CN104792800B - Equipment is examined in glass top chip engagement - Google Patents
Equipment is examined in glass top chip engagement Download PDFInfo
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- CN104792800B CN104792800B CN201410220535.XA CN201410220535A CN104792800B CN 104792800 B CN104792800 B CN 104792800B CN 201410220535 A CN201410220535 A CN 201410220535A CN 104792800 B CN104792800 B CN 104792800B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
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Abstract
The present invention provides a kind of glass top chip engagement and examines equipment, including：Base；With respect to the horizontally disposed inspection object of base；On base and be arranged on examine object below the first imaging device, it will be seen that light is radiated on inspection object relative to inspection object while (scanning direction) is mobile in one direction, to examine the lower image of object using reflected light capture according to line scanning method；On base and be arranged on examine object above the second imaging device, its while relative to inspection object, (scanning direction) is mobile in one direction by Infrared irradiation on object is examined, the upper image of object is examined using reflected light capture according to line scanning method；The driving unit for making the first and second imaging devices be moved along scanning direction；And the control device of control driving unit, the first and second linear trigger signals synchronous with translational speed of first and second imaging devices along scanning direction are sent respectively to the first and second imaging devices by it.
Description
Cross reference to related applications
The korean patent application No.10-2014- of Korean Intellectual Property Office is submitted this application claims on January 22nd, 2014
The disclosure of which, is incorporated herein by 0007705 priority by reference herein.
Technical field
Engaged the present invention relates to glass top chip (chip on glass, COG) and examine equipment.More specifically, it is of the invention
Relate to be carried out at the same time impression inspection and alignment is examined to examine the glass top chip of glass top chip engagement state to engage inspection
Test equipment.
Background technology
In general, glass top chip engagement refers to the engagement of chip and panel when using panel manufacture display device.
Chip provides the external control signal for appearing picture to panel.
Specifically, the process of glass top chip engagement is as follows：Anisotropic conductive film containing conductive particle is attached
On the lead of panel, then chip is installed in anisotropic conductive film and applies appropriate heat to anisotropic conductive film
And pressure, so that the lead of panel be engaged with chip using anisotropic conductive film.Here, contained by anisotropic conductive film
Conductive particle can rupture, therefore, the lead of panel is electrically connected by the conductive particle of rupture with chip.
However, if chip cannot be accurately aligned with lead when carrying out glass top chip engagement, then it is possible that
Contact fault.Therefore, it is necessary to the accurately joint shape between checking chip and panel after glass top chip engagement is carried out
State.
The inspection of engagement state between chip and panel can include：For each to different between checking chip and panel
Whether whether the conducting sphere in property conducting film is examined by normally-compacted impression, and be respectively mounted for checking chip and panel
The alignment of (engagement) in its exact position is examined.
Examined according to the impression disclosed in Korea patent registration No.10-0549470 (patent document 1), rupture will be used as
The distribution of the recessed impression (indentation impression) of conductive particle mark is captured as 3-D view and to catching
The image obtained is analyzed, so as to examine engagement state.In addition, according in Korean patent publication No.10-2010-0070814
Alignment disclosed in (patent document 2) is examined, the alignment mark that will be formed on chip and the alignment mark being formed on panel
Image is captured as, so that according to the position of the corresponding alignment mark in capture images come the misalignment between checking chip and panel
Degree.
Moved however, being used for the impression that impression is examined according to prior art and examining equipment to use along scanning direction
By the linescan cameras of linear unit shooting linear image while dynamic, and the alignment for being used to be aligned inspection examines what equipment used
It is the area camera shot to certain area.Therefore, impression examines equipment and alignment to examine equipment needs separately installed.This
Sample, because individually carrying out impression inspection and alignment inspection, can take longer time to test.It is in addition, because single
Solely installation impression examines equipment and alignment inspection to set, so adding installation space and cost.
[prior art document]
[patent document]
(patent document 1) patent document 1：Korea patent registration No.10-0549470
(patent document 2) patent document 2：Korean patent publication No.10-2010-0070814
The content of the invention
One aspect of the present invention provides one kind can be carried out at the same time impression inspection and alignment in a verifying attachment
Equipment is examined in the glass top chip engagement of inspection.
According to an aspect of the invention, there is provided equipment is examined in a kind of glass top chip engagement, including：Base；Examine
Object, the inspection object are horizontally disposed with relative to the base；First imaging device, first imaging device are installed on institute
State on base and be arranged on the inspection underbelly, and first imaging device is relative to the inspection object
It will be seen that light is radiated on the inspection object while movement along a direction (scanning direction), with according to line scanning method
And utilize the reflected light capture lower image for examining object；Second imaging device, second imaging device are installed on institute
State on base and be arranged on the top of the inspection object, and second imaging device is relative to the inspection object
Infrared irradiation is examined on object described along while direction (scanning direction) movement, with according to line scanning method
And utilize the reflected light capture upper image for examining object；Driving unit, the driving unit make the first imaging dress
Put and moved with second imaging device along scanning direction；And control device, the control device control driving are single
Member, and the first linear trigger signal and the second linear trigger signal are sent respectively to first imaging by the control device
Device and second imaging device, the first linear trigger signal and the second linear trigger signal with it is the first one-tenth described
As device and second imaging device are synchronous along the translational speed of scanning direction.
