CN104792800A - Chip on glass bonding inspection apparatus - Google Patents
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- CN104792800A CN104792800A CN201410220535.XA CN201410220535A CN104792800A CN 104792800 A CN104792800 A CN 104792800A CN 201410220535 A CN201410220535 A CN 201410220535A CN 104792800 A CN104792800 A CN 104792800A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
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Abstract
The invention provides a chip on glass bonding inspection apparatus. The chip on glass bonding inspection apparatus comprises a base, an inspection object horizontally disposed relative to the base, a first imaging device installed on the base and disposed below the inspection object, a second imaging device installed on the base and disposed over the inspection object, a drive unit enabling the first and second imaging devices to move in the scanning direction, and a control device controlling the drive unit. The first imaging device moves relative to the inspection object in one direction (scanning direction) and irradiates visible light on the inspection object at the same time, and captures a lower-part image of the inspection object by utilizing reflected light according to a row scanning method; the second imaging device moves relative to the inspection object in the direction (scanning direction) and irradiates infrared light on the inspection object at the same time, and captures an upper-part image of the inspection object by utilizing reflected light according to the row scanning method; and the control device sends first and second linear trigger signals synchronous with moving speeds of the first and second imaging devices in the scanning direction respectively to the first and second imaging devices.
Description
The cross reference of related application
This application claims the right of priority that on January 22nd, 2014 submits the korean patent application No.10-2014-0007705 of Korean Intellectual Property Office to, by reference the disclosure of this application is incorporated to herein at this.
Technical field
The present invention relates to glass top chip (chip on glass, COG) and engage inspection machine.More particularly, the present invention relates to and carry out impression inspection simultaneously and aim at inspection checking the glass top chip of glass top chip engagement state to engage inspection machine.
Background technology
In general, glass top chip engages the joint referring to chip and panel when using panel to manufacture display device.Chip is provided for the external control signal of appearing picture to panel.
Specifically, the process that glass top chip engages is as follows: be attached on the lead-in wire of panel by the anisotropic conductive film containing conductive particle, then chip to be arranged in anisotropic conductive film and to apply suitable heat and pressure to anisotropic conductive film, thus utilizing anisotropic conductive film by the lead-in wire of panel and chip join.Here, the conductive particle contained by anisotropic conductive film can break, and therefore, the lead-in wire of panel is connect by the conductive particle that breaks and chip electrical.
But, if chip accurately can not be aimed at lead-in wire when carrying out glass top chip and engaging, so may contact fault be there is.Therefore, after carrying out glass top chip joint, need the engagement state accurately between checking chip and panel.
Whether the inspection of the engagement state between chip and panel can comprise: checked by normally-compacted impression for the conducting sphere in the anisotropic conductive film between checking chip and panel, and whether all installs (joint) aligning in its exact position for checking chip and panel and check.
Check according to impression disclosed in Korea patent registration No.10-0549470 (patent document 1), the distribution of the recessed impression (indentationimpression) as the conductive particle mark that breaks is captured as 3-D view and analyzes the image of catching, thus inspection engagement state.In addition, inspection is aimed at according to disclosed in Korean patent publication No.10-2010-0070814 (patent document 2), the alignment mark be formed on chip and the alignment mark be formed on panel are all captured as image, thus carry out the misalignment degree between checking chip and panel according to the position of the respective aligned mark of catching in image.
But, the impression inspection machine for impression inspection according to prior art uses at the linescan cameras being taken linear image while the movement of direction of scanning by linear unit, and uses for the aligning inspection machine aiming at inspection the area camera taken certain area.Therefore, impression inspection machine and aligning inspection machine need to install separately.Like this, because carry out separately impression inspection and aim at inspection, test so the longer time can be taken.In addition, establish, so add installing space and cost because install separately impression inspection machine and aim at inspection.
[prior art file]
[patent document]
(patent document 1) patent document 1: Korea patent registration No.10-0549470
(patent document 2) patent document 2: Korean patent publication No.10-2010-0070814
Summary of the invention
One aspect of the present invention provides a kind of glass top chip joint inspection machine that can carry out impression inspection simultaneously and aim at inspection in a verifying attachment.
According to an aspect of the present invention, provide a kind of glass top chip and engage inspection machine, comprising: base; Inspection object, described inspection object is horizontally disposed with relative to described base; First imaging device, described first imaging device to be arranged on described base and to be arranged on described inspection underbelly, and described first imaging device relative to described inspection object along while the movement of a direction (direction of scanning) by radiation of visible light on described inspection object, to utilize reflected light to catch the bottom graph picture of described inspection object according to line scanning method; Second imaging device, described second imaging device to be arranged on described base and to be arranged on the top of described inspection object, and described second imaging device relative to described inspection object along while the movement of a direction (direction of scanning) by Infrared irradiation on described inspection object, to utilize reflected light to catch the upper image of described inspection object according to line scanning method; Driver element, described driver element makes described first imaging device and described second imaging device move along direction of scanning; And control device, described control device controls described driver element, and the first linear trigger pip and the second linear trigger pip are sent to described first imaging device and described second imaging device by described control device respectively, the described first linear trigger pip and the described second linear trigger pip and described first imaging device and described second imaging device synchronous along the translational speed of direction of scanning.
