TWI582412B - Chip on glass bonding inspection apparatus - Google Patents

Description

Bond inspection equipment for wafers on glass [Cross-reference to related applications]

The present application claims the priority of the Korean Patent Application No. 10-2014-0007705, filed on Jan. 22, 2014, the disclosure of which is hereby incorporated by reference.

The present invention relates to a chip on glass (COG) joint inspection apparatus. More specifically, the present invention relates to an on-glass wafer bonding inspection apparatus capable of simultaneously performing an indentation check sum alignment check to inspect a wafer bonding state on a glass.

In general, wafer bonding on a glass refers to bonding of a wafer to a panel when a display device is manufactured using a panel. The wafer provides an external control signal to the panel for visualizing the image.

Specifically, the process of wafer bonding on a glass is as follows: an anisotropic conductive film containing conductive particles is attached to a lead of a panel, and then the wafer is mounted on an anisotropic conductive film and applied to the anisotropic conductive film appropriately. The heat and pressure thereby bonding the leads of the panel to the wafer using an anisotropic conductive film. Here, the conductive particles contained in the anisotropic conductive film may be broken, and therefore, the leads of the panel are electrically connected to the wafer through the broken conductive particles.

However, if the wafer cannot be precisely aligned with the leads during wafer bonding on the glass, contact failure may occur. Therefore, after performing wafer bonding on the glass, it is required The joint state between the wafer and the panel is accurately inspected.

The inspection of the bonding state between the wafer and the panel may include: for inspecting the wafer Whether the conductive ball in the anisotropic conductive film between the panels is inspected by normal compression indentation, and an alignment test for verifying whether the wafer and the panel are both mounted (joined) at their precise positions.

According to the disclosure in Korean Patent Registration No. 10-0549470 (Patent Document 1) The indentation test captures the distribution state of the indentation impression as a mark of the fractured conductive particle into a three-dimensional image and analyzes the captured image to examine the state of engagement. Further, according to the alignment inspection disclosed in Korean Patent Publication No. 10-2010-0070814 (Patent Document 2), the alignment marks formed on the wafer and the alignment marks formed on the panel are each captured as an image, The degree of misalignment between the wafer and the panel is thereby verified based on the position of the corresponding alignment mark within the captured image.

However, the indentation inspection apparatus for indentation inspection according to the related art uses a line scan camera that takes a linear image by a linear unit while moving in the scanning direction, and an alignment inspection apparatus for alignment inspection. An area camera that shoots a certain area is used. Therefore, the indentation inspection device and the alignment inspection device need to be individually installed. Therefore, because the indentation check is performed separately for the sum check, it takes a long time to perform the test. In addition, since the indentation inspection apparatus and the alignment inspection apparatus are separately installed, the installation space and cost are increased.

[Prior art file] [patent file]

(Patent file 1) Patent file 1: Korean Patent Registration No. 10-0549470

(Patent file 2) Patent file 2: Korean Patent Publication No. 10-2010-0070814

One aspect of the present invention provides an on-glass wafer bonding inspection apparatus capable of simultaneously performing indentation inspection and alignment inspection in an inspection apparatus.

According to an aspect of the invention, there is provided an on-glass wafer bonding inspection apparatus comprising: a base; an inspection object, the inspection object being horizontally disposed with respect to the base; and a first imaging device, the first imaging device being mounted at the On the base and disposed under the inspection object, and the first imaging device irradiates visible light on the inspection object while moving relative to the inspection object in one direction (scanning direction) to follow a line scanning method and capturing a lower image of the inspection object using reflected light; a second imaging device mounted on the base and disposed above the inspection object, and the second imaging The device irradiates infrared light on the inspection object while moving in one direction (scanning direction) with respect to the inspection object to capture an upper image of the inspection object according to a line scanning method and using reflected light; driving a unit that moves the first imaging device and the second imaging device in a scanning direction; and controls loading The control device controls the driving unit, and the control device transmits a first linear trigger signal and a second linear trigger signal to the first imaging device and the second imaging device, respectively A linear trigger signal and the second linear trigger signal are synchronized with a moving speed of the first imaging device and the second imaging device along a scanning direction.

