TWI570278B - 複合電鍍液 - Google Patents
複合電鍍液 Download PDFInfo
- Publication number
- TWI570278B TWI570278B TW101106180A TW101106180A TWI570278B TW I570278 B TWI570278 B TW I570278B TW 101106180 A TW101106180 A TW 101106180A TW 101106180 A TW101106180 A TW 101106180A TW I570278 B TWI570278 B TW I570278B
- Authority
- TW
- Taiwan
- Prior art keywords
- composite plating
- plating
- metal
- present
- plating film
- Prior art date
Links
- 238000007747 plating Methods 0.000 title claims description 148
- 239000002131 composite material Substances 0.000 title claims description 66
- 239000007788 liquid Substances 0.000 title 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 74
- 239000002041 carbon nanotube Substances 0.000 claims description 63
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 63
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 239000002184 metal Substances 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 40
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 37
- 230000005855 radiation Effects 0.000 claims description 23
- 150000003839 salts Chemical class 0.000 claims description 22
- 239000002270 dispersing agent Substances 0.000 claims description 20
- 238000009713 electroplating Methods 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 10
- 239000004327 boric acid Substances 0.000 claims description 10
- 229920002125 Sokalan® Polymers 0.000 claims description 9
- 239000004584 polyacrylic acid Substances 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 5
- 229910052783 alkali metal Inorganic materials 0.000 claims description 5
- -1 halide salt Chemical class 0.000 claims description 5
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 4
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 4
- 229910021585 Nickel(II) bromide Inorganic materials 0.000 claims description 2
- IPLJNQFXJUCRNH-UHFFFAOYSA-L nickel(2+);dibromide Chemical compound [Ni+2].[Br-].[Br-] IPLJNQFXJUCRNH-UHFFFAOYSA-L 0.000 claims description 2
- 238000004070 electrodeposition Methods 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052799 carbon Inorganic materials 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000004458 analytical method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000001000 micrograph Methods 0.000 description 5
- 229920000620 organic polymer Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- 239000002134 carbon nanofiber Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000002086 nanomaterial Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 3
- 239000011852 carbon nanoparticle Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000004451 qualitative analysis Methods 0.000 description 3
- 238000004445 quantitative analysis Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052938 sodium sulfate Inorganic materials 0.000 description 3
- 235000011152 sodium sulphate Nutrition 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000001493 electron microscopy Methods 0.000 description 2
- 238000000921 elemental analysis Methods 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- 239000003002 pH adjusting agent Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000002087 whitening effect Effects 0.000 description 2
- 238000004876 x-ray fluorescence Methods 0.000 description 2
- KIUKXJAPPMFGSW-DNGZLQJQSA-N (2S,3S,4S,5R,6R)-6-[(2S,3R,4R,5S,6R)-3-Acetamido-2-[(2S,3S,4R,5R,6R)-6-[(2R,3R,4R,5S,6R)-3-acetamido-2,5-dihydroxy-6-(hydroxymethyl)oxan-4-yl]oxy-2-carboxy-4,5-dihydroxyoxan-3-yl]oxy-5-hydroxy-6-(hydroxymethyl)oxan-4-yl]oxy-3,4,5-trihydroxyoxane-2-carboxylic acid Chemical compound CC(=O)N[C@H]1[C@H](O)O[C@H](CO)[C@@H](O)[C@@H]1O[C@H]1[C@H](O)[C@@H](O)[C@H](O[C@H]2[C@@H]([C@@H](O[C@H]3[C@@H]([C@@H](O)[C@H](O)[C@H](O3)C(O)=O)O)[C@H](O)[C@@H](CO)O2)NC(C)=O)[C@@H](C(O)=O)O1 KIUKXJAPPMFGSW-DNGZLQJQSA-N 0.000 description 1