Accompanying drawing explanation
Below in conjunction with in the detailed description of accompanying drawing, above and other aspect of the present invention, other advantages of characteristic sum more clearly will be understood, in accompanying drawing:
Fig. 1 is the skeleton view engaging inspection machine according to glass top chip of the present invention;
Fig. 2 is the outboard profile engaging inspection machine according to glass top chip of the present invention;
Fig. 3 is the enlarged drawing of the part A that Fig. 1 is shown;
Fig. 4 is the schematic diagram of the control device engaging inspection machine according to glass top chip of the present invention;
Fig. 5 is the view for illustration of controlling glass top chip joint inspection machine according to the present invention;
Fig. 6 shows the view being engaged the object that inspection machine is tested by glass top chip according to the present invention; And
Fig. 7 is the view being engaged the image that inspection machine is caught by glass top chip according to the present invention.
Embodiment
Below, describe in detail according to glass top chip joint inspection machine of the present invention with reference to accompanying drawing.For convenience of description, identical Reference numeral represents identical element, and will omit the description repeated.In addition, in the following description, " line scanning method " refers to that the method for linear image caught by the first imaging device 200 and the second imaging device 300 while the X-direction movement along Fig. 1 by linear unit.In addition, the X-direction of Fig. 1 refers to that the first imaging device 200 and the second imaging device 300 are caught by linear unit " direction of scanning " of linear image while movement.Here, Z-direction refers to " vertical direction ".
With reference to figure 1 and Fig. 2, engage inspection machine 10 according to the glass top chip of the embodiment of the present invention and comprise: base 100, be arranged on the first imaging device 200 of the side surface of base 100 and be arranged on second imaging device 300 on top of base 100.
Base 100 has along the X direction the elongate in shape that (direction of scanning) continues to extend.First imaging device 200 is arranged on the bottom of a side surface of base 100, and the second imaging device 300 to be arranged on above the first imaging device 200 and position spaced a predetermined distance.
Object 400 (hereinafter referred to as " inspection object ") to be tested is arranged between the first imaging device 200 and the second imaging device 300.Therefore, inspection object 400 bottom graph picture caught by the first imaging device 200, and inspection object 400 upper image caught by the second imaging device 300.
As shown in Figure 6, object 400 is checked can be the object being similar to the liquid crystal panel that upper chip 420 is bonded with each other by anisotropic conductive film 410 with lower transparent panel 430.Anisotropic conductive film 410 is containing conductive particle 411, and when engaging, anisotropic conductive film 410 can be compressed at high temperature under high pressure.
With reference to figure 6, in inspection object 400, the lower surface at chip 420 two ends all forms chip alignment mark 421, the upper surface at transparent panel 430 two ends all forms panel alignment mark 431.In addition, the lead-in wire 432 of chip 420 and transparent panel 430 is arranged on the core of inspection object 400 and is electrically connected to each other by the conductive particle 411 of anisotropic conductive film 410.
As depicted in figs. 1 and 2, the first imaging device 200 checks object 400 bottom graph picture by radiation of visible light to inspection object 400 to utilize reflected light to catch.For this reason, the first imaging device 200 comprises: the first light source 220, for generation of visible ray; First optical system 210, to receive reflected light on the radiation of visible light that produced by the first light source 220 to the lower surface of inspection object 400; And first camera 230, for the light received in the first optical system 210 is converted to image and catches image.As shown in Figure 6, because transparent panel 430 is arranged on the bottom of inspection object 400, so pass transparent panel 430 then by panel alignment mark 431 and lead-in wire 432 reflection from the visible ray of the first imaging device 200 irradiation.Because first camera 230 receives reflected light to catch image, thus first camera 230 can obtain with comprise check panel alignment mark in object 400 431 and go between 432 the relevant image in inspection district.
The recessed indentation image of compression conductive particle 411 can be captured as 3-D view to check impression state by the first imaging device 200.Here, in order to obtain 3-D view, the first optical system 210 comprises differential interference microscope.Because differential interference microscope is normally known, therefore omit it and describe in detail.
In addition, as depicted in figs. 1 and 2, the first imaging device 200 comprises laser displacement sensor 240, and this laser displacement sensor 240 is for measuring and checking the distance between object 400 to focus.
