TWI576708B - 自動缺陷分類的分類器準備與維持 - Google Patents

自動缺陷分類的分類器準備與維持 Download PDF

Info

Publication number
TWI576708B
TWI576708B TW102114039A TW102114039A TWI576708B TW I576708 B TWI576708 B TW I576708B TW 102114039 A TW102114039 A TW 102114039A TW 102114039 A TW102114039 A TW 102114039A TW I576708 B TWI576708 B TW I576708B
Authority
TW
Taiwan
Prior art keywords
category
data
classification
defect
defects
Prior art date
Application number
TW102114039A
Other languages
English (en)
Chinese (zh)
Other versions
TW201346593A (zh
Inventor
凱薩門亞當
許蘭弗拉德米爾
羅茲門艾瑞特
Original Assignee
應用材料以色列公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料以色列公司 filed Critical 應用材料以色列公司
Publication of TW201346593A publication Critical patent/TW201346593A/zh
Application granted granted Critical
Publication of TWI576708B publication Critical patent/TWI576708B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
    • G06F18/214—Generating training patterns; Bootstrap methods, e.g. bagging or boosting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/77—Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
    • G06V10/774—Generating sets of training patterns; Bootstrap methods, e.g. bagging or boosting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/98—Detection or correction of errors, e.g. by rescanning the pattern or by human intervention; Evaluation of the quality of the acquired patterns
    • G06V10/987—Detection or correction of errors, e.g. by rescanning the pattern or by human intervention; Evaluation of the quality of the acquired patterns with the intervention of an operator
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Evolutionary Computation (AREA)
  • Multimedia (AREA)
  • Artificial Intelligence (AREA)
  • Data Mining & Analysis (AREA)
  • Quality & Reliability (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Health & Medical Sciences (AREA)
  • Computing Systems (AREA)
  • Databases & Information Systems (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Information Retrieval, Db Structures And Fs Structures Therefor (AREA)
TW102114039A 2012-04-20 2013-04-19 自動缺陷分類的分類器準備與維持 TWI576708B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/452,771 US9607233B2 (en) 2012-04-20 2012-04-20 Classifier readiness and maintenance in automatic defect classification

Publications (2)

Publication Number Publication Date
TW201346593A TW201346593A (zh) 2013-11-16
TWI576708B true TWI576708B (zh) 2017-04-01

Family

ID=49380169

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102114039A TWI576708B (zh) 2012-04-20 2013-04-19 自動缺陷分類的分類器準備與維持

Country Status (4)

Country Link
US (1) US9607233B2 (OSRAM)
JP (1) JP6391083B2 (OSRAM)
KR (1) KR102092054B1 (OSRAM)
TW (1) TWI576708B (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10636133B2 (en) 2017-10-27 2020-04-28 Industrial Technology Research Institute Automated optical inspection (AOI) image classification method, system and computer-readable media
US11315231B2 (en) 2018-06-08 2022-04-26 Industrial Technology Research Institute Industrial image inspection method and system and computer readable recording medium