Brief description of the drawings
From detailed description below in conjunction with the accompanying drawings, it will be more clearly understood that above and other aspect, the spy of the present invention
Seek peace other advantages, in attached drawing：
Fig. 1 is the perspective view that equipment is examined in glass top chip engagement according to the present invention；
Fig. 2 is the side view that equipment is examined in glass top chip engagement according to the present invention；
Fig. 3 is the enlarged drawing for the part A for showing Fig. 1；
Fig. 4 is the schematic diagram for the control device that equipment is examined in glass top chip engagement according to the present invention；
Fig. 5 is for illustrating to engage the view for examining equipment to be controlled to glass top chip according to the present invention；
Fig. 6 is to show to engage regarding for the object for examining equipment to test by glass top chip according to the present invention
Figure；And
Fig. 7 is the view that the image for examining equipment to capture is engaged by glass top chip according to the present invention.
Embodiment
In the following, glass top chip engagement according to the present invention, which will be described in detail with reference to the attached drawings, examines equipment.For the ease of retouching
State, identical reference numeral represents identical element, and will omit repetitive description.In addition, in the following description, " OK
Scan method " refers to that the first imaging device 200 and the second imaging device 300 pass through line while being moved along the X-direction of Fig. 1
The method of property elements capture linear image.In addition, the X-direction of Fig. 1 refers to the first imaging device 200 and the second imaging device 300
" scanning direction " of linear image is captured by linear unit while movement.Here, Z-direction refers to " vertical direction ".
With reference to figure 1 and Fig. 2, glass top chip according to embodiments of the present invention engagement examines equipment 10 to include：Base 100,
The first imaging device 200 installed in the side surface of base 100 and the second imaging device 300 installed in the top of base 100.
Base 100 has the elongate in shape that (scanning direction) persistently extends along the X direction.First imaging device 200 is set
In the lower part of a side surface of base 100, the second imaging device 300 is arranged on the top of the first imaging device 200 and is spaced pre-
The position of set a distance.
Object 400 (hereinafter referred to as " inspection object ") to be tested is arranged on the first imaging device 200 and the second imaging device
Between 300.Therefore, 400 lower image of object is examined in the capture of the first imaging device 200, and thing is examined in the capture of the second imaging device 300
400 upper image of body.
As shown in fig. 6, examine object 400 can be analogous to upper chip 420 and lower transparent panel 430 by it is each to
The object for the liquid crystal panel that anisotropic conductive film 410 is bonded with each other.Anisotropic conductive film 410 contains conductive particle 411, and
During engagement, anisotropic conductive film 410 can be compressed at high temperature under high pressure.
With reference to figure 6, in object 400 is examined, chip alignment mark 421 is respectively formed in the lower surface at 420 both ends of chip,
Panel alignment mark 431 is respectively formed in the upper surface at 430 both ends of transparent panel.In addition, chip 420 and transparent panel 430
Lead 432, which is arranged on, examines the core of object 400 and mutual by the conductive particle 411 of anisotropic conductive film 410
It is electrically connected.
As depicted in figs. 1 and 2, the first imaging device 200 is it will be seen that illumination is mapped on inspection object 400 to utilize reflected light
400 lower image of object is examined in capture.For this reason, the first imaging device 200 includes：First light source 220, for producing visible ray；
First optical system 210, for by the radiation of visible light that the first light source 220 produces to the lower surface for examining object 400 to connect
Receive reflected light；And first camera 230, for the light received in the first optical system 210 to be converted into image and capture figure
Picture.As shown in fig. 6, because transparent panel 430 is arranged on the lower part for examining object 400, irradiated from the first imaging device 200
Visible ray through transparent panel 430 and then being reflected by panel alignment mark 431 and lead 432.Because first camera 230 receives
Reflected light is with capture images, so first camera 230 can be obtained with including examining the panel alignment mark 431 in object 400
The image related with the inspection area of lead 432.
The recessed indentation image of compression conductive particle 411 can be captured as 3-D view to examine by the first imaging device 200
Test impression state.Here, in order to obtain 3-D view, the first optical system 210 includes differential interference microscope.Since differential is done
It is commonly known to relate to microscope, therefore omits the detailed description.
In addition, as depicted in figs. 1 and 2, the first imaging device 200 includes laser displacement sensor 240, which passes
Sensor 240 is used to measure and examine the distance between object 400 to focus.
Second imaging device 300 will examine object 400 on Infrared irradiation to inspection object 400 to be captured using reflected light
Upper image.For this reason, the second imaging device 300 includes：Infrared light controller 320, for controlling infrared lamp (not shown) to produce
Raw infrared light；Second optical system 310, for by the Infrared irradiation that infrared light controller 320 produces to examining object 400
To receive reflected light on upper surface；And second camera 330, for the light received in the second optical system 310 to be converted into
Image and capture images.Infrared light caused by infrared light controller 320 introduces the second optical system 310 by optical fiber 340.It is red
Outer optical controller 320 is controlled by control device 900 which will be described.