Second imaging device 300 checks object 400 upper image by Infrared irradiation to inspection object 400 to utilize reflected light to catch.For this reason, the second imaging device 300 comprises: infrared light controller 320, for controlling infrared lamp (not shown) to produce infrared light; Second optical system 310, to receive reflected light on the Infrared irradiation that produced by infrared light controller 320 to the upper surface of inspection object 400; And second camera 330, for the light received in the second optical system 310 is converted to image and catches image.The infrared light that infrared light controller 320 produces introduces the second optical system 310 by optical fiber 340.Infrared light controller 320 is controlled by the control device 900 that will describe below.
As shown in Figure 6, because opaque chip 420 is arranged on the top of inspection object 400, so then reflected by chip alignment mark 421 from the infrared light of the second imaging device 300 irradiation through chip 420.Because second camera 330 receives reflected light to catch image, so second camera 330 can obtain the image relevant with the inspection district comprising the chip alignment mark 421 checked in object 400.
In addition, the first imaging device 200 and the second imaging device 300 catch the image of inspection object 400 according to line scanning method.As described above, according to line scanning method, the linear light irradiation that will have a long linearity configuration is on inspection object 400, and the linear light then receiving reflection is to convert the linear light of reception to linear image by linear unit and to catch linear image.Therefore, continuing to carry out the image capture by linear light while the movement of direction of scanning, then the linear image of being caught by linear unit is being combined obtain the image relevant with the whole inspection district (comprise and be formed in the chip alignment mark 421 checked on object 400, the recessed impression of conductive particle 411 and the region of panel alignment mark 431) of inspection object 400.For this reason, first camera and second camera all use linescan cameras.
According in the glass top chip junction apparatus 10 of the embodiment of the present invention, because the first imaging device 200 all obtains the image relevant with the inspection district in line scanning method with the second imaging device 300, so all recessed impression of the chip alignment mark 421 be formed on inspection object 400, conductive particle 411 and panel alignment mark 431 can be captured as image by use device.Therefore, can carry out using the aligning of the image relevant with panel alignment mark 431 with chip alignment mark 421 to check and use the impression of the indentation image of conductive particle 411 to check simultaneously.As a result, according to glass top chip verifying attachment, on the Conventional glass arranged separately with aligning verifying attachment and impression verifying attachment, chip join equipment is compared, and can reduce proving time and device quantity.
Because the first imaging device 200 and the second imaging device 300 all use line scanning method, so the first imaging device 200 and the second imaging device 300 are at the image can catching inspection object 400 while the movement of direction of scanning continuously, thus obtain the image relevant with the whole inspection district of inspection object 400.Below, the composition according to glass top chip junction apparatus of the present invention will be described.
With reference to figure 1 and Fig. 2, a surface of base 100 is provided with guide rail 110a and 110b extended along direction of scanning.In addition, guide rail 110a and 110b being provided with can along direction of scanning relative to the first direction of scanning moving stage 610 of guide rail 110a and 110b movement.First direction of scanning moving stage 610 is moved along guide rail 110a and 110b in a scanning direction by direction of scanning linear motor 710 (that is, the driver element 700 driven by electric signal).
In addition, the first direction of scanning moving stage 610 is connected with the second direction of scanning moving stage 620, and this second direction of scanning moving stage 620 is arranged to move along direction of scanning relative to the upper surface of base 100.Therefore, when the first direction of scanning moving stage 610 moves along direction of scanning, second direction of scanning moving stage 620 also can move along direction of scanning together with the first direction of scanning moving stage 610, and because the second direction of scanning moving stage 620 supports the first direction of scanning moving stage 610 be connected with the side surface of base 100, in the horizontal direction so the first direction of scanning moving stage 610 can keep stable.
In addition, above-mentioned infrared light controller 320 is fixed on the top of the second direction of scanning moving stage 620.Therefore, infrared light controller 320 can move along direction of scanning together with the second direction of scanning moving stage 620 by the movement of the second direction of scanning moving stage 620.
Although the second direction of scanning moving stage 620 supports infrared light controller 320 while being connected with the first direction of scanning moving stage 610 in the present embodiment, the present invention is not limited thereto.Such as, if need not move along direction of scanning according to one design infrared light controller 320, the second direction of scanning moving stage 620 can so be omitted.
The side surface of the first direction of scanning moving stage 610 is provided with along the Z direction the guide rail 120 that (vertical direction) extends.In addition, guide rail 120 being provided with can relative to the vertical direction moving stage 630 of the vertical movement of guide rail 120.Vertical direction moving stage 630 by the control of vertical direction travel motor 720 (that is, the driver element 700 driven by electric signal) along guide rail 120 vertically movement.
