CN104932205B - Data correction device, plotting unit, data correcting method and drawing practice - Google Patents
Data correction device, plotting unit, data correcting method and drawing practice Download PDFInfo
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- CN104932205B CN104932205B CN201510025614.XA CN201510025614A CN104932205B CN 104932205 B CN104932205 B CN 104932205B CN 201510025614 A CN201510025614 A CN 201510025614A CN 104932205 B CN104932205 B CN 104932205B
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- 238000012937 correction Methods 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 238000013461 design Methods 0.000 claims abstract description 53
- 238000003860 storage Methods 0.000 claims description 29
- 230000007246 mechanism Effects 0.000 claims description 12
- 238000010586 diagram Methods 0.000 claims description 6
- 238000010422 painting Methods 0.000 claims description 3
- 238000011156 evaluation Methods 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- 238000012545 processing Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 230000009466 transformation Effects 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 238000013519 translation Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003556 assay Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Data correction device, plotting unit, data correcting method and drawing practice are provided.In plotting unit, it is locating for mark set to obtain multiple marks on substrate.Based on locating and design attitude for the remaining mark group in addition to concern mark group selected in mark set, by correcting the design attitude of concern mark group respectively for multiple correcting modes, concern mark group's correction position is obtained by each correcting mode.The correction position of mark group and the goal-based assessment value of a deviation that locates are paid close attention to by for each correcting mode, obtaining display.With each correcting mode relatively, the mark assessed value based on each concern mark group for obtaining, obtains the correcting mode evaluation of estimate of the amendment precision for representing correcting mode.Compare the correcting mode assessed value of multiple correcting modes, selection amendment precision highest correcting mode, by selected correcting mode amendment draw data.In plotting unit, suitable correcting mode can be automatically selected from multiple correcting modes.
Description
Technical field
The present invention relates to the mark positional information being based on substrate, the draw data to institute's drawing image on substrate is repaiied
Positive technology.
Background technology
Always, the glass substrate in semiconductor substrate and printed base plate, or plasma display and liquid crystal display is (below
Photosensitive material on referred to as " substrate ") is drawn (draw pattern) by the irradiation of light.In recent years, with pattern
(pattern) height becomes more meticulous, and starts with the plotting unit directly drawn a design by light beam scanning on photosensitive material.
With regard to the plotting unit, when substrate occurs the deformation such as antiarch, crooked, warpage, can be painted with reference to deformation extent amendment
Diagram data.Draw data is corrected as follows：Generally first measure is located at the mark positions such as the telltale mark on substrate, according to survey
Determine the displacement that result calculates each position on substrate, then everybody is adapted according to regulation to the displacement.
For example, in TOHKEMY 2008-3441 publications (document 1), according to the rectangle that draw data is surrounded for constituting
Four target information positions, calculate the correction value of draw data.By so, can be to substrate local near draw data
The corresponding draw data of deformation is modified.In TOHKEMY 2012-79739 publications (document 2), based on substrate with lattice
The displacement of multiple datum marks of sub- shape distribution makes the deformation curve of approximation of substrate, and then corrects draw data.By so, can
The deformation on a large scale (such as substrate integrally bending) of substrate is held, draw data is accurately corrected.
However, in plotting unit in TOHKEMY 2012-198313 publications (document 3), correcting the hand of draw data
Section is included based on three three kinds of correction algorithms of amendment viewpoint.The operating personnel of plotting unit, with reference to substrate type and deformation journey
The selection correction algorithm such as degree, with selected correction algorithm amendment draw data.
Selected in addition, in plotting unit in document 3, situations such as operating personnel combine substrate deformation known in advance
Correction algorithm.But whether selected correction algorithm is more properly still not clear than other correction algorithms.
The content of the invention
Data-oriented correcting device of the present invention, based on the mark positional information on substrate, to the image of drafting on substrate
Draw data is modified.The purpose of the present invention is to automatically select suitable correcting mode.
Data correction device of the invention, including：Design attitude storage part, the design attitude of its storage mark set, institute
Stating mark set refers to, the multiple marks on substrate and for correcting draw data；Locate obtaining section, its acquirement
The mark set locates；Mark assessed value calculating part, it is based on the concern except being selected from the mark set
Mark group outside remaining mark group locate and design attitude, it is right respectively by the different multiple correcting modes of algorithm
The design attitude of the concern mark group is modified to obtain correction position, and mark assessed value is obtained for each correcting mode,
The mark assessed value represents the correction position and the deviation between locating of the concern mark group；Correcting mode is commented
Valuation calculating part, its in the mode related to each correcting mode, based on by the mark assessed value calculating part for extremely
The mark assessed value that a kind of few concern mark group obtains, the correcting mode for obtaining the amendment precision for representing each correcting mode is commented
Valuation；Correcting mode selector, its correcting mode assessed value to multiple correcting modes is compared, selection amendment precision
Highest correcting mode；Draw data correction portion, it is come using the correcting mode selected by the correcting mode selector
Correct the draw data.Suitable correcting mode can be automatically selected by the data correction device.
A preferred embodiment of the present invention is that the concern mark group is a mark.
In other preferred embodiments of the invention,
The mark assessed value calculating part, for each correcting mode, obtains the whole contained by the mark set
Mark assessed value when mark is respectively as concern mark group；The correcting mode assessed value calculating part, for each amendment
Mode, correcting mode assessed value is obtained based on the mark assessed value of whole marks.
In other preferred embodiments of the invention, the mark assessed value is that the described of concern mark group is repaiied
Positive position and described the distance between locate；The correcting mode assessed value, is at least one concern mark group
The summation of mark assessed value；The correcting mode selector, the correcting mode for selecting the correcting mode assessed value minimum.
In other preferred embodiments of the invention, the mark assessed value is that the described of concern mark group is repaiied
Positive position and described the distance between locate；The correcting mode assessed value, is at least one concern mark group
The maximum of mark assessed value；The correcting mode selector, the correcting mode for selecting the correcting mode assessed value minimum.