As shown in fig. 6, because opaque chip 420 is arranged on the top for examining object 400, from the second imaging device
The infrared light of 300 irradiations is reflected through chip 420 and then by chip alignment mark 421.Because second camera 330 receives reflected light
With capture images, so second camera 330 can obtain and the inspection including examining the chip alignment mark 421 in object 400
The related image in area.
In addition, the first imaging device 200 and the second imaging device 300 capture according to line scanning method and examine object 400
Image.As described above, according to line scanning method, by the linear light irradiation with long linearity configuration to examining on object 400, so
The linear light of reflection is received afterwards so that the linear light of reception is changed linear image by linear unit and captures linear image.Cause
This, the image capture by linear light is persistently carried out while being moved along scanning direction, then will be caught by linear unit
The linear image that obtains is combined to obtain and examine the whole inspection area of object 400 (including to be formed in the chip examined on object 400
Alignment mark 421, conductive particle 411 recessed impression and panel alignment mark 431 region) related image.For this reason, first
Camera and second camera use linescan cameras.
In glass top chip engagement equipment 10 according to embodiments of the present invention, because the first imaging device 200 and second
Imaging device 300 obtains the image related with the inspection area in line scanning method, it is possible to will by using a device
The chip alignment mark 421 examined on object 400, all recessed impressions and panel of conductive particle 411 are formed in fiducial mark
Note 431 is captured as image.Therefore, can be carried out at the same time using related with chip alignment mark 421 and panel alignment mark 431
The alignment of image is examined and examined using the impression of the indentation image of conductive particle 411.As a result, examined according to glass top chip
Device, chip engagement equipment is compared on the Conventional glass being separately provided with being directed at verifying attachment and impression verifying attachment, can be subtracted
Few Check-Out Time and device quantity.
Because the first imaging device 200 and the second imaging device 300 all use line scanning method, the first imaging device
200 and second imaging device 300 can continuously be captured while being moved along scanning direction examine object 400 image, from
And obtain the image related with examining the whole inspection area of object 400.Connect in the following, glass top chip according to the present invention will be described
Close the composition of equipment.
With reference to figure 1 and Fig. 2, be provided with a surface of base 100 along scanning direction extension guide rail 110a and
110b.In addition, it is provided with what can be moved along scanning direction relative to guide rail 110a and 110b on guide rail 110a and 110b
First scanning direction moving stage 610.First scanning direction moving stage 610 passes through scanning direction linear motor 710
(that is, the driving unit 700 driven by electric signal) and moves in a scanning direction along guide rail 110a and 110b.
In addition, the first scanning direction moving stage 610 is connected with the second scanning direction moving stage 620, this second
Scanning direction moving stage 620 is arranged to move relative to the upper surface of base 100 along scanning direction.Therefore, when
First scanning direction moving stage 610 along scanning direction move when, the second scanning direction moving stage 620 can also be with
First scanning direction moving stage 610 is moved along scanning direction together, and because the second scanning direction moving stage
620 support the first scanning direction moving stage 610 being connected with the side surface of base 100 in the horizontal direction, so first
Scanning direction moving stage 610 can keep stable.
In addition, above-mentioned infrared light controller 320 is fixed on the top of the second scanning direction moving stage 620.Therefore, it is red
Outer optical controller 320 can move loading by the movement of the second scanning direction moving stage 620 with the second scanning direction
Platform 620 is moved along scanning direction together.
Although in the present embodiment the second scanning direction moving stage 620 with the first scanning direction moving stage
Infrared light controller 320 is supported while 610 connection, but the present invention is not limited thereto.It is if for example, infrared according to one kind design
Optical controller 320 need not be moved along scanning direction, then can be omitted the second scanning direction moving stage 620.
(vertical direction) extension along the Z direction is provided with the side surface of the first scanning direction moving stage 610
Guide rail 120.Can be relative to the vertically movable vertical direction moving stage of guide rail 120 in addition, being provided with guide rail 120
630.Vertical direction moving stage 630 passes through (that is, the driving unit driven by electric signal of vertical direction travel motor 720
700) control and it is vertically movable along guide rail 120.
As reference, in the present embodiment, moving stage 600 includes the first scanning direction moving stage 610 and the
Two scanning direction moving stages 620 (only including the first scanning direction moving stage 610 in some cases) and vertical
Direction moving stage 630.In addition, for the driving list for making moving stage 600 be moved along scanning direction and vertical direction
Member 700 includes scanning direction linear motor 710 and vertical direction drive motor 720.
First imaging device 200 is fixed on vertical direction moving stage 630.In addition, the second imaging device 300 passes through
It is connected using connecting component 810 as intermediate with vertical direction moving stage 630.Because vertical direction moving stage
630 by the operation of vertical direction drive motor 720 and it is vertically movable and with by scanning direction linear motor 710 along
First scanning direction moving stage 610 of scanning direction movement connects, so vertical direction moving stage 630 can also edge
Scanning direction movement.Therefore, the first imaging device 200 and the second imaging dress being connected with vertical direction moving stage 630
Putting 300 can move along scanning direction and vertical direction relative to base 100.In addition, the first imaging device 200 and the second one-tenth
As device 300 can move together each other.In this way, because the first imaging device 200 and the second imaging device 300 are along same zone
Domain moves together each other in a scanning direction, so the first imaging device 200 and the second imaging device 300 can be scanned according to row
Method is examining the upper and lower part of object 400 to obtain the image related with identical inspection area respectively.