As a reference, in the present embodiment, moving stage 600 comprises the first direction of scanning moving stage 610 and the second direction of scanning moving stage 620 (only comprising the first direction of scanning moving stage 610 in some cases) and vertical direction moving stage 630.In addition, for making moving stage 600 comprise direction of scanning linear motor 710 and vertical direction drive motor 720 along the driver element 700 of direction of scanning and vertical direction movement.
First imaging device 200 is fixed on vertical direction moving stage 630.In addition, the second imaging device 300 is connected with vertical direction moving stage 630 as intermediate by using link 810.Move because vertical direction moving stage 630 is vertical by the operation of vertical direction drive motor 720 and is connected with by the first direction of scanning moving stage 610 of direction of scanning linear motor 710 along direction of scanning movement, so vertical direction moving stage 630 also can move along direction of scanning.Therefore, the first imaging device 200 be connected with vertical direction moving stage 630 and the second imaging device 300 can move along direction of scanning and vertical direction relative to base 100.In addition, the first imaging device 200 and the second imaging device 300 can each other together with move.Like this, because the first imaging device 200 and the second imaging device 300 along same area in a scanning direction each other together with move, so the first imaging device 200 can obtain the image relevant with identical inspection district in the upper and lower of inspection object 400 according to line scanning method respectively with the second imaging device 300.
As depicted in figs. 1 and 2, engage inspection machine 10 according to the glass top chip of the present embodiment and comprise conveyer 500, this conveyer 500, for transmitting inspection object 400, makes inspection object 400 be arranged between the first imaging device 200 and the second imaging device 300.Conveyer 500 is arranged to move relative to the guide rail 520 extended along the Y direction and to be driven by drive motor 530.The top of conveyer 500 is provided with inspection objective table 510, and inspection object 400 is placed on inspection objective table 510.As long as under the state that inspection object 400 is positioned on conveyer 500, conveyer 500 moves with the position be positioned at by inspection object 400 between first imaging device 200 and the second imaging device 300 along the direction contrary with Y-direction relative to base 100, then do not limit the structure of conveyer 500.Therefore, the description relevant with the structure of conveyer 500 will be omitted.
Engaging in inspection machine 10 according to the glass top chip comprising above-mentioned structure of the present embodiment, first imaging device 200 and the second imaging device 300 catch position in a scanning direction can be identical, to obtain accurate upper image and the bottom graph picture of inspection object 400 in the identical inspection district of the upper and lower of inspection object 400.For this reason, first imaging device 200 and the second imaging device 300 can be arranged to: before the first imaging device 200 and the second imaging device 300 move along direction of scanning, the VISIBLE LIGHT EMISSION position of the first imaging device 200 and the infrared light emission position of the second imaging device 300 aligned with each other.That is, as described above, because the first imaging device 200 and the second imaging device 300 are by identical driver element 700 (namely, direction of scanning linear motor 710) move together each other along direction of scanning, if so the catch position of the first imaging device 200 and the second imaging device 300 is identical before the first imaging device 200 and the second imaging device 300 move along direction of scanning, so the image of catching in the identical inspection district of the upper and lower of inspection object 400 can be obtained by the first imaging device 200 and the second imaging device 300.
As shown in Figure 3, provide the reference position scale 540 stretched out from the side of the inspection objective table 510 of conveyer 500 in the present embodiment, make the catch position of the catch position of the first imaging device 200 and the second imaging device 300 aligned with each other.In addition, in reference position scale 540, the vertical through hole 541 through reference position scale 540 is limited with.
Specifically, before moving along direction of scanning at the first imaging device 200 and the second imaging device 300, utilize reference position scale 540 to make the catch position of the catch position of the first imaging device 200 and the second imaging device 300 aligned with each other, can first mobile carrier device 500, make reference position scale 540 be arranged between the first imaging device 200 and the second imaging device 300, then can be caught the upper and lower image of reference position scale 540 by the first imaging device 200 and the second imaging device 300.Then, the center of the through hole 541 of reference position scale 540 can be measured to the image analysis of catching.After this, the position of the first imaging device 200 and the second imaging device 300 can be regulated to make center aligned with each other.
Even if the catch position of the first imaging device 200 is identical with the catch position of the second imaging device 300 at first, in use the catch position of the first imaging device 200 and the catch position of the second imaging device 300 also may misalignments.In this case, the image in use periodically can catching reference position scale 540 measures the misalignment degree between the catch position of the first imaging device 200 and the catch position of the second imaging device 300.Then, measured value can return to the analysis about inspection district image.As a result, glass top chip engages inspection machine 10 can obtain inspection object 400 upper image and bottom graph picture (being caught by the first imaging device 200 and the second imaging device 300) in the same position in the inspection district of inspection object 400.Therefore, can accurate impression inspection be carried out based on the image obtained and aim at inspection.