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5800434B2 (ja) * 2013-01-11 2015-10-28 Ckd株式会社 検査装置の監視システム
US9430743B2 (en) 2014-03-06 2016-08-30 Kla-Tencor Corp. Composite defect classifier
US10576603B2 (en) * 2014-04-22 2020-03-03 Kla-Tencor Corporation Patterned wafer geometry measurements for semiconductor process controls
US9286675B1 (en) * 2014-10-23 2016-03-15 Applied Materials Israel Ltd. Iterative defect filtering process
US9898811B2 (en) * 2015-05-08 2018-02-20 Kla-Tencor Corporation Method and system for defect classification
US9922269B2 (en) * 2015-06-05 2018-03-20 Kla-Tencor Corporation Method and system for iterative defect classification
US10089581B2 (en) * 2015-06-30 2018-10-02 The Boeing Company Data driven classification and data quality checking system
US10083403B2 (en) * 2015-06-30 2018-09-25 The Boeing Company Data driven classification and data quality checking method
US10436720B2 (en) * 2015-09-18 2019-10-08 KLA-Tenfor Corp. Adaptive automatic defect classification
US10643291B2 (en) * 2015-09-28 2020-05-05 Smartvid.io, Inc. Media management system
TWI797699B (zh) * 2015-12-22 2023-04-01 以色列商應用材料以色列公司 半導體試樣的基於深度學習之檢查的方法及其系統
US11580375B2 (en) * 2015-12-31 2023-02-14 Kla-Tencor Corp. Accelerated training of a machine learning based model for semiconductor applications
KR102483787B1 (ko) * 2016-02-25 2023-01-04 에스케이하이닉스 주식회사 반도체 장치의 결함 모델링 장치 및 방법, 이를 위한 컴퓨터 프로그램과, 이를 이용한 반도체 장치의 결함 검사 시스템
JP2018045673A (ja) * 2016-09-09 2018-03-22 株式会社Ｓｃｒｅｅｎホールディングス 分類器構築方法、画像分類方法、分類器構築装置および画像分類装置
US10365617B2 (en) 2016-12-12 2019-07-30 Dmo Systems Limited Auto defect screening using adaptive machine learning in semiconductor device manufacturing flow
US11037286B2 (en) * 2017-09-28 2021-06-15 Applied Materials Israel Ltd. Method of classifying defects in a semiconductor specimen and system thereof
JP6681082B2 (ja) * 2018-02-21 2020-04-15 株式会社タナカ技研 情報処理装置、情報システム、情報処理方法、およびプログラム
JP6960356B2 (ja) * 2018-02-28 2021-11-05 株式会社Ｓｃｒｅｅｎホールディングス 教師データ作成支援方法および教師データ作成支援装置
US11514357B2 (en) * 2018-03-19 2022-11-29 Kla-Tencor Corporation Nuisance mining for novel defect discovery
DE102018109816B3 (de) * 2018-04-24 2019-10-24 Yxlon International Gmbh Verfahren zur Gewinnung mindestens eines signifikanten Merkmals in einer Serie von Bauteilen gleichen Typs und Verfahren zur Klassifikation eines Bauteils eienr solchen Serie
US10748271B2 (en) 2018-04-25 2020-08-18 Applied Materials Israel Ltd. Method of defect classification and system thereof
CN112424826A (zh) 2018-07-13 2021-02-26 Asml荷兰有限公司 基于机器学习的图案分组方法
US10867108B2 (en) 2018-09-18 2020-12-15 Taiwan Semiconductor Manufacturing Co., Ltd. Optical mode optimization for wafer inspection
US11550309B2 (en) * 2019-01-08 2023-01-10 Kla Corporation Unsupervised defect segmentation
US10762618B1 (en) * 2019-02-14 2020-09-01 United Microelectronics Corp. Mask weak pattern recognition apparatus and mask weak pattern recognition method
US11122680B2 (en) * 2019-03-18 2021-09-14 International Business Machines Corporation Passive methods of loose die identification
JP7263074B2 (ja) * 2019-03-22 2023-04-24 キヤノン株式会社 情報処理装置、及びその制御方法、プログラム、記憶媒体
JP7326867B2 (ja) * 2019-05-21 2023-08-16 富士通株式会社 情報処理装置、情報処理プログラム及び情報処理方法
CN110473170B (zh) * 2019-07-10 2023-04-07 苏州卓融新能源科技有限公司 一种适用于pcb板真假缺陷判定的人工智能检测方法
US11684921B1 (en) * 2019-08-16 2023-06-27 Leidos, Inc. Pocket detection pouch
CN111079832B (zh) * 2019-12-13 2023-04-18 辽宁科技大学 具有抗特征噪声性能的钢板表面缺陷分类方法
JP7084634B2 (ja) * 2019-12-20 2022-06-15 株式会社タナカ技研 、情報処理装置、端末装置、情報処理方法、およびプログラム
JP6865901B1 (ja) * 2020-03-30 2021-04-28 三菱電機株式会社 診断システム、診断方法及びプログラム
US11430105B2 (en) 2020-06-15 2022-08-30 Mitutoyo Corporation Workpiece inspection and defect detection system including monitoring of workpiece images
US11150200B1 (en) 2020-06-15 2021-10-19 Mitutoyo Corporation Workpiece inspection and defect detection system indicating number of defect images for training
TWI801767B (zh) * 2020-11-09 2023-05-11 財團法人工業技術研究院 機器學習分類模型之修正方法與訓練系統及使用者介面
US11404244B1 (en) * 2021-02-10 2022-08-02 Applied Materials Israel Ltd. High-resolution x-ray spectroscopy surface material analysis
US11501951B1 (en) 2021-05-14 2022-11-15 Applied Materials Israel Ltd. X-ray imaging in cross-section using un-cut lamella with background material
US12205242B2 (en) * 2021-07-01 2025-01-21 Leidos, Inc. Method and system for accelerating rapid class augmentation for object detection in deep neural networks
US11756186B2 (en) 2021-09-15 2023-09-12 Mitutoyo Corporation Workpiece inspection and defect detection system utilizing color channels
WO2024036552A1 (en) * 2022-08-18 2024-02-22 Applied Materials, Inc. Method for defect review measurement on a substrate, apparatus for imaging a substrate, and method of operating thereof
US20240144464A1 (en) * 2022-10-28 2024-05-02 Applied Materials, Inc. Classification of defect patterns of substrates
US20250117915A1 (en) * 2023-10-06 2025-04-10 Applied Materials, Inc. Optical inspection-based automatic defect classification