As depicted in figs. 1 and 2, being engaged according to the glass top chip of the present embodiment examines equipment 10 to include transmission device 500,
The transmission device 500, which is used to transmit, examines object 400 so that examines object 400 to be arranged on the first imaging device 200 and the second one-tenth
As between device 300.Transmission device 500 is arranged to move and driven relative to the guide rail 520 extended along the Y direction
Motor 530 drives.The top of transmission device 500, which is provided with, examines objective table 510, examines object 400 to be placed on inspection loading
On platform 510.As long as examining in the state of object 400 is positioned on transmission device 500, transmission device 500 along with Y-direction phase
Moved relative to base 100 so that object 400 will be examined to be positioned at the first imaging device 200 and the second imaging device in anti-direction
Position between 300, then do not limit the structure of transmission device 500.Therefore, will omit related with the construction of transmission device 500
Description.
In equipment 10 is examined according to the engagement of the glass top chip including above-mentioned construction of the present embodiment, the first imaging device
200 and second the catch position in a scanning direction of imaging device 300 can be identical, to examine the upper of object 400
The accurate upper image and lower image for examining object 400 are obtained in the identical inspection area of portion and lower part.For this reason, the first imaging dress
Put 200 and second imaging device 300 can be arranged to：In the first imaging device 200 and the second imaging device 300 along scanning side
To before movement, the infrared light emission position of the VISIBLE LIGHT EMISSION position of the first imaging device 200 and the second imaging device 300 that
This alignment.That is, as described above, because the first imaging device 200 and the second imaging device 300 pass through identical driving
Unit 700 (that is, scanning direction linear motor 710) moves together each other along scanning direction, if so in the first imaging
First imaging device 200 and the second imaging device 300 before 200 and second imaging device 300 of device is moved along scanning direction
Catch position be identical, then can be obtained by the first imaging device 200 and the second imaging device 300 examine object
The image captured in the identical inspection area of 400 upper and lower part.
As shown in figure 3, the ginseng stretched out from the side of the inspection objective table 510 of transmission device 500 is provided in the present embodiment
According to position scale 540 so that the catch position of the first imaging device 200 and the catch position of the second imaging device 300 are right each other
It is accurate.In addition, the vertical through hole 541 for passing through reference position scale 540 is defined in reference position scale 540.
Specifically, in order to sharp before the first imaging device 200 and the second imaging device 300 are moved along scanning direction
Make the catch position of the catch position and the second imaging device 300 of the first imaging device 200 right each other with reference position scale 540
Standard, can mobile carrier device 500 first so that reference position scale 540 is arranged on the first imaging device 200 and the second imaging
Between device 300, it may then pass through the first imaging device 200 and the second imaging device 300 capture reference position scale 540
Upper and lower part image.It is then possible to the through hole 541 for being analyzed the image of capture to measure reference position scale 540
Center.Hereafter, the position of the first imaging device 200 and the second imaging device 300 can be adjusted so that center each other
Alignment.
Even if the catch position of the catch position of the first imaging device 200 and the second imaging device 300 is initially identical,
The catch position of the catch position of the first imaging device 200 and the second imaging device 300 may also can misalignment in use.
In this case, the image of reference position scale 540 can be periodically captured in use to measure the first imaging
Misalignment degree between the catch position of the catch position of device 200 and the second imaging device 300.Then, measured value can return
Back to the analysis in relation to inspection area image.As a result, glass top chip engagement examines equipment 10 to examine the inspection of object 400
The same position for testing area obtains the upper image for examining object 400 and lower image (by the first imaging device 200 and the second one-tenth
As device 300 captures).Therefore, accurate impression inspection can be carried out based on the image of acquisition and alignment is examined.
Although the present embodiment defines through hole 541 in reference position scale 540, it may form part of its image can be by
First imaging device 200 and the mark of second imaging device 300 capture replace through hole 541.
In addition, (that is, vertical direction drives by driving unit 700 for the first imaging device 200 and the second imaging device 300
Motor 720) it is vertically movable be mainly used for making the first imaging device 200 (vertical direction) be mobile along the Z direction, so as to utilize
Laser displacement sensor 240 is measured relative to the focus direction for examining object 400, is then passing through 200 He of the first imaging device
When the upper linear image and lower linear image of object 400 are examined in the capture of second imaging device 300, make the first imaging device
200 focus and the focus of the second imaging device 300 are mutually focused.
Specifically, when setting the first imaging device 200 and the second imaging device 300, the first imaging device 200 is set
Put at (vertical direction) along the Z direction to examining the position that object 400 is focused, then the second imaging device 300 is set
In the position focused along vertical direction to inspection object 400.In the first imaging device 200 and the second imaging device 300
When being moved along scanning direction to capture the upper linear image and lower linear image of examining object 400, laser displacement is utilized
Sensor 240 come measure examine 400 and first imaging device 200 of object between focal length, then the first imaging device 200 be based on
Focal length is moved along vertical direction and focused with the focus to the first imaging device 200.Here, as described above, because
Two imaging devices 300 and the first imaging device 200 it is vertically movable together with moved along vertical direction, if so the first imaging
The focus focusing of device 200, then the focus of the second imaging device 300 can also focus.
