TWI569919B - 於拋光之現場監測期間針對資料濾波之線性預測 - Google Patents
於拋光之現場監測期間針對資料濾波之線性預測 Download PDFInfo
- Publication number
- TWI569919B TWI569919B TW102112924A TW102112924A TWI569919B TW I569919 B TWI569919 B TW I569919B TW 102112924 A TW102112924 A TW 102112924A TW 102112924 A TW102112924 A TW 102112924A TW I569919 B TWI569919 B TW I569919B
- Authority
- TW
- Taiwan
- Prior art keywords
- signal
- value
- polishing
- predicted
- monitoring system
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims description 91
- 238000012544 monitoring process Methods 0.000 title claims description 43
- 238000001914 filtration Methods 0.000 title claims description 8
- 238000011065 in-situ storage Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims description 31
- 238000005259 measurement Methods 0.000 claims description 15
- 238000004590 computer program Methods 0.000 claims description 13
- 238000011156 evaluation Methods 0.000 claims description 13
- 238000004364 calculation method Methods 0.000 claims description 12
- 230000009471 action Effects 0.000 claims description 3
- 230000001939 inductive effect Effects 0.000 claims description 2
- 238000009795 derivation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 16
- 230000008859 change Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000001364 causal effect Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 229910000449 hafnium oxide Inorganic materials 0.000 description 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000009897 systematic effect Effects 0.000 description 2
- 241000212384 Bifora Species 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013213 extrapolation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Numerical Control (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/456,801 US9308618B2 (en) | 2012-04-26 | 2012-04-26 | Linear prediction for filtering of data during in-situ monitoring of polishing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201350261A TW201350261A (zh) | 2013-12-16 |
| TWI569919B true TWI569919B (zh) | 2017-02-11 |
Family
ID=49477713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102112924A TWI569919B (zh) | 2012-04-26 | 2013-04-11 | 於拋光之現場監測期間針對資料濾波之線性預測 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9308618B2 (enExample) |
| JP (1) | JP6181156B2 (enExample) |
| KR (1) | KR101919032B1 (enExample) |
| TW (1) | TWI569919B (enExample) |
| WO (1) | WO2013162857A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11504821B2 (en) | 2017-11-16 | 2022-11-22 | Applied Materials, Inc. | Predictive filter for polishing pad wear rate monitoring |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8694144B2 (en) | 2010-08-30 | 2014-04-08 | Applied Materials, Inc. | Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing |
| US9375824B2 (en) | 2013-11-27 | 2016-06-28 | Applied Materials, Inc. | Adjustment of polishing rates during substrate polishing with predictive filters |
| US9490186B2 (en) | 2013-11-27 | 2016-11-08 | Applied Materials, Inc. | Limiting adjustment of polishing rates during substrate polishing |
| US10065714B2 (en) * | 2015-02-25 | 2018-09-04 | Onesubsea Ip Uk Limited | In-situ testing of subsea power components |
| US9727054B2 (en) | 2015-02-25 | 2017-08-08 | Onesubsea Ip Uk Limited | Impedance measurement behind subsea transformer |
| US9679693B2 (en) | 2015-02-25 | 2017-06-13 | Onesubsea Ip Uk Limited | Subsea transformer with seawater high resistance ground |
| US10026537B2 (en) | 2015-02-25 | 2018-07-17 | Onesubsea Ip Uk Limited | Fault tolerant subsea transformer |
| US9945909B2 (en) | 2015-02-25 | 2018-04-17 | Onesubsea Ip Uk Limited | Monitoring multiple subsea electric motors |
| US10565701B2 (en) * | 2015-11-16 | 2020-02-18 | Applied Materials, Inc. | Color imaging for CMP monitoring |
| US11557048B2 (en) | 2015-11-16 | 2023-01-17 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| JP2017102051A (ja) * | 2015-12-03 | 2017-06-08 | ニッタ株式会社 | 圧力測定装置及び圧力測定プログラム |
| JP2018001296A (ja) * | 2016-06-28 | 2018-01-11 | 株式会社荏原製作所 | 研磨装置、研磨方法、及び研磨制御プログラム |
| CN109791881B (zh) | 2016-09-21 | 2021-02-19 | 应用材料公司 | 具有补偿滤波的端点检测 |
| JP6989317B2 (ja) | 2017-08-04 | 2022-01-05 | キオクシア株式会社 | 研磨装置、研磨方法、およびプログラム |
| JP7098311B2 (ja) * | 2017-12-05 | 2022-07-11 | 株式会社荏原製作所 | 研磨装置、及び研磨方法 |
| JP7237083B2 (ja) * | 2018-03-12 | 2023-03-10 | アプライド マテリアルズ インコーポレイテッド | 研磨のインシトゥモニタリングにおけるフィルタリング |
| US11577362B2 (en) | 2018-03-14 | 2023-02-14 | Applied Materials, Inc. | Pad conditioner cut rate monitoring |
| US11100628B2 (en) | 2019-02-07 | 2021-08-24 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| JP7151900B2 (ja) * | 2019-07-16 | 2022-10-12 | 日本電気株式会社 | 推定装置、制御システム、推定方法及びプログラム |