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040156540A1 (en) * 2003-02-12 2004-08-12 Kla-Tencor Technologies, Corporation Automatic supervised classifier setup tool for semiconductor defects
US6999614B1 (en) * 1999-11-29 2006-02-14 Kla-Tencor Corporation Power assisted automatic supervised classifier creation tool for semiconductor defects

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5923430A (en) 1993-06-17 1999-07-13 Ultrapointe Corporation Method for characterizing defects on semiconductor wafers
US8144368B2 (en) 1998-01-20 2012-03-27 Digimarc Coporation Automated methods for distinguishing copies from original printed objects
US5991699A (en) 1995-05-04 1999-11-23 Kla Instruments Corporation Detecting groups of defects in semiconductor feature space
US6292582B1 (en) 1996-05-31 2001-09-18 Lin Youling Method and system for identifying defects in a semiconductor
US6148099A (en) * 1997-07-03 2000-11-14 Neopath, Inc. Method and apparatus for incremental concurrent learning in automatic semiconductor wafer and liquid crystal display defect classification
US6195458B1 (en) 1997-07-29 2001-02-27 Eastman Kodak Company Method for content-based temporal segmentation of video
US6996549B2 (en) 1998-05-01 2006-02-07 Health Discovery Corporation Computer-aided image analysis
US6256093B1 (en) * 1998-06-25 2001-07-03 Applied Materials, Inc. On-the-fly automatic defect classification for substrates using signal attributes
US6650779B2 (en) 1999-03-26 2003-11-18 Georgia Tech Research Corp. Method and apparatus for analyzing an image to detect and identify patterns
US6922482B1 (en) * 1999-06-15 2005-07-26 Applied Materials, Inc. Hybrid invariant adaptive automatic defect classification
US6763130B1 (en) 1999-07-21 2004-07-13 Applied Materials, Inc. Real time defect source identification
US6577757B1 (en) 1999-07-28 2003-06-10 Intelligent Reasoning Systems, Inc. System and method for dynamic image recognition
JP2001156135A (ja) 1999-11-29 2001-06-08 Hitachi Ltd 欠陥画像の分類方法及びその装置並びにそれを用いた半導体デバイスの製造方法
US20020164070A1 (en) 2001-03-14 2002-11-07 Kuhner Mark B. Automatic algorithm generation
US7127099B2 (en) 2001-05-11 2006-10-24 Orbotech Ltd. Image searching defect detector
AU2002305652A1 (en) 2001-05-18 2002-12-03 Biowulf Technologies, Llc Methods for feature selection in a learning machine
WO2002095554A2 (en) 2001-05-18 2002-11-28 Imprivata Inc. System and method for authentication using biometrics
JP3726263B2 (ja) * 2002-03-01 2005-12-14 ヒューレット・パッカード・カンパニー 文書分類方法及び装置
US20040034612A1 (en) 2002-03-22 2004-02-19 Nick Mathewson Support vector machines for prediction and classification in supply chain management and other applications
JP4118703B2 (ja) * 2002-05-23 2008-07-16 株式会社日立ハイテクノロジーズ 欠陥分類装置及び欠陥自動分類方法並びに欠陥検査方法及び処理装置
US7020337B2 (en) 2002-07-22 2006-03-28 Mitsubishi Electric Research Laboratories, Inc. System and method for detecting objects in images
US7602962B2 (en) 2003-02-25 2009-10-13 Hitachi High-Technologies Corporation Method of classifying defects using multiple inspection machines
JP4443270B2 (ja) * 2003-03-12 2010-03-31 株式会社日立ハイテクノロジーズ 欠陥分類方法
US7756320B2 (en) * 2003-03-12 2010-07-13 Hitachi High-Technologies Corporation Defect classification using a logical equation for high stage classification
US9002497B2 (en) 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
US7106434B1 (en) 2003-07-28 2006-09-12 Kla-Tencor Technologies, Inc. Inspection tool
JP2007503034A (ja) 2003-08-19 2007-02-15 フロインホーファー−ゲゼルシャフト ツール フェルデルング デア アンゲヴァンテン フォルシュング イー ファウ データストリーム中の異常オブジェクトを自動的にオンラインで検出及びクラス分類するための方法及び装置
US7490071B2 (en) 2003-08-29 2009-02-10 Oracle Corporation Support vector machines processing system
JP2005158780A (ja) 2003-11-20 2005-06-16 Hitachi Ltd パターン欠陥検査方法及びその装置
JP2005198970A (ja) 2004-01-19 2005-07-28 Konica Minolta Medical & Graphic Inc 医用画像処理装置
US20050175243A1 (en) 2004-02-05 2005-08-11 Trw Automotive U.S. Llc Method and apparatus for classifying image data using classifier grid models
