TWI575307B - Data correction apparatus, drawing apparatus, data correction method, and drawing method - Google Patents

Description

Data correction device, drawing device, data correction method and drawing method

The present invention relates to a technique for correcting image data of an image drawn on a substrate based on position information of a mark on a substrate.

In the prior art, the light is applied to a photosensitive material formed on a semiconductor substrate, a printed circuit board, a plasma display device, or a glass substrate for a liquid crystal display device (hereinafter referred to as "substrate"), and the pattern is drawn. In recent years, as the pattern has been refined, there has been a drawing device that directly scans a light beam on a photosensitive material to draw a pattern.

In the above-described drawing device, when deformation such as warpage, distortion, distortion, or the like occurs on the substrate, the deformation of the substrate is integrated to correct the drawing data. The correction of the drawing data is usually performed by measuring the position of the mark on the substrate, such as an alignment mark, and calculating the displacement of each position on the substrate from the measurement result, and then drawing the data of each position. Integrate with this displacement.

For example, in Japanese Patent Laid-Open Publication No. 2008-3441 (Document 1), the correction amount of the drawing data is calculated based on the position information of the four symbols constituting the rectangle around the drawing data. Thereby, the drawing data corresponding to the local deformation of the substrate in the vicinity of the drawing data can be corrected. In Japanese Laid-Open Patent Publication No. 2012-79739 (Document 2), a spline of a substrate is splined according to displacement of a plurality of reference points arranged in a lattice on a substrate. After the approach, correct the depiction data. Thereby, it is possible to capture the tendency of deformation (for example, undulation of the entire substrate) in a wide range of the substrate, and to reliably correct the drawing data.

On the other hand, in the drawing device of Japanese Laid-Open Patent Publication No. 2012-198313 (Document 3), as a means for correcting the drawing data, three correction algorithms which are obtained based on three corrections are incorporated. Further, the operator of the drawing device selects the correction algorithm depending on the type of the substrate, the degree of deformation, and the like, and applies the selected correction algorithm to correct the drawing data.

However, in the drawing device of Document 3, the operator selects the correction algorithm in advance based on the deformation of the obtained substrate, etc., and whether the selected correction algorithm is more suitable than other correction algorithms is not clear.

The present invention is suitable for a data correction device that corrects the image of the image drawn on the substrate based on the position information of the mark on the substrate. It is an object of the invention to automatically select an appropriate correction mode.

A data correction device according to the present invention includes: a design position memory unit that memorizes a plurality of symbols, that is, a design position of a symbol set, wherein the plurality of marks are on a substrate, and are used for correction of the drawing data; a measurement position acquisition unit that acquires a measurement position of the symbol set; and a symbol evaluation value calculation unit that uses an algorithm to calculate each other based on a measurement position and a design position of the remaining symbol group excluding the attention mark group selected from the symbol set In the plurality of different correction modes, the correction position is obtained by correcting the design position of the target mark group, and the deviation from the measurement position of the correction position of the target mark group is obtained for each correction mode. The correction value evaluation value calculation unit is configured to calculate, based on the attention mark group of the at least one class, the correction value calculation unit. The correction value is obtained, and the correction mode evaluation value for displaying the correction accuracy of each of the correction modes is obtained; the correction mode selection unit compares the correction mode evaluation values of the plurality of correction modes, and selects the correction with the highest correction accuracy And a drawing data correcting unit that corrects the drawing data by using the correction mode selected by the correction mode selecting unit. According to the data correction device, an appropriate correction mode can be automatically selected.

In a preferred embodiment of the present invention, the attention mark group is a symbol.

According to still another preferred embodiment of the present invention, the symbol evaluation value calculation unit obtains, for each of the correction patterns, a symbol when each of the symbols included in the symbol set is used as a target symbol group. In the evaluation value, the correction mode evaluation value calculation unit obtains the correction mode evaluation value based on the symbol evaluation values of all the symbols for the respective correction modes.

In still another preferred embodiment of the present invention, the symbol evaluation value is a distance between the correction position of the target mark group and the measurement position, and the correction mode evaluation value is the at least one type of attention mark group In the total of the symbol evaluation values, the correction mode selection unit selects the correction mode in which the correction mode evaluation value is the smallest.

In still another preferred embodiment of the present invention, the symbol evaluation value is a distance between the correction position of the target mark group and the measurement position, and the correction mode evaluation value is the at least one type of attention mark group The correction value selection unit selects the correction mode in which the correction mode evaluation value is the smallest.

In another preferred embodiment of the present invention, the measurement position acquisition unit The imaging unit includes: a photographing unit that captures the set of symbols; and a measurement position calculation unit that obtains the measurement position of the symbol set from an image obtained by the photographing unit.

The invention is also suitable for a rendering device for rendering an image on a substrate. A drawing device according to the present invention includes: a light source; the data correcting device; and a light modulation unit that modulates light from the light source based on the drawing data corrected by the data correcting device; And a scanning mechanism that scans the substrate by the light modulated by the light modulation unit.

The present invention is also applicable to a data correction method and a drawing method for correcting a drawing data of an image drawn on a substrate based on position information of a mark on a substrate, the drawing method is to depict an image On the substrate.

The above and other objects, features, aspects and advantages of the present invention are apparent from the accompanying drawings and claims.