100‧‧‧Base

120‧‧‧rails

200‧‧‧First imaging device

210‧‧‧First optical system

220‧‧‧First light source

230‧‧‧ first camera

240‧‧‧Laser Displacement Sensor

300‧‧‧Second imaging device

310‧‧‧Second optical system

320‧‧‧Infrared light controller

330‧‧‧Second camera

340‧‧‧ fiber optic

400‧‧‧Inspection of objects

410‧‧‧ Anisotropic conductive film

411‧‧‧Electrical particles

420‧‧‧ wafer

421‧‧‧ wafer alignment mark

430‧‧‧Transparent panel

431‧‧‧ Panel alignment mark

432‧‧‧ lead

500‧‧‧Transfer

510‧‧‧ stage

520‧‧‧rail

530‧‧‧Drive motor

540‧‧‧Reference position positioning bracket

541‧‧‧through hole

610‧‧‧ stage

620‧‧‧ stage

630‧‧‧ stage

700‧‧‧ drive unit

710‧‧‧Scanning direction linear motor

720‧‧‧Moving motor in the vertical direction

810‧‧‧Connecting parts

900‧‧‧Control device

910‧‧‧First image input unit

920‧‧‧Second image input unit

930‧‧‧Image Processing Unit

940‧‧‧Trigger signal control unit

950‧‧‧Drive Control Unit

The above and other aspects, features, and other advantages of the present invention will be more clearly understood from the following description of the accompanying drawings. FIG. 1 is a perspective view of a wafer-on-chip wafer bonding inspection apparatus according to the present invention; 2 is a side view of a wafer-on-wafer bonding inspection apparatus according to the present invention; Figure 3 is an enlarged view showing a portion A of Figure 1; Figure 4 is a schematic view of a control device for a wafer-on-chip bonding inspection apparatus according to the present invention; and Figure 5 is a view for explaining a wafer-on-chip bonding inspection apparatus according to the present invention. View of the control; FIG. 6 is a view showing an object inspected by the on-glass wafer bonding inspection apparatus according to the present invention; and FIG. 7 is a view of an image captured by the on-glass bonding inspection apparatus according to the present invention. .

Hereinafter, the on-glass wafer bonding inspection apparatus according to the present invention will be described in detail with reference to the accompanying drawings. For the convenience of description, the same component symbols denote the same elements, and the repeated description will be omitted. Further, in the following description, the "line-scan method" means that the first imaging device 200 and the second imaging device 300 capture a linear image by a linear unit while moving in the X direction of FIG. Methods. Further, the X direction of FIG. 1 means that the first imaging device 200 and the second imaging device 300 capture the "scanning direction" of the linear image by the linear unit while moving. Here, the Z direction means "vertical direction".

1 and 2, a wafer-on-glass wafer bonding inspection apparatus 10 according to an embodiment of the present invention includes a base 100, a first image forming apparatus 200 mounted on a side surface of the base 100, and a second image forming apparatus mounted on an upper portion of the base 100. 300.

The base 100 has an elongated shape that continuously extends in the X direction (scanning direction). The first image forming apparatus 200 is disposed at a lower portion of one side surface of the base 100, and the second image forming apparatus 300 is disposed above the first imaging device 200 and spaced apart by a predetermined distance.

The object to be inspected 400 (hereinafter referred to as "inspection object") is set in the first imaging Between the device 200 and the second imaging device 300. Therefore, the first imaging device 200 captures the lower image of the inspection object 400, and the second imaging device 300 captures the upper image of the inspection object 400.

As shown in FIG. 6, the inspection object 400 can be similar to the upper wafer 420 and the lower The transparent panel 430 is an object of a liquid crystal panel that is bonded to each other by the anisotropic conductive film 410. The anisotropic conductive film 410 contains conductive particles 411, and upon bonding, the anisotropic conductive film 410 can be compressed under high temperature and high pressure.

Referring to FIG. 6, in the inspection object 400, on the lower surface of both ends of the wafer 420 Wafer alignment marks 421 are formed, and panel alignment marks 431 are formed on the upper surfaces of both ends of the transparent panel 430. Further, the wafer 420 and the leads 432 of the transparent panel 430 are disposed at the central portion of the inspection object 400 and electrically connected to each other through the conductive particles 411 of the anisotropic conductive film 410.

As shown in FIGS. 1 and 2, the first imaging device 200 irradiates visible light to the inspection. The image of the lower portion of the inspection object 400 is captured on the object 400 by the reflected light. To this end, the first imaging device 200 includes: a first light source 220 for generating visible light; and a first optical system 210 for illuminating the visible light generated by the first light source 220 onto the lower surface of the inspection object 400 to receive the reflected light; And a first camera 230 for converting light received in the first optical system 210 into an image and capturing an image. As shown in FIG. 6, since the transparent panel 430 is disposed at the lower portion of the inspection object 400, visible light irradiated from the first imaging device 200 passes through the transparent panel 430 and is then reflected by the panel alignment mark 431 and the lead 432. Since the first camera 230 receives the reflected light to capture an image, the first camera 230 can acquire an image related to the inspection area including the panel alignment mark 431 and the lead 432 in the inspection object 400.