US7609893B2 (en) 2004-03-03 2009-10-27 Trw Automotive U.S. Llc Method and apparatus for producing classifier training images via construction and manipulation of a three-dimensional image model
US20060009011A1 (en) 2004-07-06 2006-01-12 Gary Barrett Method for recycling/reclaiming a monitor wafer
US7188050B2 (en) 2004-08-25 2007-03-06 Siemens Corporate Research, Inc. Method and apparatus for detecting out-of-range conditions in power generation equipment operations
US7450766B2 (en) 2004-10-26 2008-11-11 Hewlett-Packard Development Company, L.P. Classifier performance
JP4654093B2 (ja) * 2005-08-31 2011-03-16 株式会社日立ハイテクノロジーズ 回路パターン検査方法及びその装置
JP4776308B2 (ja) 2005-09-05 2011-09-21 株式会社東京精密 画像欠陥検査装置、画像欠陥検査システム、欠陥分類装置及び画像欠陥検査方法
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570800B2 (en) 2005-12-14 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for binning defects detected on a specimen
US7684609B1 (en) 2006-05-25 2010-03-23 Kla-Tencor Technologies Corporation Defect review using image segmentation
JP4253335B2 (ja) 2006-07-13 2009-04-08 株式会社東芝 カーネル関数値を用いた、画像の平均値シフトによるフィルタリングとクラスタリングの方法及び装置
JP4908995B2 (ja) * 2006-09-27 2012-04-04 株式会社日立ハイテクノロジーズ 欠陥分類方法及びその装置並びに欠陥検査装置
US8194968B2 (en) 2007-01-05 2012-06-05 Kla-Tencor Corp. Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
JP4723544B2 (ja) * 2007-09-10 2011-07-13 シャープ株式会社 基板分類方法および装置、基板分類方法をコンピュータに実行させるためのプログラム、並びに上記プログラムを記録したコンピュータ読み取り可能な記録媒体
JP5081590B2 (ja) 2007-11-14 2012-11-28 株式会社日立ハイテクノロジーズ 欠陥観察分類方法及びその装置
US7949622B2 (en) 2007-12-13 2011-05-24 Yahoo! Inc. System and method for generating a classifier model for classifying web content
US8583416B2 (en) 2007-12-27 2013-11-12 Fluential, Llc Robust information extraction from utterances
US7756658B2 (en) 2008-05-14 2010-07-13 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer and generating inspection results for the wafer
US20090305423A1 (en) 2008-06-09 2009-12-10 Ohio State University Research Foundation Methods for Monitoring Composition and Flavor Quality of Cheese Using a Rapid Spectroscopic Method
JP5075111B2 (ja) * 2008-12-29 2012-11-14 株式会社日立ハイテクノロジーズ 画像分類基準更新方法、プログラムおよび画像分類装置
US8175373B2 (en) 2009-02-16 2012-05-08 Kla-Tencor Corporation Use of design information and defect image information in defect classification
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8457414B2 (en) 2009-08-03 2013-06-04 National Instruments Corporation Detection of textural defects using a one class support vector machine
JP2011158373A (ja) * 2010-02-02 2011-08-18 Dainippon Screen Mfg Co Ltd 自動欠陥分類のための教師データ作成方法、自動欠陥分類方法および自動欠陥分類装置
WO2011155123A1 (ja) * 2010-06-07 2011-12-15 株式会社 日立ハイテクノロジーズ 観察画像の分類基準の最適化方法、および画像分類装置
US8315453B2 (en) * 2010-07-27 2012-11-20 Applied Materials Israel, Ltd. Defect classification with optimized purity
US9165051B2 (en) 2010-08-24 2015-10-20 Board Of Trustees Of The University Of Illinois Systems and methods for detecting a novel data class
US8983179B1 (en) 2010-11-10 2015-03-17 Google Inc. System and method for performing supervised object segmentation on images
US8502146B2 (en) 2011-10-03 2013-08-06 Kla-Tencor Corporation Methods and apparatus for classification of defects using surface height attributes
CN104303264B (zh) 2012-03-19 2017-06-09 科磊股份有限公司 用于半导体装置的自动化检验的配方产生的方法、计算机系统及设备
US10043264B2 (en) 2012-04-19 2018-08-07 Applied Materials Israel Ltd. Integration of automatic and manual defect classification
US10599944B2 (en) 2012-05-08 2020-03-24 Kla-Tencor Corporation Visual feedback for inspection algorithms and filters
US10330608B2 (en) 2012-05-11 2019-06-25 Kla-Tencor Corporation Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology tools
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9053390B2 (en) 2012-08-14 2015-06-09 Kla-Tencor Corporation Automated inspection scenario generation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6999614B1 (en) * 1999-11-29 2006-02-14 Kla-Tencor Corporation Power assisted automatic supervised classifier creation tool for semiconductor defects
US20040156540A1 (en) * 2003-02-12 2004-08-12 Kla-Tencor Technologies, Corporation Automatic supervised classifier setup tool for semiconductor defects