Although the present embodiment is limited with through hole 541 in reference position scale 540, mark that its image can be caught by the first imaging device 200 and the second imaging device 300 can be formed to replace through hole 541.
In addition, first imaging device 200 and the second imaging device 300 are by driver element 700 (namely, vertical direction drive motor 720) vertical movement be mainly used in making the first imaging device 200 along the Z direction (vertical direction) mobile, thus utilize laser displacement sensor 240 measure relative to inspection object 400 focus direction, then when being caught upper linear image and the lower linear image of inspection object 400 by the first imaging device 200 and the second imaging device 300, the focus of the focus of the first imaging device 200 and the second imaging device 300 is focused mutually.
Specifically, when arranging the first imaging device 200 and the second imaging device 300, first imaging device 200 is arranged on along the Z direction the position that (vertical direction) focuses to inspection object 400, then the second imaging device 300 is arranged on the position of inspection object 400 being focused along vertical direction.When the first imaging device 200 and the second imaging device 300 move upper linear image and the lower linear image of catching inspection object 400 along direction of scanning, utilize laser displacement sensor 240 to measure the focal length checked between object 400 and the first imaging device 200, then the first imaging device 200 moves to focus to the focus of the first imaging device 200 based on focal length along vertical direction.Here, as described above, because the second imaging device 300 moves along vertical direction together with the vertical movement of the first imaging device 200, if so the focus focusing of the first imaging device 200, then the focus of the second imaging device 300 also can be focused.
Link 810 is arranged between the first imaging device 200 and the second imaging device 300.In addition, link 810 can have the side opened wide towards conveyer 500 and in "
" opposite side of shape.By conveyer 500 along the inspection object 400 of direction (with the direction of scanning vertical direction) movement contrary with Y-direction can be contained in by "
" shape limit space in.Therefore, the movement of object 400 is checked can not to disturb link 810.
In addition, because conveyer 500 transmits inspection object 400 and reference position scale 540 along the Y direction, so the direction of scanning of the first imaging device 200 and the second imaging device 300 can not be disturbed mutually.
Engage inspection machine 10 according to the glass top chip of the present embodiment and comprise control device 900, this control device 900 is for driving driver element 700, control the image capture of the first imaging device 200 and the second imaging device 300, and the image that analysis is caught is to determine that whether engagement state is wrong.Control device 900 can be in a computer built-in, and this computing machine sends to/from driver element 700, first imaging device 200 and the second imaging device 300 and receives electric signal and store the program for analyzing the image of catching.
Fig. 4 illustrates that control device 900 controls the image capture of driver element 700 and the first imaging device 200 and the second imaging device 300 with the structural drawing of the process processed the image of catching.With reference to figure 4, control device 900 comprises: the first image input units 910 and the second image input units 920, first image input units 910 and the second image input units 920 are for receiving linear image by linear unit from the first imaging device 200 and the second imaging device 300; And graphics processing unit 930, the linear image that graphics processing unit 930 receives for organizing combined analysis.In addition, control device 900 comprises: driving control unit 950, and this driving control unit 950 is for controlling the movement of driver element 700; And trigger pip control module 940, this trigger pip control module 940 is for sending the first linear trigger pip and the second linear trigger pip, and the first imaging device 200 and the second imaging device 300 carry out image capture by the first linear trigger pip and the second linear trigger pip.
Specifically, driving control unit 950 drives direction of scanning linear motor 710 to move with constant speed along direction of scanning to make the first imaging device 200 and the second imaging device 300.In addition, driving control unit 950 controls vertical direction motor 720, make when the first imaging device 200 and the second imaging device 300 to move along direction of scanning and catch linear image continuously, the focal length focusing of the first imaging device 200 and the second imaging device 300.
In addition, by the driver element 700 for the movement of gated sweep direction (namely trigger pip control module 940 receives, direction of scanning linear motor 710) coded signal that produces, the first linear trigger pip and the second linear trigger pip are sent to the first imaging device 200 and the second imaging device 300 respectively.According to the recurrence interval of each in the send from trigger pip control module 940 first linear trigger pip and the second linear trigger pip, the first imaging device 200 and the second imaging device 300 all can each pulse capture linear images.
Here, the recurrence interval of the first linear trigger pip and the recurrence interval of the second linear trigger pip is determined according to the resolution of the first imaging device 200 and the second imaging device 300 respectively.Such as, as shown in Figure 5, when the resolution of the first imaging device 200 is about 0.72 μm/pixel, the recurrence interval of the first linear trigger pip can be about 0.72 μm/pulse.In addition, when the resolution of the second imaging device 300 is about 1.44 μm/pixel, the recurrence interval of the second linear trigger pip can be about 1.44 μm/pulse.