The first imaging device 200 may have a concave indentation image of the compressed conductive particles 411 Capture into a three-dimensional image to verify the indentation state. Here, in order to acquire a three-dimensional image, the first optical system 210 includes a differential interference microscope. Since a differential interference microscope is generally known, a detailed description thereof will be omitted.

In addition, as shown in FIGS. 1 and 2, the first imaging device 200 includes a laser displacement The sensor 240 is used to measure the distance between the object 400 and the inspection object 400 for focusing.

The second imaging device 300 irradiates infrared light onto the inspection object 400 to utilize the inverse The light capture captures the upper image of the object 400. To this end, the second imaging device 300 includes an infrared light controller 320 for controlling an infrared lamp (not shown) to generate infrared light, and a second optical system 310 for illuminating the infrared light generated by the infrared light controller 320. To the upper surface of the inspection object 400 to receive the reflected light; and a second camera 330 for converting the light received in the second optical system 310 into an image and capturing an image. The infrared light generated by the infrared light controller 320 is introduced into the second optical system 310 through the optical fiber 340. The infrared light controller 320 is controlled by a control device 900 to be described below.

As shown in FIG. 6, because the opaque wafer 420 is disposed on the inspection object 400 Therefore, the infrared light irradiated from the second imaging device 300 passes through the wafer 420 and is then reflected by the wafer alignment mark 421. Because the second camera 330 receives the reflected light to capture an image, the second camera 330 can acquire an image related to the inspection zone that includes the wafer alignment mark 421 in the inspection object 400.

In addition, the first imaging device 200 and the second imaging device 300 follow the line scan side The method captures an image of the inspection object 400. As described above, according to the line scanning method, linear light having a long linear shape is irradiated onto the inspection object 400, and then the reflected linear light is received to convert the received linear light into a linear image and capture a linear image through a linear unit. . Therefore, along the sweep The image capture by linear light is continued while the direction is moving, and then the linear images captured by the linear unit are combined to acquire and examine the entire inspection area of the object 400 (including the wafer alignment mark 421 formed on the inspection object 400). An image related to the concave indentation of the conductive particles 411 and the area of the panel alignment mark 431. To this end, both the first camera and the second camera use a line scan camera.

In the on-glass wafer bonding apparatus 10 according to an embodiment of the present invention, An image forming apparatus 200 and a second image forming apparatus 300 each acquire an image relating to the inspection area in the line scanning method, so that all of the wafer alignment marks 421 and conductive particles 411 formed on the inspection object 400 can be formed by using one apparatus. The recessed indentation and the panel alignment mark 431 are captured as an image. Therefore, the alignment inspection using the images related to the wafer alignment marks 421 and the panel alignment marks 431 and the indentation inspection using the indentation images of the conductive particles 411 can be simultaneously performed. As a result, according to the on-glass wafer inspection apparatus, the inspection time and the number of apparatuses can be reduced as compared with the conventional on-wafer wafer bonding apparatus in which the alignment inspection apparatus and the indentation inspection apparatus are separately provided.

Because the first imaging device 200 and the second imaging device 300 both use a line scan side The first imaging device 200 and the second imaging device 300 can continuously capture an image of the inspection object 400 while moving along the scanning direction, thereby acquiring an image related to the entire inspection area of the inspection object 400. Next, the composition of the on-glass bonding apparatus according to the present invention will be described.

Referring to FIGS. 1 and 2, a scan along the surface of the base 100 is provided. Guide rails 110a and 110b extending in the direction. Further, the guide rails 110a and 110b are provided with a movement stage 610 which is movable in the scanning direction with respect to the guide rails 110a and 110b. The first scanning direction moving stage 610 is moved in the scanning direction along the guide rails 110a and 110b by the scanning direction linear motor 710 (i.e., the driving unit 700 driven by the electric signal).

Further, the first scanning direction moves the stage 610 and moves the stage in the second scanning direction The second scanning direction moving stage 620 is disposed to be movable relative to the upper surface of the base 100 along the scanning direction. Therefore, when the first scanning direction moving stage 610 moves along the scanning direction, the second scanning direction moving stage 620 can also move along the scanning direction together with the first scanning direction moving stage 610, and because of the second scanning direction The moving stage 620 supports the first scanning direction moving stage 610 connected to the side surface of the base 100 in the horizontal direction, so that the first scanning direction moving stage 610 can be kept stable.

