CN103946313B - 具有改善的热稳定性的凝胶 - Google Patents

具有改善的热稳定性的凝胶 Download PDF

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Publication number
CN103946313B
CN103946313B CN201280054242.8A CN201280054242A CN103946313B CN 103946313 B CN103946313 B CN 103946313B CN 201280054242 A CN201280054242 A CN 201280054242A CN 103946313 B CN103946313 B CN 103946313B
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China
Prior art keywords
gel
ferrocene
hydrosilylation
ultraviolet
reaction product
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Active
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CN201280054242.8A
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English (en)
Chinese (zh)
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CN103946313A (zh
Inventor
布赖恩·R·哈克尼斯
马林达·N·豪厄尔
玄大涉
姜静
约翰·J·科南
肯特·R·拉森
兰德尔·G·施密特
徐胜清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Chemical Silicones Korea Ltd
Dow Silicones Corp
Original Assignee
Dow Corning Korea Ltd
Dow Corning Corp
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Publication of CN103946313A publication Critical patent/CN103946313A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Formation Of Insulating Films (AREA)
CN201280054242.8A 2011-10-06 2012-10-05 具有改善的热稳定性的凝胶 Active CN103946313B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161543990P 2011-10-06 2011-10-06
US61/543,990 2011-10-06
PCT/US2012/058974 WO2013070350A1 (en) 2011-10-06 2012-10-05 Gel having improved thermal stability

Publications (2)

Publication Number Publication Date
CN103946313A CN103946313A (zh) 2014-07-23
CN103946313B true CN103946313B (zh) 2016-11-09

Family

ID=47116377

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280054242.8A Active CN103946313B (zh) 2011-10-06 2012-10-05 具有改善的热稳定性的凝胶

Country Status (7)

Country Link
US (1) US20140291872A1 (enExample)
EP (1) EP2764054A1 (enExample)
JP (1) JP2014534295A (enExample)
KR (1) KR20140095482A (enExample)
CN (1) CN103946313B (enExample)
TW (1) TWI570188B (enExample)
WO (1) WO2013070350A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012200335A1 (de) * 2012-01-11 2013-07-11 Wacker Chemie Ag Hitzestabilisierte Siliconmischung
DE102013013984A1 (de) * 2013-08-23 2015-02-26 Elantas Gmbh Silikongel mit verringerter Schadgasemission
CN106715592A (zh) * 2014-09-25 2017-05-24 信越化学工业株式会社 紫外线增稠型导热性硅润滑脂组合物
JP6390361B2 (ja) * 2014-11-11 2018-09-19 信越化学工業株式会社 紫外線増粘型熱伝導性シリコーングリース組成物
WO2017093375A1 (en) 2015-12-03 2017-06-08 Elantas Beck Gmbh One-component, storage-stable, uv-crosslinkable organosiloxane composition
JP6642145B2 (ja) * 2016-03-14 2020-02-05 信越化学工業株式会社 付加一液加熱硬化型熱伝導性シリコーングリース組成物の硬化物の製造方法
TW201829672A (zh) 2017-02-10 2018-08-16 美商道康寧公司 可固化組成物及經塗佈基材
US11851603B2 (en) * 2018-11-07 2023-12-26 Dow Silicones Corporation Thermally conductive composition and methods and devices in which said composition is used
WO2021132349A1 (ja) * 2019-12-26 2021-07-01 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物及びその硬化物、保護剤又は接着剤、並びに電気・電子機器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374967A (en) 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
US4530879A (en) 1983-03-04 1985-07-23 Minnesota Mining And Manufacturing Company Radiation activated addition reaction
US4510094A (en) 1983-12-06 1985-04-09 Minnesota Mining And Manufacturing Company Platinum complex
US6376569B1 (en) 1990-12-13 2002-04-23 3M Innovative Properties Company Hydrosilation reaction utilizing a (cyclopentadiene)(sigma-aliphatic) platinum complex and a free radical photoinitiator
JPH08183986A (ja) * 1994-12-27 1996-07-16 Tonen Corp 流体継手用流体組成物
JP3436435B2 (ja) * 1995-02-22 2003-08-11 東レ・ダウコーニング・シリコーン株式会社 紫外線硬化型シリコーン組成物の硬化方法
JPH09286919A (ja) * 1996-04-18 1997-11-04 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物およびその硬化物
JP3765444B2 (ja) 1997-07-10 2006-04-12 東レ・ダウコーニング株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
US6020409A (en) 1997-09-19 2000-02-01 Dow Corning Corporation Routes to dielectric gel for protection of electronic modules
US6169155B1 (en) * 1999-01-14 2001-01-02 Dow Corning Corporation Silicone gel composition and silicone gel produced therefrom
US6150546A (en) 1999-05-03 2000-11-21 General Electric Company Irradiation-curable silicone compositions, photo-active platinum (IV) compounds, and method
DE10004158A1 (de) * 2000-02-01 2001-08-02 Basf Ag Stabilisatorzusammensetzung
JP3923716B2 (ja) * 2000-09-29 2007-06-06 株式会社東芝 半導体装置
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions
DE102005057460A1 (de) * 2005-12-01 2007-06-06 Wacker Chemie Ag Zu hochfesten Elastomeren vernetzbare ionisch und/oder organometallisch funktionalisierte Siliconpolymere
WO2008138944A2 (de) * 2007-05-14 2008-11-20 Momentive Performance Materials Gmbh Verwendung von ferrocen oder ferrocen-derivaten zur herstellung von isolatoren
US20090062417A1 (en) * 2007-08-31 2009-03-05 Momentive Performance Materials Gmbh Process For The Continuous Manufacturing Of Shaped Articles And Use Of Silicone Rubber Compositions In That Process
DE102008000156A1 (de) * 2008-01-25 2009-07-30 Wacker Chemie Ag Durch Bestrahlung aktivierte Hydrosilylierungsreaktionen

Also Published As

Publication number Publication date
TW201315777A (zh) 2013-04-16
CN103946313A (zh) 2014-07-23
TWI570188B (zh) 2017-02-11
WO2013070350A8 (en) 2014-04-24
US20140291872A1 (en) 2014-10-02
EP2764054A1 (en) 2014-08-13
WO2013070350A1 (en) 2013-05-16
KR20140095482A (ko) 2014-08-01
JP2014534295A (ja) 2014-12-18

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Address after: michigan

Co-patentee after: Dow Chemical Silicone Korea Co., Ltd.

Patentee after: Dow organosilicon company

Address before: michigan

Co-patentee before: DOW CORNING KOREA LTD.

Patentee before: Dow Corning

CP01 Change in the name or title of a patent holder