1‧‧‧Drawing device

2‧‧‧ data processing device

3‧‧‧Exposure device

4‧‧‧pattern design device

9‧‧‧Substrate

9a‧‧‧Printed circuit board

21‧‧‧Data Conversion Department

22‧‧‧Information Correction Department

31‧‧‧Drawing controller

32‧‧‧Workbench

33‧‧‧Lighting Department

34‧‧‧Photography Department

35‧‧‧Scanning agency

80‧‧ ‧ mark collection

81‧‧‧ mark

220‧‧‧Revision mode memory

221‧‧‧Design Position Memory

222‧‧‧Measurement Location Acquisition Department

223‧‧‧Mark Evaluation Value Calculation Unit

224‧‧‧Revision mode evaluation value calculation unit

225‧‧‧Revision Mode Selection Department

226‧‧‧Drawing data correction department

228‧‧‧Measurement Position Calculation Department

331‧‧‧Light source

332‧‧‧Light Modulation Department

C1‧‧‧ round

C2‧‧‧ round

M‧‧‧ mark

P1‧‧‧ pattern

P2‧‧‧ pattern

P3‧‧‧ pattern

S11~S18, S121, S122, S131~S135‧‧‧ steps

Fig. 1 is a view showing the configuration of a drawing device.

Figure 2 is a block diagram showing the function of the data processing apparatus.

Fig. 3A is a view for explaining the basic concept of the correction processing of the drawing data.

Fig. 3B is a view for explaining the basic concept of the correction processing of the drawing data.

Fig. 3C is a view for explaining the basic concept of the correction processing of the drawing data.

Fig. 3D is a diagram for explaining the basic concept of the correction processing of the drawing data.

Fig. 3E is a view for explaining the basic concept of the correction processing of the drawing data.

Fig. 3F is a view for explaining the basic concept of the correction processing of the drawing data.

Fig. 3G is a diagram for explaining the basic concept of the correction processing of the drawing data.

Figure 4 is a plan view showing a collection of marks on a substrate.

Figure 5 is a diagram showing the flow of correction of the depicted data.

Fig. 6 is a view showing a flow of a part of the correction of the depiction data.

Fig. 7 is a view showing a flow of a part of the correction of the depiction data.

Fig. 1 is a view showing the configuration of a drawing device 1 according to an embodiment of the present invention. The drawing device 1 irradiates light onto a photosensitive material provided on a surface of a printed circuit board, a semiconductor substrate, a liquid crystal substrate, or the like (hereinafter, simply referred to as "substrate"), and directly draws an image of a circuit pattern or the like directly on the substrate. Device.

The drawing device 1 includes a data processing device 2 and an exposure device 3. The data processing device 2 performs generation and correction of the drawing data. The data processing device 2 is a general computer system including a CPU that performs various arithmetic processing, a ROM that stores a basic program, and a RAM that stores various kinds of information. The exposure device 3 draws (i.e., exposes) the substrate 9 based on the drawing data transmitted from the data processing device 2. The data processing device 2 and the exposure device 3 may be integrally provided or physically separated as long as the data can be transferred between the two devices.

2 is a block diagram showing the function of the data processing device 2. The data processing device 2 includes a data conversion unit 21 and a data correction unit 22. The pattern data created by the pattern designing device 4 such as CAD is input to the data conversion unit 21 as the drawing material of the image drawn on the substrate 9. The pattern data is design data of an image such as a circuit pattern. Pattern data is usually vector data such as polygons. The data conversion unit 21 converts the vector data into mesh data.

The data correcting unit 22 corrects the mesh data generated by the data conversion unit 21 based on the position information of the symbol on the substrate 9 (see FIG. 1), and generates the final drawing data. The data correction unit 22 includes a correction pattern storage unit 220 and The position storage unit 221, the measurement position acquisition unit 222, the symbol evaluation value calculation unit 223, the correction mode evaluation value calculation unit 224, the correction mode selection unit 225, and the drawing data correction unit 226. The measurement position acquisition unit 222 includes a measurement position calculation unit 228 and an imaging unit 34. The photographing unit 34 is provided in the exposure device 3 as will be described later. That is, the photographing unit 34 is shared by the exposure device 3 and the data correcting unit 22. The correction of the drawing data by the data correcting unit 22 will be described later.

As shown in FIG. 1, the exposure device 3 includes a drawing controller 31, a table 32, a light emitting unit 33, an imaging unit 34, and a scanning mechanism 35. The drawing controller 31 controls the light emitting unit 33, the imaging unit 34, and the scanning unit 35. The stage 32 holds the substrate 9 below the light emitting portion 33. The light emitting portion 33 includes a light source 331 and a light modulation portion 332. The light source 331 emits laser light toward the light modulation unit 332. The light modulation unit 332 modulates the light from the light source 331 based on the drawing data from the data processing device 2 (that is, the drawing data corrected by the data correcting unit 22). The light modulated by the light modulation unit 332 is irradiated onto the substrate 9 on the stage 32. As the light modulation unit 332, for example, a DMD (Digital Mirror Device) can be used.

The scanning mechanism 35 moves the table 32 in the horizontal direction. Specifically, the table 32 is moved by the scanning mechanism 35 in the main scanning direction and in the sub-scanning direction perpendicular to the main scanning direction. Thereby, the light modulated by the light modulation unit 332 is scanned on the substrate 9 in the main scanning direction and the sub-scanning direction. In the exposure device 3, a rotation mechanism that horizontally rotates the table 32 may be provided. Further, an elevating mechanism that moves the light emitting portion 33 in the vertical direction may be provided. The scanning mechanism 35 is not necessarily required to move the table 32 as long as the light from the light emitting portion 33 can be scanned on the substrate 9. For example, the scanning unit 35 may move the light emitting unit 33 above the table 32 in the main scanning direction and the sub-scanning direction.