Connecting component 810 is arranged between the first imaging device 200 and the second imaging device 300.In addition, connecting component
810 can have towards transmission device 500 open wide side and in "" shape opposite side.By transmission device 500 along with
The mobile inspection object 400 in the opposite direction of Y-direction (direction vertical with scanning direction) can be contained in by "" shape restriction
Space in.Therefore, the movement of object 400 is examined without interference with connecting component 810.
In addition, because transmission device 500 transmits along the Y direction examines object 400 and reference position scale 540, the
The scanning direction of one imaging device 200 and the second imaging device 300 will not interfere with each other.
Being engaged according to the glass top chip of the present embodiment examines equipment 10 to include control device 900, which uses
It is driven in driving unit 700, controls the image capture of the first imaging device 200 and the second imaging device 300, and divide
Whether the image for analysing capture is wrong with definite engagement state.Control device 900 can it is built-in in a computer, the computer
Send and receive electric signal to/from driving unit 700, the first imaging device 200 and the second imaging device 300 and store and be used for
The program analyzed the image of capture.
Fig. 4 is to show that control device 900 controls 700 and first imaging device 200 of driving unit and the second imaging device
The structure chart for the process that 300 image capture is handled with the image to capture.With reference to figure 4, control device 900 includes：The
One image input units 910 and the second image input units 920, the first image input units 910 and the second image input units
920 are used to receive linear image from the first imaging device 200 and the second imaging device 300 by linear unit；And at image
Unit 930 is managed, image processing unit 930 is used for the linear image that group combined analysis receives.In addition, control device 900 includes：
Drive control unit 950, the drive control unit 950 are used for the movement for controlling driving unit 700；And trigger signal control is single
Member 940, the trigger signal control unit 940 are used to sending the first linear trigger signal and the second linear trigger signal, the first one-tenth
As 200 and second imaging device 300 of device passes through the first linear trigger signal and the second linear trigger signal progress image capture.
Specifically, drive control unit 950 drives scanning direction linear motor 710 so that the first imaging device 200
Moved with the second imaging device 300 along scanning direction with constant speed.In addition, drive control unit 950 controls vertical direction
Motor 720 so that in the first imaging device 200 and the second imaging device 300 is moved along scanning direction and continuous captured line
Property image when, the first imaging device 200 and the second imaging device 300 focal length focusing.
(that is, swept by the driving unit 700 for controlling scanning direction to move in addition, trigger signal control unit 940 is received
Retouch dimension linear motor 710) encoded signal that produces, so as to by the first linear trigger signal and the second linear trigger signal point
The first imaging device 200 and the second imaging device 300 are not sent to.According to first sent from trigger signal control unit 940
The pulse period of each in linear trigger signal and the second linear trigger signal, the first imaging device 200 and the second imaging dress
Putting 300 each can open linear image by pulse capture one.
Here, the first linear triggering is determined according to the resolution ratio of the first imaging device 200 and the second imaging device 300 respectively
The pulse period of signal and the pulse period of the second linear trigger signal.For example, as shown in figure 5, when the first imaging device 200
When resolution ratio is about 0.72 μm/pixel, the pulse period of the first linear trigger signal can be about 0.72 μm/pulse.This
Outside, when the resolution ratio of the second imaging device 300 is about 1.44 μm/pixel, the pulse period of the second linear trigger signal can
Think about 1.44 μm/pulse.
In this case, the first imaging device 200 can be with about 0.72 μm of range acquisition linear image, the second one-tenth
As device 300 can be with about 1.44 μm of range acquisition linear image.Therefore, two bracing cables are captured in the first imaging device 200
During property image, the second imaging device 300 can capture a linear image.Therefore, the first imaging device 200 and the second imaging dress
The related image of the same position along scanning direction in the inspection area with examining object 400 can be obtained by putting 300.
Because moved using the first imaging device 200 and the second imaging device 300 of line scanning method along scanning direction
Linear image is captured while dynamic respectively, so sending to the pulse week of the first linear trigger signal of the first imaging device 200
Phase and send to the second imaging device 300 the second linear trigger signal pulse period can with the first imaging device 200 and
Second imaging device 300 matches (synchronization) along the translational speed of scanning direction.For example, as shown in figure 5, when scanning direction is linear
The pulse period of the encoded signal of motor 710 is about 0.18 μm/pulse, and the pulse period of the first linear trigger signal is
0.72 μm/pulse, and when the pulse period of the second linear trigger signal is about 1.44 μm/pulse, trigger signal control is single
First linear trigger signal is sent to first by first 940 encoded signals based on the scanning direction linear motor 710 received
Imaging device 200 is using four pulse matchings with each cycle as about 0.18 μm/pulse, and by the second linear trigger signal
The second imaging device 300 is sent to using eight pulse matchings with each cycle as about 0.18 μm/pulse.