In other preferred embodiments of the invention, the obtaining section that locates includes：Image pickup part, it shoots described
Mark set；Locate calculating part, and it obtains the described of the mark set according to the image obtained by the image pickup part
Locate.
The present invention is additionally provided in the plotting unit drawn on substrate.Related plotting unit of the invention includes：Light source；It is above-mentioned
Data correction device；Modulating sections, it is based on by the draw data of the data correction device amendment, to from the light source
Light is modulated；Sweep mechanism, its light for making to be modulated by the modulating sections is scanned on substrate.
The present invention also provides data correcting method and the drawing practice drawn on substrate, based on the mark position on substrate
Confidence ceases, the draw data of the image drawn on amendment substrate.
By referring to accompanying drawing and following on the detailed description of the invention, the purpose and other purposes, spy can be specified
Levy, mode and advantage.
Brief description of the drawings
Fig. 1 is the figure of the structure for representing plotting unit.
Fig. 2 is the block diagram for representing data processing equipment function.
Fig. 3 A are the figures illustrated for the basic conception to draw data correcting process.
Fig. 3 B are the figures illustrated for the basic conception to draw data correcting process.
Fig. 3 C are the figures illustrated for the basic conception to draw data correcting process.
Fig. 3 D are the figures illustrated for the basic conception to draw data correcting process.
Fig. 3 E are the figures illustrated for the basic conception to draw data correcting process.
Fig. 3 F are the figures illustrated for the basic conception to draw data correcting process.
Fig. 3 G are the figures illustrated for the basic conception to draw data correcting process.
Fig. 4 is the top view for representing mark set on substrate.
Fig. 5 is the figure of the amendment flow for representing draw data.
Fig. 6 is the figure for the part for representing draw data amendment flow.
Fig. 7 is the figure for the part for representing draw data amendment flow.
Description of reference numerals
1 plotting unit
2 data processing equipments
3 exposure devices
9 substrates
34 image pickup parts
35 sweep mechanisms
80 mark set
581 marks
221 design attitude storage parts
222 locate obtaining section
223 mark assessed value calculating parts
224 correcting mode assessed value calculating parts
225 correcting mode selectors
226 draw data correction portions
228 locate calculating part
331 light sources
332 modulating sections
S11~S18, S121, S122, S131~S135 steps
Specific embodiment
Fig. 1 is the figure of the structure of the plotting unit 1 for representing one embodiment of the present invention.Plotting unit 1 is direct imaging apparatus,
Its photosensitive material irradiation to being located on the surface of printed base plate, semiconductor substrate, crystal liquid substrate etc. (following general name " substrate ")
Light, so as to the image such as direct protracting circuit pattern on substrate.
Plotting unit 1 includes data processing equipment 2 and exposure device 3.Data processing equipment 2 is generated and corrects drawing number
According to.Data processing 2 is common computer system, including processes the CPU of various calculating, the ROM of storage base program and storage
RAM of various information etc..Exposure device 3 draws (expose) the drawing number come from the transmission of data processing equipment 2 on substrate 9
According to.If data can be joined between data processing equipment 2 and exposure device 3, both can be located at together, in physical bit
Put separable.
Fig. 2 is the block diagram for representing data processing equipment function.Data processing equipment 2 includes that data conversion unit 21 and data are repaiied
Positive portion 22.The pattern data that will be generated by design device 4 as will on substrate 9 drawing image draw data, it is and defeated
Enter to data conversion unit 21.Pattern data refers to the design data of the images such as circuit pattern.Pattern data be often referred to polygon etc. to
Amount data.Pattern data is converted to raster data by data conversion unit 21.
Data correction portion 22, based on the positional information of the mark on substrate 9 (reference picture 1), to being given birth to by data conversion unit 21
Into raster data be that draw data is modified, generate final draw data.Data correction portion 22 includes：Correcting mode is deposited
Storage portion 220, design attitude storage part 221, the obtaining section that locates 222, the assessment of mark assessed value calculating part 223, correcting mode
Value calculating part 224, correcting mode selector 225, draw data correction portion 226.The obtaining section that locates 222 includes locating
Calculating part 228 and image pickup part 34.Image pickup part 34 is located on exposure device 3 as described later.That is, image pickup part 34 is exposure device 3
With common to data correction portion 22.Amendment of the data correction portion 22 on draw data is as described later.
As shown in figure 1, exposure device 3 includes drawing controller 31, objective table 32, light exit portion 33, image pickup part 34 and sweeps
Retouch mechanism 35.Drawing controller 31 controls light exit portion 33, image pickup part 34 and sweep mechanism 35.Objective table 32 is in exit portion 33
Lower section keeps substrate 9.Light exit portion 33 includes light source 331 and modulating sections 332.Light source 331 swashs to the outgoing of modulating sections 332
Light.Modulating sections 332 are based on the draw data (that is, the draw data of the amendment of data correction portion 22) from data processing equipment 2
To modulate the light from light source 331.Light irradiation after the modulation of modulating sections 332 is on the substrate 9 of objective table 32.Such as DMD (numerals
Micro-mirror element) can be used for modulating sections 332.
Sweep mechanism 35 moves horizontally objective table 32.Specifically, objective table 32 is made to be swept in master by sweep mechanism 35
Retouch direction and moved on the sub-scanning direction of main scanning direction.By so, the light that modulating sections 332 are modulated,
Scanned on main scanning direction and sub-scanning direction on substrate.In exposure device 3, objective table 32 is designed as horizontal rotation
Rotating mechanism.In addition, being scanned for for mechanism 35, carried out on substrate 9 as long as the light of the outgoing of Cong Guang exit portion 33 can be made
Scanning, it is not necessary to have to be the mechanism for moving objective table 32.For example, can carry light exit portion 33 by sweep mechanism 35
Moved according to main scanning direction and sub-scanning direction the top of thing platform 3.
