TWI572687B - 鍺化學機械拋光 - Google Patents

鍺化學機械拋光 Download PDF

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Publication number
TWI572687B
TWI572687B TW104115644A TW104115644A TWI572687B TW I572687 B TWI572687 B TW I572687B TW 104115644 A TW104115644 A TW 104115644A TW 104115644 A TW104115644 A TW 104115644A TW I572687 B TWI572687 B TW I572687B
Authority
TW
Taiwan
Prior art keywords
group
polymer
poly
amino acid
cmp
Prior art date
Application number
TW104115644A
Other languages
English (en)
Chinese (zh)
Other versions
TW201608000A (zh
Inventor
蔡智斌
葉銘智
葛倫 懷騰納
呂龍岱
Original Assignee
卡博特微電子公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 卡博特微電子公司 filed Critical 卡博特微電子公司
Publication of TW201608000A publication Critical patent/TW201608000A/zh
Application granted granted Critical
Publication of TWI572687B publication Critical patent/TWI572687B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dispersion Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
TW104115644A 2014-08-22 2015-05-15 鍺化學機械拋光 TWI572687B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/308,587 US20160053381A1 (en) 2014-08-22 2014-08-22 Germanium chemical mechanical polishing

Publications (2)

Publication Number Publication Date
TW201608000A TW201608000A (zh) 2016-03-01
TWI572687B true TWI572687B (zh) 2017-03-01

Family

ID=55347801

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104115644A TWI572687B (zh) 2014-08-22 2015-05-15 鍺化學機械拋光

Country Status (6)

Country Link
US (1) US20160053381A1 (enExample)
JP (1) JP6603309B2 (enExample)
KR (1) KR102444550B1 (enExample)
CN (1) CN106574171B (enExample)
TW (1) TWI572687B (enExample)
WO (1) WO2016028370A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI890904B (zh) * 2021-04-20 2025-07-21 日商力森諾科股份有限公司 Cmp研磨液及研磨方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9597768B1 (en) * 2015-09-09 2017-03-21 Cabot Microelectronics Corporation Selective nitride slurries with improved stability and improved polishing characteristics
JP2021089906A (ja) * 2018-03-22 2021-06-10 株式会社フジミインコーポレーテッド ゲルマニウム溶解抑制剤
US10676647B1 (en) * 2018-12-31 2020-06-09 Cabot Microelectronics Corporation Composition for tungsten CMP
JP7409899B2 (ja) * 2020-02-18 2024-01-09 株式会社フジミインコーポレーテッド 研磨用組成物、研磨方法、および半導体基板の製造方法
KR102455159B1 (ko) * 2020-07-17 2022-10-18 주식회사 케이씨텍 금속막 연마용 슬러리 조성물
KR20220130544A (ko) * 2021-03-18 2022-09-27 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법
CN118159613A (zh) * 2021-09-23 2024-06-07 Cmc材料有限责任公司 用于介电质化学机械研磨的包含高分子量聚合物的基于二氧化硅的浆料组合物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201011826A (en) * 2008-07-30 2010-03-16 Cabot Microelectronics Corp Methods and compositions for polishing silicon-containing substrates
TW201404843A (zh) * 2012-07-17 2014-02-01 Cabot Microelectronics Corp 鍺銻碲化學機械拋光漿料

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012638A (ja) * 2003-10-01 2007-01-18 Asahi Kasei Chemicals Corp 金属用研磨組成物
CN1989600A (zh) * 2004-09-14 2007-06-27 日立化成工业株式会社 Cmp用研磨浆料
WO2008082177A1 (en) * 2006-12-29 2008-07-10 Lg Chem, Ltd. Cmp slurry composition for forming metal wiring line
US7915071B2 (en) * 2007-08-30 2011-03-29 Dupont Air Products Nanomaterials, Llc Method for chemical mechanical planarization of chalcogenide materials
US7678605B2 (en) * 2007-08-30 2010-03-16 Dupont Air Products Nanomaterials Llc Method for chemical mechanical planarization of chalcogenide materials
KR101396232B1 (ko) * 2010-02-05 2014-05-19 한양대학교 산학협력단 상변화 물질 연마용 슬러리 및 이를 이용한 상변화 소자 제조 방법
WO2012103091A2 (en) * 2011-01-24 2012-08-02 Clarkson University Abrasive free silicon chemical mechanical planarization
RU2605941C2 (ru) 2011-08-01 2016-12-27 Басф Се СПОСОБ ИЗГОТОВЛЕНИЯ ПОЛУПРОВОДНИКОВЫХ УСТРОЙСТВ, ВКЛЮЧАЮЩИЙ ХИМИКО-МЕХАНИЧЕСКОЕ ПОЛИРОВАНИЕ ЭЛЕМЕНТАРНОГО ГЕРМАНИЯ И/ИЛИ МАТЕРИАЛА Si1-x Gex В ПРИСУТСТВИИ ХМП (ХИМИКО-МЕХАНИЧЕСКОЙ ПОЛИРОВАЛЬНОЙ) КОМПОЗИЦИИ, ВКЛЮЧАЮЩЕЙ СПЕЦИАЛЬНОЕ ОРГАНИЧЕСКОЕ СОЕДИНЕНИЕ
JP2013080751A (ja) * 2011-09-30 2013-05-02 Fujimi Inc 研磨用組成物
KR20150014924A (ko) * 2012-04-18 2015-02-09 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201011826A (en) * 2008-07-30 2010-03-16 Cabot Microelectronics Corp Methods and compositions for polishing silicon-containing substrates
TW201404843A (zh) * 2012-07-17 2014-02-01 Cabot Microelectronics Corp 鍺銻碲化學機械拋光漿料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI890904B (zh) * 2021-04-20 2025-07-21 日商力森諾科股份有限公司 Cmp研磨液及研磨方法

Also Published As

Publication number Publication date
CN106574171A (zh) 2017-04-19
JP2017531311A (ja) 2017-10-19
TW201608000A (zh) 2016-03-01
US20160053381A1 (en) 2016-02-25
CN106574171B (zh) 2019-03-19
JP6603309B2 (ja) 2019-11-06
WO2016028370A1 (en) 2016-02-25
KR102444550B1 (ko) 2022-09-20
KR20170044156A (ko) 2017-04-24

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