In addition, the infrared light controller 320 is fixed in the second scanning direction to move the stage. The upper part of the 620. Therefore, the infrared light controller 320 can move along the scanning direction together with the second scanning direction moving stage 620 by moving the movement of the stage 620 by the second scanning direction.

Although in the embodiment the second scanning direction moves the stage 620 with the first scan The infrared light controller 320 is supported while the moving direction of the moving stage 610 is connected, but the present invention is not limited thereto. For example, if the infrared light controller 320 does not have to move in the scanning direction according to one design, the second scanning direction moving stage 620 can be omitted.

a side surface of the moving stage 610 in the first scanning direction is disposed along the Z direction A guide rail 120 that extends (vertical direction). Further, a vertical movement stage 630 capable of moving vertically with respect to the guide rail 120 is attached to the guide rail 120. The vertical direction moving stage 630 is vertically moved along the guide rail 120 by the control of the vertical direction moving motor 720 (i.e., the driving unit 700 driven by the electric signal).

For reference, in the present embodiment, the mobile stage 600 includes a first scanning direction. The moving stage 610 and the second scanning direction moving stage 620 (in some cases, only the first scanning direction moving stage 610) and the vertical direction moving stage 630. In addition, for moving the stage 600 The driving unit 700 that moves in the scanning direction and the vertical direction includes a scanning direction linear motor 710 and a vertical direction driving motor 720.

The first image forming apparatus 200 is fixed to the vertical movement stage 630. In addition, The second image forming apparatus 300 is connected to the vertical direction moving stage 630 by using the connecting member 810 as an intermediate. Since the vertical direction moving stage 630 is vertically moved by the operation of the vertical direction driving motor 720 and is connected to the first scanning direction moving stage 610 that is moved in the scanning direction by the scanning direction linear motor 710, the stage 630 is moved in the vertical direction. It can also be moved in the scanning direction. Therefore, the first imaging device 200 and the second imaging device 300 connected to the vertical direction moving stage 630 can move relative to the base 100 in the scanning direction and the vertical direction. Further, the first imaging device 200 and the second imaging device 300 may move together with each other. Thus, since the first imaging device 200 and the second imaging device 300 move together with each other in the scanning direction along the same region, the first imaging device 200 and the second imaging device 300 can respectively be in the upper portion of the inspection object 400 in accordance with the line scanning method. And the lower part acquires an image related to the same inspection area.

As shown in FIG. 1 and FIG. 2, the wafer bonding inspection device on the glass according to the embodiment The device 10 includes a transfer device 500 for transporting the test object 400 such that the test object 400 is disposed between the first image forming device 200 and the second image forming device 300. The conveying device 500 is provided to be movable relative to the guide rail 520 extending in the Y direction and driven by the drive motor 530. An inspection stage 510 is disposed on an upper portion of the conveying device 500, and the inspection object 400 is placed on the inspection stage 510. As long as the inspection object 400 is placed on the conveying device 500, the conveying device 500 moves relative to the base 100 in a direction opposite to the Y direction to position the inspection object 400 between the first imaging device 200 and the second imaging device 300. The position of the transfer device 500 is not limited. Therefore, the description related to the configuration of the conveying device 500 will be omitted.

On-glass wafer bonding inspection apparatus including the above configuration according to the present embodiment In the preparation 10, the capturing positions of the first imaging device 200 and the second imaging device 300 in the scanning direction may be the same to acquire an accurate upper image of the inspection object 400 in the same inspection region of the upper and lower portions of the inspection object 400. And the lower image. To this end, the first imaging device 200 and the second imaging device 300 may be configured to: before the first imaging device 200 and the second imaging device 300 move in the scanning direction, the visible light emission position and the second imaging of the first imaging device 200 The infrared light emission positions of the device 300 are aligned with each other. That is, as described above, since the first imaging device 200 and the second imaging device 300 are moved together with each other in the scanning direction by the same driving unit 700 (ie, the scanning direction linear motor 710), if the first imaging is performed Before the device 200 and the second imaging device 300 move along the scanning direction, the capturing positions of the first imaging device 200 and the second imaging device 300 are the same, then the inspection object can be acquired by the first imaging device 200 and the second imaging device 300. Images captured in the same inspection area above and below the 400.