The upper surface of substrate 9 of the image pickup part 34 to being carried on objective table 32 images.Specifically, by image pickup part
34, it is pointed on substrate 9 multiple i.e. mark set of mark and is imaged.Mark set is used for the amendment of draw data hereinafter.Should
Multiple marks are the telltale marks designed to determine position of substrate 9 etc..And, for mark, as long as can be correct
Judge its position, be not limited to telltale mark, for example, can also be the through hole or circuit pattern being located on substrate.Image pickup part
Image acquired in 34 is sent to the calculating part 228 (reference picture 2) that locates.
Then, the basic conception for correcting draw data relevant treatment is illustrated.In design device 4, generally
It is assumed that substrate is in, and without deformation, the flat perfect condition in surface carrys out pattern-making data.But, actual substrate may be sent out
The deformations such as the warpage that raw antiarch, crooked, early stage treatment are caused.Now, the configuration bit on the substrate set by pattern data
When putting protracting circuit pattern, it is impossible to obtain required finished product.Therefore, in order to form the circuit pattern with reference to substrate deformation, need
That wants with good grounds substrate deforms the correcting process (i.e. local correction process) for carrying out translation circuit pattern forming position.In other words, originally
The draw data correcting process of implementation method is exactly coordinate transform processing.
Fig. 3 A~Fig. 3 G are the figures illustrated for the basic conception to draw data correcting process.Fig. 3 A are illustrated and carried
The preceding pattern P 1 drawn on printed base plate 9a.Pattern P 1 includes multiple circle C1 and multiple Christ-cross M.After Fig. 3 B are illustrated
In the pattern P 2 that the pattern P 1 of Fig. 3 A is drawn on printed base plate.Pattern P 2 includes multiple circle C2.Each circle C2 is less than circle C1.
When printed base plate 9a does not deform, draw a design P1, P2 successively, then as shown in Figure 3 C, pattern P 3 is formed on substrate 9a.
In pattern P 3, multiple circle C2 is located at the center of multiple circle C1 respectively.
When two such pattern overlapping is drawn, it is believed that be to form the thin copper film pattern and and thin copper film such as printed base plate
The pattern of the solder resist (welding resisting layer) of pattern overlapping.In addition, being also believed to form the 1st of multilayer printed board wiring pattern
Layer and the 2nd layer, or form surface wiring pattern and back wiring pattern of printed on both sides substrate etc..And, forming surface
When wiring pattern and back wiring pattern, pattern is turned over when being exposed to back wiring pattern from rear side.
For example, the pattern P 1 shown in Fig. 3 A is the thin copper film pattern of printed base plate 9a, pattern P 2 is to be overlapped in shown in Fig. 3 B
The solder resist pattern of thin copper film pattern.In this case, first, form photic in the layers of copper of the whole surface of printed base plate 9a
Anti- film against corrosion.Then, the draw data for being generated based on the pattern data according to pattern P 1, is entered to the anti-film of the photoresist
Row is drawn (expose).Then, imaging treatment is carried out by the anti-film of photoresist, layers of copper is etched, so as to form copper
Wiring pattern.Next, forming solder mask layer on printed base plate 9a thin copper film patterns by being coated with or pressing.Then, base
In the draw data generated by the pattern data shown in pattern P 2, the solder mask layer is drawn, imaging treatment.
In the forming process of the thin copper film pattern, implement the treatment such as imaging, etching, flushing and heat drying, at this
Printed base plate 9a under the influence of a little treatment is it may happen that the deformation such as flexible or crooked.For example：When thin copper film pattern is formed, print
The deformation shown in Fig. 3 D can be generated on brush substrate 9a.With regard to Fig. 3 D, for the deformation for making printed base plate 9a is readily appreciated that, adjacent note
Number M connects (Fig. 3 E~3G is identical) with double dot dash line.For printed base plate 9a, if not to the pattern according to pattern P 2
The draw data of data genaration is modified and directly uses it for drawing, then as shown in FIGURE 3 E, each in two pattern Ps 1, P2
Deviation is also easy to produce from the position relationship of contained round C1, C2, it is impossible to form required finished product.
Accordingly, it would be desirable to consider printed base plate 9a deformation (i.e. on printed base plate 9a formed pattern P 1 deformation and
Dislocation), as illustrated in Figure 3 F, the draw data to being generated according to the pattern data for representing pattern P 2 is modified.And in figure
In 3F, in order to easily compare with Fig. 3 D, on the basis of multiple circle C2, the multiple mark M fine rules not being included in pattern P 2
Connection.The correcting process is described treatment to be locally-located.By based on revised draw data come the P2 that draws a design, then such as
Shown in Fig. 3 G, the pattern that display two pattern Ps 1, P2 each self-contained round C1, C2 are in required position is formd.
When obtaining the deflection of the printed base plate 9a, for example, shooting the multiple mark M being located on printed base plate 9a, base
In the image obtained by shooting, the position of each mark M is obtained.Then, the deviation of based assays position and design attitude, obtains
The deflection of printed base plate 9a, the position of each mark M calculated by referring to that locates, the design attitude refers to printing
The position of substrate 9a each mark M when not deforming.
And, in fig. 3d, for the round C1 in the pattern P 1 that is formed on the printed base plate 9a, only move and draw position
Put；In Fig. 3 F, for revised pattern P 2 in round C2, only move drafting position.In actual treatment, the circle of pattern P 1
C1 sometimes not only move but also can deform by position.At this moment, the round C2 in revised figure P2 also not only binding site movement and
And combine the deformation of circle C1 and correct.
Secondly, the amendment of data correction portion 22 (reference picture 2) on draw data with regard to plotting unit 1 is illustrated.
In data correction portion 22, correcting mode storage part 220 puies forward the program being previously stored with for performing multiple correcting modes.As above institute
State, multiple correcting modes allow for the deformation of substrate 9 and correct the modification method of draw data respectively.In multiple correcting modes
In, the algorithm for correcting draw data is different.Therefore, the correction result for being drawn by multiple correcting modes is general all each
Differ.