- JQXYBDVZAUEPDL-UHFFFAOYSA-N 2-methylidene-5-phenylpent-4-enoic acid Chemical compound OC(=O)C(=C)CC=CC1=CC=CC=C1 JQXYBDVZAUEPDL-UHFFFAOYSA-N 0.000 description 1
- PICIWILTNUQXAZ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;phenyl 2-methylprop-2-enoate;styrene Chemical compound CC(=C)C(O)=O.C=CC1=CC=CC=C1.CC(=C)C(=O)OC1=CC=CC=C1 PICIWILTNUQXAZ-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000004475 Arginine Substances 0.000 description 1
- 229910000521 B alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 229920000858 Cyclodextrin Polymers 0.000 description 1
- ODKSFYDXXFIFQN-BYPYZUCNSA-P L-argininium(2+) Chemical compound NC(=[NH2+])NCCC[C@H]([NH3+])C(O)=O ODKSFYDXXFIFQN-BYPYZUCNSA-P 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 238000001241 arc-discharge method Methods 0.000 description 1
- ODKSFYDXXFIFQN-UHFFFAOYSA-N arginine Natural products OC(=O)C(N)CCCNC(N)=N ODKSFYDXXFIFQN-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007844 bleaching agent Substances 0.000 description 1
- DLDJFQGPPSQZKI-UHFFFAOYSA-N but-2-yne-1,4-diol Chemical compound OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004939 coking Methods 0.000 description 1
- 238000004440 column chromatography Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229940097362 cyclodextrins Drugs 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229920002674 hyaluronan Polymers 0.000 description 1
- 229960003160 hyaluronic acid Drugs 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000001182 laser chemical vapour deposition Methods 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002048 multi walled nanotube Substances 0.000 description 1
- 239000002116 nanohorn Substances 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229940053662 nickel sulfate Drugs 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 1
- UQPSGBZICXWIAG-UHFFFAOYSA-L nickel(2+);dibromide;trihydrate Chemical compound O.O.O.Br[Ni]Br UQPSGBZICXWIAG-UHFFFAOYSA-L 0.000 description 1
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- BTAAXEFROUUDIL-UHFFFAOYSA-M potassium;sulfamate Chemical compound [K+].NS([O-])(=O)=O BTAAXEFROUUDIL-UHFFFAOYSA-M 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002109 single walled nanotube Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- QDWYPRSFEZRKDK-UHFFFAOYSA-M sodium;sulfamate Chemical compound [Na+].NS([O-])(=O)=O QDWYPRSFEZRKDK-UHFFFAOYSA-M 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011038171A JP5631775B2 (ja) | 2011-02-24 | 2011-02-24 | 複合めっき液 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201235515A TW201235515A (en) | 2012-09-01 |
| TWI570278B true TWI570278B (zh) | 2017-02-11 |
Family
ID=46692194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101106180A TWI570278B (zh) | 2011-02-24 | 2012-02-24 | 複合電鍍液 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9476138B2 (enExample) |
| JP (1) | JP5631775B2 (enExample) |
| CN (1) | CN102650072B (enExample) |
| TW (1) | TWI570278B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104195619A (zh) * | 2014-09-17 | 2014-12-10 | 朱忠良 | 一种复合电镀液及使用所述复合电镀液进行电镀的方法 |
| JP6435546B2 (ja) * | 2014-10-17 | 2018-12-12 | ディップソール株式会社 | 銅−ニッケル合金電気めっき装置 |
| JP6531277B2 (ja) * | 2015-03-30 | 2019-06-19 | 株式会社 コーア | 無電解めっき液及び無電解めっき方法 |
| CN104928732A (zh) * | 2015-05-13 | 2015-09-23 | 中国石油天然气股份有限公司西南油气田分公司重庆天然气净化总厂 | 一种镍钨单壁碳纳米管复合镀液、镀膜及其制备方法 |
| US10316424B2 (en) | 2016-02-23 | 2019-06-11 | Samsung Electronics Co., Ltd. | Flexible electrically conductive structure, flexible wiring board, production method thereof, and electronic device includng the same |