As shown in FIG. 3, an inspection stage from the conveyor 500 is provided in the present embodiment. The reference position positioning bracket 540 that protrudes from one side of the 510 causes the capturing position of the first imaging device 200 and the capturing position of the second imaging device 300 to be aligned with each other. Further, a through hole 541 that vertically passes through the reference position positioning bracket 540 is defined in the reference position positioning bracket 540.

Specifically, in order to be along the first imaging device 200 and the second imaging device 300 Before the scanning direction is moved, the reference position positioning bracket 540 is used to align the capturing position of the first imaging device 200 with the capturing position of the second imaging device 300, and the conveying device 500 may be moved first, so that the reference position positioning bracket 540 is disposed at the first position. Between the imaging device 200 and the second imaging device 300, upper and lower images of the reference position locating bracket 540 can then be captured by the first imaging device 200 and the second imaging device 300. Then, you can analyze the captured image to The center position of the through hole 541 of the reference position positioning bracket 540 is measured. Thereafter, the positions of the first imaging device 200 and the second imaging device 300 can be adjusted to align the center positions with each other.

Even if the capture position of the first imaging device 200 and the capture of the second imaging device 300 The capture position is initially the same, and the capture position of the first imaging device 200 and the capture position of the second imaging device 300 may also be misaligned during use. In this case, the image of the reference position positioning bracket 540 may be periodically captured during use to measure the degree of misalignment between the capturing position of the first imaging device 200 and the capturing position of the second imaging device 300. The measured value can then be returned to the analysis of the image of the relevant inspection area. As a result, the on-glass wafer bonding inspection apparatus 10 can acquire the upper image and the lower image (captured by the first imaging device 200 and the second imaging device 300) of the inspection object 400 at the same position of the inspection region of the inspection object 400. Therefore, an accurate indentation check summation alignment test can be performed based on the acquired image.

Although the present embodiment defines a through hole 541 in the reference position positioning bracket 540, However, instead of the through hole 541, a mark whose image can be captured by the first imaging device 200 and the second imaging device 300 can be formed.

Furthermore, the first imaging device 200 and the second imaging device 300 are driven by means of a drive unit The vertical movement of 700 (i.e., the vertical direction driving motor 720) is mainly used to move the first imaging device 200 in the Z direction (vertical direction), thereby measuring the focus direction with respect to the inspection object 400 using the laser displacement sensor 240. Then, when the upper linear image and the lower linear image of the inspection object 400 are captured by the first imaging device 200 and the second imaging device 300, the focus of the first imaging device 200 and the focus of the second imaging device 300 are made to be in focus with each other.

Specifically, when the first imaging device 200 and the second imaging device 300 are provided At the time, the first imaging device 200 is disposed to inspect the object 400 along the Z direction (vertical direction) At the position where the focusing is performed, the second imaging device 300 is then placed at a position where the inspection object 400 is focused in the vertical direction. When the first imaging device 200 and the second imaging device 300 are moved along the scanning direction to capture the upper linear image and the lower linear image of the inspection object 400, the inspection object 400 and the first imaging are measured using the laser displacement sensor 240. The focal length between the devices 200 is then moved by the first imaging device 200 in the vertical direction based on the focal length to focus the focus of the first imaging device 200. Here, as described above, since the second imaging device 300 moves in the vertical direction together with the vertical movement of the first imaging device 200, if the focus of the first imaging device 200 is in focus, the focus of the second imaging device 300 is also Can focus.

The connecting member 810 is disposed between the first imaging device 200 and the second imaging device 300. Further, the connecting member 810 may have a side that is open toward the conveying device 500 and is " The other side of the shape. The inspection object 400 moved by the conveying device 500 in a direction opposite to the Y direction (a direction perpendicular to the scanning direction) can be accommodated by " "The shape is limited to the space. Therefore, the movement of the inspection object 400 does not interfere with the connection member 810.

Further, since the conveying device 500 conveys the inspection object 400 and the reference position positioning bracket 540 in the Y direction, the scanning directions of the first imaging device 200 and the second imaging device 300 do not interfere with each other.

The on-glass wafer bonding inspection apparatus 10 according to the present embodiment includes a control device 900 for driving the driving unit 700, controlling image capturing of the first imaging device 200 and the second imaging device 300, and analyzing and capturing Image to determine if there is an error in the engagement status. The control device 900 may be built in a computer that transmits and receives electrical signals to/from the drive unit 700, the first imaging device 200, and the second imaging device 300 and stores a program for analyzing the captured images.