In this case, the first imaging device 200 can with the range acquisition linear image of about 0.72 μm, and the second imaging device 300 can with the range acquisition linear image of about 1.44 μm.Therefore, when two linear images caught by the first imaging device 200, the second imaging device 300 can catch a linear image.Therefore, the first imaging device 200 and the second imaging device 300 can obtain and the image relevant along the same position of direction of scanning in the inspection district checking object 400.
Because use the first imaging device 200 of line scanning method and the second imaging device 300 catching linear image respectively while the movement of direction of scanning, so the recurrence interval being sent to the first linear trigger pip of the first imaging device 200 can mate (synchronous) along the translational speed of direction of scanning with the first imaging device 200 and the second imaging device 300 with the recurrence interval of the second linear trigger pip being sent to the second imaging device 300.Such as, as shown in Figure 5, be about 0.18 μm/pulse when the recurrence interval of the coded signal of direction of scanning linear motor 710, the recurrence interval of the first linear trigger pip is 0.72 μm/pulse, and the recurrence interval of the second linear trigger pip is when being about 1.44 μm/pulse, first linear trigger pip to send to the first imaging device 200 being four pulse matchings of about 0.18 μm/pulse with each cycle based on the coded signal of the direction of scanning linear motor 710 received by trigger pip control module 940, and the second linear trigger pip sent to the second imaging device 300 being eight pulse matchings of about 0.18 μm/pulse with each cycle.
As a result, when mating (that is, synchronous) with the first imaging device 200 and the second imaging device 300 along the translational speed of direction of scanning, the first imaging device 200 and the second imaging device 300 can catch linear image.If the translational speed along direction of scanning that the recurrence interval in the first linear trigger pip and the second linear trigger pip each to be faster or slower than in the first imaging device 200 and the second imaging device 300 each, then the first imaging device and the second imaging device all may capture and to be narrower than or wider than the linear image of its displacement, thus get coarse image.
As described above, engage in inspection machine 10 at glass top chip according to the present invention, because the first linear trigger pip of the first imaging device 200 and the second imaging device 300 and the recurrence interval of the second linear trigger pip synchronous with the coded signal sent from a direction of scanning linear motor 710 and mutually mate, so glass top chip engages inspection machine 10 can obtain accurate upper image in the inspection district of inspection object 400 and bottom graph picture.
Below, the operation of the glass top chip joint inspection machine 10 comprising above-mentioned structure will be described.
First, first imaging device 200 and the second imaging device 300 are arranged to: before being sent to by inspection object 400 between first imaging device 200 and the second imaging device 300, utilize reference position scale 540 to make the catch position of the first imaging device 200 and the second imaging device 300 aligned with each other.After this, be placed on by inspection object 400 on conveyer 500, then conveyer 500 moves to be positioned at by inspection object 400 between first imaging device 200 and the second imaging device 300 along the direction contrary with Y-direction.
Then, drive the first imaging device 200 and the second imaging device 300 are moved along direction of scanning to the direction of scanning linear motor 710 of driver element 700.Here, the trigger pip control module 940 of control device 900 receives the coded signal of direction of scanning linear motor 710, to produce the first linear trigger pip synchronous with the translational speed of the first imaging device 200 and the second imaging device 300 and the second linear trigger pip based on the coded signal that receives.When being mated with the translational speed along direction of scanning by the first linear trigger pip and the second linear trigger pip, the first imaging device 200 and the second imaging device 300 catch the upper linear image relevant with checking the inspection district of object 400 and lower linear image respectively along direction of scanning.
The upper linear image of catching and lower linear image are input to the first image input units 910 and the second image input units 920.Graphics processing unit 930 can combine upper linear image respectively with lower linear image to obtain the upper image relevant with the inspection district of inspection object 400 and bottom graph picture, as shown in Figure 7.
With reference to figure 7, the recessed impression (being present in the lead-in wire 432 of transparent panel 430) of the bottom image confirming conductive particle 411 can caught from the first imaging device 200 and be arranged in the panel alignment mark 431 at transparent panel 430 two ends, and the upper image can caught from the second imaging device 300 confirms chip alignment mark 421.
Control device 900 can carry out aligning inspection, so that by the position of chip alignment mark 421 in upper image and the misalignment degree relatively come between checking chip 420 and transparent panel 430 of the position of panel alignment mark 431 on bottom graph picture.In addition, control device 900 can also carry out impression inspection, to check the recessed impression of conductive particle 411 on bottom graph picture.
At the first imaging device 200 and the second imaging device 300 along while the movement of direction of scanning, the first imaging device 200 and the second imaging device 300 can focus by utilizing the focus of laser displacement sensor 240 to the first imaging device 200 and the second imaging device 300 and based on the distance between inspection object 400 along the Z direction (vertical direction) mobile.