The photographing unit 34 photographs the upper surface of the substrate 9 placed on the table 32. Specifically, the photographing unit 34 captures a plurality of symbols, that is, a symbol set located on the substrate 9. The symbol set is used for correction of the drawing data described later. The plurality of marks are, for example, alignment marks provided for use in positioning of the substrate 9 or the like. Further, as long as the position can be accurately determined, the mark is not limited to the alignment mark, and may be, for example, one of a through hole and a circuit pattern provided on the substrate 9. The image acquired by the imaging unit 34 is transmitted to the measurement position calculation unit 228 (see FIG. 2).

Secondly, the basic concept of correcting the processing of the data is explained. Generally, in the pattern designing device 4, it is assumed that the substrate is a shape that is free from deformation and flat on the upper side, thereby making pattern data. However, the actual substrate has a case where warpage, distortion, distortion due to the processing in the previous step, and the like are generated. In this case, if the circuit pattern is drawn on the arrangement position on the set substrate by the pattern data, the desired product cannot be obtained. Therefore, correction processing (so-called area alignment processing) for converting the formation position of the circuit pattern in accordance with the deformation of the substrate is required to form a circuit pattern in response to deformation of the substrate. In the present embodiment, the process of correcting the drawing data is specifically a table conversion process.

3A to 3G are diagrams for explaining the basic concept of the correction processing of the drawing data. FIG. 3A shows a pattern P1 which is first drawn on the printed circuit board 9a. The pattern P1 includes a plurality of circles C1 and a plurality of cross-shaped marks M. FIG. 3B shows the pattern P2 drawn on the printed circuit board 9a after the pattern P1 of FIG. 3A. Pattern P2 contains a plurality of circles C2. Each circle C2 is smaller than the circle C1. When the printed circuit board 9a is not deformed, the patterns P1 and P2 are sequentially drawn, and as shown in FIG. 3C, the pattern P3 is formed on the printed circuit board 9a. In the pattern P3, a plurality of circles C2 are respectively located at the centers of the plurality of circles C1.

In this way, as such a case where two patterns are superimposed, for example, there is formation. The copper wiring pattern of the printed circuit board and the pattern of the solder resist superposed on the copper wiring pattern. Further, there are cases where the first layer and the second layer of the wiring pattern of the multilayer printed circuit board are formed, or the surface wiring pattern and the back surface wiring pattern of the double-sided printed circuit board are formed. In the case where the surface wiring pattern and the back surface wiring pattern are formed, when the back surface wiring pattern is exposed from the back surface side, the pattern surface is reversed.

For example, it is considered that the pattern P1 shown in FIG. 3A is a copper wiring pattern of the printed circuit board 9a, and the pattern P2 shown in FIG. 3B is a pattern in which the pattern of the solder resist of the copper wiring pattern is superposed. In this case, first, a photoresist film is formed on the entire copper layer formed on the printed circuit board 9a. Next, the drawing of the photoresist film (that is, exposure) is performed based on the drawing data generated from the pattern data of the display pattern P1. Then, development processing of the photoresist film is performed, and the copper layer is etched to form a copper wiring pattern. Next, a solder resist layer is formed on the copper wiring pattern of the printed circuit board 9a by coating or stacking. Then, the solder resist layer is drawn based on the drawing data generated from the pattern data of the display pattern P2, and development processing is performed.

In the process of forming the copper wiring pattern, there are cases in which development, etching, washing, heat drying, and the like are performed, and the printed circuit board 9a is deformed by stretching, warping, or the like due to the influence of the processes. For example, the deformation shown in FIG. 3D is produced on the printed circuit board 9a due to the formation of the copper wiring pattern. In FIG. 3D, in order to facilitate the understanding of the deformation of the printed circuit board 9a, the adjacent symbols M are connected to each other (the same applies to FIGS. 3E to 3G) by a two-dot chain line. In the printed circuit board 9a, if the drawing data generated from the pattern data of the display pattern P2 is not used for correction and is used for drawing, it is contained in the positions of the circles C1 and C2 in the two patterns P1 and P2, respectively. In relation, as shown in FIG. 3E, a deviation occurs, and the desired pattern cannot be formed.

Therefore, the deformation of the printed circuit board 9a is considered (that is, formed on the print) As shown in FIG. 3F, the pattern data generated from the pattern data of the display pattern P2 is corrected as shown in FIG. 3F. Further, in FIG. 3F, in order to facilitate comparison with FIG. 3D, in addition to the plurality of circles C2, a plurality of symbols M not included in the pattern P2 are collectively drawn by thin lines. This correction processing is the above-described area alignment processing. The pattern P2 is formed by drawing the pattern P2 based on the corrected drawing data. The pattern is as shown in FIG. 3G, and the circles C1 and C2 included in the two patterns P1 and P2 respectively display the desired positional relationship.

When the deformation of the printed circuit board 9a is obtained, for example, a plurality of symbols M provided on the printed circuit board 9a are imaged, and the position of each symbol M is obtained from the acquired image. Further, the deformation of the printed circuit board 9a is obtained based on the deviation between the measurement position of the obtained symbol M, that is, the measurement position, and the position of each symbol M which is not deformed by the printed circuit board 9a.

In addition, in FIG. 3D, the circle C1 of the pattern P1 formed on the printed circuit board 9a is drawn so as to move only in position, and in FIG. 3F, the circle C2 of the corrected pattern P2 is moved only by position. Make a description. In the actual process, the circle C1 of the pattern P1 has a case where not only the position but also the shape is deformed. In this case, the circle C2 of the corrected pattern P2 is corrected not only for the position but also for the deformation of the circle C1.