4 is a diagram showing the control device 900 controlling the drive unit 700 and the first imaging device A block diagram of the process of image capture of the second imaging device 300 to process the captured image. Referring to FIG. 4, the control device 900 includes a first image input unit 910 and a second image input unit 920 for using a linear unit from the first imaging device. 200 and the second imaging device 300 receive a linear image; and an image processing unit 930 for combining and analyzing the received linear image. Further, the control device 900 includes a drive control unit 950 for controlling the movement of the drive unit 700, and a trigger signal control unit 940 for transmitting the first linear trigger signal and the The two linear trigger signals, the first imaging device 200 and the second imaging device 300 perform image capturing by the first linear trigger signal and the second linear trigger signal.

Specifically, the drive control unit 950 drives the scan direction linear motor 710 to move the first imaging device 200 and the second imaging device 300 at a constant speed in the scanning direction. Further, the drive control unit 950 controls the vertical direction motor 720 such that when the first imaging device 200 and the second imaging device 300 move along the scanning direction and continuously capture a linear image, the first imaging device 200 and the second imaging device 300 Focus focus.

Further, the trigger signal control unit 940 receives the encoded signal generated by the driving unit 700 for controlling the scanning direction movement (ie, the scanning direction linear motor 710) to respectively transmit the first linear trigger signal and the second linear trigger signal to The first imaging device 200 and the second imaging device 300. According to the pulse period of each of the first linear trigger signal and the second linear trigger signal transmitted from the trigger signal control unit 940, both the first imaging device 200 and the second imaging device 300 can capture one linear pattern per pulse. image.

Here, according to the solutions of the first imaging device 200 and the second imaging device 300, respectively The resolution determines a pulse period of the first linear trigger signal and a pulse period of the second linear trigger signal. For example, as shown in FIG. 5, when the resolution of the first imaging device 200 is about 0.72 μm/pixel, the pulse period of the first linear trigger signal may be about 0.72 μm/pulse. Further, when the resolution of the second imaging device 300 is about 1.44 μm/pixel, the pulse period of the second linear trigger signal may be about 1.44 μm/pulse.

In this case, the first imaging device 200 can capture a linear image at a distance of about 0.72 μm, and the second imaging device 300 can capture a linear image at a distance of about 1.44 μm. Therefore, when the first imaging device 200 captures two linear images, the second imaging device 300 can capture a linear image. Therefore, the first imaging device 200 and the second imaging device 300 can acquire an image related to the same position in the inspection area of the inspection object 400 along the scanning direction.

Since the first imaging device 200 and the second imaging device 300 using the line scanning method respectively capture linear images while moving in the scanning direction, the pulse period of the first linear trigger signal transmitted to the first imaging device 200 and The pulse period of the second linear trigger signal transmitted to the second imaging device 300 may be matched (synchronized) with the moving speed of the first imaging device 200 and the second imaging device 300 in the scanning direction. For example, as shown in FIG. 5, when the pulse period of the encoded signal of the scanning direction linear motor 710 is about 0.18 μm/pulse, the pulse period of the first linear trigger signal is 0.72 μm/pulse, and the pulse of the second linear trigger signal When the period is about 1.44 μm/pulse, the trigger signal control unit 940 transmits the first linear trigger signal to the first imaging device 200 based on the received encoded signal of the linear motor 710 in the scanning direction to be about 0.18 μm/per cycle. The four pulses of the pulse match and the second linear trigger signal is sent to the second imaging device 300 to match eight pulses of approximately 0.18 [mu]m per pulse per cycle.

As a result, scanning along with the first imaging device 200 and the second imaging device 300 In the case where the moving speed of the direction is matched (ie, synchronized), the first imaging device 200 and the second imaging device 300 can capture a linear image. If the pulse period of each of the first linear trigger signal and the second linear trigger signal is faster or slower than the moving speed of each of the first imaging device 200 and the second imaging device 300 along the scanning direction, then Both the first imaging device and the second imaging device may capture a linear image that is narrower or wider than its moving distance, thereby obtaining an inaccurate image.

As described above, the wafer bonding inspection apparatus 10 on glass according to the present invention Because the pulse periods of the first linear trigger signal and the second linear trigger signal of the first imaging device 200 and the second imaging device 300 are synchronized with and matched with the encoded signals transmitted from one scanning direction linear motor 710, the glass The upper wafer bonding inspection apparatus 10 can acquire an accurate upper image and a lower image in the inspection area of the inspection object 400.

Next, the operation of the on-glass wafer bonding inspection apparatus 10 including the above configuration will be described.