Such as Fig. 4 examples, in the related amendment of each correcting mode of the storage of correcting mode storage part 220, as shown in figure 4,
It is mark set 80 for the multiple marks 81 on substrate 9, using the mark set 80 for representing amendment pre-plot data
Position is that the position of " design attitude " and the mark set 80 being actually located on substrate 9 " locates ".In Fig. 4 examples,
Multiple marks 81 are configured with clathrate, and are substantially uniformly distributed on substrate 9.The number of mark 81, can be in more than 3 models
Enclose interior appropriate change.The position of multiple marks 81 also can suitably change.
In the first correcting mode, for example, transformation matrix is obtained, the transformation matrix is used for the design position of mark set 80
Put coordinate (being for example set in the coordinate being placed in XY coordinate systems of substrate 9) and be changed into the coordinate that locates.Specifically, table is obtained
Show the design attitude coordinates matrix of the design attitude coordinate of institute's markedness 81 and represent that institute markedness 81 locates the survey of coordinate
Positioning puts coordinates matrix, obtains the transformation matrix for the coordinates matrix that is changed into locating by design attitude coordinates matrix.Then,
Using the transformation matrix, the coordinate to correcting pre-plot data each position enters line translation, and so, substrate 9 is considered in generation
The revised draw data of deformation.In revised draw data, the coordinate of institute's markedness 81 that mark set 80 is included
Coordinate with the mark 81 in actual substrate 9 (substrate 9 for deforming) is consistent.
In other correcting modes, for example, in the same manner as above-mentioned first correcting mode, obtain for by design attitude coordinate
Matrix is changed into locating the transformation matrix of coordinates matrix.In other correcting modes, being directed to when making to obtain transformation matrix
The design conditions that the design attitude coordinate of each mark 81 is weighted etc., it is different from above-mentioned first correcting mode, and then obtain with
Other different transformation matrixs of first correcting mode.Then, using the transformation matrix to amendment pre-plot data each position
Coordinate enters line translation, by this conversion, revised draw data of the generation in view of the deformation of substrate 9.By the amendment
In the draw data of mode amendment, with above-mentioned, the note on the coordinate and actual substrate 9 of institute's markedness 81 that mark set 80 is included
Numbers 81 coordinate is consistent.But the dislocation of each position design attitude and the dislocation of above-mentioned first correcting mode are not between mark 81
Together.In correcting mode storage part 220, by for obtaining the different correcting modes, one by one conduct such as parameter during transformation matrix
Single correcting mode is stored.
And in other correcting modes, for example, using multiple marks 81 of mark set 80 as summit, on substrate 9
Field carry out triangle segmentation.In triangle segmentation, with 3 marks 81 not wrapped in each triangle field on summit
Containing other marks 81.In the correcting mode, so that each triangle before the amendment obtained by the design attitude of mark 81 is led
The domain mode consistent with the triangle field of the actual substrate 9 obtained that locates by mark 81, carries out draw data
Amendment.In revised draw data, by changing position, to cause each position position in each triangle field before amendment
In in the field of revised each triangle.And then generate the revised draw data deformed in view of substrate 9.
It is revised in each correcting mode stored by correcting mode storage part 220 in plotting unit shown in Fig. 1
In draw data, the coordinate of institute's markedness 81 that mark set 80 is included, preferably with actual substrate 9 on mark 81 seat
Mark (locating) is consistent.And, the correcting mode number of the storage of correcting mode storage part 220 is up to more than 2.Separately
Outward, the correcting mode of the storage of correcting mode storage part 220, can be the mode beyond above-mentioned example.Other correcting mode bags
Include, the correcting mode of spline interpolation is such as carried out to the coordinate of position between mark 81, the coordinate of position between mark 81 is carried out
Against apart from load interpolation (space interpolation：IDW correcting mode) etc..
Fig. 5 illustrates the flow chart that draw data is corrected by data correction portion 22.In plotting unit 1, first, in figure
In data correction portion shown in 2 22, design attitude (the i.e. mark set of mark set 80 is obtained according to the draw data before amendment
The design attitude of the 80 multiple marks 81 for being included), it is then stored in standby (step in design attitude storage part 221
S11).For example can so prepare the design attitude of mark 80：Obtained according to the pattern data made by design device 4
The design attitude, is then stored in design attitude storage part 221.
After getting out the design attitude of mark set 80, the survey of mark set 80 is obtained by the obtaining section 222 that locates
Positioning is put, i.e., the physical location (step S12) of multiple marks 81 on substrate 9.In step s 12, as shown in fig. 6, by shooting
Multiple marks 81 that portion 34 is pointed on substrate 9 i.e. mark set 80 is imaged (step S121).Then, in step S121
In, the image obtained by image pickup part 34 is sent to the calculating part 228 that locates.In the calculating part 228 that locates, according to this
Image obtains locating (step S122) for mark set 80.
After obtaining the locating of mark set 80, as shown in figure 5, being stored for correcting mode storage part 220 respectively
Multiple correcting modes, obtain the correcting mode assessed value (step S13~S15) for representing each correcting mode amendment precision.
In step s 13, as shown in fig. 7, selecting concern mark group (step S131) first from mark set 80.Concern
Mark group is that the multiple (but the institute's markedness 81 included than mark set to I haven't seen you for ages few two or more) that mark set 80 is included is remembered
Numbers 81 or a mark 81.Then, a correcting mode (step S132) is selected from multiple correcting modes.
Next, based on the multiple mark set 81 removed in the mark set 80 after selected concern mark group
The design attitude of (hereinafter referred to as " remaining mark group ") and locate, by selected correcting mode, amendment concern mark
The design attitude of group simultaneously obtains correction position (step S133).Then, by mark assessed value calculating part 223, obtain expression with
Mark assessed value (step 134) of concern mark group's correction position and a deviation that locates.
