TWI582125B - Method for manufacturing hardened anisotropic conductive material, connecting structure and connecting structure for electronic parts - Google Patents

Method for manufacturing hardened anisotropic conductive material, connecting structure and connecting structure for electronic parts Download PDF

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Publication number
TWI582125B
TWI582125B TW103101876A TW103101876A TWI582125B TW I582125 B TWI582125 B TW I582125B TW 103101876 A TW103101876 A TW 103101876A TW 103101876 A TW103101876 A TW 103101876A TW I582125 B TWI582125 B TW I582125B
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Taiwan
Prior art keywords
electrode
connection
compound
conductive
layer
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TW103101876A
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English (en)
Chinese (zh)
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TW201446827A (zh
Inventor
Hideaki Ishizawa
Takashi Kubota
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Sekisui Chemical Co Ltd
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Publication of TW201446827A publication Critical patent/TW201446827A/zh
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Publication of TWI582125B publication Critical patent/TWI582125B/zh

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    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H01L2224/832—Applying energy for connecting
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    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83399—Material
    • H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal

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  • Engineering & Computer Science (AREA)
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TW103101876A 2013-01-17 2014-01-17 Method for manufacturing hardened anisotropic conductive material, connecting structure and connecting structure for electronic parts TWI582125B (zh)

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CN107077914B (zh) * 2015-02-19 2019-05-31 积水化学工业株式会社 导电糊剂及连接结构体
KR102569944B1 (ko) * 2015-05-25 2023-08-24 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
JPWO2017029993A1 (ja) * 2015-08-19 2018-05-31 積水化学工業株式会社 導電材料及び接続構造体
JP6630284B2 (ja) * 2015-08-24 2020-01-15 積水化学工業株式会社 導電材料及び接続構造体
JP6551794B2 (ja) * 2016-05-30 2019-07-31 パナソニックＩｐマネジメント株式会社 導電粒子、ならびに回路部材の接続材料、接続構造、および接続方法
KR20180024099A (ko) * 2016-08-26 2018-03-08 삼성디스플레이 주식회사 접합 조립체 및 이를 포함하는 표시 장치
JP2018131569A (ja) * 2017-02-16 2018-08-23 パナソニックＩｐマネジメント株式会社 導電性粒子を含む樹脂組成物
KR20210149265A (ko) * 2020-06-01 2021-12-09 삼성디스플레이 주식회사 표시장치 및 이의 제조 방법
EP3979298A1 (en) * 2020-09-30 2022-04-06 Infineon Technologies Austria AG Device for controlling trapped ions and method of manufacturing the same
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JP5886582B2 (ja) * 2010-09-28 2016-03-16 積水化学工業株式会社 異方性導電材料、ｂステージ状硬化物、ｂステージ状硬化物の製造方法及び接続構造体
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TW201233725A (en) * 2011-02-03 2012-08-16 Namics Corp Epoxy resin composition and semiconductor-sealing material using the same

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