As a result, matched with the first imaging device 200 and the second imaging device 300 along the translational speed of scanning direction
In the case of (that is, synchronous), the first imaging device 200 and the second imaging device 300 can capture linear image.If First Line
Property trigger signal and the second linear trigger signal in each pulse period be faster or slower than the first imaging device 200 and the
The translational speed along scanning direction of each in two imaging devices 300, then the first imaging device and the second imaging device are equal
The linear image for being narrower than or being wider than its displacement distance may be captured, so as to get inaccurate image.
As described above, in glass top chip according to the present invention engages and examines equipment 10, because the first imaging device
200 and second imaging device 300 the first linear trigger signal and the second linear trigger signal pulse period with being swept from one
Retouch the encoded signal synchronization of the transmission of dimension linear motor 710 and be mutually matched, so equipment 10 is examined in glass top chip engagement
The accurate upper image and lower image in the inspection area for examining object 400 can be obtained.
In the following, description is included to the operation of the glass top chip engagement inspection equipment 10 of above-mentioned construction.
First, the first imaging device 200 and the second imaging device 300 are arranged to：First is transmitted to object 400 will be examined
Before between 200 and second imaging device 300 of imaging device, make the first imaging device 200 and using reference position scale 540
The catch position of two imaging devices 300 is aligned with each other.Hereafter, object 400 will be examined to be placed on transmission device 500, Ran Houchuan
Device 500 is sent to be moved along the direction opposite with Y-direction so that object 400 will be examined to be positioned at the first imaging device 200 and second
Between imaging device 300.
Then, the scanning direction linear motor 710 of driving unit 700 is driven so that the first imaging device 200
Moved with the second imaging device 300 along scanning direction.Here, the trigger signal control unit 940 of control device 900 is received and swept
The encoded signal of dimension linear motor 710 is retouched, to be produced and the first imaging device 200 and the based on the encoded signal that receives
The the first linear trigger signal and the second linear trigger signal of the translational speed synchronization of two imaging devices 300.Passing through First Line
Property trigger signal and the second linear trigger signal with along scanning direction translational speed it is matched in the case of, the first imaging device
200 and second imaging device 300 capture the related upper linear figure of inspection area with examining object 400 respectively along scanning direction
Picture and lower linear image.
The upper linear image and lower linear image of capture are input to the first image input units 910 and second
Image input units 920.Image processing unit 930 can be respectively combined upper linear image and lower linear image with obtain with
The inspection area of object 400 related upper image and lower image are examined, as shown in Figure 7.
, can be from the recessed impression for the lower image confirmation conductive particle 411 that the first imaging device 200 captures with reference to figure 7
(being present in the lead 432 of transparent panel 430) and the panel alignment mark 431 for being arranged in 430 both ends of transparent panel, and can
Chip alignment mark 421 is confirmed with the upper image captured from the second imaging device 300.
Control device 900 can carry out alignment inspection, will pass through position of the chip alignment mark 421 in upper image
And the comparison of position of the panel alignment mark 431 in lower image carrys out the misalignment between checking chip 420 and transparent panel 430
Degree.In addition, control device 900 can also carry out impression inspection, to examine conductive particle 411 recessed in lower image
Impression.
While the first imaging device 200 and the second imaging device 300 are moved along scanning direction, the first imaging device
200 and second imaging device 300 can be by using laser displacement sensor 240 to the first imaging device 200 and the second imaging
The focus of device 300 is focused and is based on and examines the distance between object 400 and (vertical direction) is mobile along the Z direction.
As described above, according to the present invention, because the first imaging device 200 and the second imaging device 300 are scanned according to row
Method obtains linear image by linear unit, it is possible to which examining equipment to be carried out at the same time using one, alignment is examined and impression is examined
Test, but carry out alignment respectively by different equipment in the prior art and examine and impression inspection.Therefore, inspection can be shortened
Time and the installation space and cost for reducing device.
In addition, according to the present invention, the first linear trigger signal of the first imaging device 200 and the second imaging device 300 and
Second linear trigger signal can be synchronous with the translational speed of the first imaging device and the second imaging device, more accurately to capture
Related with the inspection area of inspection object 400 upper image and lower image.Therefore, inspection and pressure can be more accurately directed at
Trace is examined.
Although disclosing the preferred embodiment of the present invention, do not depart from appended claims illustrated it is of the invention
In the case of scope and spirit, those skilled in the art can make various changes and modifications the present invention.It is also understood that this
Term used in text is not departing from the situation of scope and spirit of the present invention into being descriptive rather than restricted
Under can carry out various changes.
Although it is used to make the first imaging device 200 and the second imaging device for example, providing one in the aforementioned embodiment
The 300 scanning direction linear motors 710 moved along scanning direction, but the present invention is not limited thereto.That is, it can divide
Indescribably confession is used for the linear motor for making the first imaging device 200 be moved along scanning direction and for making the second imaging device
300 linear motors moved along scanning direction.In this case, the trigger signal control unit 940 of control device 900
Can from each linear motor received encoded signal and based on the encoded signal received by the first linear trigger signal and
Second linear trigger signal is sent to the first imaging device 200 and the second imaging device 300.