Mark assessed value for example refers to, the correction position of concern mark group and the distance between locates.Concern mark
When group is for a mark 81, mark assessed value refers to the correction position of this mark 81 and the distance between locates (below
Referred to as " amendment offset distance ").When concern mark group is for multiple marks 81, mark assessed value is, for example, that concern mark group is wrapped
The summation of the amendment offset distance of the multiple marks 81 for containing.Mark assessed value is alternatively the multiple that for example concern mark group is included
The average value or maximum of the amendment offset distance of mark 81.
After obtaining mark assessed value for selected correcting mode, step S132 is returned to, select next correcting mode
(step S135, S132).In next correcting mode, mark assessed value is obtained yet by step S133, S134.Repaiied in data
In positive portion 22, for each correcting mode that correcting mode storage part 220 is stored, by step S132~S135, obtain and respectively repair
Mark assessed value (step S13) of positive way.
After step S13 terminates, as shown in figure 5, being confirmed whether there is next concern mark group (step S14).If no
Next concern mark group, then into step S15.If there is next concern mark group, step S13 selections are returned to next
Concern mark group, mark assessed value (S131~S135) is obtained for each correcting mode.Then, repeat step S131~S135,
S14, untill without next concern mark group.In mark assessed value calculating part 223, for each correcting mode, obtain
The mark assessed value of at least one concern mark group.
In the present embodiment, each concern mark group is a mark 81, and by mark set 80 included it is all
(that is, at least one concern mark group, mark set 80 is included when mark 81 is respectively as concern mark group
Institute's markedness 81 respectively as concern mark group when) mark assessed value, be directed to each correcting mode and assessed by mark
What value calculating part 223 was obtained, it is explained below.In other words, in mark assessed value calculating part 223, for each amendment
Mode, each mark 81 that mark set 80 is included successively as concern mark group, be repeated step S131~S135,
S14, obtains the mark assessed value that all kinds concern mark faciation is closed.And, in mark assessed value calculating part 223, for
A kind of correcting mode, after obtaining institute's markedness assessed value of the correlation of mark 81, can also be directed to other correcting modes, obtain mark 81
Related institute's markedness assessed value.
In step S15, based on each concern mark group obtained by step S13, S14 with each correcting mode relatively
Mark assessed value (that is, the mark assessed value obtained for whole marks 81), asked by correcting mode assessed value calculating part 224
Go out correcting mode assessed value.Correcting mode assessed value represents repairing for each correcting mode of the storage in correcting mode storage part 220
Positive precision.Correcting mode assessed value, the summation of the mark assessed value for example, obtained respectively for institute's markedness 81.Or, repair
Positive way assessed value is, for example, the maximum of the mark assessed value obtained respectively for institute's markedness 81.
Correcting mode assessed value is obtained, by correcting mode selector 225, to the inner storage of correcting mode storage part 220
Multiple respective correcting mode assessed values of correcting mode are compared.Then, selection corrects precision highest correcting mode to make
For the correcting mode (step S16) that amendment substrate 9 is used.It is directed to what institute's markedness 81 was obtained respectively in correcting mode assessed value
During the summation of mark assessed value, correcting mode selector 225 can select the minimum correcting mode of correcting mode assessed value, be used as
Amendment precision highest correcting mode.In correcting mode assessed value is the mark assessed value obtained respectively for institute's markedness 81
Maximum when, similarly, correcting mode selector 225 can select the minimum correcting mode of correcting mode assessed value, be used as
Amendment precision highest correcting mode.
Then, by draw data correction portion 226, repaiied with the correcting mode selected by correcting mode selector 225
Positive draw data (step S17).Revised draw data, painting for exposure device 3 is sent to from draw data correction portion 226
Figure controller 31.In the exposure device 3 shown in Fig. 1, by drawing controller 31, controlled based on the revised draw data
Light exit portion 33 and sweep mechanism 35, are drawn (step S18) on substrate 9.
Illustrate as described, in plotting unit 1, the multiple marks 81 on substrate 9 are obtained by the obtaining section 222 that locates
That is mark set 80 locates.In mark assessed value calculating part 223, based on selected from mark set 80 except close
Outside annotation group remaining mark group locate and design attitude, correct concern mark respectively by multiple correcting modes
The design attitude of group, and then the correction position of concern mark group is obtained by each correcting mode.Then, for each correcting mode,
Obtain the mark assessed value for paying close attention to mark group's correction position and a deviation that locates.In correcting mode assessed value calculating part
In 224, based on the mark assessed value obtained for each concern mark group, obtain expression amendment side with each correcting mode relatively
The correcting mode assessed value of the amendment precision of formula.Then, in correcting mode selector 225, repairing for multiple correcting modes is compared
Positive way assessed value, selection amendment precision highest correcting mode, selected amendment side is pressed by draw data correction portion 226
Formula amendment draw data.
So, in plotting unit 1, operating personnel need not determine the deflection of substrate 9 to determine correcting mode, it becomes possible to
The amendment suitable correcting mode of precision highest is automatically selected from multiple correcting modes.By so, being capable of achieving draw data
High precision int.As a result, in draw data 1, can realize that the high accuracy for considering to combine the deformation of substrate 9 is drawn.
In draw data 1, as described above, one mark 81 during concern mark group, therefore, it is possible to be easy to from set 80
Selection concern mark group.By the calculating that concern mark group's associated token assessed value so, can be simplified.Even if in addition, mark collection
The 80 institute's markedness 81 for being included are closed successively by as concern mark group, it is also possible to which the number of control concern mark group becomes many.It is logical
Cross so, the time needed for calculating institute's markedness assessed value can be shortened.
In addition, in said embodiment, by each correcting mode, the mark set 80 being distributed on substrate 9 can be obtained
Comprising institute's markedness 81, respectively using they one by one one to one as concern mark group when mark assessed value.Then, for
Each correcting mode, based on being distributed on substrate for institute's markedness 81, obtains correcting mode assessed value respectively.By so, can
Realize the high accuracy amendment of each position draw data on substrate 9.