As described above, according to the present invention, because the first imaging device 200 and the second imaging device 300 obtain linear image according to line scanning method by linear unit, so an inspection machine can be utilized to carry out aligning inspection and impression inspection, but carry out aligning inspection and impression inspection respectively by different equipment in the prior art simultaneously.Therefore, can proving time be shortened and reduce installing space and the cost of device.
In addition, according to the present invention, first linear trigger pip and the second linear trigger pip of the first imaging device 200 and the second imaging device 300 can be synchronous with the translational speed of the first imaging device and the second imaging device, with inspection district associated upper image and the bottom graph picture of catching more accurately with check object 400.Therefore, inspection and impression inspection can be aimed at more accurately.
Although disclose the preferred embodiments of the present invention, when not departing from the scope and spirit of the present invention that claims are set forth, those skilled in the art can make various changes and modifications the present invention.It is descriptive instead of restrictive for it is also understood that term as used herein is entered, and can carry out various change without departing from the scope and spirit of the present invention.
Such as, although provide one in the aforementioned embodiment for making the first imaging device 200 and the second imaging device 300 along the direction of scanning linear motor 710 of direction of scanning movement, the present invention is not limited thereto.That is, can be provided for respectively making the first imaging device 200 along the linear motor of direction of scanning movement with for making the second imaging device 300 along the linear motor of direction of scanning movement.In this case, the first linear trigger pip and the second linear trigger pip can be sent to the first imaging device 200 and the second imaging device 300 from each linear motor received encoded signal based on the coded signal received by the trigger pip control module 940 of control device 900.
In addition, although provide trigger pip control module 940 in the aforementioned embodiment together with the control device 900 for controlling driver element 700, the present invention is not limited thereto.Such as, trigger pip control module 940 can be provided individually relative to the control device for controlling driver element 700.
In addition, although the first imaging device 200 and the second imaging device 300 move along direction of scanning relative to inspection object 400 in the aforementioned embodiment, the present invention is not limited thereto.Such as, first imaging device 200 and the second imaging device 300 can be fixing, and the driver element (linear motor) of the conveyer 500 that can be provided for being placed with above making inspection object 400 (direction of scanning) movement along the X direction, to allow to check object 400 to move along direction of scanning relative to the first imaging device 200 and the second imaging device 300.Here, trigger pip control module 940 can receive for making conveyer 500 along driver element (linear motor) coded signal of direction of scanning movement, and sends to the first imaging device 200 and the second imaging device 300 by with inspection object 400 along synchronous the first linear trigger pip of the translational speed of direction of scanning and the second linear trigger pip.
According to the present invention as described above, because irradiate visible ray all obtain linear image according to line scanning method by linear unit with first imaging device and irradiation infrared light of catching inspection object bottom graph picture with second imaging device of catching inspection object upper image, so an inspection machine can be utilized to carry out aligning inspection and impression inspection, but carry out aligning inspection and impression inspection respectively by different equipment in the prior art simultaneously.Therefore, the proving time of inspection engagement state can be shortened and reduce installing space and the cost of device.
Claims (9)
1. glass top chip engages an inspection machine, comprising:
Base;
Inspection object, described inspection object is horizontally disposed with relative to described base;
First imaging device, described first imaging device to be arranged on described base and to be arranged on described inspection underbelly, and described first imaging device relative to described inspection object along while the movement of a direction (direction of scanning) by radiation of visible light on described inspection object, to utilize reflected light to catch the bottom graph picture of described inspection object according to line scanning method;
Second imaging device, described second imaging device to be arranged on described base and to be arranged on the top of described inspection object, and described second imaging device relative to described inspection object along while a direction (described direction of scanning) movement by Infrared irradiation on described inspection object, to utilize reflected light to catch the upper image of described inspection object according to line scanning method;
Driver element, described driver element makes described first imaging device and described second imaging device move along direction of scanning; And
Control device, described control device controls described driver element, and the first linear trigger pip and the second linear trigger pip are sent to described first imaging device and described second imaging device by described control device respectively, the described first linear trigger pip and the described second linear trigger pip and described first imaging device and described second imaging device synchronous along the translational speed of described direction of scanning.
2. glass top chip according to claim 1 engages inspection machine, and also comprise moving stage, described moving stage is moved along described direction of scanning relative to described base by described driver element,
Wherein, described first imaging device and described second imaging device are connected to described moving stage, move together with the movement along with described moving stage along described direction of scanning.
3. glass top chip according to claim 1 engages inspection machine, wherein, described first imaging device and described second imaging device are arranged to: the VISIBLE LIGHT EMISSION position of described first imaging device is aimed at mutually with the infrared light emission position of described second imaging device.