| US11091847B2 (en) * | 2016-10-28 | 2021-08-17 | Unison Industries Llc | Method of manufacturing aircraft engine parts utilizing reusable and reconfigurable smart memory polymer mandrel |
| JP2019002034A (ja) * | 2017-06-13 | 2019-01-10 | 国立大学法人信州大学 | 銅・単層カーボンナノチューブ複合めっき方法 |
| CN109537030B (zh) * | 2018-11-26 | 2020-12-15 | 江苏科技大学 | 一种碳纳米颗粒溶液的制备方法及其在镍涂层中的应用 |
| CN111041540A (zh) * | 2019-12-24 | 2020-04-21 | 托伦斯半导体设备启东有限公司 | 一种半导体硅片耐磨处理工艺 |
| JP2021172528A (ja) * | 2020-04-17 | 2021-11-01 | 国立研究開発法人産業技術総合研究所 | カーボンナノチューブ膜、分散液及びカーボンナノチューブ膜の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1563505A (zh) * | 2004-03-16 | 2005-01-12 | 天津大学 | 脉冲镀镍基纳米复合镀层的方法及设备 |
| CN101070604A (zh) * | 2006-03-27 | 2007-11-14 | 上村工业株式会社 | 电镀方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR813548A (fr) * | 1936-11-16 | 1937-06-03 | Mond Nickel Co Ltd | Procédé pour l'obtention de dépôts brillants ou semi-brillants de nickel |
| US3860949A (en) * | 1973-09-12 | 1975-01-14 | Rca Corp | Semiconductor mounting devices made by soldering flat surfaces to each other |
| JPS62103387A (ja) * | 1985-07-29 | 1987-05-13 | C Uyemura & Co Ltd | 電気めつき液 |
| US5051814A (en) * | 1987-04-15 | 1991-09-24 | The Board Of Trustees Of The Leland Stanford Junior University | Method of providing stress-free thermally-conducting attachment of two bodies |
| JPH04116191A (ja) * | 1990-09-04 | 1992-04-16 | C Uyemura & Co Ltd | 電気めっき方法 |
| CN1265028C (zh) * | 2001-10-29 | 2006-07-19 | 株式会社新王磁材 | 在物品表面形成电镀膜的方法 |
| JP4032116B2 (ja) * | 2002-11-01 | 2008-01-16 | 国立大学法人信州大学 | 電子部品およびその製造方法 |
| US7112472B2 (en) * | 2003-06-25 | 2006-09-26 | Intel Corporation | Methods of fabricating a composite carbon nanotube thermal interface device |
| JP4324434B2 (ja) * | 2003-09-18 | 2009-09-02 | 新光電気工業株式会社 | 放熱部材及びその製造方法 |
| CN1544707A (zh) * | 2003-11-13 | 2004-11-10 | 上海交通大学 | 复合电沉积制备镍基纳米碳管复合材料的方法 |
| JP4489561B2 (ja) * | 2004-06-18 | 2010-06-23 | 国立大学法人信州大学 | 繊維状ナノカーボン・金属複合材料およびその製造方法 |
| CN100413063C (zh) | 2004-07-21 | 2008-08-20 | 鸿富锦精密工业（深圳）有限公司 | 一种热管及其制造方法 |
| US7906210B2 (en) | 2004-10-27 | 2011-03-15 | Nissei Plastic Industrial Co., Ltd. | Fibrous nanocarbon and metal composite and a method of manufacturing the same |
| KR100748228B1 (ko) * | 2006-02-28 | 2007-08-09 | 한국과학기술원 | 전기도금을 이용한 금속/탄소나노튜브 복합재료 제조방법 |
| JP2008157912A (ja) * | 2006-11-28 | 2008-07-10 | Seiko Epson Corp | 時計部品、及び当該時計部品を備えた時計 |
| JP4999072B2 (ja) * | 2007-03-22 | 2012-08-15 | 古河電気工業株式会社 | 表面被覆材 |
| JP5266088B2 (ja) * | 2009-02-18 | 2013-08-21 | パナソニック株式会社 | 電磁シールド用めっき膜、電磁シールド基板及びその製造方法 |
| JP5544527B2 (ja) * | 2009-03-02 | 2014-07-09 | 国立大学法人信州大学 | 複合めっき皮膜及びその形成方法並びに電解めっき液 |
| JP2010222707A (ja) * | 2010-06-07 | 2010-10-07 | Shinshu Univ | 無電解めっき方法および無電解めっき液 |
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2011
- 2011-02-24 JP JP2011038171A patent/JP5631775B2/ja active Active
-
2012
- 2012-02-23 US US13/403,331 patent/US9476138B2/en active Active
- 2012-02-24 CN CN201210045704.1A patent/CN102650072B/zh active Active
- 2012-02-24 TW TW101106180A patent/TWI570278B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1563505A (zh) * | 2004-03-16 | 2005-01-12 | 天津大学 | 脉冲镀镍基纳米复合镀层的方法及设备 |
| CN101070604A (zh) * | 2006-03-27 | 2007-11-14 | 上村工业株式会社 | 电镀方法 |
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| CN102650072B (zh) | 2016-05-25 |
| US9476138B2 (en) | 2016-10-25 |
| US20120216997A1 (en) | 2012-08-30 |
| TW201235515A (en) | 2012-09-01 |
| CN102650072A (zh) | 2012-08-29 |
| JP2012172245A (ja) | 2012-09-10 |
| JP5631775B2 (ja) | 2014-11-26 |
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