the first curing light source 40 on the most downstream side to the irradiation region of the second curing light source 41 on the most downstream side is larger than that from the film material of the head 32 from the downstream side. The distance from the spot to the irradiation region of the first curing light source 40 on the downstream side is preferably long.

Next, refer to Figure 9A to Figure 10F for other realities. A film forming apparatus and a film forming method will be described. Hereinafter, differences from the embodiments shown in FIGS. 1 to 6F will be described, and the same configurations will be briefly described. In this embodiment, only four scans of the 1/4 of the nozzle pitch are offset in the x direction for each scan, thereby forming a film in one path.

Figure 9A shows the substrate 60 and the head in the first scan. 32 and a side view of the first curing light source 40. In this embodiment, the second curing light source 41 (Fig. 2A, Fig. 2B) is not used. The first curing light source 40 is controlled by the control device 50 (Fig. 1) to switch the intensity of the emitted light in two stages.

When the intensity of light emitted from the first curing light source 40 is low (Hereinafter, the strength at this time is referred to as "low strength"), and the film material applied to the substrate 60 can be cured to the first curing degree or the second curing degree. That is, as shown in Figs. 6B and 6D, only the surface layer portion of the film material is thinned and hardened to form a film. When the intensity of the light emitted from the first curing light source 40 is high (hereinafter, the intensity at this time is "high strength"), the film material applied to the substrate 60 can be cured to the third curing degree. That is, as shown in Fig. 6F, the film material can be hardened to the inside.

The first scan is about the moving direction of the substrate 60 (y The positive direction of the shaft is performed in a state in which the first curing light source 40 disposed on each downstream side of the head 32 is radiated with low intensity light.

Fig. 10A shows the first hardening light from the most downstream side A cross-sectional view of the substrate 60 after the light of the source 40 is irradiated (the position of the one-point chain line 10A in Fig. 9A). Similarly to the state shown in Fig. 6D, the first film portion 72 covered with the film 72a and the second film portion 74 covered with the film 74a are formed. The inside of the first film portion 72 and the second film portion 74 are still in a liquid state.

Figure 9B shows the substrate 60 and the head in the second scan. 32 and a cross-sectional view of the first curing light source 40. At the end of the first scanning, the moving direction of the substrate 60 is reversed, and the substrate 60 is shifted by only 1/4 of the nozzle pitch in the x direction, and the second scanning is performed. In the second scanning, the first curing light source 40 from the most upstream side (the most positive side of the y-axis) radiates high-intensity light, and the other two first curing light sources 40 emit low-intensity light.

Figure 10B shows the moment before the high-intensity light irradiation (the first A cross-sectional view of the substrate 60 in the position of the one-point chain line 10B of Fig. 9B. The surface tension of the liquid portions of the first film portion 72 and the second film portion 74 deforms the films 72a and 74b to be flat. Thereby, the boundaries of the first film portion 72 and the second film portion 74 are indistinguishable.

Figure 10C shows the subsequent high-intensity light irradiation (9B) A cross-sectional view of the substrate 60 at the position of the point chain 10C of the figure. The film 70 is formed by hardening to the inside of the first film portion 72 and the second film portion 74 (Fig. 10B). The surface of the film 70 is flat. As a result, the film material that is pseudo-hardened during a certain scan hardens to the third degree of hardening on the next scan.

Figure 10D shows the most downstream side (the y-axis in Figure 9B) The negative side of the first curing light source 40 is followed by a cross-sectional view of the substrate 60 (the position of the one-point chain line 10D in FIG. 9B). The third film portion 85 and the fourth film portion 86 are formed on the film 70 applied to the first scanning. The film materials of the third film portion 85 and the fourth film portion 86 are the bounce locations of the second film portion 74 and the first film portion 72 formed from the first scanning, respectively, and are bounced in the x direction. At a point that is only 1/4 of the nozzle pitch. At this point of time, the third film portion 85 and the fourth film portion 86 are in a state in which the films 85a and 86a are formed on the surface, and the inside is still in a liquid state. Therefore, the surface of the third film portion 85 and the fourth film portion 86 is flattened while the time passes.

Figure 9C shows the substrate 60 and the head in the third scan. 32 and a side view of the first curing light source 40. At the end of the second scanning, the moving direction of the substrate 60 is reversed, and the substrate 60 is shifted by only 1/4 of the nozzle pitch in the x direction, and the third scanning is performed. In the third scanning, the first curing light source 40 from the most upstream side (the most negative side of the y-axis) radiates high-intensity light, and the other two first curing light sources 40 emit low-intensity light.

Figure 10E shows high intensity light illumination followed (Fig. 9C) A cross-sectional view of the substrate 60 of the position of the point line 10E. The third film portion 85 and the fourth film portion 86 (Fig. 10D) are cured to form a film 87. Thereafter, as shown in Fig. 9C, the film material discharged from the head 32 is applied over the film 87, and the film portion 88 is formed by pseudo-hardening.

Fig. 9D is a side view showing the substrate 60, the head 32, and the first curing light source 40 in the fourth scanning. At the end of the 3rd scan At this time, the moving direction of the substrate 60 is reversed, and the substrate 60 is shifted by only 1/4 of the nozzle pitch in the x direction, and the fourth scanning is performed. In the fourth scanning, the first curing light source 40 from the most upstream side (the most positive side of the y-axis) emits high-intensity light, similar to the second scanning (Fig. 9B). The two first curing light sources 40 emit low intensity light. The film 89 is formed by curing the film portion 88 formed at the time of the third scanning to the third degree of hardening. Thereafter, on the film 89, the film material discharged from the head 32 is applied, and the film portion 90 is formed by pseudo-hardening.