Next, the correction of the drawing material in the material correction unit 22 (see FIG. 2) of the drawing device 1 will be described. In the data correcting unit 22, a program for executing a plurality of correction modes is stored in advance in the correction mode storage unit 220. As described above, the plurality of correction modes are correction methods for correcting the drawing data in consideration of the deformation of the substrate 9. In the multiple correction modes, the algorithms used to correct the data are different. Therefore, the result of the correction according to the plurality of correction modes is usually different from each other.

And performing according to each correction mode stored in the correction mode storage unit 220. In the correction, as shown in FIG. 4, the plurality of symbols 81 on the substrate 9, that is, the symbol set 80, the position of the symbol set 80 displayed by the drawing data before the correction is the "design position", and the actual setting is The position of the symbol set 80 on the substrate 9 is the "measurement position". In the example shown in FIG. 4, a plurality of symbols 81 are arranged in a lattice shape and are substantially uniformly distributed on the substrate 9. The number of the symbols 81 can be appropriately changed within a range of three or more. The arrangement of the plurality of symbols 81 can also be appropriately changed.

In one correction mode, for example, a coordinate row for converting the coordinates of the design position of the symbol set 80 (for example, the coordinates of the XY coordinate system set on the substrate 9) to the coordinates of the measurement position is obtained. Specifically, the design position coordinate row showing the coordinates of the design positions of all the symbols 81, and the measurement position coordinate rows showing the coordinates of the measurement positions of all the symbols 81 are obtained, and the coordinates of the design position coordinates are converted into the measurement position coordinates. The conversion row and column of the row and column. Then, by using the conversion matrix to convert the coordinates of the respective positions of the drawing data before the correction, the corrected drawing material in which the deformation of the substrate 9 is taken into consideration is generated. In the corrected drawing data, the coordinates of all the symbols 81 included in the symbol set 80 coincide with the coordinates of the mark 81 on the actual substrate 9 (i.e., the deformed substrate 9).

In other correction modes, for example, similar to the above-described one correction mode, a conversion matrix that converts the design position coordinate row and column into the measurement position coordinate row and column is obtained. In the other correction mode, by converting the calculation condition different from the one correction mode, another conversion matrix different from the one correction mode is obtained, wherein the calculation condition is obtained for each symbol 81 when the conversion row is converted. The coordinates of the design location are added with weights, and so on. Then, by using the conversion matrix to convert the coordinates of the respective positions of the drawing data before the correction, the corrected drawing data taking into account the deformation of the substrate 9 is generated. In the drawing data corrected by the correction mode, all the marks 81 included in the symbol set 80 are the same as described above. The coordinate system is identical to the coordinate of the mark 81 on the actual substrate 9, but the displacement of the self-designed position of the portion between the marks 81 is different from the displacement in the above-described one correction mode. In the correction pattern storage unit 220, the correction methods for obtaining parameters and the like when converting the matrix are different as the respective correction modes.

Further, in the other correction modes, for example, a plurality of symbols 81 of the symbol set 80 are used as vertices, and the region on the substrate 9 is triangularly divided. In the triangle division, the other symbols 81 are not included in the respective triangle regions in which the three symbols 81 are the vertices. The correction of the drawing data is performed in the correction mode so that the triangular regions before the correction of the design position of the symbol 81 match the triangular regions on the actual substrate 9 obtained from the measurement position of the symbol 81. Each part in each triangular region before correction is displaced in the corrected data after being corrected in the respective triangular regions after correction. Thereby, the corrected drawing material taking into account the deformation of the substrate 9 can be generated.

In the drawing device 1 shown in FIG. 1, it is preferable that all of the symbols 81 included in the symbol set 80 are included in the drawing data corrected based on the correction modes stored in the correction mode storage unit 220. The coordinates coincide with the coordinates of the mark 81 on the actual substrate 9 (i.e., the measurement position). In addition, the number of correction modes stored in the correction mode storage unit 220 may be two or more. Further, the correction mode stored in the correction mode storage unit 220 may be other than the above-described correction mode. As another correction mode, for example, there are a correction mode in which spline interpolation is performed on the coordinates of the position between the symbols 81, and a correction mode in which the coordinates of the position between the marks 81 are subjected to inverse distance load interpolation.

FIG. 5 is a view showing a flow of correction of the drawing data by the data correcting unit 22. In the drawing device 1, first, in the data correcting unit 22 shown in FIG. 2, the design position of the symbol set 80 is obtained from the drawing data before correction (that is, included in the symbol set). The design position of the plurality of symbols 81 in 80 is prepared by being stored in the design position storage unit 221 (step S11). The design position of the symbol set 80 can be obtained, for example, from the pattern data created by the pattern designing device 4, and prepared by being stored in the design position memory unit 221.

When the design position of the symbol set 80 is prepared, the measurement position acquisition unit 222 acquires the measurement position of the symbol set 80, that is, the actual position of the plurality of marks 81 on the substrate 9 (step S12). In step S12, as shown in FIG. 6, the imaging unit 34 images a plurality of symbols 81, which are located on the substrate 9, that is, the symbol set 80 (step S121). Next, the image acquired by the imaging unit 34 in step S121 is transmitted to the measurement position calculation unit 228. The measurement position calculation unit 228 obtains the measurement position of the symbol set 80 from the image (step S122).

When the measurement position of the symbol set 80 is obtained, as shown in FIG. 5, for each of the plurality of correction modes stored in the correction mode storage unit 220, the correction mode evaluation value for displaying the correction accuracy of each correction mode is obtained (step S13). ~S15).