First, the first imaging device 200 and the second imaging device 300 are arranged to cause the first imaging device 200 with the reference position positioning bracket 540 before transferring the inspection object 400 between the first imaging device 200 and the second imaging device 300. The capturing positions of the second imaging device 300 are aligned with each other. Thereafter, the inspection object 400 is placed on the conveyor 500, and then the conveyor 500 is moved in a direction opposite to the Y direction to position the inspection object 400 between the first imaging device 200 and the second imaging device 300.

Then, the scanning direction linear motor 710 of the driving unit 700 is driven to move the first imaging device 200 and the second imaging device 300 in the scanning direction. Here, the trigger signal control unit 940 of the control device 900 receives the encoded signal of the scanning direction linear motor 710. No. to generate a first linear trigger signal and a second linear trigger signal synchronized with the moving speeds of the first imaging device 200 and the second imaging device 300 based on the received encoded signal. In the case where the first linear trigger signal and the second linear trigger signal are matched with the moving speed along the scanning direction, the first imaging device 200 and the second imaging device 300 respectively capture the inspection of the inspection object 400 along the scanning direction. The area is related to the upper linear image and the lower linear image.

The captured upper linear image and lower linear image are respectively input to the first image The input unit 910 and the second image input unit 920. The image processing unit 930 may combine the upper linear image and the lower linear image, respectively, to acquire an upper image and a lower image related to the inspection area of the inspection object 400, as shown in FIG.

Referring to FIG. 7, a lower image confirmation guide that can be captured from the first imaging device 200 A recessed indentation of the electric particles 411 (present in the lead 432 of the transparent panel 430) and a panel alignment mark 431 disposed at both ends of the transparent panel 430, and the wafer alignment can be confirmed from the upper image captured by the second imaging device 300 Mark 421.

Control device 900 can perform an alignment check to pass the wafer alignment mark The degree of misalignment between the wafer 420 and the transparent panel 430 is checked by comparing the position of the 421 on the upper image with the position of the panel alignment mark 431 on the lower image. In addition, the control device 900 can also perform an indentation test to inspect the concave indentations of the conductive particles 411 on the lower image.

Moving in the scanning direction between the first imaging device 200 and the second imaging device 300 Meanwhile, the first imaging device 200 and the second imaging device 300 may focus on the focal points of the first imaging device 200 and the second imaging device 300 by using the laser displacement sensor 240 and based on the distance from the inspection object 400. Move in the Z direction (vertical direction).

As described above, according to the present invention, because the first imaging device 200 and the second imaging device The image device 300 acquires a linear image by a linear unit according to the line scanning method, so that the alignment check can be performed simultaneously by using one inspection device. However, in the prior art, the alignment check is performed by different devices. . Therefore, the inspection time can be shortened and the installation space and cost of the device can be reduced.

Further, according to the present invention, the first imaging device 200 and the second imaging device 300 The first linear trigger signal and the second linear trigger signal may be synchronized with the moving speeds of the first imaging device and the second imaging device to more accurately capture the upper image and the lower image related to the inspection region of the inspection object 400. Therefore, a more accurate alignment checksum total indentation test can be performed.

Although the preferred embodiment of the invention has been disclosed, it does not depart from the appended claims Various changes and modifications of the invention may be made by those skilled in the art without departing from the scope of the invention. It is also to be understood that the terms of the invention are intended to be illustrative and not restrictive, and various modifications may be made without departing from the scope and spirit of the invention.

For example, although a first imaging device is provided in the foregoing embodiment The scanning direction linear motor 710 is moved 200 and the second imaging device 300 in the scanning direction, but the present invention is not limited thereto. That is, a linear motor for moving the first imaging device 200 in the scanning direction and a linear motor for moving the second imaging device 300 in the scanning direction may be separately provided. In this case, the trigger signal control unit 940 of the control device 900 may receive the encoded signal from each linear motor and transmit the first linear trigger signal and the second linear trigger signal to the first imaging based on the received encoded signal. The device 200 and the second imaging device 300.

Further, although in the foregoing embodiment, the control for controlling the driving unit 700 The device 900 together provides the trigger signal control unit 940, but the invention is not limited thereto. For example, the trigger signal control unit 940 can be separately provided with respect to the control device for controlling the drive unit 700.