As shown in Fig. 9E, at the end of the fourth scan, The moving direction of the substrate 60 is reversed. The substrate 60 is moved from at least one of the first curing light sources 40 while emitting high-intensity light. The discharge of the film material from the head 32 is not performed.

Fig. 10F is a cross-sectional view showing the substrate 60 after high-intensity light irradiation (the position of the one-point chain line 10F in Fig. 9E). The film portion 90 (Fig. 9E) is cured until the third degree of hardening to form the film 91. At the time of the fourth scanning, the film 92 formed of the films 70, 87, 89, and 91 is formed by the movement of the substrate 60 for final hardening (Fig. 9E).

In the embodiment shown in Figs. 9A to 10F, the film 92 having a flat surface and little penetration can be formed. In addition, the clarity of the formed film can be improved. For example, when the nozzle pitch of the two heads 32 is equivalent to 600 dpi as a whole, the film 92 can be formed with a resolution of 2400 pdi by performing four scans.

The invention has been described along the above embodiments, but the invention is not limited thereto. For example, various changes, improvements, combinations, etc. can be made for the industry. Self-evident.

60‧‧‧Substrate

70‧‧‧ film

71‧‧‧Liquid film material

72‧‧‧1st film part

72a‧‧‧ film

73‧‧‧Liquid film material

74‧‧‧2nd film part

74a‧‧‧ film

Claims (7)

A film forming method comprising the steps of: forming a first film portion after the elastic film material is bounced on a substrate, and then curing the film material after the filming to the first curing degree; a step of forming a second film portion by superimposing the first film on the liquid film, and then re-hardening the film material after the filming to the second hardness; After the boundary between the first film portion and the second film portion is indistinguishable, the first film portion and the second film portion are hardened to be hardened by one of the first curing degree and the second curing degree. The steps up to the third degree of hardening. The film forming method according to the first aspect of the invention, wherein the step of forming the first thin film portion includes: shifting a position of the elastic portion parallel to each other, and shifting the first hypothetical line at equal intervals a step of playing the film material and a step of curing the stretched film material to a first degree of curing, and forming the second film portion, comprising: the first hypothetical line adjacent to each other a step of ejecting the film material while overlapping a second portion of the first film portion on both sides along the second hypothetical line that is disposed in parallel with the first hypothetical line. and The step of hardening the above-mentioned film material after the hardening to the second hardness. The film forming method according to the first or second aspect of the invention, wherein, in the step of forming the first film portion, the film material is elasticized on the substrate to harden the film material after the impact The elapsed time until the first curing degree is shorter than 0.2 second. In the step of forming the second thin film portion, after the film material is bounced on the substrate, the film material after the buff is cured to the second portion. The elapsed time until the curing degree is shorter than 0.2 second, and after the second film portion is cured to the second curing degree, the first film portion and the second film portion are cured to the third curing degree. The time is longer than 0.5 seconds. The film forming method according to the first or second aspect of the invention, wherein the film material comprises a photocurable resin, and the first film portion and the second film portion are cured to a third degree of hardening. The power density of the irradiated light is higher than the power density of the light irradiated to the thin film material in the step of forming the first thin film portion and the step of forming the second thin film portion. A film forming apparatus comprising: a stage holding a substrate; at least two heads provided opposite to the substrate held by the stage, and droplets of the photocurable film material are discharged toward the substrate a plurality of nozzle holes; At least three light sources for curing, the film material adhering to the substrate is irradiated with light for curing, and the moving mechanism moves the substrate relative to the head and the light source for curing, and the control device controls In the light source for curing, when the liquid film material adhering to the substrate passes through a plurality of positions corresponding to the light source for curing, the curing degree of the film material is obtained by light from the light source for curing, and the control is performed. The apparatus controls the head, the light source for curing, and the moving mechanism to eject the film material from the nozzle hole while moving the substrate in the scanning direction, and irradiates the film material adhering to the substrate with a light-forming film for curing. When the nozzle, the curing light source, and the moving mechanism are controlled, the liquid film-like material is ejected from the nozzle hole on the substrate held by the stage, and the film material after the spring is hardened from the film material. Light is irradiated with at least one of the light sources, thereby hardening The first film portion is formed until the first curing portion, and a portion of the liquid film material from the nozzle hole is elastically overlapped with the first film portion, and the film is re-stretched. The material is irradiated with light from at least one of the light source for curing, and is cured to a second degree of hardening to form a second film portion, after the boundary between the first film portion and the second film portion is indistinguishable And irradiating light to at least one of the first thin film portion and the second thin film portion from the curing light source, thereby making the first thin The film portion and the second film portion are cured to a third degree of hardening higher than one of the first curing degree and the second curing degree. The film forming apparatus according to claim 5, wherein the head and the curing light source are disposed such that when the substrate moves in the scanning direction, a certain position on the surface of the substrate sequentially passes through one of the nozzles and one The position of the curing light source, the other one of the heads, the other one of the curing light sources, and the other of the other curing light sources is disposed on the substrate surface of the curing light source on the most downstream side in the moving direction of the substrate. The power density is higher than the power density of the substrate surface of the other light source for hardening. The film forming apparatus according to claim 5, wherein the plurality of the heads are arranged in the scanning direction, and the plurality of light sources for curing are disposed between the heads and more than the heads disposed at both ends On the outside, the control device controls the head, the curing light source, and the moving mechanism to discharge the film material from the head while moving the substrate in the scanning direction, and the curing light source from the downstream side of the head Light hardens the film material adhering to the substrate to the first curing degree, and then reverses the moving direction of the substrate, and improves hardening to the first hardening by light from one of the curing light sources. a degree of hardening of the film material up to the degree, and discharging the film material from the head The film material adhered to the substrate is cured to the first curing degree by light from the curing light source on the downstream side of the head.