TWI590326B - 電漿處理裝置、資料處理裝置及資料處理方法 - Google Patents

電漿處理裝置、資料處理裝置及資料處理方法 Download PDF

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Publication number
TWI590326B
TWI590326B TW105104759A TW105104759A TWI590326B TW I590326 B TWI590326 B TW I590326B TW 105104759 A TW105104759 A TW 105104759A TW 105104759 A TW105104759 A TW 105104759A TW I590326 B TWI590326 B TW I590326B
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TW
Taiwan
Prior art keywords
data
processing
smoothing
predicted value
smoothed
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TW105104759A
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English (en)
Chinese (zh)
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TW201640580A (zh
Inventor
渡辺成一
井上智己
中元茂
福地功祐
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日立全球先端科技股份有限公司
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Publication of TW201640580A publication Critical patent/TW201640580A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972—Spectral analysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Drying Of Semiconductors (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Computational Mathematics (AREA)
  • Pure & Applied Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Theoretical Computer Science (AREA)
  • Algebra (AREA)
  • Databases & Information Systems (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Plasma Technology (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • Probability & Statistics with Applications (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
TW105104759A 2015-05-12 2016-02-18 電漿處理裝置、資料處理裝置及資料處理方法 TWI590326B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015097000A JP6553398B2 (ja) 2015-05-12 2015-05-12 プラズマ処理装置、データ処理装置およびデータ処理方法

Publications (2)

Publication Number Publication Date
TW201640580A TW201640580A (zh) 2016-11-16
TWI590326B true TWI590326B (zh) 2017-07-01

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Family Applications (1)

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TW105104759A TWI590326B (zh) 2015-05-12 2016-02-18 電漿處理裝置、資料處理裝置及資料處理方法

Country Status (4)

Country Link
US (2) US10615010B2 (cg-RX-API-DMAC7.html)
JP (1) JP6553398B2 (cg-RX-API-DMAC7.html)
KR (1) KR101810875B1 (cg-RX-API-DMAC7.html)
TW (1) TWI590326B (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI708275B (zh) * 2018-08-21 2020-10-21 日商日立全球先端科技股份有限公司 狀態預測裝置及半導體製造裝置

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6239294B2 (ja) * 2013-07-18 2017-11-29 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理装置の運転方法
JP6318007B2 (ja) 2013-11-29 2018-04-25 株式会社日立ハイテクノロジーズ データ処理方法、データ処理装置および処理装置
KR102063049B1 (ko) 2016-10-14 2020-01-07 주식회사 엘지화학 금속폼의 제조 방법
JP6676020B2 (ja) * 2017-09-20 2020-04-08 株式会社日立ハイテク プラズマ処理装置及びプラズマ処理装置状態予測方法
CN108897283B (zh) * 2018-05-31 2022-07-19 中策橡胶集团股份有限公司 一种炼胶生产线数据分析处理方法
JP6804694B1 (ja) * 2019-02-08 2020-12-23 株式会社日立ハイテク エッチング処理装置、エッチング処理方法および検出器
JP7188560B2 (ja) * 2019-03-27 2022-12-13 株式会社島津製作所 ポンプ監視装置、真空ポンプおよび生成物堆積診断用データ処理プログラム
US11569135B2 (en) 2019-12-23 2023-01-31 Hitachi High-Tech Corporation Plasma processing method and wavelength selection method used in plasma processing
US10922056B1 (en) * 2020-04-24 2021-02-16 DESC (Dubai Electronic Security Center) Atmospheric pressure air microplasma system for true random bit generation
US12051575B2 (en) 2020-09-30 2024-07-30 Hitachi High-Tech Corporation Plasma processing apparatus and plasma processing method
US11437289B2 (en) 2020-09-30 2022-09-06 Hitachi High-Tech Corporation Plasma processing apparatus and plasma processing method
CN112269963A (zh) * 2020-10-27 2021-01-26 南开大学 一种多项式拟合的纳米随机表面光学特性快速预测算法
CN112668125B (zh) * 2021-01-06 2023-07-04 北京信息科技大学 提高非完整小圆弧评价精度的方法、系统、介质及设备
US12001310B2 (en) * 2021-04-05 2024-06-04 International Business Machines Corporation Approximating activity loads in databases using smoothed time series
WO2023248347A1 (ja) * 2022-06-21 2023-12-28 株式会社日立ハイテク プラズマ処理装置および加熱装置
CN118350974B (zh) * 2024-06-14 2024-09-20 山东征途信息科技股份有限公司 一种智慧社区综合康养监护方法及系统

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6153728A (ja) 1984-08-24 1986-03-17 Hitachi Ltd エツチング終点判定方法
KR0152355B1 (ko) 1994-03-24 1998-12-01 가나이 쓰토무 플라즈마 처리장치 및 처리방법
US6153115A (en) * 1997-10-23 2000-11-28 Massachusetts Institute Of Technology Monitor of plasma processes with multivariate statistical analysis of plasma emission spectra
JP3383236B2 (ja) 1998-12-01 2003-03-04 株式会社日立製作所 エッチング終点判定方法及びエッチング終点判定装置
US6782297B2 (en) 2001-05-24 2004-08-24 Eric Paul Tabor Methods and apparatus for data smoothing
JP3694662B2 (ja) * 2001-09-17 2005-09-14 株式会社日立製作所 半導体素子製造プロセスにおける膜の処理量測定方法と装置、及びそれを用いた被処理材の処理方法と装置、及びそれを用いたプロセスの終点判定方法と装置
US20040040658A1 (en) * 2002-08-29 2004-03-04 Tatehito Usui Semiconductor fabricating apparatus and method and apparatus for determining state of semiconductor fabricating process
JP2004110300A (ja) * 2002-09-17 2004-04-08 Japan Research Institute Ltd データ予測方法、データ予測装置、コンピュータプログラム、及び記録媒体
TWI246725B (en) 2002-10-31 2006-01-01 Tokyo Electron Ltd Method and apparatus for detecting endpoint
JP4943716B2 (ja) * 2006-03-01 2012-05-30 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP5026326B2 (ja) 2008-04-04 2012-09-12 株式会社日立ハイテクノロジーズ エッチング処理状態の判定方法、システム
JP5383265B2 (ja) 2009-03-17 2014-01-08 株式会社日立ハイテクノロジーズ エッチング装置、分析装置、エッチング処理方法、およびエッチング処理プログラム
US8731724B2 (en) * 2009-06-22 2014-05-20 Johnson Controls Technology Company Automated fault detection and diagnostics in a building management system
JP6186152B2 (ja) 2013-03-29 2017-08-23 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
JP6132688B2 (ja) 2013-07-18 2017-05-24 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI708275B (zh) * 2018-08-21 2020-10-21 日商日立全球先端科技股份有限公司 狀態預測裝置及半導體製造裝置

Also Published As

Publication number Publication date
US20200203133A1 (en) 2020-06-25
JP2016213360A (ja) 2016-12-15
TW201640580A (zh) 2016-11-16
KR101810875B1 (ko) 2017-12-20
JP6553398B2 (ja) 2019-07-31
US20160336154A1 (en) 2016-11-17
US11605530B2 (en) 2023-03-14
US10615010B2 (en) 2020-04-07
KR20160133352A (ko) 2016-11-22

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