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10636133B2 (en) 2017-10-27 2020-04-28 Industrial Technology Research Institute Automated optical inspection (AOI) image classification method, system and computer-readable media
US11315231B2 (en) 2018-06-08 2022-04-26 Industrial Technology Research Institute Industrial image inspection method and system and computer readable recording medium

Also Published As

Publication number Publication date
US9607233B2 (en) 2017-03-28
JP6391083B2 (ja) 2018-09-19
KR20130118822A (ko) 2013-10-30
TW201346593A (zh) 2013-11-16
US20130279796A1 (en) 2013-10-24
KR102092054B1 (ko) 2020-03-24
JP2013225313A (ja) 2013-10-31

Similar Documents

Publication Publication Date Title
TWI576708B (zh) 自動缺陷分類的分類器準備與維持
TWI639824B (zh) 用於自動及手動缺陷分類之整合的方法、設備及非暫態電腦可讀取儲存媒介
KR102110755B1 (ko) 자동 결함 분류를 위한 알려지지 않은 결함 리젝션의 최적화
CN110402487B (zh) 对从晶片检测的缺陷进行分类的方法和装置
TWI691914B (zh) 用於自動分類的方法，及其裝置、系統，及電腦可讀取媒體
KR102083706B1 (ko) 반도체 검사 레시피 생성, 결함 리뷰 및 계측을 위한 적응적 샘플링
TWI833854B (zh) 用於多模式半導體檢測的光學模式選擇
US9293298B2 (en) Defect discovery and inspection sensitivity optimization using automated classification of corresponding electron beam images
KR102340791B1 (ko) 폐쇄-루프 자동 결함 검사 및 분류
TW201915770A (zh) 對半導體樣本中的缺陷進行分類之方法及其系統
KR102472309B1 (ko) 검사를 위한 모드 선택
KR20190057402A (ko) 검사 관련 알고리즘을 설정하는데 사용되는 트레이닝 세트의 최적화
TWI772735B (zh) 對半導體取樣中的缺陷進行分類的方法及其系統
KR102483787B1 (ko) 반도체 장치의 결함 모델링 장치 및 방법, 이를 위한 컴퓨터 프로그램과, 이를 이용한 반도체 장치의 결함 검사 시스템
KR102629852B1 (ko) 다중-모드 검사를 위한 통계적 학습-기반 모드 선택
CN112805719A (zh) 分类半导体样本中的缺陷
Darwin et al. Automatic classification of microlithography macrodefects using a knowledge-based system
JP2020004391A (ja) 同じタイプの一連の構成部品における少なくとも１つの重要な特徴を取得する方法及びそのような一連の構成部品を分類する方法