Although in addition, in the aforementioned embodiment with for providing triggering together with controlling the control device 900 of driving unit 700
Signaling control unit 940, but the present invention is not limited thereto.For example, can be relative to for controlling the control of driving unit 700 to fill
Put and trigger signal control unit 940 is provided separately.
In addition, although the first imaging device 200 and the second imaging device 300 are relative to inspection object in the aforementioned embodiment
400 move along scanning direction, but the present invention is not limited thereto.For example, the first imaging device 200 and the second imaging device 300
It can be fixed, and can provide and examine the transmission device 500 of object 400 (to sweep along the X direction for making to be placed above
Retouch direction) mobile driving unit (linear motor), to allow to examine object 400 relative to the first imaging device 200 and the
Two imaging devices 300 are moved along scanning direction.Here, trigger signal control unit 940 can be received for making transmission device
500 driving unit moved along scanning direction (linear motor) encoded signals, and will be with examining object 400 along scanning
The the first linear trigger signal and the second linear trigger signal of the translational speed synchronization in direction are sent to 200 He of the first imaging device
Second imaging device 300.
According to invention as described above, because irradiation visible ray examines the first of underbody image to be imaged to capture
Device and irradiation infrared light with capture examine object upper image the second imaging device pass through according to line scanning method it is linear
Unit obtains linear image, it is possible to and examining equipment to be carried out at the same time using one, alignment is examined and impression is examined, but existing
Have and carry out alignment inspection and impression inspection in technology respectively by different equipment.Therefore, it can shorten and examine engagement state
Check-Out Time and the installation space and cost for reducing device.
Claims (8)
1. equipment is examined in a kind of glass top chip engagement, including：
Object is examined, it includes chip and transparent panel, and the lead of the chip and the transparent panel is led by anisotropy
The conductive particle of electrolemma is electrically connected to each other, and chip alignment mark is respectively formed at the both ends of the chip, and described transparent
The both ends of panel are respectively formed on panel alignment mark；
Base, is flatly provided with the inspection object thereon；
First imaging device, first imaging device are installed on the base and are arranged under the inspection object
Side, and first imaging device will be seen that light irradiates while being moved relative to the inspection object along scanning direction
On the inspection object, include the face continuously to capture the inspection object according to line scanning method and using reflected light
The lower image of the lead of plate alignment mark and the transparent panel；
Second imaging device, second imaging device are installed on the base and are arranged on the upper of the inspection object
Side, and second imaging device while being moved relative to the inspection object along the scanning direction by infrared light
It is radiated on the inspection object, includes institute continuously to capture the inspection object according to line scanning method and using reflected light
State the upper image of chip alignment mark；
Driving unit, the driving unit make first imaging device and second imaging device along the scanning direction
It is mobile；And
Control device, the control device control the driving unit, and the control device is by the first linear trigger signal
First imaging device and second imaging device are sent respectively to the second linear trigger signal, described first is linear tactile
Signal and the second linear trigger signal and first imaging device and second imaging device are along the scanning
The translational speed in direction is synchronous,
Wherein, the control device is believed based on the encoded signal sent from the driving unit come the synchronous described first linear triggering
Number and the described second linear trigger signal.
2. equipment is examined in glass top chip engagement according to claim 1, moving stage, the mobile loading are further included
Platform is moved by the driving unit relative to the base along the scanning direction,
Wherein, first imaging device and second imaging device are connected to the moving stage, with the shifting
The movement of dynamic object stage is moved along the scanning direction together.
3. equipment is examined in glass top chip according to claim 1 engagement, wherein, first imaging device and described the
Two imaging devices are arranged to：The VISIBLE LIGHT EMISSION position of first imaging device and the infrared light of second imaging device are sent out
Position is penetrated to be mutually aligned.
4. equipment is examined in glass top chip engagement according to claim 1, transmission device is further included, the transmission device is used
In transmitting the inspection object so that the inspection object be arranged on first imaging device and second imaging device it
Between,
Wherein, reference position scale is provided with the transmission device, the reference position scale is used to confirm described first
The catch position of the catch position of imaging device and second imaging device.
5. equipment is examined in glass top chip engagement according to claim 1, wherein, it is based respectively on first imaging device
Pulse period of the described first linear trigger signal and described second linear is determined with the resolution ratio of second imaging device
The pulse period of trigger signal.
6. equipment is examined in the glass top chip engagement according to any one of claim 1-5, wherein, by using each to different
Property conducting film makes upper chip be engaged with lower transparent panel to manufacture the inspection object, and
The first imaging device capture lower image for examining object, the lower image includes being formed in described transparent
The recessed impression of panel alignment mark on panel and the conductive particle included in the anisotropic conductive film, and it is described
The second imaging device capture upper image for examining object, the upper image include the chip alignment being formed on chip
Mark.
7. equipment is examined in the glass top chip engagement according to any one of claim 1-5, wherein, the first imaging dress
Putting can be vertically movable with second imaging device, so that the focus of first imaging device and second imaging device
Each focus.