Further, although in the foregoing embodiment, the first imaging device 200 and the second imaging device The setting 300 moves in the scanning direction with respect to the inspection object 400, but the present invention is not limited thereto. For example, the first imaging device 200 and the second imaging device 300 may be fixed, and may provide a driving unit (linear motor) for moving the conveying device 500 on which the inspection object 400 is placed in the X direction (scanning direction). To allow the inspection object 400 to move in the scanning direction with respect to the first imaging device 200 and the second imaging device 300. Here, the trigger signal control unit 940 may receive a drive unit (linear motor) coded signal for moving the transfer device 500 in the scan direction, and a first linear trigger that synchronizes the moving speed of the inspection object 400 along the scan direction. The signal and the second linear trigger signal are transmitted to the first imaging device 200 and the second imaging device 300.

According to the invention as described above, since the visible light is irradiated to capture the inspection object The first imaging device of the lower image and the second imaging device that illuminates the infrared light to capture the upper image of the inspection object all acquire the linear image through the linear unit according to the line scanning method, so that the alignment check sum can be simultaneously performed by one inspection device Indentation inspection, however, alignment correction verification of the total indentation is performed by different equipment in the prior art. Therefore, the inspection time for checking the joint state can be shortened and the installation space and cost of the apparatus can be reduced.

100‧‧‧Base

120‧‧‧rails

200‧‧‧First imaging device

210‧‧‧First optical system

220‧‧‧First light source

230‧‧‧ first camera

240‧‧‧Laser Displacement Sensor

300‧‧‧Second imaging device

310‧‧‧Second optical system

320‧‧‧Infrared light controller

330‧‧‧Second camera

340‧‧‧ fiber optic

400‧‧‧Inspection of objects

500‧‧‧Transfer

510‧‧‧ stage

520‧‧‧rail

530‧‧‧Drive motor

540‧‧‧Reference position positioning bracket

610‧‧‧ stage

620‧‧‧ stage

630‧‧‧ stage

710‧‧‧Scanning direction linear motor

720‧‧‧Moving motor in the vertical direction

810‧‧‧Connecting parts

Claims (7)

An on-glass wafer bonding inspection apparatus for inspecting an inspection object, the apparatus comprising: a base; a first imaging device mounted on the base and disposed under the inspection object, and The first imaging device irradiates visible light on the inspection object while moving in one direction (scanning direction) with respect to the inspection object to capture a lower image of the inspection object according to a line scanning method and using reflected light a second imaging device mounted on the base and disposed above the inspection object, and the second imaging device is in one direction relative to the inspection object (the scanning Irradiating the infrared light on the inspection object while moving, to capture an upper image of the inspection object according to a line scanning method and using reflected light; a driving unit that causes the first imaging device and The second imaging device moves along a scanning direction; and a control device that controls the driving unit, and the control The device transmits a first linear trigger signal and a second linear trigger signal to the first imaging device and the second imaging device, respectively, the first linear trigger signal and the second linear trigger signal Synchronizing the moving speed of the first imaging device and the second imaging device along the scanning direction, wherein the control device synchronizes the first linear trigger signal and the sound based on the encoded signal transmitted from the driving unit The second linear trigger signal is described. The on-glass wafer bonding inspection apparatus of claim 1, further comprising a moving stage, wherein the moving stage moves along the scanning direction relative to the base by the driving unit, Wherein the first imaging device and the second imaging device are coupled to the moving stage to move along the scanning direction along with movement of the moving stage. The on-glass wafer bonding inspection apparatus of claim 1, wherein the first imaging device and the second imaging device are disposed to: a visible light emission position of the first imaging device and the second The infrared light emission positions of the imaging device are aligned with each other. The on-glass wafer bonding inspection apparatus of claim 1, further comprising a conveying device for conveying the inspection object such that the inspection object is disposed at the first imaging device and Between the second imaging devices, wherein the transfer device is provided with a reference position positioning bracket for confirming the capturing position of the first imaging device and the capturing of the second imaging device position. The on-glass wafer bonding inspection apparatus of claim 1, wherein the pulse period of the first linear trigger signal is determined based on resolutions of the first imaging device and the second imaging device, respectively And a pulse period of the second linear trigger signal. The on-glass wafer bonding inspection apparatus according to any one of claims 1 to 5, wherein the inspection object is manufactured by joining an upper wafer to a lower transparent panel by using an anisotropic conductive film, and The lower image of the inspection object includes a panel alignment mark formed on the transparent panel and a concave indentation of conductive particles contained in the anisotropic conductive film, and an upper image of the inspection object includes formation The wafer alignment marks on the wafer. The on-glass wafer bonding inspection apparatus according to any one of claims 1 to 5, wherein the first imaging device and the second imaging device are vertically movable to make Each of the focal points of the first imaging device and the second imaging device is in focus.