In step S13, as shown in FIG. 7, first, the attention mark group is selected from the symbol set 80 (step S131). The attention mark group is a plurality of symbols (or fewer than the number of all the symbols 81 included in the symbol set 80), or a mark 81, which is included in the symbol set 80. Next, one of the plurality of correction modes described above is selected (step S132).

Next, according to the design position and the measurement position of the plurality of symbols 81 (hereinafter referred to as "remaining symbol group") after the selected target symbol group is removed from the symbol set 80, the selected correction mode is used for the target mark group. The design position is corrected to obtain a correction position (step S133). Then, the symbol evaluation value calculation unit 223 obtains a symbol evaluation value indicating the deviation of the self-measurement position of the correction position of the attention mark group (step S134).

The symbol evaluation value is, for example, the distance between the correction position of the attention mark group and the measurement position. When the target mark group is a mark 81, the mark evaluation value is the distance between the corrected position of the one mark 81 and the measurement position (hereinafter referred to as "correction deviation distance"). In the case where the attention mark group is a plurality of symbols 81, the symbol evaluation value is, for example, the total of the correction deviation distances of the respective symbols 81 included in the target mark group. The symbol evaluation value may be, for example, an average value or a maximum value of the correction deviation distances of the plurality of symbols 81 included in the target mark group.

When the symbol evaluation value is obtained for the selected correction mode, the process returns to step S132 to select the next correction mode (steps S135 and S132). In the next correction mode, steps S133 and S134 are also performed to obtain the symbol evaluation value. In the data correcting unit 22, the correction values stored in the correction mode storage unit 220 are subjected to steps S132 to S135 to obtain the symbol evaluation values for the respective correction modes (step S13).

When the step S13 is ended, as shown in FIG. 5, it is confirmed whether or not there is a next attention mark group (step S14). In the case where there is no next attention mark group, the process proceeds to step S15. When there is a next target mark group, the process returns to step S13, the next target mark group is selected, and the mark evaluation value is obtained for each correction mode (steps S131 to S135). Then, steps S131 to S135 and S14 are repeated until the next attention mark group disappears. The symbol evaluation value calculation unit 223 obtains the symbol evaluation value of the at least one type of attention mark group for each correction mode.

In the present embodiment, the case where the symbol evaluation value calculation unit 223 obtains the symbol evaluation value for each correction mode has been described, and wherein the symbol evaluation value is a symbol 81 and will be included in the symbol set. The case where all the symbols 81 in the 80 are respectively regarded as the target mark group (that is, the case where the at least one type of attention mark group is the case where all the marks 81 included in the mark set 80 are respectively regarded as the target mark group) are evaluated. value. In other words, in the correction value calculation unit 223, the respective symbols 81 included in the symbol set 80 are sequentially used as the target symbol group, and the steps S131 to S135 and S14 are repeatedly performed to obtain the attention of the entire category. The evaluation value of the mark group. Further, in the symbol evaluation value calculation unit 223, the symbol evaluation values of all the symbols 81 may be obtained for one correction mode, and the symbol evaluation values of all the symbols 81 may be obtained for the other correction patterns.

In step S15, for each correction mode, the value of the symbol evaluation value obtained for each of the attention mark groups in steps S13 and S14 (that is, the symbol evaluation value obtained for all the symbols 81) is evaluated by the correction mode. The calculation unit 224 obtains a correction mode evaluation value. The correction mode evaluation value indicates the correction accuracy of each correction mode stored in the correction mode storage unit 220. The correction mode evaluation value is, for example, the total of the symbol evaluation values obtained for all the symbols 81. Alternatively, the correction mode evaluation value is, for example, the maximum value of the symbol evaluation value obtained for each of the symbols 81.

When the correction mode evaluation value is obtained, the correction mode selection unit 225 compares the correction mode evaluation values of the plurality of correction modes stored in the correction mode storage unit 220. Then, the correction mode having the highest correction accuracy is selected as the correction mode for correction of the substrate 9 (step S16). When the correction mode evaluation value is the total of the symbol evaluation values obtained for all the symbols 81, the correction mode selection unit 225 selects the correction mode having the smallest correction mode evaluation value as the correction mode having the highest correction accuracy. Similarly, in the case where the correction mode evaluation value is the maximum value of the symbol evaluation values obtained for all the symbols 81, the correction mode selection unit 225 selects the correction mode having the smallest correction mode evaluation value as the correction mode having the highest correction accuracy.

Then, the drawing data correction unit 226 corrects the drawing data by the correction mode selected by the correction mode selection unit 225 (step S17). Post-correction The data, the self-drawing data correction unit 226 is transmitted to the drawing controller 31 of the exposure device 3. In the exposure apparatus 3 shown in FIG. 1, the light-emitting portion 33 and the scanning mechanism 35 are controlled by the drawing controller 31 based on the corrected image data to draw the substrate 9 (step S18).

As described above, in the drawing device 1, the measurement position acquisition unit 222 acquires the measurement positions of the plurality of symbols 81 on the substrate 9, that is, the symbol set 80. The symbol evaluation value calculation unit 223 corrects the design position of the target mark group in a plurality of correction modes based on the measurement position and the design position of the remaining symbol group other than the target mark group selected from the symbol set 80, and obtains the basis for the design position of the target mark group. The correction position of the attention mark group of each correction mode. Then, for each correction mode, the symbol evaluation value indicating the deviation of the self-measurement position of the correction position of the attention mark group is obtained. In the correction mode evaluation value calculation unit 224, the correction mode evaluation value of the correction accuracy of the display correction mode is obtained based on the symbol evaluation value obtained for each of the attention mark groups for each correction mode. Then, the correction mode selection unit 225 compares the correction mode evaluation values of the plurality of correction modes, selects the correction mode with the highest correction accuracy, and the drawing data correction unit 226 performs the drawing data in the selected correction mode. Correction.