4. glass top chip according to claim 1 engages inspection machine, also comprises conveyer, described conveyer for transmitting described inspection object, to make described inspection object be arranged between described first imaging device and described second imaging device,
Wherein, described conveyer is provided with reference position scale, described reference position scale is for the catch position of the catch position and described second imaging device that confirm described first imaging device.
5. glass top chip according to claim 1 engages inspection machine, and wherein, described control device comes synchronously the described first linear trigger pip and the described second linear trigger pip based on the coded signal sent from described driver element.
6. glass top chip according to claim 5 engages inspection machine, wherein, the recurrence interval of the described first linear trigger pip and the recurrence interval of the described second linear trigger pip is determined based on the resolution of described first imaging device and described second imaging device respectively.
7. glass top chip according to any one of claim 1-6 engages inspection machine, wherein, by utilizing anisotropic conductive film, upper chip is engaged with lower transparent panel and manufactures described inspection object, and
The bottom graph picture of described inspection object caught by described first imaging device, described bottom graph picture comprises the panel alignment mark be formed on described transparent panel and the recessed impression being included in the conductive particle in described anisotropic conductive film, and the upper image of described inspection object caught by described second imaging device, described upper image comprises the chip alignment mark be formed on chip.
8. the glass top chip according to any one of claim 1-6 engages inspection machine, wherein, described first imaging device and described second imaging device can vertically movements, all focus with each making the focus of described first imaging device and described second imaging device.
9. glass top chip engages an inspection machine, comprising:
Base;
Inspection object, described inspection object is horizontally disposed with relative to described base;
First imaging device, described first imaging device to be arranged on described base and to be arranged on described inspection underbelly, and described first imaging device by radiation of visible light on described inspection object, to utilize reflected light to catch the bottom graph picture of described inspection object according to line scanning method;
Second imaging device, described second imaging device to be arranged on described base and to be arranged on the top of described inspection object, and described second imaging device by Infrared irradiation on described inspection object, to utilize reflected light to catch the upper image of described inspection object according to line scanning method;
Driver element, described driver element makes described inspection object move along direction of scanning relative to described first imaging device and described second imaging device; And
Control device, described control device controls described driver element, and the first linear trigger pip and the second linear trigger pip are sent to described first imaging device and described second imaging device by described control device respectively, the described first linear trigger pip and the described second linear trigger pip synchronous along the translational speed of described direction of scanning with described inspection object.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140007705A KR101619149B1 (en) | 2014-01-22 | 2014-01-22 | Chip on glass bonding inspection apparatus |
| KR10-2014-0007705 | 2014-01-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104792800A true CN104792800A (en) | 2015-07-22 |
| CN104792800B CN104792800B (en) | 2018-04-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410220535.XA Active CN104792800B (en) | 2014-01-22 | 2014-05-23 | Equipment is examined in glass top chip engagement |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101619149B1 (en) |
| CN (1) | CN104792800B (en) |
| TW (2) | TWI509237B (en) |
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| CN105259178A (en) * | 2015-11-20 | 2016-01-20 | 云南卡索实业有限公司 | Shearing type linear trace laser detection system |
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| KR102008224B1 (en) * | 2018-05-29 | 2019-08-07 | 에스엔유 프리시젼 주식회사 | Inspecting system being capable of inspecting curved surface |
| KR102326328B1 (en) * | 2020-03-05 | 2021-11-15 | 주식회사 앱소 | Apparatus and Method for Vision Inspection |
| CN116013803B (en) * | 2023-03-30 | 2023-06-20 | 深圳新控半导体技术有限公司 | Temperature sensing type detection device for chip adhesion and detection method thereof |
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| TWM469621U (en) * | 2013-06-21 | 2014-01-01 | 昇佳電子股份有限公司 | Optical sensor |
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- 2014-01-22 KR KR1020140007705A patent/KR101619149B1/en active IP Right Grant
- 2014-05-23 CN CN201410220535.XA patent/CN104792800B/en active Active
- 2014-05-29 TW TW103118721A patent/TWI509237B/en active
- 2014-05-29 TW TW104132659A patent/TWI582412B/en active
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| KR20100070814A (en) * | 2008-12-18 | 2010-06-28 | 주식회사 브이원텍 | Apparatus for inspecting conjugation portion of c.o.g |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201530123A (en) | 2015-08-01 |
| CN104792800B (en) | 2018-04-17 |
| TWI509237B (en) | 2015-11-21 |
| KR101619149B1 (en) | 2016-05-10 |
| TWI582412B (en) | 2017-05-11 |
| KR20150087575A (en) | 2015-07-30 |
| TW201602561A (en) | 2016-01-16 |
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