As described, being the distance between paying close attention to the correction position of mark group and locating in mark assessed value, and repair
When positive way assessed value is the mark assessed value summation of each concern mark group, can be automatically obtained makes each position deviation on substrate 9 total
With the amendment for diminishing.In addition, be the distance between paying close attention to the correction position of mark group and locating in mark assessed value, and
When correcting mode assessed value is mark assessed value (i.e. the maximum of mark assessed value) for paying close attention to maximum in mark group, can be automatically real
Maximum deflection difference value in each position is now set on substrate 9 to be changed into minimum amendment.
In plotting unit 1, as described above, the obtaining section 222 that locates includes：Image pickup part 34, it is to mark set 80
Imaged；Locate calculating part 228, its measure that mark set 80 is obtained according to the image obtained by image pickup part 34
Position.By so, without other devices, it becomes possible to obtain locating for mark set 80 automatically by plotting unit 1.
The plotting unit 1 can carry out various conversion.
In data correction portion 22, in step s 13, as long as described above, being directed to by mark assessed value calculating part 223
At least one concern mark group obtains mark assessed value.Then, in step S15, it is based on each correcting mode relatively
For the mark assessed value that at least one concern mark group obtains, amendment is obtained by correcting mode assessed value calculating part 224
Mode assessed value.At this moment, it is also possible to automatic from multiple correcting modes by the correcting mode assessed value of relatively more each correcting mode
The selection amendment suitable correcting mode of precision highest.
The above-mentioned correcting mode assessed value obtained based at least one mark assessed value for paying close attention to mark faciation pass, for example
It is the summation of the mark assessed value of at least one concern mark group.At this moment, in step s 16, by correcting mode selector
The minimum correcting mode of 225 selection correcting mode assessed values.By so, as described, can be automatically obtained that each position on substrate 9 is made
The amendment that deviation summation diminishes.Or, correcting mode assessed value refers to that the mark of such as at least one concern mark group is commented
The maximum of valuation.At this moment, also in step s 16, correcting mode assessed value minimum is selected by correcting mode selector 225
Correcting mode.By so, as described above, can be automatically obtained making on substrate 9 maximum deflection difference value in each position be changed into minimum
Amendment.Correcting mode assessed value, for example can be this it is at least one concern mark group mark assessed value average value or square
With also can be subduplicate summation.
In plotting unit 1, when established condition is met, as described above, obtaining all kinds concern mark faciation
Before the mark assessed value of pass, mark assessed value (that is, the mark assessment of at least one concern mark group for having obtained can be based on
Value) obtain correcting mode assessed value.For example, when the mark assessed value that various concern mark faciations are closed is obtained, an amendment
Deviation (that is, the deviation between paying close attention to the correction position of mark group and locating) shown in the mark assessed value of mode, than surplus
Deviation shown in the mark assessed value of remaining correcting mode is smaller, if this result continue for the regulation number of turns, based on having obtained
The mark assessed value for taking obtains correcting mode assessed value.Or, the concern of all kinds that can be selected in mark set 80
In mark group, it is also possible in the mark assessed value that the concern mark faciation for having obtained regulation ratio is closed, based on the note for having obtained
Number assessed value obtains correcting mode assessed value.
As described above, concern mark group is not limited to a mark 81, or a part for mark set 80 is multiple notes
Numbers 81.For example, when concern mark group is two marks 81, in mark assessed value calculating part 223, by for mark set 80
In whole combinations of two marks 81 obtain respective mark assessed value respectively, obtain what the concern mark faciation of all kinds was closed
Mark assessed value.
In the data processing equipment 2, the amendment that data correction portion 22 is carried out is not necessarily for the light for representing pattern
Grid data are carried out.For example, can be by the vector data of the correction chart diagram case of data correction portion 22, the then vector by that will correct
Data are transformed to raster data, so as to generate final draw data.
The obtaining section that locates 222, is not necessarily to include image pickup part 34 and the calculating part 228 that locates.Locate meter
Calculation portion 222 can be data receiving portion, for example, receiving and obtaining the measure position by accepting the mark set 80 that operating personnel are input into
The data or the data for locating of the mark set 80 sent from other devices put.
Including design attitude storage part 221, the obtaining section that locates 222, mark assessed value calculating part 223, correcting mode
The device of assessed value calculating part 224, correcting mode selector 225 and draw data correction portion 226 is (for example, above-mentioned computer
System), based on the positional information of the mark 81 on substrate 9, can enter as the draw data to the image being plotted on substrate 9
Row amendment data correction device and be used alone.Or, the data correction device also can and other in addition to exposure device 3
Device is used together.
The composition of above-mentioned implementation method and each modified example, can mutually it is reconcilable under the premise of it is appropriately combined.
Though the invention has been described in detail, the example way in the explanation is not limited to.Therefore, as long as insurmountability
The scope of the invention, can there is various conversion and pattern.
Claims (22)
1. a kind of data correction device, based on the mark positional information on substrate, the drawing of the image to be drawn on substrate
Data are modified, it is characterised in that including：
Design attitude storage part, the design attitude of its storage mark set, the mark set refers to, on substrate and uses
In multiple marks of amendment draw data,
Locate obtaining section, and it obtains locating for the mark set,
Mark assessed value calculating part, it is based on the remaining mark in addition to the concern mark group selected from the mark set
Group's locates and design attitude, by the different multiple correcting modes of algorithm, respectively to the design of the concern mark group
Position is modified to obtain correction position, and mark assessed value is obtained for each correcting mode, and the mark assessed value represents institute
Deviation between stating the correction position of concern mark group and locating,
Correcting mode assessed value calculating part, its in the mode related to each correcting mode, based on being assessed by the mark
The mark assessed value that value calculating part is obtained at least one concern mark group, obtains the amendment essence for representing each correcting mode
The correcting mode assessed value of degree,
Correcting mode selector, its correcting mode assessed value to multiple correcting modes is compared, selection amendment precision
Highest correcting mode,
Draw data correction portion, it corrects described painting using the correcting mode selected by the correcting mode selector
Diagram data.