As described above, in the drawing device 1, the worker does not need to perform the deformation of the measurement substrate 9 to determine the operation of the correction mode, and the correction mode having the highest correction accuracy can be automatically selected from the plurality of correction modes. Thereby, the correction of the high precision of the data can be realized. As a result, in the drawing device 1, it is possible to realize high-precision drawing in which the deformation of the substrate 9 is appropriately taken into consideration.

In the drawing device 1, as described above, by the attention mark group being one mark 81, the attention mark group can be easily selected from the mark set 80. Thereby, the calculation of the mark evaluation value of the attention mark group can be simplified. Further, even if all the symbols 81 included in the symbol set 80 are sequentially used as the target mark group, the number of the attention mark group can be suppressed from being changed. More circumstances. Thereby, the time required to calculate all the mark evaluation values can be shortened.

Further, in the above-described embodiment, for each correction mode, the symbol evaluation value in the case where all the symbols 81 included in the symbol set 80 distributed on the substrate 9 are collectively used as the target mark group is obtained. Then, for each correction mode, the correction mode evaluation value is obtained based on the symbol evaluation values of all the symbols 81 distributed on the substrate 9. Thereby, the correction of the high precision of the drawing data at each position on the substrate 9 can be achieved.

As described above, when the mark evaluation value is the distance between the correction position of the target mark group and the measurement position, and the correction mode evaluation value is the total of the mark evaluation values of the respective attention mark groups, the substrate 9 can be automatically realized. The total of the deviations at each position is small. Further, the mark evaluation value is the distance between the corrected position of the target mark group and the measurement position, and the correction mode evaluation value is the largest mark evaluation value among the mark evaluation values of the respective attention mark groups (that is, the maximum value of the mark evaluation value) In the case of the value), the correction of the maximum value of the deviation at each position on the substrate 9 can be automatically achieved.

In the drawing device 1, as described above, the measurement position acquisition unit 222 includes the imaging unit 34 that captures the symbol set 80 and the measurement position calculation unit 228 that obtains the measurement position of the symbol set 80 from the image acquired by the imaging unit 34. Thereby, the measurement position of the symbol set 80 can be automatically acquired in the drawing device 1 without using another device.

The drawing device 1 described above can be variously modified.

In the data correcting unit 22, as described above, the symbol evaluation value calculation unit 223 may obtain the symbol evaluation value for at least one type of the attention mark group in step S13. In the step S15, the correction mode evaluation value is obtained by the correction mode evaluation value calculation unit 224 based on the symbol evaluation value obtained for the at least one type of the attention mark group. In this case, by comparing the correction mode evaluation values of the respective correction modes, it is also possible to automatically select the appropriate correction precision from the plurality of correction modes automatically. Correction mode.

The correction mode evaluation value obtained based on the symbol evaluation value of the at least one type of attention mark group is, for example, a total of the symbol evaluation values of the attention mark group of the at least one type. In this case, in step S16, the correction mode selection unit 225 selects the correction mode in which the correction mode evaluation value is the smallest. Thereby, as described above, the total of the deviations at the respective positions on the substrate 9 can be automatically corrected to be small. Alternatively, the correction mode evaluation value is, for example, the maximum value of the symbol evaluation value of the attention mark group of the at least one type. In this case as well, in step S16, the correction mode selection unit 225 selects the correction mode in which the correction mode evaluation value is the smallest. Thereby, as described above, the correction of the maximum value of the deviation at each position on the substrate 9 can be automatically achieved. The correction mode evaluation value may be, for example, an average or a sum of squares of the evaluation values of the symbol group of the at least one class, or may be a total of square roots.

In the drawing device 1, when the predetermined condition is satisfied, as described above, before the completion of the acquisition of the evaluation value of the symbol category of the full category, the evaluation value based on the acquired symbol (that is, at least A correction mode evaluation value is obtained by evaluating the value of the mark of the type of attention mark group. For example, when the symbol evaluation value of the plurality of types of the attention mark group is obtained, the deviation of the mark evaluation value of one correction mode (that is, the deviation of the self-measurement position of the correction position of the target mark group) is displayed as compared with the remaining correction mode. When the result of the small deviation of the evaluation value of the mark is continuous for a predetermined number of times, the correction mode evaluation value is obtained based on the acquired symbol evaluation value. Alternatively, when the acquisition of the symbol evaluation value of the target symbol group of the predetermined ratio (for example, half of the total number of the target symbol groups selected by the symbol set 80 is completed, the obtained evaluation value of the symbol is obtained. Correct the mode evaluation value.

As described above, the attention mark group is not limited to one mark 81, and may be a part of the mark set 80, that is, a plurality of marks 81. For example, in the attention mark group is 2 marks 81 In the case of the symbol evaluation value calculation unit 223, the symbol evaluation value is obtained for each combination of the two symbols 81 in the symbol set 80, and the symbol evaluation value of the full-type target symbol group is obtained.

In the data processing device 2 described above, the correction by the data correcting unit 22 does not necessarily require the correction of the mesh data of the display pattern. For example, the data correction unit 22 may correct the vector data of the display pattern, and convert the corrected vector data into the grid data to generate the final drawing data.

The measurement position acquisition unit 222 does not necessarily have to include the imaging unit 34 and the measurement position calculation unit 228. The measurement position acquisition unit 222 may be, for example, a data reception unit that accepts and acquires data of a measurement position of the symbol set 80 input by the operator or data of a measurement position of the symbol set 80 transmitted from another device.