| EP3800008B1 (de) * | 2019-10-02 | 2024-12-04 | Optikron GmbH | Vorrichtung und verfahren zum schleifen und/oder polieren planer flächen von werkstücken |
| JP7374710B2 (ja) * | 2019-10-25 | 2023-11-07 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
| JP7504713B2 (ja) * | 2020-08-19 | 2024-06-24 | キオクシア株式会社 | 半導体製造装置及び半導体製造方法 |
| US11794305B2 (en) | 2020-09-28 | 2023-10-24 | Applied Materials, Inc. | Platen surface modification and high-performance pad conditioning to improve CMP performance |
| JP7599330B2 (ja) * | 2020-12-25 | 2024-12-13 | 株式会社荏原製作所 | 研磨装置、及び研磨方法 |
| WO2022186993A1 (en) * | 2021-03-03 | 2022-09-09 | Applied Materials, Inc. | Motor torque endpoint during polishing with spatial resolution |
| US12311494B2 (en) * | 2021-03-03 | 2025-05-27 | Applied Materials, Inc. | Pressure signals during motor torque monitoring to provide spatial resolution |
| JP2023124546A (ja) * | 2022-02-25 | 2023-09-06 | 株式会社荏原製作所 | 研磨装置および研磨装置における研磨終点検出方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200505628A (en) * | 2003-06-18 | 2005-02-16 | Ebara Corp | Substrate polishing apparatus and substrate polishing method |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5036015A (en) * | 1990-09-24 | 1991-07-30 | Micron Technology, Inc. | Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers |
| US5069002A (en) * | 1991-04-17 | 1991-12-03 | Micron Technology, Inc. | Apparatus for endpoint detection during mechanical planarization of semiconductor wafers |
| US5846882A (en) | 1996-10-03 | 1998-12-08 | Applied Materials, Inc. | Endpoint detector for a chemical mechanical polishing system |
| US5865665A (en) * | 1997-02-14 | 1999-02-02 | Yueh; William | In-situ endpoint control apparatus for semiconductor wafer polishing process |
| US6165051A (en) * | 1998-10-29 | 2000-12-26 | Kulicke & Soffa Investments, Inc. | Monitoring system for dicing saws |
| US6464824B1 (en) * | 1999-08-31 | 2002-10-15 | Micron Technology, Inc. | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| US6293845B1 (en) * | 1999-09-04 | 2001-09-25 | Mitsubishi Materials Corporation | System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current |
| US6290572B1 (en) * | 2000-03-23 | 2001-09-18 | Micron Technology, Inc. | Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| DE60132385T2 (de) | 2000-05-19 | 2008-05-15 | Applied Materials, Inc., Santa Clara | Polierkissen |
| JP4857468B2 (ja) * | 2001-01-25 | 2012-01-18 | ソニー株式会社 | データ処理装置およびデータ処理方法、並びにプログラムおよび記録媒体 |
| US6747283B1 (en) * | 2001-03-19 | 2004-06-08 | Lam Research Corporation | In-situ detection of thin-metal interface using high resolution spectral analysis of optical interference |
| US7030018B2 (en) * | 2002-02-04 | 2006-04-18 | Kla-Tencor Technologies Corp. | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
| US7087527B2 (en) * | 2002-08-28 | 2006-08-08 | Micron Technology, Inc. | Extended kalman filter incorporating offline metrology |
| US6859765B2 (en) | 2002-12-13 | 2005-02-22 | Lam Research Corporation | Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection |
| US6884147B2 (en) * | 2003-03-28 | 2005-04-26 | Yield Dynamics, Inc. | Method for chemical-mechanical polish control in semiconductor manufacturing |
| US7292906B2 (en) * | 2004-07-14 | 2007-11-06 | Tokyo Electron Limited | Formula-based run-to-run control |
| JP4159594B1 (ja) | 2007-05-21 | 2008-10-01 | 株式会社東京精密 | 研磨終了時点の予測・検出方法とその装置 |
| JP5057892B2 (ja) * | 2007-08-30 | 2012-10-24 | 株式会社東京精密 | トルク変化を利用した研磨終端時点検知方法及びその装置 |
| US8930013B2 (en) * | 2010-06-28 | 2015-01-06 | Applied Materials, Inc. | Adaptively tracking spectrum features for endpoint detection |
-
2012
- 2012-04-26 US US13/456,801 patent/US9308618B2/en active Active
-
2013
- 2013-04-05 WO PCT/US2013/035514 patent/WO2013162857A1/en not_active Ceased
- 2013-04-05 KR KR1020147033311A patent/KR101919032B1/ko active Active
- 2013-04-05 JP JP2015508995A patent/JP6181156B2/ja active Active
- 2013-04-11 TW TW102112924A patent/TWI569919B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200505628A (en) * | 2003-06-18 | 2005-02-16 | Ebara Corp | Substrate polishing apparatus and substrate polishing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11504821B2 (en) | 2017-11-16 | 2022-11-22 | Applied Materials, Inc. | Predictive filter for polishing pad wear rate monitoring |
| TWI806925B (zh) * | 2017-11-16 | 2023-07-01 | 美商應用材料股份有限公司 | 用於拋光墊磨損率監測的裝置、方法、和電腦程式產品 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013162857A1 (en) | 2013-10-31 |
| JP6181156B2 (ja) | 2017-08-16 |
| JP2015519740A (ja) | 2015-07-09 |
| KR20150005674A (ko) | 2015-01-14 |
| US9308618B2 (en) | 2016-04-12 |
| TW201350261A (zh) | 2013-12-16 |
| US20130288572A1 (en) | 2013-10-31 |
| KR101919032B1 (ko) | 2018-11-15 |
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