2. data correction device according to claim 1, it is characterised in that
The concern mark group is a mark.
3. data correction device according to claim 2, it is characterised in that
The mark assessed value, be the correction position of the concern mark group and it is described the distance between locate,
The correcting mode assessed value, is the summation of the mark assessed value of at least one concern mark group, the amendment side
Formula selector, the correcting mode for selecting the correcting mode assessed value minimum.
4. data correction device according to claim 2, it is characterised in that
The mark assessed value, be the correction position of the concern mark group and it is described the distance between locate,
The correcting mode assessed value, is the maximum of the mark assessed value of at least one concern mark group,
The correcting mode selector, the correcting mode for selecting the correcting mode assessed value minimum.
5. data correction device according to claim 2, it is characterised in that
The mark assessed value calculating part, for each correcting mode, obtains the whole marks contained by the mark set
Mark assessed value during respectively as concern mark group,
The correcting mode assessed value calculating part, for each correcting mode, the mark assessed value based on whole marks
To obtain correcting mode assessed value.
6. data correction device according to claim 5, it is characterised in that
The mark assessed value, is the distance between the correction position of the concern mark group and the putting of the measure position,
The correcting mode assessed value, is the summation of the mark assessed value of at least one concern mark group,
The correcting mode selector, the correcting mode for selecting the correcting mode assessed value minimum.
7. data correction device according to claim 5, it is characterised in that
The mark assessed value, be the correction position of the concern mark group and it is described the distance between locate,
The correcting mode assessed value, is the maximum of the mark assessed value of at least one concern mark group,
The correcting mode selector, the correcting mode for selecting the correcting mode assessed value minimum.
8. data correction device according to claim 1, it is characterised in that
The mark assessed value, be the correction position of the concern mark group and it is described the distance between locate,
The correcting mode assessed value, is the summation of the mark assessed value of at least one concern mark group,
The correcting mode selector, the correcting mode for selecting the correcting mode assessed value minimum.
9. data correction device according to claim 1, it is characterised in that
The mark assessed value, be the correction position of the concern mark group and it is described the distance between locate,
The correcting mode assessed value, is the maximum of the mark assessed value of at least one concern mark group,
The correcting mode selector, the correcting mode for selecting the correcting mode assessed value minimum.
10. the data correction device according to any one claim in claim 1~9, it is characterised in that
The obtaining section that locates includes：
Image pickup part, it shoots the mark set,
Locate calculating part, and it obtains the measure of the mark set according to the image obtained by the image pickup part
Position.
A kind of 11. plotting units, the drawing image on substrate, it is characterised in that including：
Light source,
Data correction device, it is based on the mark positional information on substrate, the draw data of the image to be drawn on substrate
It is modified,
Modulating sections, it is based on, by the draw data of the data correction device amendment, adjusting the light from the light source
System,
Sweep mechanism, its light for making to be modulated by the modulating sections is scanned on substrate；
Data correction device includes：
Design attitude storage part, the design attitude of its storage mark set, the mark set refers to, on substrate and uses
In multiple marks of amendment draw data,
Locate obtaining section, and it obtains locating for the mark set,
Mark assessed value calculating part, it is based on the remaining mark in addition to the concern mark group selected from the mark set
Group's locates and design attitude, by the different multiple correcting modes of algorithm, respectively to the design of the concern mark group
Position is modified to obtain correction position, and mark assessed value is obtained for each correcting mode, and the mark assessed value represents institute
Deviation between stating the correction position of concern mark group and locating,
Correcting mode assessed value calculating part, its in the mode related to each correcting mode, based on being assessed by the mark
The mark assessed value that value calculating part is obtained at least one concern mark group, obtains the amendment essence for representing each correcting mode
The correcting mode assessed value of degree,
Correcting mode selector, its correcting mode assessed value to multiple correcting modes is compared, selection amendment precision
Highest correcting mode,
Draw data correction portion, it corrects described painting using the correcting mode selected by the correcting mode selector
Diagram data.
12. a kind of data correcting methods, based on the mark positional information on substrate, the drawing of the image to be drawn on substrate
Data are modified, it is characterised in that including：
A) operation, prepares the design attitude of mark set, and the mark set refers to be drawn on substrate and for correcting
Multiple marks of data,
B) operation, obtains the mark set and locates,
C) operation, based on except being selected from the mark set concern mark group in addition to remaining mark group locate
And design attitude, by the different multiple correcting modes of algorithm, the design attitude for paying close attention to mark group is modified respectively,
To obtain correction position, mark assessed value is obtained for each correcting mode, the mark assessed value represents the concern mark group
The correction position and the deviation between locating,
D) operation, in the mode related to each correcting mode, is remembered based on being paid close attention to at least one in the c) operation
The mark assessed value that number group obtains, obtains the correcting mode assessed value of the amendment precision for representing each correcting mode,
E) operation, the correcting mode assessed value to multiple correcting modes is compared, selection amendment precision highest amendment
Mode,
F) operation, the draw data is corrected using the correcting mode selected by correcting mode selector.
13. data correcting methods according to claim 12, it is characterised in that
The concern mark group is a mark.
14. data correcting methods according to claim 13, it is characterised in that
The mark assessed value, be the correction position of the concern mark group and it is described the distance between locate,
The correcting mode assessed value, is the summation of the mark assessed value of at least one concern mark group, in the e) work
In sequence, the correcting mode for selecting the correcting mode assessed value minimum.
15. data correcting methods according to claim 13, it is characterised in that
The mark assessed value, be the correction position of the concern mark group and it is described the distance between locate,
The correcting mode assessed value, is the maximum of the mark assessed value of at least one concern mark group,
In the e) operation, the correcting mode for selecting the correcting mode assessed value minimum.