The design position storage unit 221, the measurement position acquisition unit 222, the symbol evaluation value calculation unit 223, the correction mode evaluation value calculation unit 224, the correction mode selection unit 225, and the device for drawing the data correction unit 226 (for example, the computer system described above) Alternatively, it may be used as a data correction device for correcting the image data of the image drawn on the substrate 9 based on the position information of the mark 81 on the substrate 9. Alternatively, the data correction device can be used with other devices than the exposure device 3.

The configurations in the above-described embodiments and modifications are preferably combined as long as they do not contradict each other.

The invention has been described and illustrated in detail, and is not intended to limit the invention. Therefore, many variations and aspects are permitted without departing from the scope of the invention.

1‧‧‧Drawing device

2‧‧‧ data processing device

3‧‧‧Exposure device

9‧‧‧Substrate

31‧‧‧Drawing controller

32‧‧‧Workbench

33‧‧‧Lighting Department

34‧‧‧Photography Department

35‧‧‧Scanning agency

331‧‧‧Light source

332‧‧‧Light Modulation Department

Claims (22)

A data correction device for correcting image data of an image drawn on a substrate according to position information of a mark on a substrate, comprising: a design position memory unit that memorizes a design position of a plurality of symbols, that is, a symbol set; The plurality of symbols are located on the substrate and used for correction of the drawing data; the measurement position obtaining unit acquires the measurement position of the symbol set; and the symbol evaluation value calculation unit selects the flag set based on the removal. The measurement position and the design position of the remaining symbol group other than the target mark group are corrected by the algorithm in a plurality of correction modes, and the correction position is obtained by correcting the design position of the target mark group, and the correction mode is obtained for each correction mode. And obtaining a symbol evaluation value for displaying a deviation of the correction position of the target mark group from the measurement position; and a correction mode evaluation value calculation unit for each of the correction modes by the symbol evaluation value calculation unit A type of attention mark group obtained by the attention mark group, and the obtained value is obtained. The correction mode evaluation value for displaying the correction accuracy of each correction mode; the correction mode selection unit compares the correction mode evaluation values of the plurality of correction modes, and selects the correction mode with the highest correction accuracy; and the drawing data correction unit, The correction data is corrected by the correction mode selected by the correction mode selection unit. For example, the data correction device of claim 1 is characterized in that the above-mentioned attention mark group is a mark. The data correction device according to claim 2, wherein the symbol evaluation value is a distance between the correction position of the target mark group and the measurement position, and the correction mode evaluation value is attention of at least one of the above categories Mark group evaluation In the total of the values, the correction mode selection unit selects the correction mode in which the correction mode evaluation value is the smallest. The data correction device according to claim 2, wherein the symbol evaluation value is a distance between the correction position of the target mark group and the measurement position, and the correction mode evaluation value is attention of at least one of the above categories The maximum value of the symbol evaluation value of the symbol group, and the correction mode selection unit selects the correction mode in which the correction mode evaluation value is the smallest. The data correction device according to the second aspect of the invention, wherein the symbol evaluation value calculation unit obtains, for each of the correction patterns, a case where all the symbols included in the symbol set are respectively used as a target symbol group. In the above-described correction mode evaluation value calculation unit, the correction mode evaluation value calculation unit obtains the correction mode evaluation value based on the symbol evaluation values of all the symbols. The data correction device according to claim 5, wherein the symbol evaluation value is a distance between the correction position of the attention mark group and the measurement position, and the correction mode evaluation value is attention of at least one of the above categories. In the total of the symbol evaluation values of the symbol group, the correction mode selection unit selects the correction mode in which the correction mode evaluation value is the smallest. For example, the information correction device of the fifth application patent scope, wherein The symbol evaluation value is a distance between the correction position of the target mark group and the measurement position, and the correction mode evaluation value is a maximum value of a mark evaluation value of the at least one type of attention mark group, and the correction mode selection is performed. The department selects the correction mode in which the above-mentioned correction mode evaluation value is the smallest. The data correction device according to claim 1, wherein the symbol evaluation value is a distance between the correction position of the target mark group and the measurement position, and the correction mode evaluation value is attention of at least one of the above categories. In the total of the symbol evaluation values of the symbol group, the correction mode selection unit selects the correction mode in which the correction mode evaluation value is the smallest. The data correction device according to claim 1, wherein the symbol evaluation value is a distance between the correction position of the target mark group and the measurement position, and the correction mode evaluation value is attention of at least one of the above categories. The maximum value of the symbol evaluation value of the symbol group, and the correction mode selection unit selects the correction mode in which the correction mode evaluation value is the smallest. The data correction device according to any one of claims 1 to 9, wherein the measurement position acquisition unit includes: a photographing unit that captures the symbol set; and a measurement position calculation unit that performs the photographing In the image obtained by the department, the above is obtained. The above measurement position of the token set. A drawing device for drawing an image on a substrate, the drawing device comprising: a light source; and a data correction device for correcting the image of the image drawn on the substrate according to the position information of the mark on the substrate a light modulation unit that modulates light from the light source based on the drawing data corrected by the data correction device; and a scanning mechanism that modulates the light by the light modulation unit Scanning on the substrate, and the data correction device includes: a design position memory unit that memorizes a plurality of symbols, that is, a design position of the symbol set, the plurality of marks are on the substrate, and are used in the drawing of the data. a measurement position acquisition unit that acquires a measurement position of the symbol set, and a symbol evaluation value calculation unit that uses an algorithm based on a measurement position and a design position of a remaining symbol group other than the attention mark group selected from the symbol set For the plurality of