KR101919032B1 - 인-시츄 폴리싱 모니터링 중에 데이터의 필터링을 위한 선형 예측 - Google Patents

인-시츄 폴리싱 모니터링 중에 데이터의 필터링을 위한 선형 예측 Download PDF

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KR101919032B1
KR101919032B1 KR1020147033311A KR20147033311A KR101919032B1 KR 101919032 B1 KR101919032 B1 KR 101919032B1 KR 1020147033311 A KR1020147033311 A KR 1020147033311A KR 20147033311 A KR20147033311 A KR 20147033311A KR 101919032 B1 KR101919032 B1 KR 101919032B1
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South Korea
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signal
polishing
values
value
predicted
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KR20150005674A (ko
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도미니크 제이. 벤벵누
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어플라이드 머티어리얼스, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Numerical Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020147033311A 2012-04-26 2013-04-05 인-시츄 폴리싱 모니터링 중에 데이터의 필터링을 위한 선형 예측 Active KR101919032B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/456,801 US9308618B2 (en) 2012-04-26 2012-04-26 Linear prediction for filtering of data during in-situ monitoring of polishing
US13/456,801 2012-04-26
PCT/US2013/035514 WO2013162857A1 (en) 2012-04-26 2013-04-05 Linear prediction for filtering of data during in-situ monitoring of polishing

Publications (2)

Publication Number Publication Date
KR20150005674A KR20150005674A (ko) 2015-01-14
KR101919032B1 true KR101919032B1 (ko) 2018-11-15

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KR1020147033311A Active KR101919032B1 (ko) 2012-04-26 2013-04-05 인-시츄 폴리싱 모니터링 중에 데이터의 필터링을 위한 선형 예측

Country Status (5)

Country Link
US (1) US9308618B2 (enExample)
JP (1) JP6181156B2 (enExample)
KR (1) KR101919032B1 (enExample)
TW (1) TWI569919B (enExample)
WO (1) WO2013162857A1 (enExample)

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US9375824B2 (en) 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
US9490186B2 (en) 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
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US9679693B2 (en) 2015-02-25 2017-06-13 Onesubsea Ip Uk Limited Subsea transformer with seawater high resistance ground
US10026537B2 (en) 2015-02-25 2018-07-17 Onesubsea Ip Uk Limited Fault tolerant subsea transformer
US9945909B2 (en) 2015-02-25 2018-04-17 Onesubsea Ip Uk Limited Monitoring multiple subsea electric motors
US10565701B2 (en) * 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
JP2017102051A (ja) * 2015-12-03 2017-06-08 ニッタ株式会社 圧力測定装置及び圧力測定プログラム
JP2018001296A (ja) * 2016-06-28 2018-01-11 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム
CN109791881B (zh) 2016-09-21 2021-02-19 应用材料公司 具有补偿滤波的端点检测
JP6989317B2 (ja) 2017-08-04 2022-01-05 キオクシア株式会社 研磨装置、研磨方法、およびプログラム
US11504821B2 (en) 2017-11-16 2022-11-22 Applied Materials, Inc. Predictive filter for polishing pad wear rate monitoring
JP7098311B2 (ja) * 2017-12-05 2022-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
JP7237083B2 (ja) * 2018-03-12 2023-03-10 アプライド マテリアルズ インコーポレイテッド 研磨のインシトゥモニタリングにおけるフィルタリング
US11577362B2 (en) 2018-03-14 2023-02-14 Applied Materials, Inc. Pad conditioner cut rate monitoring
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology
JP7151900B2 (ja) * 2019-07-16 2022-10-12 日本電気株式会社 推定装置、制御システム、推定方法及びプログラム
EP3800008B1 (de) * 2019-10-02 2024-12-04 Optikron GmbH Vorrichtung und verfahren zum schleifen und/oder polieren planer flächen von werkstücken
JP7374710B2 (ja) * 2019-10-25 2023-11-07 株式会社荏原製作所 研磨方法および研磨装置
JP7504713B2 (ja) * 2020-08-19 2024-06-24 キオクシア株式会社 半導体製造装置及び半導体製造方法
US11794305B2 (en) 2020-09-28 2023-10-24 Applied Materials, Inc. Platen surface modification and high-performance pad conditioning to improve CMP performance
JP7599330B2 (ja) * 2020-12-25 2024-12-13 株式会社荏原製作所 研磨装置、及び研磨方法
WO2022186993A1 (en) * 2021-03-03 2022-09-09 Applied Materials, Inc. Motor torque endpoint during polishing with spatial resolution
US12311494B2 (en) * 2021-03-03 2025-05-27 Applied Materials, Inc. Pressure signals during motor torque monitoring to provide spatial resolution
JP2023124546A (ja) * 2022-02-25 2023-09-06 株式会社荏原製作所 研磨装置および研磨装置における研磨終点検出方法

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Also Published As

Publication number Publication date
WO2013162857A1 (en) 2013-10-31
JP6181156B2 (ja) 2017-08-16
TWI569919B (zh) 2017-02-11
JP2015519740A (ja) 2015-07-09
KR20150005674A (ko) 2015-01-14
US9308618B2 (en) 2016-04-12
TW201350261A (zh) 2013-12-16
US20130288572A1 (en) 2013-10-31

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