8. equipment is examined in a kind of glass top chip engagement, including：
Object is examined, it includes chip and transparent panel, and the lead of the chip and the transparent panel is led by anisotropy
The conductive particle of electrolemma is electrically connected to each other, and chip alignment mark is respectively formed at the both ends of the chip, and described transparent
The both ends of panel are respectively formed on panel alignment mark；
Base, is flatly provided with the inspection object thereon；
First imaging device, first imaging device are installed on the base and are arranged under the inspection object
Side, and first imaging device will be seen that light is radiated on the inspection object, with according to line scanning method and using instead
Penetrate the lower image that light continuously captures the lead for including the panel alignment mark and the transparent panel of the inspection object；
Second imaging device, second imaging device are installed on the base and are arranged on the upper of the inspection object
Side, and second imaging device examines Infrared irradiation on object described, with according to line scanning method and using instead
Penetrate the upper image for including the chip alignment mark that light continuously captures the inspection object；
Driving unit, the driving unit make the inspection object be filled relative to first imaging device and second imaging
Put along scanning direction and move；And
Control device, the control device control the driving unit, and the control device is by the first linear trigger signal
First imaging device and second imaging device are sent respectively to the second linear trigger signal, described first is linear tactile
Signalling and the second linear trigger signal and the inspection object are synchronous along the translational speed of the scanning direction,
Wherein, the control device is believed based on the encoded signal sent from the driving unit come the synchronous described first linear triggering
Number and the described second linear trigger signal.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0007705 | 2014-01-22 | ||
| KR1020140007705A KR101619149B1 (en) | 2014-01-22 | 2014-01-22 | Chip on glass bonding inspection apparatus |
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| Publication Number | Publication Date |
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| CN104792800A CN104792800A (en) | 2015-07-22 |
| CN104792800B true CN104792800B (en) | 2018-04-17 |
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| CN201410220535.XA Active CN104792800B (en) | 2014-01-22 | 2014-05-23 | Equipment is examined in glass top chip engagement |
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| Country | Link |
|---|---|
| KR (1) | KR101619149B1 (en) |
| CN (1) | CN104792800B (en) |
| TW (2) | TWI509237B (en) |
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| CN105259178B (en) * | 2015-11-20 | 2019-03-15 | 云南卡索实业有限公司 | A kind of shearing class linear trace laser detection system |
| KR102008224B1 (en) * | 2018-05-29 | 2019-08-07 | 에스엔유 프리시젼 주식회사 | Inspecting system being capable of inspecting curved surface |
| KR102326328B1 (en) * | 2020-03-05 | 2021-11-15 | 주식회사 앱소 | Apparatus and Method for Vision Inspection |
| CN116013803B (en) * | 2023-03-30 | 2023-06-20 | 深圳新控半导体技术有限公司 | Temperature sensing type detection device for chip adhesion and detection method thereof |
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| JP2006184021A (en) * | 2004-12-24 | 2006-07-13 | Saki Corp:Kk | Visual inspection system |
| KR20100070814A (en) * | 2008-12-18 | 2010-06-28 | 주식회사 브이원텍 | Apparatus for inspecting conjugation portion of c.o.g |
| CN103376259A (en) * | 2012-04-11 | 2013-10-30 | 百励科技股份有限公司 | Device and method for detecting internal defects of element |
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| EP2609419A1 (en) * | 2010-08-24 | 2013-07-03 | Nanda Technologies GmbH | Methods and systems for inspecting bonded wafers |
| KR101019831B1 (en) | 2010-09-02 | 2011-03-04 | 주식회사 투아이스펙트라 | System for inspecting edge of glass substrate |
| JP6004517B2 (en) * | 2011-04-19 | 2016-10-12 | 芝浦メカトロニクス株式会社 | Substrate inspection apparatus, substrate inspection method, and adjustment method of the substrate inspection apparatus |
| TW201339572A (en) * | 2012-03-21 | 2013-10-01 | Optivu Vision System Corp | Apparatus and method for detecting defects in device |
| JP5958808B2 (en) * | 2012-06-04 | 2016-08-02 | 株式会社Ｊｏｌｅｄ | Display panel manufacturing method, inspection apparatus and inspection method thereof |
| TWM469621U (en) * | 2013-06-21 | 2014-01-01 | 昇佳電子股份有限公司 | Optical sensor |
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2014
- 2014-01-22 KR KR1020140007705A patent/KR101619149B1/en active IP Right Grant
- 2014-05-23 CN CN201410220535.XA patent/CN104792800B/en active Active
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006184021A (en) * | 2004-12-24 | 2006-07-13 | Saki Corp:Kk | Visual inspection system |
| KR20100070814A (en) * | 2008-12-18 | 2010-06-28 | 주식회사 브이원텍 | Apparatus for inspecting conjugation portion of c.o.g |
| CN103376259A (en) * | 2012-04-11 | 2013-10-30 | 百励科技股份有限公司 | Device and method for detecting internal defects of element |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI582412B (en) | 2017-05-11 |
| TW201530123A (en) | 2015-08-01 |
| CN104792800A (en) | 2015-07-22 |
| KR101619149B1 (en) | 2016-05-10 |
| TWI509237B (en) | 2015-11-21 |
| TW201602561A (en) | 2016-01-16 |
| KR20150087575A (en) | 2015-07-30 |
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