correction modes that are different from each other, the correction position of the above-mentioned target mark group is corrected to obtain a correction position. For each correction mode, a symbol evaluation value for displaying a deviation from the measurement position of the correction position of the target mark group is obtained, and a correction mode evaluation value calculation unit for evaluating each of the correction modes by the mark The value calculation unit obtains a correction mode evaluation value for displaying the correction accuracy of each of the correction modes for the symbol evaluation value obtained by the at least one type of the attention mark group, and the correction mode selection unit for the plurality of correction modes The correction mode evaluation value is compared, and the correction mode having the highest correction accuracy is selected; and the drawing data correction unit is selected by the correction mode selection unit The correction mode is described, and the above-mentioned depiction data is corrected. A data correction method for correcting image data of an image drawn on a substrate according to position information of a mark on a substrate, comprising the steps of: a) preparing a plurality of symbols, that is, a design position of the symbol set; And the plurality of symbols are on the substrate and are used for correction of the rendered data; b) the step of obtaining the measurement position of the set of symbols; c) the addition of the attention mark group selected from the set of symbols; The measurement position and the design position of the remaining symbol group are corrected by the algorithm in a plurality of correction modes, and the correction position is obtained by correcting the design position of the target mark group, and the above-mentioned attention is obtained for each correction mode. a step of displaying a mark evaluation value indicating a deviation of the correction position from the measurement position of the mark group; d) a mark obtained by the attention mark group for at least one type in the step c) The evaluation value is a step of obtaining a correction mode evaluation value for displaying the correction accuracy of each of the correction modes; e) Comparing the correction mode evaluation values of the plurality of correction modes, selecting a correction mode having the highest correction accuracy; and f) correcting the above-described drawing data by using the correction mode selected by the correction mode selection unit The steps. For example, the data correction method of claim 12, wherein the above-mentioned attention mark group is a mark. The data correction method of claim 13, wherein the symbol evaluation value is a distance between the correction position of the attention mark group and the measurement position, and the correction mode evaluation value is attention of at least one of the above categories Mark group evaluation In the total of the values, in the above step e), the correction mode in which the correction mode evaluation value is the smallest is selected. The data correction method of claim 13, wherein the symbol evaluation value is a distance between the correction position of the attention mark group and the measurement position, and the correction mode evaluation value is attention of at least one of the above categories The maximum value of the symbol evaluation value of the symbol group is selected in the above step e), and the correction mode in which the correction mode evaluation value is the smallest is selected. The data correction method of claim 13, wherein the at least one type of the attention mark group in the step d) is to treat all the symbols included in the symbol set as a target mark group, The above step c) is directed to each of the correction modes described above, wherein all of the symbols are repeated as the target symbol group, and the step d) is based on the correction patterns described above for all the symbols. The correction mode evaluation value is obtained by the value. The data correction method of claim 16, wherein the symbol evaluation value is a distance between the correction position of the attention mark group and the measurement position, and the correction mode evaluation value is attention of at least one of the above categories. In the total of the symbol evaluation values of the symbol group, in the above step e), the correction mode in which the correction mode evaluation value is the smallest is selected. The data correction method of claim 16, wherein the symbol evaluation value is a distance between the correction position of the attention mark group and the measurement position, The correction mode evaluation value is a maximum value of the symbol evaluation value of the at least one type of attention mark group, and in the above e) step, the correction mode in which the correction mode evaluation value is the smallest is selected. The data correction method of claim 12, wherein the symbol evaluation value is a distance between the correction position of the attention mark group and the measurement position, and the correction mode evaluation value is attention of at least one of the above categories In the total of the symbol evaluation values of the symbol group, in the above step e), the correction mode in which the correction mode evaluation value is the smallest is selected. The data correction method of claim 12, wherein the symbol evaluation value is a distance between the correction position of the attention mark group and the measurement position, and the correction mode evaluation value is attention of at least one of the above categories The maximum value of the symbol evaluation value of the symbol group is selected in the above step e), and the correction mode in which the correction mode evaluation value is the smallest is selected. The data correction method according to any one of claims 12 to 20, wherein the step b) has the following steps: b1) a step of capturing the set of symbols; and b2) from the step b1) In the acquired image, the step of obtaining the measurement position of the symbol set is performed. A drawing method for drawing an image on a substrate, the drawing method comprising: step of correcting drawing data of an image drawn on the substrate according to position information of the mark on the substrate; and The step of scanning the modulated light on the substrate according to the corrected data, and the step of correcting the above-described drawing data includes the following steps: a) preparing a plurality of symbols, that is, designing the symbol set. a step of locating the plurality of marks on the substrate and utilizing the correction of the rendered data; b) obtaining the measurement position of the set of symbols; c) selecting the attention mark selected from the set of symbols The measurement position and the design position of the remaining symbol group other than the group are corrected by the algorithm in a plurality of correction modes, and the correction position is obtained by correcting the design position of the target mark group, and the correction mode is obtained for each correction mode. a step of displaying a mark evaluation value indicating a deviation of the correction position of the target mark group from the measurement position; d) determining, for each of the correction modes described above, for the at least one type of attention mark group in the step c) The step of evaluating the value of the mark, and determining the correction mode evaluation value for displaying the correction accuracy of each of the correction modes (e) comparing the correction mode evaluation values of the plurality of correction modes, selecting a correction mode having the highest correction accuracy; and f) using the correction mode selected by the correction mode selection unit Describe the steps to correct the data.