16. data correcting methods according to claim 13, it is characterised in that
Described at least one concern mark group in the d) operation, is the whole marks difference for being included the mark set
As the mark group of concern mark group,
In the c) operation, for each correcting mode, repeatedly using whole marks as the concern mark
Group,
In the d) operation, for each correcting mode, amendment is obtained based on the mark assessed value of whole marks
Mode assessed value.
17. data correcting methods according to claim 16, it is characterised in that
The mark assessed value, is the distance between the correction position of the concern mark group and the putting of the measure position,
The correcting mode assessed value, is the summation of the mark assessed value of at least one concern mark group,
In the e) operation, the correcting mode for selecting the correcting mode assessed value minimum.
18. data correcting methods according to claim 16, it is characterised in that
The mark assessed value, be the correction position of the concern mark group and it is described the distance between locate,
The correcting mode assessed value, is the maximum of the mark assessed value of at least one concern mark group,
In the e) operation, the correcting mode for selecting the correcting mode assessed value minimum.
19. data correcting methods according to claim 12, it is characterised in that
The mark assessed value, be the correction position of the concern mark group and it is described the distance between locate,
The correcting mode assessed value, is the summation of the mark assessed value of at least one concern mark group,
In the e) operation, the correcting mode for selecting the correcting mode assessed value minimum.
20. data correcting methods according to claim 12, it is characterised in that
The mark assessed value, be the correction position of the concern mark group and it is described the distance between locate,
The correcting mode assessed value, is the maximum of the mark assessed value of at least one concern mark group,
In the e) operation, the correcting mode for selecting the correcting mode assessed value minimum.
21. data correcting method according to any one claim in claim 12~20, it is characterised in that
B) the operation also includes：
B1) operation, shoots the mark set,
B2) operation, according in the b1) image that obtains in operation, obtain the described of the mark set and locate.
A kind of 22. drawing practices, the drawing image on substrate, it is characterised in that including：
Data correction operation, based on the mark positional information on substrate, the draw data of the image to be drawn on substrate enters
Row amendment,
Scanning operation, makes the light modulated based on the revised draw data, is scanned on substrate；
Data correction operation includes：
A) operation, prepares the design attitude of mark set, and the mark set refers to be drawn on substrate and for correcting
Multiple marks of data,
B) operation, obtains the mark set and locates,
C) operation, based on except being selected from the mark set concern mark group in addition to remaining mark group locate
And design attitude, by the different multiple correcting modes of algorithm, the design attitude for paying close attention to mark group is modified respectively,
To obtain correction position, mark assessed value is obtained for each correcting mode, the mark assessed value represents the concern mark group
The correction position and the deviation between locating,
D) operation, in the mode related to each correcting mode, is remembered based on being paid close attention to at least one in the c) operation
The mark assessed value that number group obtains, obtains the correcting mode assessed value of the amendment precision for representing each correcting mode,
E) operation, the correcting mode assessed value to multiple correcting modes is compared, selection amendment precision highest amendment
Mode,
F) operation, the draw data is corrected using the correcting mode selected by correcting mode selector.
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| JP2014-058035 | 2014-03-20 | ||
| JP2014058035A JP2015184315A (en) | 2014-03-20 | 2014-03-20 | Data correction device, drawing device, data correction method, and drawing method |
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| JP (1) | JP2015184315A (en) |
| KR (1) | KR101661410B1 (en) |
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| US9997329B2 (en) | 2015-11-26 | 2018-06-12 | Nuflare Technology, Inc. | Evaluation method, correction method, recording medium and electron beam lithography system |
| JP6640684B2 (en) * | 2015-11-26 | 2020-02-05 | 株式会社ニューフレアテクノロジー | Evaluation method, correction method, program, and electron beam writing apparatus |
| JP2018028600A (en) * | 2016-08-17 | 2018-02-22 | 株式会社Ｓｃｒｅｅｎホールディングス | Data correction apparatus, drawing apparatus, data correction method, drawing method and program |
| CN112740281A (en) * | 2019-01-31 | 2021-04-30 | 惠普发展公司，有限责任合伙企业 | Predicted object attributes |
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| US5748329A (en) * | 1996-03-08 | 1998-05-05 | Industrial Technology Research Institute | Method and apparatus for adaptive color scanning/printing data correction employing neural networks |
| JP2004327922A (en) * | 2003-04-28 | 2004-11-18 | Sumitomo Heavy Ind Ltd | Working position correction method |
| EP1494077A3 (en) * | 2003-07-02 | 2006-12-27 | Fuji Photo Film Co., Ltd. | Image forming apparatus and image forming method |
| JP2007220937A (en) * | 2006-02-17 | 2007-08-30 | Toppan Printing Co Ltd | Overlapping drawing method of substrate |
| JP4819540B2 (en) * | 2006-03-20 | 2011-11-24 | 富士通セミコンダクター株式会社 | Circuit pattern data correction method and semiconductor device manufacturing method |
| JP5336036B2 (en) * | 2006-06-26 | 2013-11-06 | 株式会社オーク製作所 | Drawing system |
| JP2008058797A (en) * | 2006-09-01 | 2008-03-13 | Fujifilm Corp | Drawing device and drawing method |
| JP2010122526A (en) * | 2008-11-20 | 2010-06-03 | Shinko Electric Ind Co Ltd | Maskless exposure method |
| TWI371928B (en) * | 2008-12-15 | 2012-09-01 | Inst Information Industry | Data correction apparatus, data correction method and computer program product thereof |
| KR20100094143A (en) * | 2009-02-18 | 2010-08-26 | 삼성전자주식회사 | Method for compensation of position error of lithography apparatus |
| JP5496041B2 (en) * | 2010-09-30 | 2014-05-21 | 大日本スクリーン製造株式会社 | Displacement calculation method, drawing data correction method, drawing method, and drawing apparatus |
| JP5731864B2 (en) * | 2011-03-18 | 2015-06-10 | 株式会社Ｓｃｒｅｅｎホールディングス | Drawing data correction device and drawing device |
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| KR101661410B1 (en) | 2016-09-29 |
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