TWI570188B - 具有改良的熱穩定性之凝膠 - Google Patents

具有改良的熱穩定性之凝膠 Download PDF

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Publication number
TWI570188B
TWI570188B TW101137052A TW101137052A TWI570188B TW I570188 B TWI570188 B TW I570188B TW 101137052 A TW101137052 A TW 101137052A TW 101137052 A TW101137052 A TW 101137052A TW I570188 B TWI570188 B TW I570188B
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TW
Taiwan
Prior art keywords
ferrocene
gel
weight
hydrogenation reaction
heat stabilizer
Prior art date
Application number
TW101137052A
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English (en)
Chinese (zh)
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TW201315777A (zh
Inventor
約翰Ｊ 基南
肯特Ｒ 拉森
蘭道Ｇ 史密特
許生青
布萊恩Ｒ 哈克尼司
玄大涉
江潔
馬林達Ｎ 何威爾
Original Assignee
道康寧公司
韓國道康寧股份有限公司
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Application filed by 道康寧公司, 韓國道康寧股份有限公司 filed Critical 道康寧公司
Publication of TW201315777A publication Critical patent/TW201315777A/zh
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Publication of TWI570188B publication Critical patent/TWI570188B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Formation Of Insulating Films (AREA)
TW101137052A 2011-10-06 2012-10-05 具有改良的熱穩定性之凝膠 TWI570188B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161543990P 2011-10-06 2011-10-06

Publications (2)

Publication Number Publication Date
TW201315777A TW201315777A (zh) 2013-04-16
TWI570188B true TWI570188B (zh) 2017-02-11

Family

ID=47116377

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101137052A TWI570188B (zh) 2011-10-06 2012-10-05 具有改良的熱穩定性之凝膠

Country Status (7)

Country Link
US (1) US20140291872A1 (enExample)
EP (1) EP2764054A1 (enExample)
JP (1) JP2014534295A (enExample)
KR (1) KR20140095482A (enExample)
CN (1) CN103946313B (enExample)
TW (1) TWI570188B (enExample)
WO (1) WO2013070350A1 (enExample)

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* Cited by examiner, † Cited by third party
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DE102012200335A1 (de) * 2012-01-11 2013-07-11 Wacker Chemie Ag Hitzestabilisierte Siliconmischung
DE102013013984A1 (de) * 2013-08-23 2015-02-26 Elantas Gmbh Silikongel mit verringerter Schadgasemission
EP3199591B1 (en) * 2014-09-25 2020-04-29 Shin-Etsu Chemical Co., Ltd. Uv-thickening thermally conductive silicone grease composition
JP6390361B2 (ja) * 2014-11-11 2018-09-19 信越化学工業株式会社 紫外線増粘型熱伝導性シリコーングリース組成物
EP3383953B8 (en) 2015-12-03 2025-04-16 ELANTAS Europe GmbH One-component, storage-stable, uv-crosslinkable organosiloxane composition
JP6642145B2 (ja) * 2016-03-14 2020-02-05 信越化学工業株式会社 付加一液加熱硬化型熱伝導性シリコーングリース組成物の硬化物の製造方法
TW201829672A (zh) 2017-02-10 2018-08-16 美商道康寧公司 可固化組成物及經塗佈基材
WO2020093258A1 (en) * 2018-11-07 2020-05-14 Dow Global Technologies Llc Thermally conductive composition and methods and devices in which said composition is used
CN115003760A (zh) * 2019-12-26 2022-09-02 陶氏东丽株式会社 固化性聚有机硅氧烷组合物和其固化物、保护剂或粘接剂以及电气/电子设备
EP4015562A1 (de) * 2020-12-17 2022-06-22 Ems-Chemie Ag Polyamid-formmassen, hieraus hergestellte formkörper und verwendung der polyamid-formmassen
EP4015575A1 (de) * 2020-12-17 2022-06-22 Ems-Chemie Ag Gefüllte polyamid-formmassen, hieraus hergestellte formkörper und verwendung der gefüllten polyamid-formmassen

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6169155B1 (en) * 1999-01-14 2001-01-02 Dow Corning Corporation Silicone gel composition and silicone gel produced therefrom
CN101321808A (zh) * 2005-12-01 2008-12-10 瓦克化学有限公司 可交联形成高强度弹性体的离子和/或有机金属官能化的硅氧烷聚合物
CN101925608A (zh) * 2008-01-25 2010-12-22 瓦克化学股份公司 通过辐射活化的氢化硅烷化反应

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US4374967A (en) 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
US4530879A (en) 1983-03-04 1985-07-23 Minnesota Mining And Manufacturing Company Radiation activated addition reaction
US4510094A (en) 1983-12-06 1985-04-09 Minnesota Mining And Manufacturing Company Platinum complex
US6376569B1 (en) 1990-12-13 2002-04-23 3M Innovative Properties Company Hydrosilation reaction utilizing a (cyclopentadiene)(sigma-aliphatic) platinum complex and a free radical photoinitiator
JPH08183986A (ja) * 1994-12-27 1996-07-16 Tonen Corp 流体継手用流体組成物
JP3436435B2 (ja) * 1995-02-22 2003-08-11 東レ・ダウコーニング・シリコーン株式会社 紫外線硬化型シリコーン組成物の硬化方法
JPH09286919A (ja) * 1996-04-18 1997-11-04 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物およびその硬化物
JP3765444B2 (ja) * 1997-07-10 2006-04-12 東レ・ダウコーニング株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
US6020409A (en) 1997-09-19 2000-02-01 Dow Corning Corporation Routes to dielectric gel for protection of electronic modules
US6150546A (en) 1999-05-03 2000-11-21 General Electric Company Irradiation-curable silicone compositions, photo-active platinum (IV) compounds, and method
DE10004158A1 (de) * 2000-02-01 2001-08-02 Basf Ag Stabilisatorzusammensetzung
JP3923716B2 (ja) * 2000-09-29 2007-06-06 株式会社東芝 半導体装置
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions
JP2010526927A (ja) * 2007-05-14 2010-08-05 モーメンテイブ・パーフオーマンス・マテリアルズ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 絶縁体の生成におけるフェロセン又はフェロセン誘導体の使用
US20090062417A1 (en) * 2007-08-31 2009-03-05 Momentive Performance Materials Gmbh Process For The Continuous Manufacturing Of Shaped Articles And Use Of Silicone Rubber Compositions In That Process

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
US6169155B1 (en) * 1999-01-14 2001-01-02 Dow Corning Corporation Silicone gel composition and silicone gel produced therefrom
CN101321808A (zh) * 2005-12-01 2008-12-10 瓦克化学有限公司 可交联形成高强度弹性体的离子和/或有机金属官能化的硅氧烷聚合物
CN101925608A (zh) * 2008-01-25 2010-12-22 瓦克化学股份公司 通过辐射活化的氢化硅烷化反应

Also Published As

Publication number Publication date
WO2013070350A1 (en) 2013-05-16
CN103946313A (zh) 2014-07-23
WO2013070350A8 (en) 2014-04-24
TW201315777A (zh) 2013-04-16
KR20140095482A (ko) 2014-08-01
CN103946313B (zh) 2016-11-09
US20140291872A1 (en) 2014-10-02
JP2014534295A (ja) 2014-12-18
EP2764054A1 (en) 2014-08-13

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